JP2003204005A5 - - Google Patents

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Publication number
JP2003204005A5
JP2003204005A5 JP2002366119A JP2002366119A JP2003204005A5 JP 2003204005 A5 JP2003204005 A5 JP 2003204005A5 JP 2002366119 A JP2002366119 A JP 2002366119A JP 2002366119 A JP2002366119 A JP 2002366119A JP 2003204005 A5 JP2003204005 A5 JP 2003204005A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2002366119A
Other versions
JP2003204005A (ja
JP4768952B2 (ja
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Priority claimed from US10/028,058 external-priority patent/US6787897B2/en
Application filed filed Critical
Publication of JP2003204005A publication Critical patent/JP2003204005A/ja
Publication of JP2003204005A5 publication Critical patent/JP2003204005A5/ja
Application granted granted Critical
Publication of JP4768952B2 publication Critical patent/JP4768952B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002366119A 2001-12-20 2002-12-18 シリコンガスケットを含むウエハレベルパッケージおよびその製造方法 Expired - Fee Related JP4768952B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/028,058 US6787897B2 (en) 2001-12-20 2001-12-20 Wafer-level package with silicon gasket
US10/028058 2001-12-20

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006002842A Division JP4567607B2 (ja) 2001-12-20 2006-01-10 ウエハレベルパッケージの製造方法

Publications (3)

Publication Number Publication Date
JP2003204005A JP2003204005A (ja) 2003-07-18
JP2003204005A5 true JP2003204005A5 (ja) 2006-02-23
JP4768952B2 JP4768952B2 (ja) 2011-09-07

Family

ID=21841336

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2002366119A Expired - Fee Related JP4768952B2 (ja) 2001-12-20 2002-12-18 シリコンガスケットを含むウエハレベルパッケージおよびその製造方法
JP2006002842A Expired - Fee Related JP4567607B2 (ja) 2001-12-20 2006-01-10 ウエハレベルパッケージの製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2006002842A Expired - Fee Related JP4567607B2 (ja) 2001-12-20 2006-01-10 ウエハレベルパッケージの製造方法

Country Status (3)

Country Link
US (2) US6787897B2 (ja)
JP (2) JP4768952B2 (ja)
DE (1) DE10241344B4 (ja)

Families Citing this family (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6911727B1 (en) * 1995-06-06 2005-06-28 Analog Devices, Inc. Package for sealing an integrated circuit die
US7343535B2 (en) * 2002-02-06 2008-03-11 Avago Technologies General Ip Dte Ltd Embedded testing capability for integrated serializer/deserializers
US20030183916A1 (en) * 2002-03-27 2003-10-02 John Heck Packaging microelectromechanical systems
JP3529050B2 (ja) * 2002-07-12 2004-05-24 沖電気工業株式会社 半導体装置の製造方法
US20070072330A1 (en) * 2003-03-05 2007-03-29 Rensselaer Polytechnic Institute Wafer bonding compatible with bulk micro-machining
US7520679B2 (en) * 2003-09-19 2009-04-21 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optical device package with turning mirror and alignment post
US20050063431A1 (en) 2003-09-19 2005-03-24 Gallup Kendra J. Integrated optics and electronics
US6953990B2 (en) * 2003-09-19 2005-10-11 Agilent Technologies, Inc. Wafer-level packaging of optoelectronic devices
US20050063648A1 (en) * 2003-09-19 2005-03-24 Wilson Robert Edward Alignment post for optical subassemblies made with cylindrical rods, tubes, spheres, or similar features
US6900509B2 (en) 2003-09-19 2005-05-31 Agilent Technologies, Inc. Optical receiver package
US6998691B2 (en) 2003-09-19 2006-02-14 Agilent Technologies, Inc. Optoelectronic device packaging with hermetically sealed cavity and integrated optical element
US6982437B2 (en) 2003-09-19 2006-01-03 Agilent Technologies, Inc. Surface emitting laser package having integrated optical element and alignment post
US7026189B2 (en) * 2004-02-11 2006-04-11 Hewlett-Packard Development Company, L.P. Wafer packaging and singulation method
US7642642B2 (en) * 2004-03-23 2010-01-05 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Microcap wafer bonding apparatus
US20050213995A1 (en) * 2004-03-26 2005-09-29 Myunghee Lee Low power and low jitter optical receiver for fiber optic communication link
US7091601B2 (en) * 2004-04-30 2006-08-15 Philliber Joel A Method of fabricating an apparatus including a sealed cavity
US7060895B2 (en) * 2004-05-04 2006-06-13 Idc, Llc Modifying the electro-mechanical behavior of devices
US7550912B2 (en) 2004-09-27 2009-06-23 Idc, Llc Method and system for maintaining partial vacuum in display device
US7422962B2 (en) * 2004-10-27 2008-09-09 Hewlett-Packard Development Company, L.P. Method of singulating electronic devices
US20060211233A1 (en) * 2005-03-21 2006-09-21 Skyworks Solutions, Inc. Method for fabricating a wafer level package having through wafer vias for external package connectivity and related structure
US7576426B2 (en) * 2005-04-01 2009-08-18 Skyworks Solutions, Inc. Wafer level package including a device wafer integrated with a passive component
DE102005016751B3 (de) * 2005-04-11 2006-12-14 Schott Ag Verfahren zur Herstellung gehäuster elektronischer Bauelemente
US20070004079A1 (en) * 2005-06-30 2007-01-04 Geefay Frank S Method for making contact through via contact to an offset contactor inside a cap for the wafer level packaging of FBAR chips
US7781697B2 (en) * 2006-04-10 2010-08-24 Hewlett-Packard Development Company, L.P. Micro-display and methods
US7635606B2 (en) * 2006-08-02 2009-12-22 Skyworks Solutions, Inc. Wafer level package with cavities for active devices
WO2008023824A1 (fr) * 2006-08-25 2008-02-28 Sanyo Electric Co., Ltd. Dispositif à semi-conducteur et son procédé de fabrication
US8653612B2 (en) 2006-08-25 2014-02-18 Sanyo Semiconductor Co., Ltd. Semiconductor device
EP1903000B1 (fr) * 2006-09-25 2019-09-18 Sorin CRM SAS Composant biocompatible implantable incorporant un élément actif intégré tel qu'un capteur de mesure d'un paramètre physiologique, microsystème électromécanique ou circuit électronique
US7667324B2 (en) * 2006-10-31 2010-02-23 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Systems, devices, components and methods for hermetically sealing electronic modules and packages
US20080144863A1 (en) * 2006-12-15 2008-06-19 Fazzio R Shane Microcap packaging of micromachined acoustic devices
US20080164606A1 (en) * 2007-01-08 2008-07-10 Christoffer Graae Greisen Spacers for wafer bonding
US20080217708A1 (en) * 2007-03-09 2008-09-11 Skyworks Solutions, Inc. Integrated passive cap in a system-in-package
US20080231600A1 (en) 2007-03-23 2008-09-25 Smith George E Near-Normal Incidence Optical Mouse Illumination System with Prism
US20080283944A1 (en) * 2007-05-18 2008-11-20 Geefay Frank S PHOTOSTRUCTURABLE GLASS MICROELECTROMECHANICAL (MEMs) DEVICES AND METHODS OF MANUFACTURE
JP5067030B2 (ja) * 2007-06-15 2012-11-07 三菱電機株式会社 半導体装置及びその製造方法
TW200919593A (en) * 2007-10-18 2009-05-01 Asia Pacific Microsystems Inc Elements and modules with micro caps and wafer level packaging method thereof
US8324728B2 (en) * 2007-11-30 2012-12-04 Skyworks Solutions, Inc. Wafer level packaging using flip chip mounting
US8900931B2 (en) * 2007-12-26 2014-12-02 Skyworks Solutions, Inc. In-situ cavity integrated circuit package
TWI464835B (zh) * 2008-04-04 2014-12-11 Fujikura Ltd 半導體封裝體及其製造方法
US8349635B1 (en) * 2008-05-20 2013-01-08 Silicon Laboratories Inc. Encapsulated MEMS device and method to form the same
JP4945516B2 (ja) * 2008-06-26 2012-06-06 新日鐵化学株式会社 中空封止型半導体装置の製造方法
US8410690B2 (en) * 2009-02-13 2013-04-02 Qualcomm Mems Technologies, Inc. Display device with desiccant
US9520856B2 (en) 2009-06-24 2016-12-13 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator structure having an electrode with a cantilevered portion
US9327316B2 (en) * 2009-06-30 2016-05-03 Avago Technologies General Ip (Singapore) Pte. Ltd. Multi-frequency acoustic array
TWI388038B (zh) * 2009-07-23 2013-03-01 Ind Tech Res Inst 感測元件結構與製造方法
DE102009042479A1 (de) 2009-09-24 2011-03-31 Msg Lithoglas Ag Verfahren zum Herstellen einer Anordnung mit einem Bauelement auf einem Trägersubstrat und Anordnung sowie Verfahren zum Herstellen eines Halbzeuges und Halbzeug
US8613996B2 (en) * 2009-10-21 2013-12-24 International Business Machines Corporation Polymeric edge seal for bonded substrates
US8287980B2 (en) 2009-10-29 2012-10-16 International Business Machines Corporation Edge protection seal for bonded substrates
US8551814B2 (en) * 2010-03-11 2013-10-08 Freescale Semiconductor, Inc. Method of fabricating a semiconductor device that limits damage to elements of the semiconductor device that are exposed during processing
JP5605258B2 (ja) 2011-02-16 2014-10-15 オムロン株式会社 ウエハレベルパッケージ、チップサイズパッケージデバイス及びウエハレベルパッケージの製造方法
US9099983B2 (en) 2011-02-28 2015-08-04 Avago Technologies General Ip (Singapore) Pte. Ltd. Bulk acoustic wave resonator device comprising a bridge in an acoustic reflector
US9425764B2 (en) 2012-10-25 2016-08-23 Avago Technologies General Ip (Singapore) Pte. Ltd. Accoustic resonator having composite electrodes with integrated lateral features
US9203374B2 (en) 2011-02-28 2015-12-01 Avago Technologies General Ip (Singapore) Pte. Ltd. Film bulk acoustic resonator comprising a bridge
US9444426B2 (en) 2012-10-25 2016-09-13 Avago Technologies General Ip (Singapore) Pte. Ltd. Accoustic resonator having integrated lateral feature and temperature compensation feature
JP5640892B2 (ja) 2011-05-23 2014-12-17 三菱電機株式会社 半導体装置
US8922302B2 (en) 2011-08-24 2014-12-30 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator formed on a pedestal
US9667220B2 (en) 2012-01-30 2017-05-30 Avago Technologies General Ip (Singapore) Pte. Ltd. Temperature controlled acoustic resonator comprising heater and sense resistors
US9154103B2 (en) 2012-01-30 2015-10-06 Avago Technologies General Ip (Singapore) Pte. Ltd. Temperature controlled acoustic resonator
US9667218B2 (en) 2012-01-30 2017-05-30 Avago Technologies General Ip (Singapore) Pte. Ltd. Temperature controlled acoustic resonator comprising feedback circuit
US9608592B2 (en) 2014-01-21 2017-03-28 Avago Technologies General Ip (Singapore) Pte. Ltd. Film bulk acoustic wave resonator (FBAR) having stress-relief
US8980676B2 (en) * 2012-06-25 2015-03-17 Raytheon Company Fabrication of window cavity cap structures in wafer level packaging
US9018715B2 (en) 2012-11-30 2015-04-28 Silicon Laboratories Inc. Gas-diffusion barriers for MEMS encapsulation
US9196587B2 (en) * 2013-03-14 2015-11-24 Maxim Integrated Products, Inc. Semiconductor device having a die and through substrate-via
US9793877B2 (en) 2013-12-17 2017-10-17 Avago Technologies General Ip (Singapore) Pte. Ltd. Encapsulated bulk acoustic wave (BAW) resonator device
US9793874B2 (en) 2014-05-28 2017-10-17 Avago Technologies General Ip Singapore (Singapore) Pte. Ltd. Acoustic resonator with electrical interconnect disposed in underlying dielectric
CN106206624A (zh) * 2015-04-29 2016-12-07 中国科学院微电子研究所 一种晶圆级封装盖帽及其制作方法
US10329142B2 (en) * 2015-12-18 2019-06-25 Samsung Electro-Mechanics Co., Ltd. Wafer level package and method of manufacturing the same
US10263587B2 (en) 2016-12-23 2019-04-16 Avago Technologies International Sales Pte. Limited Packaged resonator with polymeric air cavity package
US11764117B2 (en) * 2018-04-03 2023-09-19 Corning Incorporated Hermetically sealed optically transparent wafer-level packages and methods for making the same
KR102536832B1 (ko) * 2018-12-07 2023-05-25 엘지이노텍 주식회사 웨이퍼 레벨 패키지 및 이의 제조 방법
CN110690868B (zh) * 2019-09-27 2021-02-19 无锡市好达电子股份有限公司 一种滤波器的新型晶圆级封装方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4541169A (en) * 1984-10-29 1985-09-17 International Business Machines Corporation Method for making studs for interconnecting metallization layers at different levels in a semiconductor chip
JPS63104355A (ja) * 1986-10-21 1988-05-09 Kyocera Corp Ｉｃセラミツクパツケ−ジのシ−ルリングおよびその製造方法
JPH02278852A (ja) * 1989-04-20 1990-11-15 Sumitomo Metal Mining Co Ltd ハーメチックシールカバー
DE4107658A1 (de) * 1991-03-09 1992-09-17 Bosch Gmbh Robert Montageverfahren fuer mikromechanische sensoren
JPH08259903A (ja) * 1995-03-24 1996-10-08 Hitachi Kasei Polymer Co Ltd 接着工法
JPH08271426A (ja) * 1995-03-29 1996-10-18 Mitsubishi Materials Corp 赤外線式ガス分析装置
JP3613838B2 (ja) * 1995-05-18 2005-01-26 株式会社デンソー 半導体装置の製造方法
JP3846094B2 (ja) * 1998-03-17 2006-11-15 株式会社デンソー 半導体装置の製造方法
US6359333B1 (en) * 1998-03-31 2002-03-19 Honeywell International Inc. Wafer-pair having deposited layer sealed chambers
US6062461A (en) * 1998-06-03 2000-05-16 Delphi Technologies, Inc. Process for bonding micromachined wafers using solder
US6229404B1 (en) * 1998-08-31 2001-05-08 Kyocera Corporation Crystal oscillator
JP3448865B2 (ja) * 1998-12-17 2003-09-22 株式会社大真空 電子部品用パッケージおよび圧電振動デバイス
EP1041628A3 (en) * 1999-03-29 2008-05-28 Interuniversitair Microelektronica Centrum Vzw An image sensor ball grid array package and the fabrication thereof
JP2000286353A (ja) * 1999-03-30 2000-10-13 Kyocera Corp 半導体素子収納用パッケージ
JP2001015000A (ja) * 1999-04-26 2001-01-19 Sanyo Electric Co Ltd 電子部品の製造方法及び電子部品
US6265246B1 (en) 1999-07-23 2001-07-24 Agilent Technologies, Inc. Microcap wafer-level package
US6228675B1 (en) 1999-07-23 2001-05-08 Agilent Technologies, Inc. Microcap wafer-level package with vias
US6452238B1 (en) * 1999-10-04 2002-09-17 Texas Instruments Incorporated MEMS wafer level package
US6453749B1 (en) * 1999-10-28 2002-09-24 Motorola, Inc. Physical sensor component
US6489679B2 (en) * 1999-12-06 2002-12-03 Sumitomo Metal (Smi) Electronics Devices Inc. High-frequency package
KR100506583B1 (ko) * 2000-04-21 2005-08-08 오므론 가부시키가이샤 정전형 릴레이 및 해당 릴레이를 이용한 통신용 기기
US6470594B1 (en) * 2001-09-21 2002-10-29 Eastman Kodak Company Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps

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