JP2003193009A5 - - Google Patents
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- Publication number
- JP2003193009A5 JP2003193009A5 JP2002302186A JP2002302186A JP2003193009A5 JP 2003193009 A5 JP2003193009 A5 JP 2003193009A5 JP 2002302186 A JP2002302186 A JP 2002302186A JP 2002302186 A JP2002302186 A JP 2002302186A JP 2003193009 A5 JP2003193009 A5 JP 2003193009A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- adhesive
- adhesion
- hot melt
- mhz
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 18
- 239000004831 Hot glue Substances 0.000 claims description 15
- 239000002131 composite material Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 9
- 230000001070 adhesive effect Effects 0.000 claims 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 8
- 239000004840 adhesive resin Substances 0.000 claims 8
- 229920006223 adhesive resin Polymers 0.000 claims 8
- 239000000203 mixture Substances 0.000 claims 8
- 239000004020 conductor Substances 0.000 claims 7
- 238000002844 melting Methods 0.000 claims 7
- 230000008018 melting Effects 0.000 claims 7
- 229910045601 alloy Inorganic materials 0.000 claims 6
- 239000000956 alloy Substances 0.000 claims 6
- 239000000126 substance Substances 0.000 claims 5
- 229920005992 thermoplastic resin Polymers 0.000 claims 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 4
- 229910052799 carbon Inorganic materials 0.000 claims 4
- 229910052802 copper Inorganic materials 0.000 claims 4
- 239000010949 copper Substances 0.000 claims 4
- 229910052742 iron Inorganic materials 0.000 claims 4
- 229920005672 polyolefin resin Polymers 0.000 claims 4
- 229910052709 silver Inorganic materials 0.000 claims 4
- 239000004332 silver Substances 0.000 claims 4
- 230000002787 reinforcement Effects 0.000 claims 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- 150000002484 inorganic compounds Chemical class 0.000 claims 2
- 229910010272 inorganic material Inorganic materials 0.000 claims 2
- 229920001225 polyester resin Polymers 0.000 claims 2
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical class OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 claims 1
- 150000001558 benzoic acid derivatives Chemical class 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000004927 clay Substances 0.000 claims 1
- 238000001816 cooling Methods 0.000 claims 1
- 239000003484 crystal nucleating agent Substances 0.000 claims 1
- 238000002425 crystallisation Methods 0.000 claims 1
- 230000008025 crystallization Effects 0.000 claims 1
- 235000014113 dietary fatty acids Nutrition 0.000 claims 1
- 239000000194 fatty acid Substances 0.000 claims 1
- 229930195729 fatty acid Natural products 0.000 claims 1
- 150000004665 fatty acids Chemical class 0.000 claims 1
- 229910052500 inorganic mineral Inorganic materials 0.000 claims 1
- 239000000155 melt Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000011707 mineral Substances 0.000 claims 1
- 239000004645 polyester resin Substances 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 239000000454 talc Substances 0.000 claims 1
- 229910052623 talc Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002302186A JP4273739B2 (ja) | 2001-10-16 | 2002-10-16 | 誘電加熱接着用樹脂組成物、ホットメルト接着剤、被接着材の接着方法、ホットメルト接着剤の被接着材として用いられる被接着用樹脂組成物および接着複合体 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001318174 | 2001-10-16 | ||
| JP2001-318174 | 2001-10-16 | ||
| JP2002302186A JP4273739B2 (ja) | 2001-10-16 | 2002-10-16 | 誘電加熱接着用樹脂組成物、ホットメルト接着剤、被接着材の接着方法、ホットメルト接着剤の被接着材として用いられる被接着用樹脂組成物および接着複合体 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003161068A Division JP4097566B2 (ja) | 2001-10-16 | 2003-06-05 | 接着複合体の解体方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003193009A JP2003193009A (ja) | 2003-07-09 |
| JP2003193009A5 true JP2003193009A5 (OSRAM) | 2004-07-15 |
| JP4273739B2 JP4273739B2 (ja) | 2009-06-03 |
Family
ID=27615481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002302186A Expired - Fee Related JP4273739B2 (ja) | 2001-10-16 | 2002-10-16 | 誘電加熱接着用樹脂組成物、ホットメルト接着剤、被接着材の接着方法、ホットメルト接着剤の被接着材として用いられる被接着用樹脂組成物および接着複合体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4273739B2 (OSRAM) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4051605B2 (ja) * | 2002-02-15 | 2008-02-27 | 東洋紡績株式会社 | 樹脂組成物、それを用いた接着剤およびその接着方法 |
| US20040249042A1 (en) * | 2003-06-09 | 2004-12-09 | Motorola, Inc. | Microwave removable coating |
| CN100582167C (zh) | 2003-09-30 | 2010-01-20 | 株式会社日本触媒 | 复合电介质用树脂组合物及复合电介质、使用该电介质的电路基板 |
| JP2005131759A (ja) * | 2003-10-31 | 2005-05-26 | Denso Corp | 融解・凝固式組成物および融解・凝固式ワーク固定剤ならびにこれらの被覆体 |
| WO2005078035A1 (ja) * | 2004-02-18 | 2005-08-25 | Mitsubishi Plastics, Inc. | 接着剤及びそれを用いた電気資材用被覆フィルム |
| JP2010006908A (ja) * | 2008-06-25 | 2010-01-14 | Denso Corp | 接着剤、接着構造体及び高周波誘電加熱接着装置 |
| WO2011027524A1 (ja) | 2009-09-02 | 2011-03-10 | 株式会社カネカ | 誘電加熱用ホットメルト接着材 |
| JP6123047B2 (ja) * | 2012-02-17 | 2017-05-10 | 埼玉県 | 樹脂接合方法 |
| US9334431B2 (en) * | 2013-05-23 | 2016-05-10 | Bostik, Inc. | Hot melt adhesive based on low melting point polypropylene homopolymers |
| KR101728717B1 (ko) | 2015-12-24 | 2017-04-20 | 한국신발피혁연구원 | 접착공정을 단축시킬 수 있는 유도가열이 가능한 피착재 조성물을 이용한 유도가열 방법 |
| KR101860998B1 (ko) * | 2016-04-22 | 2018-07-02 | 부경대학교 산학협력단 | 유도 가열 가능한 접착 필름 및 이를 이용한 접착 장치 |
| US11673340B2 (en) | 2016-10-27 | 2023-06-13 | Lintec Corporation | Dielectric-heating bonding film and bonding method using dielectric-heating bonding film |
| US20200010730A1 (en) * | 2017-02-09 | 2020-01-09 | Lintec Corporation | Dielectric heating adhesive film and adhesion method using dielectric heating adhesive film |
| KR102776201B1 (ko) | 2018-09-20 | 2025-03-07 | 도레이 카부시키가이샤 | 열가소성 폴리에스테르 수지 조성물 및 성형품 |
| JP7312539B2 (ja) * | 2018-10-31 | 2023-07-21 | リンテック株式会社 | 高周波誘電加熱接着シート |
| JP7668218B2 (ja) * | 2019-08-23 | 2025-04-24 | 株式会社クラレ | 複合成形体の製造方法 |
| KR20220082010A (ko) * | 2019-10-10 | 2022-06-16 | 엘지전자 주식회사 | 유도 가열형 접착제 및 이의 제조 방법 |
| JP7804574B2 (ja) * | 2020-06-30 | 2026-01-22 | リンテック株式会社 | 高周波誘電加熱接着シート |
-
2002
- 2002-10-16 JP JP2002302186A patent/JP4273739B2/ja not_active Expired - Fee Related
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