JP2003181799A - 接点支持機構、接点開閉器、計測装置及び無線機 - Google Patents
接点支持機構、接点開閉器、計測装置及び無線機Info
- Publication number
- JP2003181799A JP2003181799A JP2001381793A JP2001381793A JP2003181799A JP 2003181799 A JP2003181799 A JP 2003181799A JP 2001381793 A JP2001381793 A JP 2001381793A JP 2001381793 A JP2001381793 A JP 2001381793A JP 2003181799 A JP2003181799 A JP 2003181799A
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- JP
- Japan
- Prior art keywords
- contact
- movable
- fixed
- substrate
- movable contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000007246 mechanism Effects 0.000 title claims abstract description 28
- 239000000758 substrate Substances 0.000 claims description 54
- 230000005484 gravity Effects 0.000 claims description 7
- 230000009471 action Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000000151 deposition Methods 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 18
- 238000003466 welding Methods 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Landscapes
- Micromachines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001381793A JP2003181799A (ja) | 2001-12-14 | 2001-12-14 | 接点支持機構、接点開閉器、計測装置及び無線機 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001381793A JP2003181799A (ja) | 2001-12-14 | 2001-12-14 | 接点支持機構、接点開閉器、計測装置及び無線機 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005068633A Division JP4100404B2 (ja) | 2005-03-11 | 2005-03-11 | 接点支持機構、接点開閉器、計測装置及び無線機 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003181799A true JP2003181799A (ja) | 2003-07-02 |
| JP2003181799A5 JP2003181799A5 (enExample) | 2005-02-24 |
Family
ID=27592358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001381793A Withdrawn JP2003181799A (ja) | 2001-12-14 | 2001-12-14 | 接点支持機構、接点開閉器、計測装置及び無線機 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003181799A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006351296A (ja) * | 2005-06-14 | 2006-12-28 | Sony Corp | 可動素子、ならびにその可動素子を内蔵する半導体デバイス、モジュールおよび電子機器 |
| JP2006351295A (ja) * | 2005-06-14 | 2006-12-28 | Sony Corp | 可動素子、ならびにその可動素子を内蔵する半導体デバイス、モジュールおよび電子機器 |
| JP2007012558A (ja) * | 2005-07-04 | 2007-01-18 | Sony Corp | 可動素子、ならびにその可動素子を内蔵する半導体デバイス、モジュールおよび電子機器 |
| JP2008218024A (ja) * | 2007-02-28 | 2008-09-18 | Matsushita Electric Works Ltd | マイクロリレー |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6321288B2 (enExample) * | 1979-08-31 | 1988-05-06 | Matsushita Electric Works Ltd | |
| JPS6338810B2 (enExample) * | 1979-07-31 | 1988-08-02 | Matsushita Electric Works Ltd | |
| DE4205340C1 (en) * | 1992-02-21 | 1993-08-05 | Siemens Ag, 8000 Muenchen, De | Micro-mechanical electrostatic relay with parallel electrodes - has frame shaped armature substrate with armature contacts above base electrode contacts on base substrate |
| JPH0676716A (ja) * | 1992-08-27 | 1994-03-18 | Nippon Telegr & Teleph Corp <Ntt> | 電磁駆動リレー |
| JPH07161274A (ja) * | 1993-12-08 | 1995-06-23 | Nec Corp | シリコン超小形リレー |
| JPH08227646A (ja) * | 1994-10-18 | 1996-09-03 | Siemens Ag | マイクロメカニカルリレー |
| JPH10255637A (ja) * | 1997-03-14 | 1998-09-25 | Omron Corp | 熱駆動式マイクロリレー |
| JP2000149750A (ja) * | 1998-11-04 | 2000-05-30 | Nec Corp | マイクロマシンスイッチ |
| JP2000149751A (ja) * | 1998-11-12 | 2000-05-30 | Nec Corp | マイクロマシンスイッチ |
| WO2001009911A1 (de) * | 1999-07-29 | 2001-02-08 | Tyco Electronics Logistics Ag | Mikro elektromechanisches relais und verfahren zu dessen herstellung |
| JP2001291463A (ja) * | 2000-04-07 | 2001-10-19 | Matsushita Electric Ind Co Ltd | スイッチ |
-
2001
- 2001-12-14 JP JP2001381793A patent/JP2003181799A/ja not_active Withdrawn
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6338810B2 (enExample) * | 1979-07-31 | 1988-08-02 | Matsushita Electric Works Ltd | |
| JPS6321288B2 (enExample) * | 1979-08-31 | 1988-05-06 | Matsushita Electric Works Ltd | |
| DE4205340C1 (en) * | 1992-02-21 | 1993-08-05 | Siemens Ag, 8000 Muenchen, De | Micro-mechanical electrostatic relay with parallel electrodes - has frame shaped armature substrate with armature contacts above base electrode contacts on base substrate |
| JPH0676716A (ja) * | 1992-08-27 | 1994-03-18 | Nippon Telegr & Teleph Corp <Ntt> | 電磁駆動リレー |
| JPH07161274A (ja) * | 1993-12-08 | 1995-06-23 | Nec Corp | シリコン超小形リレー |
| JPH08227646A (ja) * | 1994-10-18 | 1996-09-03 | Siemens Ag | マイクロメカニカルリレー |
| JPH10255637A (ja) * | 1997-03-14 | 1998-09-25 | Omron Corp | 熱駆動式マイクロリレー |
| JP2000149750A (ja) * | 1998-11-04 | 2000-05-30 | Nec Corp | マイクロマシンスイッチ |
| JP2000149751A (ja) * | 1998-11-12 | 2000-05-30 | Nec Corp | マイクロマシンスイッチ |
| WO2001009911A1 (de) * | 1999-07-29 | 2001-02-08 | Tyco Electronics Logistics Ag | Mikro elektromechanisches relais und verfahren zu dessen herstellung |
| JP2001291463A (ja) * | 2000-04-07 | 2001-10-19 | Matsushita Electric Ind Co Ltd | スイッチ |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006351296A (ja) * | 2005-06-14 | 2006-12-28 | Sony Corp | 可動素子、ならびにその可動素子を内蔵する半導体デバイス、モジュールおよび電子機器 |
| JP2006351295A (ja) * | 2005-06-14 | 2006-12-28 | Sony Corp | 可動素子、ならびにその可動素子を内蔵する半導体デバイス、モジュールおよび電子機器 |
| JP2007012558A (ja) * | 2005-07-04 | 2007-01-18 | Sony Corp | 可動素子、ならびにその可動素子を内蔵する半導体デバイス、モジュールおよび電子機器 |
| JP2008218024A (ja) * | 2007-02-28 | 2008-09-18 | Matsushita Electric Works Ltd | マイクロリレー |
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| CN1979714A (zh) | 开关 |
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