JP2003188302A - Composite electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a composite electronic component that is not deteriorated in electrical characteristic by holding the airtightness of cavities even when mechanical stresses, such as impacts, etc., are applied during its manufacturing process. <P>SOLUTION: External wiring conductors formed on outer peripheral surface of a laminate contain 0.1-1 wt.% V<SB>2</SB>O<SB>5</SB>per 100 wt.% one kind of metallic component selected from among Au, Cu, and Ag. In addition, internal wiring conductors formed in the laminate contain an Ag metallic component as their main component and are formed by baking conductive paste containing 0.1-2 wt.% organic metal selected out of organic magnesium and organic calcium per 100 wt.% the Ag metallic component. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite electronic component used in a transmission / reception control circuit of a high frequency communication device, and more particularly,
The present invention relates to a composite electronic component in which an electronic component element such as a surface acoustic wave element is housed in a cavity formed on the main surface of a laminated body and hermetically sealed.

[0002]

2. Description of the Related Art Conventionally, in a composite electronic component used in a transmission / reception control circuit of a high frequency communication device, as an electronic component element, for example, LiTaO ₃ , LiNbO ₃ , Li ₂ Nb ₄ O is used.
A surface acoustic wave element formed by depositing a comb-teeth shaped Al electrode on the surface of a piezoelectric substrate such as ₇ was housed and hermetically sealed in order to maintain stable electrical characteristics.

FIG. 3 shows such a conventional composite electronic component 30.
Shown in. In FIG. 3, a cavity 32 is formed on the main surface of the laminate 31, and an electrode pad 34 is formed inside the cavity 32.
4, an electronic component element 33a such as a surface acoustic wave element is flip-chip mounted via bumps 35. The opening of the cavity 32 is hermetically sealed with a sealing metal lid 36 joined via a sealing member.

One of the internal wiring conductors 40a and 40b is connected to the electrode pad 34 inside the cavity 32, and the other is extended to the outer periphery of the laminated body 31 along the laminating surface direction and the laminating surface thickness direction of the laminated body 31. ing.

On the outer periphery of the laminate 31, electronic component elements 33b such as resistors and capacitor elements are connected and fixed to surface electrodes 41a for mounting by soldering or electrodes on a mother board (not shown). Back electrode 4 for
External wiring conductors 41 such as 1b and end surface electrodes 41c formed in the thickness direction of the end surface of the laminated body 31 are formed.
These external wiring conductors 41 cover the exposed ends of the internal wiring conductors 40 (internal wiring layers 40a, via hole conductors 40b) extended to the outer periphery of the laminated body 31 so as to cover the internal wiring layers 40a and via holes of the internal wiring conductors 40. It is connected to one of the conductors 40b.

In the composite electronic component 30 described above, as a material for the laminate 31, the laminate substrate has conventionally been fired at a firing temperature of 8%.
Materials that can be fired at a relatively low temperature of 00 to 1050 ° C. have been studied. This is because a low-resistance material having a low melting point such as Ag-based, Cu-based, or Au-based is used as a wiring material for the purpose of speeding up the circuit. Therefore, a substrate material that can be co-fired with the wiring material at a low temperature is desired. This is because Therefore, as such a substrate material, a ceramic material is 10 to 60 wt% and a low melting point glass component is 90 to 40%.
A glass-ceramic material mixed in a wt% ratio is used.

The internal wiring conductor 40 and the external wiring conductor 4 are also included.
1 uses, for example, a conductive paste in which about 99 wt% Ag-based metal powder in the metal component, about 1 wt% Pt-based metal powder in the metal component, borosilicate low-melting glass, an organic binder, and an organic solvent are homogeneously mixed. It was formed by forming a conductor on an unfired ceramic green sheet and firing it simultaneously with the laminate substrate.

Further, the composite electronic component 30 described above is collectively fired in the state of a collective laminate substrate in which a large number of laminates 31 are taken in order to improve the productivity in the manufacturing process, and the electronic component elements 33a and 33b are mounted and mounted. After the cavity 32 was sealed, it was divided into individual composite electronic components 30 through break and cutting steps.

[0009]

When the composite electronic component 30 is used in a mobile phone or the like, high reliability is required with respect to external mechanical stress such as drop impact or vibration. Further, the composite electronic component 30 is collectively fired in the state of an aggregated laminate substrate from which a large number of laminates 31 are taken, and then divided and divided into individual composite electronic components 30 through the steps of breaking and cutting. It is inevitable that mechanical stress is applied in the manufacturing process.

On the other hand, when accommodating a surface acoustic wave element or the like as the electronic component element 33a, the cavity 32 is hermetically sealed with an inert gas such as N ₂ in order to maintain frequency accuracy and obtain stable electric characteristics. It is important to keep the airtightness inside the cavity 32.

However, in the above-mentioned composite electronic component 30, the internal wiring conductor 40 and the laminated body 3 are formed at the time of collective firing.
Due to the difference in the sintering behavior with the dielectric layer of No. 1, the contraction state during sintering of both of them was different, so that stress was generated at the bonding interface between the two, warpage of the substrate occurred and minute cracks were formed. . In addition, the external wiring conductor 41 and the laminated body 31
At the joint surface with the surface of the dielectric layer, the anchor effect due to the glass component of the substrate material of Ag particles is weak, and as a result, the joint strength is weak. Therefore, mechanical stress from the outside such as drop impact or vibration causes external wiring conductor There was a case where 41 was peeled from the surface of the dielectric layer and a minute crack was generated at the bonding interface between the two. Therefore, by connecting the crack at the joint interface between the internal wiring conductor 40 and the laminated body 31 and the crack at the joint interface between the external wiring conductor 41 and the laminated body 31, the inside of the cavity 32 and the outside of the laminated body 31 are connected. A through path will be formed between them, and as a result, the cavity 3
Leakage occurred in the inside of No. 2 and the airtightness could not be maintained, resulting in poor characteristics and reduced reliability performance.

The present invention has been devised in view of the above-mentioned problems, and an object thereof is to prevent the occurrence of cracks at the bonding interface between the internal wiring conductor and the dielectric layer and to provide the external wiring conductor. By increasing the bonding strength between the dielectric layer and the dielectric layer, even if a mechanical stress such as impact, drop impact, or vibration is applied during the manufacturing process, the airtightness of the cavity is maintained and the electrical characteristics are not deteriorated. It is to provide a composite electronic component having excellent reliability performance.

[0013]

The first invention of the present invention is as follows:
A laminated body in which a plurality of dielectric layers containing a glass component and a ceramic component are laminated, a cavity formed on the main surface of the laminated body, an electrode pad formed inside the cavity, and a lid body that seals the opening of the cavity. An external wiring conductor formed on the outer peripheral surface of the laminated body, an internal wiring conductor formed in the laminated body, and an electronic component element housed in the cavity so as to be connected to an electrode pad in the cavity. A composite electronic component having one of the internal wiring conductors connected to the electrode pad in the cavity, the other being exposed on the outer peripheral surface of the laminate, and the exposed portion being covered with the external wiring conductor. In, the external wiring conductor,
100w, a kind of metal component selected from Au, Cu, Ag
The composite electronic component is characterized by containing 0.1 to 1 wt% of V ₂ O ₅ with respect to t%.

According to a second aspect of the present invention, the internal wiring conductor contains an Ag metal component as a main component, and the Ag metal component 1
0.1 wt% of at least one organic metal selected from organomagnesium and organocalcium per 100 wt%
The composite electronic component of the first invention is characterized by being formed by firing a conductive paste containing 2 wt%.

According to the first aspect of the present invention, the external wiring conductor formed on the outer peripheral surface of the laminated body is 0.1 to 1 w for 100 wt% of one kind of metal component selected from Au, Cu and Ag.
It contains t% V ₂ O ₅ .

As a result, during simultaneous batch firing, V
₂ O ₅ promotes the anchoring effect between the Ag particles forming the Ag-based conductive paste and the glass component of the dielectric layer, and strengthens the spike structure between the Ag particles and the glass component. The bond strength between the laminate and the dielectric layer of the laminate is improved, and even if external mechanical stress such as impact due to division of the laminated laminate during the manufacturing process or drop impact or vibration is applied, peeling occurs at the interface between the two. The phenomenon can be prevented. As a result, in the external wiring conductor that is formed on the outer peripheral surface of the laminated body and covers the internal wiring conductor that extends from the inside of the cavity and is exposed on the outer peripheral surface of the laminated body, cracks or cracks occur at the bonding interface with the dielectric layer. The through-pass is not generated and the airtightness inside the cavity is maintained.

If the content of V ₂ O ₅ is less than 0.1 wt%, the effect of improving the bonding strength between the external wiring conductor and the dielectric layer of the laminate is small, and it is difficult to secure the airtightness inside the cavity. Is sufficient, and the content of V ₂ O ₅ is 1 wt%
If it is contained in a larger amount, the solder wettability of the conductor deteriorates.
Therefore, by setting the content to 0.1 to 1 wt%, the airtightness inside the cavity is maintained without the generation of cracks or through paths at the joint interface between the external wiring conductor and the dielectric layer. The solder wettability of the wiring conductor is not hindered, and problems can be eliminated even when the electronic component element is mounted by soldering. Therefore, it is possible to obtain a composite electronic component that does not cause characteristic deterioration such as frequency fluctuation, has excellent reliability performance, and has excellent mountability of electronic component elements.

According to the second aspect of the present invention, the internal wiring conductor contains 0.1 to 2 wt% of at least one organic metal selected from organomagnesium and organocalcium with respect to 100 wt% of Ag metal component. The conductive paste is formed by firing.

As a result, during simultaneous co-firing, A
Since organomagnesium or organocalcium diffuses between the g particles to prevent the Ag particles from contacting each other, the sintering of Ag is suppressed and the sintering temperature becomes high. Therefore, the difference in the sintering temperature between Ag and the dielectric becomes small, and the generation of cracks at the joint interface between the internal wiring conductor and the dielectric layer of the laminate, which has been conventionally caused by the difference in the sintering shrinkage behavior between the two, is suppressed. To be done.

If the content of organomagnesium or organocalcium is less than 0.1 wt%, the effect of suppressing the sintering of Ag is small, and cracks occur at the joint interface between the internal wiring conductor and the dielectric layer of the laminate. If the content exceeds 2 wt%, the conductor resistance increases and the electrical characteristics deteriorate. Therefore, by setting the content to 0.1 to 2 wt%, the occurrence of cracks at the joint interface between the internal wiring conductor and the dielectric layer of the laminated body is suppressed, thereby preventing the deterioration of the airtightness, and preventing the electrical characteristics. Will not be deteriorated. Therefore, in the internal wiring conductor that extends from the inside of the cavity formed in the main surface of the laminate and is exposed at the outer peripheral surface of the laminate, at the bonding interface between the internal wiring conductor and the dielectric layer of the laminate, as in the first invention, Airtightness is maintained. Therefore, characteristic deterioration such as frequency fluctuation does not occur,
A composite electronic component with excellent reliability performance and electrical characteristics can be obtained.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION The composite electronic component of the present invention is shown in the drawings.
It will be explained in detail based on this.

FIG. 1 is an external perspective view of a surface acoustic wave device 1 which is a composite electronic component of the present invention, and FIG. 2 is a schematic sectional view of FIG.

The surface acoustic wave device 1 is mainly composed of a laminated body 2 and electronic component elements 3a and 3b.

The laminated body 2 includes an internal wiring conductor 12 formed between arbitrary layers of a dielectric layer 2a formed by laminating a plurality of dielectric substrates,
The laminated body 2 includes a cavity 4 formed on the main surface of the laminated body 2 for accommodating the electronic component element 3a, and an external wiring conductor 11 formed on the outer peripheral surface of the laminated body 2 including the main surface, side surfaces, and end surfaces.

The dielectric layer 2a is made of a glass ceramic having a low permittivity as a material and a property suitable for a high frequency module, and an internal wiring conductor 12 made of a low impedance material such as Ag is formed as an internal wiring. There is.

As the electronic component element 3a, for example, a surface acoustic wave element is used, and a comb-teeth shaped Al electrode is formed on the surface of a piezoelectric substrate such as LiTaO ₃ . Further, the connection pad 30a is formed on the surface of the piezoelectric substrate of the electronic component element 3a, the Au bump 6 is formed by Au wire wire bonding on the connection pad 30a, and the laminated body 2 of the laminated body 2 is formed through the Au bump 6. It is connected to the electrode pad 7 formed on the bottom surface of the cavity 4.

The electronic component element 3b is, for example, a resistor or a capacitor element, and is mounted on the surface electrode 11a of the external wiring conductor 11 described later by, for example, soldering.

The internal wiring conductor 12 has, for example, an internal wiring layer 12a, a via-hole conductor 12b, and an end-face connecting conductor 12c.
It is formed by firing a conductive paste containing 0.1 to 2 wt% of at least one kind of organic metal selected from organomagnesium and organocalcium with respect to 100 wt% of the Ag metal component.

The structure is such that one of the internal wiring layers 12a is connected to the electrode pad 7 on the inner bottom surface of the cavity 4 and the other is extended along the laminating surface of the laminated body 2 and is connected to one of the end face connecting conductors 12c. The connection is made and the other end face connecting conductor 12c is exposed on the outer peripheral surface of the laminated body 2 to be connected to the end face terminal electrode 11c. The end-face connecting electrode 12c is thicker than the internal wiring layer 12a, and improves the connectivity of the end-face terminal electrode 11c.

Further, one of the other internal wiring layers 12a is connected to the electrode pad 7 on the inner bottom surface of the cavity 4, the other extends along the stacking surface of the stack 2 and in the stacking surface thickness direction of the stack 2. It is connected to one of the formed via-hole conductors 12b, and is exposed to the outer peripheral surface of the laminated body 2 and connected to the surface electrode 11a on the other side of the via-hole conductors 12b.

The cavity 4 is formed on the main surface of the laminated body 2, and an electrode pad 7 is formed on the bottom surface inside the cavity 4, and the electronic component element 3 a is formed on the electrode pad 7.
Flip chip mounting is performed via the u bump 6. The opening of the cavity 4 is sealed with a metallic lid 5 to seal the cavity 4. The lid 5 is, for example, Au-S.
n alloy or the like is used, and the electronic component element 3a
After housing, the airtight sealing is performed by brazing in a state of being filled with an inert gas such as N ₂ gas.

The external wiring conductor 11 is connected and fixed to the surface electrode 11a on the main surface of the laminate 2 on which the electronic component element 3b such as a resistor or capacitor element is mounted, or an electrode on a motherboard (not shown). Back surface terminal electrode 11b and laminated body 2
The end face terminal electrode 11c and the like are formed in the thickness direction of the end face.

These external wiring conductors 11 are made of Au, Cu, or Ag, which is a kind of metal component 10.
It contains 0.1 to 1 wt% of V ₂ O ₅ with respect to 0 wt%, and is connected to the internal wiring conductor 12 so as to cover the exposed end of the internal wiring conductor 12 extended to the outer periphery of the laminate 2. is doing.

The composite electronic component of the present invention is manufactured as follows.

That is, a dielectric ceramic green sheet is prepared, and a through hole that defines the shape of the cavity 4 and a through hole that becomes a via hole in which the via hole conductor 12b is formed is formed in each green sheet by a punching method. After that, the internal wiring layer 12a, the via-hole conductor 12b, the end face connecting conductor 12c, the front surface electrode 11a, the back surface terminal electrode 11b, the end surface terminal electrode 11c, etc. are formed on the green sheet by the screen printing method. Then, a plurality of green sheets are laminated to form a laminated body, and simultaneous co-firing is performed to form a collective laminated body. After that, the electronic component 3a having the Au bumps 6 formed in advance is housed in the cavity 4, filled with an inert gas such as N ₂ gas, and then the lid 5 is joined by brazing. Then, the composite electronic component 1 is formed by dividing the collective laminated body into individual laminated bodies 2 by a method such as breaking or cutting.

It is unavoidable that mechanical stress is applied to the laminate 2 during the breaking and cutting steps.

On the other hand, when accommodating a surface acoustic wave element or the like as the electronic component element 3a, the inside of the cavity 4 is hermetically sealed with an inert gas such as N ₂ in order to maintain frequency accuracy and obtain stable electric characteristics. It is important to maintain the airtightness inside the cavity 4.

Therefore, the first feature of the present invention is to provide the laminated body 2
The external wiring conductor 11 formed on the outer peripheral surface of Au, Cu,
It is necessary to contain 0.1 to 1 wt%, preferably 0.3 to 0.8 wt% of V ₂ O ₅ with respect to 100 wt% of one kind of metal component selected from Ag. That is, the powder of V ₂ O ₅ metal oxide in this range can further strengthen the spike structure of the anchor effect between the metal powder such as Au, Cu, and Ag and the glass component of the glass ceramic material. This allows the glass component of the glass-ceramic material to be stably adhered to the uneven surface of metal particles such as Au, Cu, Ag, etc., whereby a strong anchoring effect can be maintained for a long period of time and the laminate 2 and the outside The joint strength with the wiring conductor 11 is improved.

Further, if the content is the above, V ₂ O
_{Since 5} acts mainly on the interface between the laminate 2 and the external wiring conductor 11, it is less likely to deposit on the surface of the external wiring conductor 11 and hinders the solder wettability on the surface of the external wiring conductor 11. There is no.

Next, the second feature of the present invention is that the internal wiring conductor 12 formed inside the laminated body 2 contains an Ag metal component as a main component, and is selected from organic magnesium and organic calcium with respect to 100 wt% of the Ag metal component. 0.1-2 wt%, preferably 0.5-
That is, it is formed by firing a conductive paste containing 1.5 wt%.

That is, when the internal wiring conductor 12 using the conductive paste in such a range is co-fired together with the laminate 2, organomagnesium or organocalcium diffuses between Ag particles and the Ag particles come into contact with each other. Has a function of hindering. As a result, the sintering of Ag is suppressed, the sintering temperature becomes high, and the difference in the sintering temperature between Ag and glass ceramic becomes small. As a result, it is possible to prevent the occurrence of cracks at the bonding interface between the internal wiring conductor 12 and the dielectric layer, which has been conventionally caused by the difference in sintering shrinkage behavior between the two. Further, if the content of the organic magnesium or the organic calcium is 0.1 to 2 wt%, the conductor resistance of the internal wiring conductor 12 will not be significantly increased.

[0041]

[Experimental Example 1] The present inventor
The effect of containing V ₂ O ₅ in was investigated. First, a paste containing Ag as a metal component was prepared as the external wiring conductor paste, and V ₂ O ₅ was contained in the paste in the amounts shown in Table 1. Then, eight kinds of samples were prepared by printing, laminating, firing, mounting electronic component elements, encapsulating, and breaking each laminated body on a green sheet having a thickness of 200 μm made of glass ceramic as a substrate material by a predetermined method.

The sample thus obtained was immersed in a rosin-based flux solution, and then S containing 2% Ag at 230 ° C.
It was dipped in an n-Pb eutectic solder bath, and the solder wettability of the surface of the external wiring conductor 11 was examined. Solder wettability is "excellent" when 90% or more of the solder is attached to the entire surface area.
As a result, the value below that was determined to be “impossible”.

Regarding the joint strength, a solder-plated conductor wire of 0.6 mmφ was soldered to the external wiring conductor 11 of 2 mm □, and the joint strength was measured by the peel method. A He leak test was conducted using a He leak tester as an evaluation of airtightness. Table 1 shows the results of the solder wettability, the bonding strength, and the He leak test. In addition, as a judgment, a sample having good solder wettability and no defect in the He leak test was evaluated as ◯, and a sample excluding the sample at the critical point was evaluated as ⊚. In addition, a sample in which the solder wettability was impossible or a defect occurred in the He leak test was marked with x.

[0044]

[Table 1]

As is clear from Table 1 above, when the content of V ₂ O ₅ is 0.05 wt% or less, a strong bonding strength cannot be obtained and a layered body 2 is formed when mechanical stress is applied. The peeling phenomenon at the interface of the external wiring conductor 11 cannot be prevented, and it becomes difficult to maintain the airtightness of the cavity 4. Further, the content of the V ₂ O ₅ powder is 1.
When it is 5 wt%, V ₂ O ₅ is deposited on the surface of the external wiring conductor 11 and greatly impairs the solder wettability, so that it cannot be used as the external wiring conductor 11.

Therefore, the content of V ₂ O ₅ is 0.1 to 1 wt.
%, Preferably 0.3 to 0.8 wt%, the bonding strength between the laminated body 2 and the external wiring conductor 11 can be stably improved, and the airtightness of the cavity 4 is maintained. be able to. At the same time, since the wettability of the solder is not hindered on the surface of the external wiring conductor 11, the electronic component element 3b can be used without any problem in mountability. In addition, although the above-mentioned experimental example evaluated using Ag as a metal component of the external wiring conductor 11, the metal component was Cu.
It should be added that similar results were obtained with Au and Au.

[Experimental Example 2] Further, the present inventor investigated the effect of using a conductive paste containing organic magnesium for the internal wiring conductor 12. First,
A paste containing Ag as a metal component was prepared as the internal wiring conductor paste, and organomagnesium was contained in the paste in an amount shown in Table 2. Then, eight kinds of samples were prepared by printing, laminating, firing, mounting electronic component elements, encapsulating, and breaking each laminated body on a green sheet having a thickness of 200 μm made of glass ceramic as a substrate material by a predetermined method.

With respect to the eight kinds of samples prepared as described above, the conductor resistance of the internal wiring conductor 12 was measured, and the He leak test was carried out with a He leak tester, and cracks were observed at the interface between the internal wiring conductor 12 and the laminate 2. Was checked for. The results are shown in Table 2. In addition, as a judgment, a conductor showing a low value of 5 mΩ / □ or less and having no cracks and no defects in the He leak test was marked with ◯, and the sample excluding the sample at the critical point was evaluated as ◎. And A sample having a conductor resistance of more than 5 mΩ / □, or having a crack or a He leak test having a defect was designated as x.

[0049]

[Table 2]

As is clear from Table 2 above, when the content of organomagnesium is 0.05 wt% or less, the He leak defect occurs, but when the content of organomagnesium is 0.1 to 2 wt%. No He-leak defects and no cracks. Further, when the content of organomagnesium is 3 wt%, the conductor resistance increases and the electrical characteristics of the composite electronic component deteriorate. Therefore, it was confirmed that when the organomagnesium content is 0.1 to 2 wt%, the airtightness is maintained without causing the deterioration of the electrical characteristics, and the organomagnesium content is preferably 0.5 to
A stable effect can be expected at 1.5 wt%.

In the above experimental example, the conductive paste containing organomagnesium was used as the internal wiring conductor 12, but similar results were obtained with the conductive paste containing organocalcium instead of organomagnesium. I will add that.

[0052]

As described above, according to the composite electronic component of the present invention, the external wiring conductor formed on the outer peripheral surface of the laminate is A
100wt of one kind of metal component selected from u, Cu and Ag
% Of V ₂ O ₅ is contained.
As a result, the bonding strength between the external wiring conductor and the dielectric layer of the laminate is improved, and the airtightness of the cavity is maintained. As a result, the electrical characteristics are not deteriorated, the reliability performance is excellent,
In addition, a composite electronic component having excellent mountability of the electronic component element can be obtained.

Further, the internal wiring conductor formed inside the laminated body contains the Ag metal component as the main component, and the Ag metal component 100 w
0.1 to 2 wt% of at least one kind of organometal selected from organomagnesium and organocalcium with respect to t%
It is formed by firing the contained conductive paste. As a result, cracks are not generated at the joint interface between the internal wiring conductor and the dielectric layer of the laminated body, and the airtightness of the cavity is maintained. Therefore, it is possible to obtain a composite electronic component having excellent reliability performance without deteriorating the electrical characteristics.

[Brief description of drawings]

FIG. 1 is an external perspective view of a composite electronic component of the present invention.

FIG. 2 is a schematic sectional view of a composite electronic component of the present invention.

FIG. 3 is a schematic cross-sectional view of a conventional composite electronic component.

[Explanation of symbols]

1 ... Surface acoustic wave device 2 ... Laminated body 3a, 3b ... Electronic component element 4 ... Cavity 5 ... Metal lid 6 ... Au bump 7: Electrode pad 11 ... External wiring conductor 11a: Surface electrode 11b: Rear surface terminal electrode 11c ... End face terminal electrode 12-Internal wiring conductor 12a ... Internal wiring layer 12b ... via-hole conductor 12c ... End face connecting conductor

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 3/46 H05K 3/46 S // H01L 23/04 H01L 23/04 E (72) Inventor Hironobu Kuroyama 1-1-1 Yamashita-cho, Kokubun-shi, Kagoshima F-term in Kyocera Kokubun Factory (reference) 4E351 AA07 AA19 BB01 BB24 BB26 BB31 CC12 CC22 DD04 DD05 DD06 DD28 DD31 EE03 EE27 GG01 5E336 AA08 AA13 BB03 BB34 CC32 BC32 BC32 BC32 CC51 DD28 EE05 GG14 5E346 AA12 AA15 AA35 AA60 BB01 CC18 CC32 CC38 CC39 DD02 DD34 EE24 EE28 FF45 GG03 GG06 GG40 HH11 HH21

Claims (2)

[Claims] 1. A laminated body in which a plurality of dielectric layers containing a glass component and a ceramic component are laminated, a cavity formed on the main surface of the laminated body, an electrode pad formed inside the cavity, and an opening of the cavity. A lid for sealing, an external wiring conductor formed on the outer peripheral surface of the laminate, an internal wiring conductor formed in the laminate, and an internal wiring conductor housed in the cavity so as to be connected to the electrode pad in the cavity. An electronic component element, one of the internal wiring conductors is connected to the electrode pad in the cavity, the other is exposed on the outer peripheral surface of the laminate, and the exposed portion is covered with the external wiring conductor. In the composite electronic component, the external wiring conductor contains 0.1 to 1 wt% of V ₂ O ₅ with respect to 100 wt% of one kind of metal component selected from Au, Cu, and Ag. A composite electronic component characterized by the following. 2. The internal wiring conductor contains an Ag metal component as a main component, and contains 0.1 to 2 wt% of at least one kind of organic metal selected from organic magnesium and organic calcium with respect to 100 wt% of the Ag metal component. The composite electronic component according to claim 1, wherein the composite electronic component is formed by firing the conductive paste.