JP4945516B2 - 中空封止型半導体装置の製造方法 - Google Patents
中空封止型半導体装置の製造方法 Download PDFInfo
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- JP4945516B2 JP4945516B2 JP2008166951A JP2008166951A JP4945516B2 JP 4945516 B2 JP4945516 B2 JP 4945516B2 JP 2008166951 A JP2008166951 A JP 2008166951A JP 2008166951 A JP2008166951 A JP 2008166951A JP 4945516 B2 JP4945516 B2 JP 4945516B2
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- 239000011347 resin Substances 0.000 claims description 80
- 125000006850 spacer group Chemical group 0.000 claims description 56
- 239000000463 material Substances 0.000 claims description 47
- 239000000758 substrate Substances 0.000 claims description 14
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 10
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- 239000011342 resin composition Substances 0.000 claims description 6
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
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- 125000004182 2-chlorophenyl group Chemical group [H]C1=C([H])C(Cl)=C(*)C([H])=C1[H] 0.000 description 1
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- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
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- FLFWJIBUZQARMD-UHFFFAOYSA-N 2-mercapto-1,3-benzoxazole Chemical compound C1=CC=C2OC(S)=NC2=C1 FLFWJIBUZQARMD-UHFFFAOYSA-N 0.000 description 1
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- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
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- WCYQXGSYTSETFY-UHFFFAOYSA-N [S].CC1=CC=2C(C3=CC=CC=C3SC2C=C1)=O Chemical class [S].CC1=CC=2C(C3=CC=CC=C3SC2C=C1)=O WCYQXGSYTSETFY-UHFFFAOYSA-N 0.000 description 1
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Description
光照射後において接着性を有し且つ硬化性を有する感光性樹脂をカバー基材に塗布し、前記カバー基材の一方の面に感光性樹脂層を形成する工程と、
前記感光性樹脂層の所定箇所に光照射した後に光照射されていない箇所を除去するフォトリソグラフィーにより、前記感光性樹脂層の一部を除去し、前記感光性樹脂層の残部からなり且つ接着性を有するスペーサー部を形成する工程と、
半導体又はMEMSを備える機能部が形成されたウェーハの機能面に、前記スペーサー部を介して前記カバー基材を貼付し、前記スペーサー部を硬化せしめて中空封止型積層体を得る工程と、
前記中空封止型積層体をダイシングにより分割して前記中空封止型半導体装置を得る工程と、
を含み、且つ、
前記感光性樹脂として、下記一般式(1):
で表わされるアルカリ可溶性樹脂(A)を樹脂成分の主成分として含有する感光性樹脂組成物を用いること、
を特徴とする方法である。
Claims (2)
- 半導体又はMEMSを備える中空封止型半導体装置の製造方法であって、
光照射後において接着性を有し且つ硬化性を有する感光性樹脂をカバー基材に塗布し、前記カバー基材の一方の面に感光性樹脂層を形成する工程と、
前記感光性樹脂層の所定箇所に光照射した後に光照射されていない箇所を除去するフォトリソグラフィーにより、前記感光性樹脂層の一部を除去し、前記感光性樹脂層の残部からなり且つ接着性を有するスペーサー部を形成する工程と、
半導体又はMEMSを備える機能部が形成されたウェーハの機能面に、前記スペーサー部を介して前記カバー基材を貼付し、前記スペーサー部を硬化せしめて中空封止型積層体を得る工程と、
前記中空封止型積層体をダイシングにより分割して前記中空封止型半導体装置を得る工程と、
を含み、且つ、
前記感光性樹脂として、下記一般式(1):
で表わされるアルカリ可溶性樹脂(A)を樹脂成分の主成分として含有する感光性樹脂組成物を用いること、
を特徴とする中空封止型半導体装置の製造方法。 - 前記ウェーハに貫通電極が更に形成されていることを特徴とする請求項1に記載の中空封止型半導体装置の製造方法。
Priority Applications (1)
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JP2008166951A JP4945516B2 (ja) | 2008-06-26 | 2008-06-26 | 中空封止型半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2008166951A JP4945516B2 (ja) | 2008-06-26 | 2008-06-26 | 中空封止型半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010010328A JP2010010328A (ja) | 2010-01-14 |
JP4945516B2 true JP4945516B2 (ja) | 2012-06-06 |
Family
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Family Applications (1)
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