JP2003198078A - Printed wiring board and method of manufacturing the same - Google Patents

Printed wiring board and method of manufacturing the same

Info

Publication number
JP2003198078A
JP2003198078A JP2001400177A JP2001400177A JP2003198078A JP 2003198078 A JP2003198078 A JP 2003198078A JP 2001400177 A JP2001400177 A JP 2001400177A JP 2001400177 A JP2001400177 A JP 2001400177A JP 2003198078 A JP2003198078 A JP 2003198078A
Authority
JP
Japan
Prior art keywords
mask film
wiring pattern
wiring board
printed wiring
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001400177A
Other languages
Japanese (ja)
Inventor
Hiroshi Nakayama
博史 中山
Original Assignee
Nidec Copal Corp
日本電産コパル株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Copal Corp, 日本電産コパル株式会社 filed Critical Nidec Copal Corp
Priority to JP2001400177A priority Critical patent/JP2003198078A/en
Publication of JP2003198078A publication Critical patent/JP2003198078A/en
Pending legal-status Critical Current

Links

Abstract

(57) [Problem] To provide a structure capable of easily peeling off a mask film coated on a printed wiring board. A printed wiring board (1) includes an insulating substrate (2).
A wiring pattern 3 made of a metal foil formed on the surface thereof; a resist film for covering a part of the wiring pattern 3 permanently while exposing a part of the wiring pattern 3; A mask film 4 for temporarily protecting a region serving as a connection terminal 3c with the outside from scratches and dirt. A dummy pattern 3d made of a metal foil is provided at the edge of the area where the mask film 4 is arranged, and the mask film 4 is easily peeled off by a gap generated between the mask film 4 and the base material 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board and a method for manufacturing the same. More specifically, the present invention relates to a mask film peeling technique that is temporarily used to protect a wiring pattern from scratches and dirt during an assembly process of a printed wiring board.

[0002]

2. Description of the Related Art A printed wiring board used for assembling electronic equipment basically comprises an insulating base material and a wiring pattern made of a metal foil formed on the surface of the insulating base material. Chips such as ICs, capacitors, and resistors are soldered to the wiring pattern. Assembly and soldering of these parts are being automated by robots.

The surface of the printed wiring board is previously coated with a film. There are two types of this film, a resist film that is permanently coated and a mask film that is temporarily coated. The resist film permanently covers the other part while exposing a part of the wiring pattern. For example, a portion not requiring soldering in the assembly process is coated with a resist film. This resist film is
After assembly, it remains on the surface of the printed wiring board.
On the other hand, the mask film is used to temporarily protect at least an area of the exposed portion of the wiring pattern, which is to be a connection terminal with the outside, from scratches and dirt during the assembly process.
Since the connection terminal is for electrical connection with the outside, it cannot be permanently covered with the resist film. However, like the other parts of the wiring pattern, the area that will be the connection terminal must be kept clean during the assembly process. Therefore, conventionally, a mask film that can be peeled off more easily than a resist film is used to temporarily protect a region to be a connection terminal to the outside. After the assembly work of the printed wiring board is completed, the mask film is peeled off at the shipping stage.

[0004]

The mask film is a coating material (coat) capable of peeling (peeling), and is supplied to the market under the name such as peel coating. As described above, the peel coat protects the metal foil of the printed wiring board from dirt and scratches during the assembling process, and the peel coat must be peeled off at the time of shipping. Conventionally, tweezers or the like has been used as a means for peeling off the peel coat. However, since the peel coat protects the exposed portion of the metal foil, it adheres to some extent and does not peel off easily. or,
The thickness is about 0.1 mm, which makes it difficult to grasp with tweezers. Therefore, during the peeling work using the tweezers, the exposed portion of the metal foil protected by the peel coat and the resist film portion previously coated on the printed wiring board may be damaged.

[0005]

SUMMARY OF THE INVENTION In view of the above-mentioned problems of the prior art, it is an object of the present invention to provide a structure and method capable of easily peeling a mask film coated on a printed wiring board. The following measures have been taken to achieve this purpose. That is, an insulating base material, a wiring pattern made of a metal foil formed on the surface thereof, a resist film that permanently covers the other portion of the wiring pattern while exposing a part of the wiring pattern, and a wiring pattern of the wiring pattern. In a printed wiring board having a mask film that temporarily protects at least an area serving as a connection terminal with the outside of the exposed part from scratches and stains, the metal foil is formed on the edge of the area where the mask film is arranged. It is characterized in that a dummy pattern is provided, and the mask film is easily peeled off due to a gap formed between the mask film and the base material. For example,
The dummy pattern is two strip-shaped patterns that are separated from each other. Preferably, the dummy pattern is arranged in a portion without the resist film.

According to the present invention, a dummy pattern (discard pattern) is previously provided on the end of the region to which the mask film (peel coat) is to be applied with the same metal foil as the wiring pattern. Utilizing the thickness of the dummy pattern,
Make a gap between the peel coat and the substrate. Use this gap to create a space for peeling off the peel coat with tweezers. There should be no resist film in this space. Therefore, it is preferable not to apply a resist film around the dummy pattern. As described above, in the present invention, the peel coat that is in close contact with the surface of the printed wiring board is easily peeled off by using the gap of the dummy pattern. Further, since the dummy pattern serves as a mark for peeling off, there is no fear of damaging other exposed portions of the metal foil or the covered portion of the resist film.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a schematic partial plan view showing a preferred embodiment of a printed wiring board according to the present invention. As shown in the figure, the printed wiring board 1 is composed of a base material 2 and a wiring pattern 3 formed on the surface thereof. As the base material 2, for example, a plastic sheet such as fiber-reinforced epoxy resin is used. The wiring pattern 3 is made of a metal foil having a thickness of about 0.1 to 0.2 mm. For example, the base material 2 is preliminarily laminated with a copper foil. By selectively etching this copper foil, a wiring pattern 3 having a complicated shape as shown in the figure
Can be formed. Depending on the case, the surface of the copper foil forming the wiring pattern 3 may be plated with gold or the like. Chips such as ICs, capacitors, and resistors are automatically attached to the printed wiring board 1 by a robot or the like. To fix these chips to the printed wiring board,
Soldering is performed. This soldering is performed by immersing the base material 2 on which the chips are assembled in a molten solder bath. This work is called solder dip.

Prior to assembly work such as chip assembly and solder dip, the printed wiring board 1 is previously protective-coated with a film. This film is divided into two types according to the purpose of use, and there are a resist film and a mask film 4. Although not shown in the drawing, the resist film permanently covers the other part of the wiring pattern 3 while exposing a part thereof. The resist film is made of a liquid resin and is applied to the surface of the base material 2 by screen printing or the like. Then, heat treatment is performed to bring the resist film into close contact with the base material 2. In some cases, the resist film may be cured by irradiation with ultraviolet rays instead of heat treatment. In any case, the resist film in the cured state is permanently adhered to the surface of the base material 2. The resist film basically covers a portion where soldering by solder dip is unnecessary and protects the wiring pattern 3 from solder or the like. Further, even after the assembling and soldering of the chips and the like are left on the printed wiring board 1 as it is, the surface is protected to prevent a short circuit between the wiring patterns and the reliability of the printed wiring board 1 is improved. .

On the other hand, the mask film 4 temporarily protects the exposed portion of the wiring pattern 3 which is to be the connection terminal 3c with the outside from scratches and dirt during the assembly process. The surface is coated. Connection terminal 3c
Is provided in order to establish electrical connection with other components when the printed wiring board, on which the chips are assembled and soldered, is incorporated into the electronic device body. Therefore, the connection terminals 3c must be kept clean at the shipping stage after the processing of the printed wiring board 1 is completed. For this purpose, the mask film 4 is used to prevent solder from adhering and other stains and scratches during solder dipping. Like the resist film, the mask film 4 is also pre-coated on the printed wiring board 1 by screen printing or the like. However, the difference from the resist film is that the mask film 4 is not permanently coated on the base material 2 and must be peeled off later. In this respect, when compared with the resist film, the mask film 4
Has low adhesion. However, in order to protect the wiring pattern 3 during the assembly process, it must not be easily peeled off, and there is a considerable degree of adhesion.

As a feature of the present invention, a dummy pattern 3d made of a metal foil is provided at the edge of the area where the mask film 4 is arranged, like the wiring pattern 3. By arranging the dummy pattern 3d, the mask film 4 and the substrate 2
There is a gap between and. The gap is used to facilitate the peeling of the mask film 4. Dummy pattern 3d
Like the wiring pattern 3, can be formed by selectively etching the metal foil. Therefore, the dummy pattern 3
Since the d is provided, no additional process is required, and the dummy pattern 3d can be formed simultaneously with the etching process of the wiring pattern 3. In the illustrated example, the dummy pattern 3d is composed of two strip-shaped patterns that are separated from each other. A gap is created between the two dummy patterns 3d, and the mask film 4 can be easily peeled off by inserting tweezers or the like into the gap. It is preferable that the dummy pattern 3d be provided in a portion without the resist film. If there is a resist film, the gap formed by the dummy pattern 3d is filled with the thickness of the resist film, which is not preferable. The dummy pattern 3d is
Since it has a peculiar shape unlike the ordinary wiring pattern 3, it also serves as a mark when the mask film 4 is peeled off. As a result, other parts of the wiring pattern 3 and the surface of the resist film are not damaged by tweezers or the like.

FIG. 2 is a printed wiring board 1 shown in FIG.
3 shows a schematic cross-sectional shape of. As shown in the figure, a wiring pattern 3 made of a metal foil is formed on the surface of the base material 2. At the same time, two dummy patterns 3d made of metal foil are also formed. The portion of the wiring pattern 3 is covered with the resist film 5. As described above, the resist film 5 is applied by, for example, screen printing and then cured by heat treatment or ultraviolet irradiation. Thereby, the resist film 5 is permanently adhered to the surface of the base material 2 and is not peeled off later.

Apart from the resist film 5, portions such as inner connection terminals of the wiring pattern 3 are covered with a mask film 4. The mask film 4 is also made to adhere to the base material 2 by applying an ink material by screen printing or the like and then thermosetting. However, resist film 5
Unlike the above, it does not adhere permanently, but is provided with an adhesiveness that allows later peeling. Mask film 4
Are formed so that their edges hang over the dummy pattern 3d. As a result, between the mask film 4 and the base material 2,
A gap G is provided by interposing two dummy patterns 3d. The gap G corresponds to the thickness of the dummy pattern 3d and is, for example, 0.1 mm to 0.2 mm. Insert the tweezers into the gap G, and lift it to peel off the mask film 4. If there is no dummy pattern 3d, there is almost no space between the base material 2 and the mask film 4, and there is a risk of damaging the base material surface or the wiring pattern surface when inserting the tweezers.

The mask film 4 is supplied to the market under the name of peel coat as described above. Peel coat can temporarily peel off after soldering by temporarily heat-resisting the parts of the wiring pattern 3 that do not require soldering by solder dipping, such as lands for post-soldering and carbon contacts. It is also called a solder masking material. The solder masking material is required to have heat resistance, and even if the solder masking material is subjected to dip soldering or reflow soldering two to three times, no gas is generated from the coating film and the coating film cannot be peeled off. Further, after dip soldering or reflow soldering, peeling is possible even if left for a long time. Solder masking materials are generally supplied in ink. By printing the ink, the surface of the base material 2 is coated. The printing conditions are set so that the coating film thickness after curing is about 100 μm. The most suitable printing method is screen printing. The screen conditions are, for example, 80 to 100 mesh, and the emulsion thickness is 50 μm or more. After printing 13
Heat treatment is performed at 0 ° C. to 150 ° C. for about 10 minutes to cure. Thereby, the mask film 4 is obtained.

[0014]

As described above, according to the present invention, a dummy pattern made of a metal foil is provided at the edge of the area where the mask film is arranged, and the gap formed between the mask film and the base material causes The mask film is easily peeled off.
Since the mask film is easily peeled off, it does not damage the exposed part of the metal foil or the surface of the resist film. As a result, the defective rate of the printed wiring board can be reduced.

[Brief description of drawings]

FIG. 1 is a partial plan view of a printed wiring board according to the present invention.

FIG. 2 is a schematic sectional view of a printed wiring board according to the present invention.

[Explanation of symbols]

1 ... Printed wiring board, 2 ... Base material, 3 ... Wiring pattern, 3c ... Connection terminal, 3d ... Dummy pattern, 5 ... Resist film, G ... Gap

Claims (4)

[Claims]
1. An insulating base material, a wiring pattern formed of a metal foil on the surface of the insulating base material, a resist film which permanently covers other portions of the wiring pattern while exposing a part of the wiring pattern, In a printed wiring board provided with a mask film for temporarily protecting, from scratches and stains, an area of the exposed portion of the wiring pattern, which is to be a connection terminal with the outside, the metal is provided on an edge of the area where the mask film is arranged. A printed wiring board, characterized in that a dummy pattern made of foil is provided, and a gap formed between the mask film and the base material facilitates peeling of the mask film.
2. The printed wiring board according to claim 1, wherein the dummy pattern is two strip-shaped patterns spaced apart from each other.
3. The printed wiring board according to claim 1, wherein the dummy pattern is provided in a portion where the resist film is absent.
4. A step of forming a wiring pattern made of a metal foil on the surface of an insulating base material, and a step of permanently covering the other part of the wiring pattern with a resist film while leaving a part of the wiring pattern exposed. A step of temporarily protecting a region of the exposed portion of the wiring pattern, which is to be a connection terminal with the outside, from scratches and stains with a mask film, wherein the metal foil is formed on the edge of the region where the mask film is arranged. A method for manufacturing a printed wiring board, wherein the dummy film is provided, and the mask film is easily peeled off by a gap formed between the mask film and the base material.
JP2001400177A 2001-12-28 2001-12-28 Printed wiring board and method of manufacturing the same Pending JP2003198078A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001400177A JP2003198078A (en) 2001-12-28 2001-12-28 Printed wiring board and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001400177A JP2003198078A (en) 2001-12-28 2001-12-28 Printed wiring board and method of manufacturing the same

Publications (1)

Publication Number Publication Date
JP2003198078A true JP2003198078A (en) 2003-07-11

Family

ID=27604890

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001400177A Pending JP2003198078A (en) 2001-12-28 2001-12-28 Printed wiring board and method of manufacturing the same

Country Status (1)

Country Link
JP (1) JP2003198078A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010531632A (en) * 2007-06-28 2010-09-24 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツングRobert Bosch Gmbh Electrical control equipment
KR101175886B1 (en) 2010-11-25 2012-08-21 삼성전기주식회사 printed circuit board and method for anufacturing the same
CN101801154B (en) * 2009-02-09 2014-05-07 索尼公司 Circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010531632A (en) * 2007-06-28 2010-09-24 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツングRobert Bosch Gmbh Electrical control equipment
US8488324B2 (en) 2007-06-28 2013-07-16 Robert Bosch Gmbh Electric control unit having a housing part and a cooling part
KR101484799B1 (en) 2007-06-28 2015-01-20 로베르트 보쉬 게엠베하 Electric control device
US9345139B2 (en) 2007-06-28 2016-05-17 Robert Bosch Gmbh Control module for a transmission control installed in an automatic transmission
CN101801154B (en) * 2009-02-09 2014-05-07 索尼公司 Circuit board
KR101175886B1 (en) 2010-11-25 2012-08-21 삼성전기주식회사 printed circuit board and method for anufacturing the same

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