JP2003163379A - Led light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED light emitting device in which the light emitted from the electrode forming surface of the LED mounted by a flip-chip method on a connecting terminal formed in a recess of a support base having the recess is efficiently output to the opening side of the recess 3. <P>SOLUTION: The LED light emitting device comprises a gap 18 opened at its outer periphery 17 and formed between the electrode forming surface 12 of the LED 5 and the bottom 4 of the recess 3 of the support base 2, the connecting terminal 7 formed on the upper surface of the support base 16 formed in the recess 3 of the base 2 so that the upper surface 15 is disposed at a position higher than the bottom position 19 of the opening outer periphery 17 of the gap 18. Thus, the light emitted from the electrode forming surface 12 of the LED 5 and reflected on the bottom 4 of the recess 3 opposed to the electrode forming surface 12 passes through the opening outer periphery 17 of the gap 18, and is outputted to the opening 14 side of the recess 3. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED (Light Emittinng Diode) having electrodes formed only on one surface side.
The present invention relates to an LED light emitting device in which a light emitting diode) is mounted in a flip chip method on a connection terminal formed in a recess of a support base having a recess.

[0002]

2. Description of the Related Art L in which electrodes are formed only on one surface side
As means for mounting so that the light from the ED can be extracted in a specific direction, for example, FIG. 12 ((a) is a schematic plan view,
(B) is a schematic cross-sectional view], a recess 3 is formed in the support base 2, an LED 5 is die-bonded to the bottom 4 of the recess 3, and the electrodes 6, 6 of the LED 5 and the support base 2 are formed. After connecting the connection terminals 7 and 7 with the gold wires 8 and 8, the recess 3
Is sealed with a transparent resin 9. The connection terminals 7 are the circuit patterns 10 formed on the support base 2.
Is also part of.

Some LEDs 5 used in such an LED light emitting device 1 emit light from the front and back surfaces and the side surfaces. Then, as a means for efficiently extracting the light emitted from the side surface of the LED 5 to the opening 14 side of the recess 3, the recess 3
There is a method of using the inner surface of the as a reflecting surface. However, since the light emitted from the surface on which the LED 5 is die-bonded is absorbed by the die-bonding resin, there is a problem that the light extraction efficiency from the LED 5 is insufficient.

As a means for improving the light extraction efficiency, as shown in FIG. 13 [(a) is a schematic plan view and (b) is a schematic cross-sectional view], the metal projections 1 are formed on the electrodes 6, 6 of the LED 5, respectively.
LED in which 1 and 11 are formed and the electrode forming surface 12 faces downward
By mounting 5 on the connection terminals 7, 7 formed on the bottom 4 of the recess 3 by the flip chip method, light from the electrode forming surface 12 of the LED 5 located on the bottom 4 side of the recess 3 The light reflected by the bottom 4 of the recess 3 facing the electrode forming surface 12 is passed through the LED 5 and the opening 1 of the recess 3 is formed.
Taking out to the 4 side is considered. However, when the reflected light is extracted by passing through the LED 5, the light is absorbed or reflected in the LED 5 and cannot be extracted efficiently. Therefore, regarding the extraction of the light from the electrode forming surface 12, , Measures to improve are needed.

In the flip-chip method, the surface of the LED 5 on which the semiconductor element is formed (electrode forming surface 12) faces the supporting base 2 (face down).
In this way, it represents a method of electrically connecting the electrodes 6, 6 of the LED 5 and the connection terminals 7, 7 on the support base 2.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to flip a connection terminal formed in a recess of a support base having a recess. LE that can efficiently extract the light emitted from the electrode formation surface of the LED mounted in the chip method to the opening side of the recess 3
D light emitting device.

[0007]

L of the invention according to claim 1
In an ED light emitting device, an LED having an electrode formed on only one surface side is mounted in a flip-chip method on a connection terminal formed in the recess of a supporting base having a recess.
1. An LED light emitting device, wherein light emitted from an electrode formation surface of an ED is reflected at the bottom of a recess facing the electrode formation surface and is extracted to the opening side of the recess. Between the surface and the bottom of the recess of the supporting base facing the electrode forming surface, a gap whose outer peripheral portion is open is formed, and the gap is higher than the bottom position of the open outer peripheral portion. The connection terminal is formed on the upper surface of the support base formed in the recess of the support base so that the upper surface thereof is located at a position, and the connection terminal is radiated from the electrode formation surface of the LED and is opposed to the electrode formation surface. The LED light-emitting device is characterized in that the light reflected at the bottom of is passed through the outer peripheral portion where the gap is open and is extracted to the opening side of the recess.

The LED light emitting device of the invention according to claim 2 is
The LED light emitting device according to claim 1, wherein a bottom of the recess forming the gap is formed in a concave shape.

The LED light emitting device of the invention according to claim 3 is
The supporting substrate having a recess is formed by a printed circuit board having a dug portion whose surface is a reflective surface, and a frame member which surrounds the dug portion and whose inner surface is a reflective surface. The LED light-emitting device according to claim 1 or 2, wherein a dug-near portion close to the dug-down portion is used as the support base, and the connection terminal is formed on an upper surface of the support base.

The LED light-emitting device of the invention according to claim 4 is
3. The LED light emitting device according to claim 1, wherein the support base is formed integrally with the support base so as to project from the bottom of the recess of the support base so as to stand up. .

The LED light emitting device of the invention according to claim 5 is
A convex portion that reflects light emitted from the electrode forming surface of the LED toward the outer peripheral portion where the gap is open is formed at the bottom of the recess of the supporting base facing the electrode forming surface of the LED. It is an LED light-emitting device in any one of Claims 1-4 characterized by the above-mentioned.

The LED light emitting device of the invention according to claim 6 is
The LED light-emitting device according to claim 5, wherein the convex portion has a dome shape or a conical shape.

The LED light emitting device of the invention according to claim 7 is
6. The LED light emitting device according to claim 5, wherein the convex portion is a polyhedron including a reflecting surface facing the outer peripheral portion where the gap is open.

The LED light-emitting device of the invention according to claim 8 is
The LED light-emitting device according to claim 5, wherein the convex portion is a convex portion whose top portion forms a cross-shaped ridgeline that extends radially outward from the center of the bottom portion of the recess.

The LED light emitting device of the invention according to claim 9 is
The LED light emitting device according to any one of claims 1, 2, and 4 to 8, wherein the support is columnar.

In the LED light-emitting device according to the tenth aspect of the present invention, the support base is a ridge that stands up so as to cross the bottom of the recess and the side surface of the support base forms a reflecting surface that extends downward. It is LED light-emitting device in any one of Claim 1, Claim 2, and Claim 4 characterized.

According to an eleventh aspect of the present invention, in the LED light-emitting device, the support base is the convex ridge, and the top surface of the ridge forms a cross shape that extends radially outward from the center of the bottom of the recess. The LED light emitting device according to claim 10, wherein the LED light emitting device is a strip portion.

The LED light emitting device of the invention according to claim 12 is characterized in that the support base has a truncated pyramid shape or a truncated cone shape, and the side surface thereof is a reflecting surface. The LED light-emitting device according to any one of 1.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows a first embodiment of the present invention, wherein (a) is a schematic plan view and (b) is a schematic sectional view.
The LED light-emitting device 1 of the first embodiment uses the support base 2 made of synthetic resin and made by molding. The support base 2 is formed with a recess 3, and the bottom 4 of the recess 3 is formed with pillar-shaped support bases 16 and 16 in which the height of the upper surface 15 is one step higher than the surroundings. . The column-shaped supporting bases 16 and 16 are formed so as to stand up from the bottom portion 4 of the recess 3. In addition, the pillar-shaped support bases 16, 16 are
Simultaneously with the production of the support base 2 by molding, it is formed integrally with the support base 2 by molding of synthetic resin. Then, the circuit patterns 10 and 10 extending from the support bases 16 and 16 to the outside of the recess 3 are formed by plating,
The connection terminals 7 and 7 are formed on the upper surface 15 of the supports 16 and 16 as part of the circuit patterns 10 and 10. The circuit pattern 10 is formed, for example, by plating a synthetic resin support substrate 2 with copper to form a copper film with a thickness of about 5 to 10 μm, and then performing nickel plating with a nickel film with a thickness of about 5 to 10 μm. A gold film having a thickness of about 0.3 to 0.5 μm may be formed on the surface of the film and then plated with gold to form a gold film on the surface.

In the LED light emitting device 1 of the first embodiment, the electrode forming surface 12 of the LED 5 and the electrode forming surface 12
A gap 18 whose outer peripheral portion 17 is open is formed between the bottom portion 4 of the recess 3 of the support base 2 facing the
The upper surface 15 of the support base 2 is positioned higher than the bottom position 19 of the open outer peripheral portion 17 of the gap 18.
A support 16 is formed in the recess 3. The inner surface of the recess 3 is formed to be a reflecting surface except for the columnar support 16 and the circuit pattern 10 formed in the recess 3. The specific means for forming the reflecting surface is not particularly limited. For example, it may be formed by means such as vapor deposition of a metal film such as aluminum on the inner surface of the recess 3. When the reflective surface is formed using a conductive material such as a metal film, the metal film is formed so that the metal film forming the reflective surface and the circuit pattern 10 are electrically insulated from each other. To do.

Then, metal projections 11 and 11 are formed on the electrodes 6 and 6 on the electrode formation surface 12 of the LED 5, and the metal projections 11 and 11 and the connection terminals 7 and 7 are joined to form L
The ED 5 is mounted on the support base 2 by the flip chip method.
The metal protrusions 11 and 11 can be formed by, for example, a method in which a gold wire is wire-bonded on the electrodes 6 and 6, and then the wire is cut off. By means of LE
Metal projections 11, 11 formed on the electrodes 6, 6 of D5,
This can be performed by joining the connection terminals 7, 7 on the support base 16 and forming an alloy layer. Further, after mounting the LED 5 on the support base 2 by the flip chip method, the inside of the recess 3 is filled with the transparent resin 9 to seal the LED 5 and the joint portion.

In the LED light emitting device 1 according to the first embodiment, the electrode forming surface 12 of the LED 5 and the electrode forming surface 12 are formed.
Since a gap 18 whose outer peripheral portion 17 is open is formed between the bottom portion 4 of the recess 3 of the support base 2 facing the electrode forming surface 12 of the LED 5. The bottom 4 of the recess 3 of the support base 2 facing 12
The light reflected by can pass through the outer peripheral portion 17 of the gap 18 that is open, and can be extracted to the opening 14 side of the recess 3.
In this case, the light passing through the open outer peripheral portion 17 may be reflected again on the inner surface of the recess 3 and then extracted to the opening 14 side of the recess 3. As described above, in the LED light emitting device 1 according to the first embodiment, the connection terminal 7 is mounted on the columnar support base 16 whose upper surface 15 is formed one step higher than the surroundings.
Therefore, as compared with the conventional LED light emitting device 1 shown in FIG. 13, in which the connection terminal 7 is formed on the bottom 4 of the recess 3 without forming such a support,
It is possible to secure a high height of the gap 18 formed between the electrode forming surface 12 of the LED 5 and the bottom portion 4 of the recess 3 of the supporting base 2 facing the electrode forming surface 12. Therefore, in the LED light emitting device 1 of the first embodiment, the light emitted from the electrode forming surface 12 of the LED 5 and reflected by the bottom portion 4 of the recess 3 is not reflected toward the electrode forming surface 12 of the LED 5 and is reflected by the LED 5. An outer peripheral portion 1 in which a gap 18 formed between the electrode forming surface 12 and the bottom portion 4 of the recess 3 of the support base 2 is opened.
The rate of passing 7 can be increased.
Therefore, the LED light emitting device 1 of the first embodiment is
5 is an LED light emitting device in which the efficiency of extracting light emitted from the electrode forming surface 12 of No. 5 is improved.

Next, FIG. 2 shows a second embodiment of the present invention, in which (a) is a schematic plan view and (b) is a schematic sectional view. The LED light-emitting device 1 according to the second embodiment is the same as the above-mentioned first embodiment.
In the LED light emitting device 1 of the embodiment, the outer peripheral portion 17 is formed between the electrode forming surface 12 of the LED 5 and the bottom portion 4 of the recess 3 of the supporting base 2 facing the electrode forming surface 12 so as to open. Regarding the gap 18 formed, the bottom portion 4 of the recess 3 forming the gap 18 is formed in a concave shape. Other than that, the LED light emitting device 1 of the first embodiment has the same structure.

In the LED light emitting device 1 according to the second embodiment, the recess 3 of the supporting base 2 facing the electrode forming surface 12 is formed.
Since the bottom portion 4 of the LED 5 is formed in a concave shape, the light emitted from the electrode forming surface 12 of the LED 5 and reflected by the bottom portion 4 of the recess 3 is not reflected toward the electrode forming surface 12 of the LED 5, An outer peripheral portion 1 in which a gap 18 formed between the electrode forming surface 12 and the bottom portion 4 of the recess 3 of the support base 2 is opened.
The rate of passing 7 can be increased.
Therefore, the LED light emitting device 1 of the second embodiment is
5 is an LED light emitting device in which the efficiency of extracting light emitted from the electrode forming surface 12 of No. 5 is further improved.

Next, FIG. 3 shows a third embodiment of the present invention, wherein (a) is a schematic plan view and (b) is a schematic sectional view. As shown in FIG. 3, the LED light-emitting device 1 of the third embodiment includes a support substrate 2 having a recess 3 and a printed circuit board 21 having a dug portion 20 having a reflecting surface.
Surrounding the dug portion 20 and the mounted LED 5,
The inner surface 22 is formed by a frame member 23 having a reflecting surface, and the digging proximity portion 24 that is close to the digging portion 20 of the printed circuit board 21 is used as the support base 16, and the upper surface 15 of the support base 16 is connected to the connection terminal. 7 is formed. The dug portion 20 is formed on the printed circuit board 21 so as to pass below the electrode forming surface 12 of the mounted LED 5 and extend outward from the mounted LED 5. Also,
The inner side surface 22 of the frame member 23 is formed as an inclined surface that is inclined inward. Although the frame member 23 of the third embodiment has a rectangular outer shape, it may have a polygonal shape or a circular shape. As the material of the frame member 23, various materials such as synthetic resin, metal, and ceramic can be used. Then, the printed circuit board 21 and the frame member 23 are fixed and integrated with each other by using, for example, an adhesive. The means for making the surface of the dug portion 20 and the inner side surface 22 of the frame member 23 the reflecting surface is not particularly limited, but may be formed by means of vapor deposition of a metal film such as aluminum. When the reflective surface is formed using a conductive material such as a metal film, the metal film forming the reflective surface and the circuit pattern 10 formed on the printed board 21 are electrically insulated. As described above, the metal film is formed.

In the LED light-emitting device 1 of the third embodiment, the support base 2 having the recess 3 is thus formed in the dug portion 2.
0 and a frame member 23, and the digging proximity portion 24 that is close to the digging portion 20 of the printed circuit board 21 is used as the support base 16, and the connection terminal 7 is provided on the upper surface 15 of the support base 16. Is formed. And
The circuit patterns 10 and 10 are provided on the printed circuit board 21 so as to extend to the outside of the LEDs 5 mounted on the support bases 16 and 16.
Is formed. The connection terminals 7, 7 formed on the supports 16, 16 are formed as a part of the circuit patterns 10, 10.

The circuit pattern 10 is formed by, for example, etching the copper foil (having a thickness of about 12 to 35 μm) of the copper clad laminate, which is a material for producing the printed circuit board 21, and then nickel plating. 5-10 μm
A nickel film having a thickness of about 10 μm is formed on a copper film (copper foil), and then gold plating is performed to form a gold film having a thickness of about 0.3 to 0.5 μm on the surface. Further, the electrical connection between the circuit pattern 10 and the outside is performed by, for example, a method of forming a through-hole portion which is electrically connected to the circuit pattern 10 on the printed board 21 and connecting the outside on the back surface of the printed board 21. be able to.

In the LED light emitting device 1 of the third embodiment, between the electrode forming surface 12 of the LED 5 and the bottom portion 4 of the recess 3 of the supporting base 2 facing the electrode forming surface 12,
A gap 18 whose outer peripheral portion 17 is open is formed by the dug portion 20 of the printed board 21. The digging proximity portion 24 that is close to the digging portion 20 of the printed board 21 is located at the bottom position 1 of the outer peripheral portion 17 of the gap 18.
The upper surface 15 is located at a position higher than 9 and the dug-down proximity portion 24 serves as a support base 16 on which the connection terminal 7 is formed.

Then, metal projections 11 and 11 are formed on the electrodes 6 and 6 on the electrode formation surface 12 of the LED 5, and the metal projections 11 and 11 and the connection terminals 7 and 7 are joined to each other to form L.
The ED 5 is mounted on the support base 2 by the flip chip method.
The metal protrusions 11 and 11 can be formed by, for example, a method in which a gold wire is wire-bonded on the electrodes 6 and 7, and then the wire is torn off. For mounting by the flip chip method, pressurization, heating, application of ultrasonic waves, etc. By means of LE
Metal projections 11, 11 formed on the electrodes 6, 6 of D5,
This can be performed by joining the connection terminals 7, 7 on the support base 16 and forming an alloy layer. Further, after mounting the LED 5 on the support base 2 by the flip chip method, the inside of the recess 3 is filled with the transparent resin 9 to seal the LED 5 and the joint portion.

In the LED light emitting device 1 according to the third embodiment, the electrode forming surface 12 of the LED 5 and the electrode forming surface 12 are formed.
Since a gap 18 whose outer peripheral portion 17 is open is formed between the bottom portion 4 of the recess 3 of the support base 2 facing the electrode forming surface 12 of the LED 5. The bottom 4 of the recess 3 of the support base 2 facing 12
The light reflected by the dug portion 20 can be extracted to the opening 14 side of the recess 3 through the outer peripheral portion 17 where the gap 18 is open. In that case, the light that has passed through the outer peripheral portion 17 again receives the inner surface of the recess 3 (the inner surface 22 of the frame member 23)
There is also a case where the light is reflected by and is taken out to the opening 14 side of the recess 3. Thus, the LED light emitting device 1 of the third embodiment
Then, the upper surface 15 is set to a position higher than the bottom position 19 of the outer peripheral portion 17 of the gap 18
Since the connection terminal 7 is formed on the (dug proximity portion 24), the connection terminal 7 is formed on the bottom portion 4 of the recess 3 without forming such a support.
As compared with the conventional LED light emitting device 1 shown in FIG. 3, the height of the gap 18 formed between the electrode forming surface 12 of the LED 5 and the bottom 4 of the recess 3 of the supporting base 2 facing the electrode forming surface 12 is It can be secured high. Therefore, in the LED light-emitting device 1 according to the third embodiment, the light emitted from the electrode forming surface 12 of the LED 5 and reflected by the bottom portion 4 of the recess 3 is reflected by the LED 5.
Ratio of light that passes through the open outer peripheral portion 17 of the gap 18 formed between the electrode forming surface 12 of the LED 5 and the bottom portion 4 of the recess 3 of the support base 2 without being reflected toward the electrode forming surface 12 of Can be made larger. for that reason,
The LED light-emitting device 1 of the third embodiment is an LED light-emitting device with improved light extraction efficiency.

Next, FIG. 4 shows a fourth embodiment of the present invention, in which (a) is a schematic plan view and (b) is a schematic sectional view. In the LED light emitting device 1 of the fourth embodiment, in addition to the LED light emitting device 1 of the first embodiment described above, the LED 5 is provided on the bottom portion 4 of the recess 3 of the supporting base 2 facing the electrode forming surface 12 of the LED 5. The light emitted from the electrode forming surface 12 of
An electrode forming surface 12 of D5 and a convex portion 28 for reflecting toward the outer peripheral portion 17 of the gap 18 formed between the bottom portion 4 of the recess 3 of the supporting base 2 facing the electrode forming surface 12 are added. I am preparing to do so. The convex portion 28 is formed so as to be integrated with the supporting base 2 by molding a synthetic resin at the same time when the supporting base 2 is manufactured by molding.
The surface is formed as a reflective surface. In addition, in the fourth embodiment, the convex portion 28 has a roof shape with a substantially triangular cross section, is below the electrode forming surface 12 of the mounted LED 5, and reaches the edge portion of the mounted LED 5. It is formed on the support base 2. And other than that, the LED of the first embodiment
It has the same structure as the light emitting device 1.

In the LED light emitting device 1 of the fourth embodiment, the light emitted from the electrode forming surface 12 of the LED 5 is emitted from the LED 5
The gap 1 formed between the electrode forming surface 12 and the bottom portion 4 of the recess 3 of the supporting base 2 facing the electrode forming surface 12
8 is provided with the convex portion 28 that reflects in the direction of the open outer peripheral portion 17, the light emitted from the electrode forming surface 12 of the LED 5 and reflected by the bottom portion 4 of the recess 3 is reflected by the LED 5
The ratio of passing through the open outer peripheral portion 17 of the gap 18 formed between the electrode forming surface 12 of the LED 5 and the bottom portion 4 of the recess 3 of the support base 2 without being reflected toward the electrode forming surface 12 of Can be larger. Therefore, the fourth
The LED light emitting device 1 of the embodiment is an LED in which the efficiency of extracting light from the electrode formation surface 12 of the LED 5 is further improved.
It becomes a light emitting device.

Next, FIG. 5 shows a fifth embodiment of the present invention, wherein (a) is a schematic plan view and (b) is a schematic sectional view. In the LED light emitting device 1 of the fifth embodiment, the mounted L in the LED light emitting device 1 of the fourth embodiment described above is mounted.
The convex portion 28 formed on the support base 2 below the electrode forming surface 12 of the ED 5 has a dome shape as shown in FIG. Other than that, the LED light-emitting device 1 of the fourth embodiment has the same structure. Therefore, the LED light emitting device 1 of the fifth embodiment is an LED light emitting device in which the efficiency of extracting light is further improved, similarly to the LED light emitting device 1 of the fourth embodiment.

Next, FIG. 6 shows a sixth embodiment of the present invention, in which (a) is a schematic plan view and (b) is a schematic sectional view. In the LED light emitting device 1 of the sixth embodiment, the mounted L in the LED light emitting device 1 of the fourth embodiment described above is mounted.
The convex portion 28 formed on the support base 2 below the electrode forming surface 12 of the ED 5 has a conical shape as shown in FIG. Other than that, the LED light-emitting device 1 of the fourth embodiment has the same structure. Therefore, the LED light-emitting device 1 of the sixth embodiment is an LED light-emitting device in which the efficiency of extracting light is further improved, similarly to the LED light-emitting device 1 of the fourth embodiment.

Next, FIG. 7 shows a seventh embodiment of the present invention, in which (a) is a schematic plan view and (b) is A- in (a).
It is a schematic sectional drawing which makes a line A a cross section. L of the seventh embodiment
In the ED light emitting device 1, the electrode forming surface 12 of the mounted LED 5 in the LED light emitting device 1 of the fourth embodiment described above.
As shown in FIG. 7, the convex portion 28 formed on the support base 2 below the base is shaped like a quadrangular pyramid, and the convex portion 28 faces the electrode forming surface 12. There is provided a reflecting surface facing the outer peripheral portion 17 where the gap 18 formed between the bottom portions 4 of the recess 3 of the base 2 is open. In addition, in the seventh embodiment, the LED 5 is provided with four electrodes 6, four columnar supporting bases 16 and four connection terminals 7 are formed so as to correspond to the respective electrodes 6, and each connection is further performed. The four circuit patterns 10 connected to the terminals 7 are formed. The other structures are substantially the same as the LED light emitting device 1 of the fourth embodiment. In the seventh embodiment, the convex portion 28
Is formed in a quadrangular pyramid shape, but even if the convex portion 28 is provided with a reflecting surface facing the outer peripheral portion 17 where the gap 18 is open.
Since the efficiency of taking out light can be further improved by forming the above, the convex portion 28 can be formed into various polyhedrons.

As described above, the seventh embodiment has the convex portion 28 having the reflecting surface facing the outer peripheral portion 17 in which the gap 18 is open, and therefore, as compared with the convex portion 28 having no such convex portion. The LED light emitting device has improved efficiency of extracting light from the electrode forming surface 12 of the LED 5.

Next, FIG. 8 shows an eighth embodiment of the present invention, in which (a) is a schematic plan view and (b) is B- of (a).
It is a schematic end view at the time of making B line into a cross section. In the LED light emitting device 1 of the eighth embodiment, the LE of the seventh embodiment is used.
The LE formed on the support base 2 below the electrode forming surface 12 of the mounted LED 5 in the D light emitting device 1.
Concerning the convex portion 28 that reflects the light emitted from the electrode forming surface 12 of D5 toward the outer peripheral portion 17 where the gap 18 is open,
As shown in FIG. 8A, the top portion 29 forms a cross-shaped ridge line that extends radially outward from the center of the bottom portion 4 of the recess 3. Further, the rising surface of the concave portion 3 of the convex portion 28 from the bottom portion 4 is formed as an inclined reflecting surface. The other structures are the same as those of the LED light emitting device 1 of the seventh embodiment.

As described above, the eighth embodiment has the convex portion 28 for reflecting the light toward the outer peripheral portion 17 where the gap 18 is open, so that the convex portion 28 is not provided with such a convex portion.
The LED light emitting device has improved efficiency of extracting light from the electrode forming surface 12 of the ED 5.

Next, FIG. 9 shows a ninth embodiment of the present invention, in which (a) is a schematic plan view and (b) is C- of (a).
It is a schematic sectional drawing which makes a C line a cross section. L of the ninth embodiment
In the ED light emitting device 1, instead of the columnar support base 16 in the LED light emitting device 1 of the first embodiment, the support base 1 is used.
6 is a ridge that stands up so as to cross the bottom 4 of the recess 3 and has a side surface that forms a reflecting surface that spreads downward. The top surface of the support base 16 serving as the protrusion is formed to be a substantially flat surface, and the connection terminal 7 and the circuit pattern 10 are formed on the top surface. The other structures are the same as those of the LED light emitting device 1 of the first embodiment.

As described above, in the ninth embodiment, the support base 1
Since 6 is formed as the ridge portion as described above, it is easier to manufacture the columnar support base than when it is formed. Similar to the LED light emitting device of the first embodiment, the LED light emitting device has an improved efficiency of extracting light from the electrode forming surface 12 of the LED 5.

Next, FIG. 10 shows a tenth embodiment of the present invention, in which (a) is a schematic plan view and (b) is a schematic end face when the DD line of (a) is taken as a cross section. It is a figure. Tenth
In the LED light-emitting device 1 of the embodiment, the LED light-emitting device 1 of the ninth embodiment has a protrusion that rises so as to cross the bottom portion 4 of the recess 3 and the side surface of the LED light-emitting device 1 forms a reflection surface that extends downward. Supporting base 16 formed by strips
In addition, the top surface of the concave portion 3 is a ridge portion that forms a cross shape that extends radially outward from the center of the bottom portion 4 of the recess 3. In addition, in the tenth embodiment,
The LED 5 has four electrodes 6, and each electrode 6
The four connection terminals 7 are formed on the support 16 so as to correspond to, and four circuit patterns 10 connected to each connection terminal 7 are formed.

As described above, in the tenth embodiment, since the support base 16 is formed as the above-mentioned protruding portion,
It is possible to deal with the LED 5 having four electrodes 6, and the support 16 can be manufactured more easily than when a columnar support is formed, and the electrode of the LED 5 is formed similarly to the LED light emitting device of the first embodiment. The LED light emitting device has improved efficiency of extracting light from the surface 12.

Next, FIG. 11 shows an eleventh embodiment of the present invention, in which (a) is a schematic plan view and (b) is a schematic sectional view. In the LED light-emitting device 1 according to the eleventh embodiment, the columnar support base 16 formed on the support base 2 in the LED light-emitting device 1 according to the fourth embodiment described above is shown in FIG.
As shown in, the shape is a truncated pyramid. Other than that, the LED light-emitting device 1 of the fourth embodiment has the same structure. Therefore, the LED light-emitting device 1 of the eleventh embodiment is an LED light-emitting device in which the efficiency of extracting light is further improved, similarly to the LED light-emitting device 1 of the fourth embodiment. In the eleventh embodiment, the support base 16
Although the shape is a quadrangular truncated pyramid, the same effect can be obtained by forming the shape of a truncated cone or various truncated pyramids.

[0045]

The LE of the invention according to claims 1 to 12
In the D light emitting device, a gap having an open outer periphery is formed between the electrode forming surface of the LED and the bottom of the recess of the supporting base facing the electrode forming surface, and the gap is opened. The connection terminal is formed on the upper surface of the support base formed in the recess of the support base so that the upper surface is located at a position higher than the bottom position of the outer peripheral portion, and the connection terminal is radiated from the electrode formation surface of the LED to form the electrode. Since the light reflected by the bottom of the recess facing the surface passes through the open outer periphery of the gap and is extracted to the opening side of the recess, the light is emitted from the electrode formation surface of the LED. The LED light emitting device has improved efficiency of extracting light to the opening side of the recess of the support base.

Claim 2, Claim 5, Claim 6, Claim 7, Claim 8, Claim 10, Claim 11 and Claim 12
In addition to the above effects, the LED light-emitting device according to the invention has the effect of further improving the efficiency of extracting the light emitted from the electrode formation surface of the LED to the opening side of the recess of the support base.

In the LED light-emitting device of the invention according to claim 3, in addition to the effects of the inventions according to claims 1 to 12, since the supporting substrate is formed by using the printed board,
Compared with the case where a complicated molding die is prepared and the supporting base is formed by molding, the supporting base can be easily produced.

[Brief description of drawings]

FIG. 1 is a diagram illustrating a configuration of a first embodiment of the present invention, in which (a) is a schematic plan view and (b) is a schematic sectional view.

2A and 2B are diagrams illustrating a configuration of a second embodiment of the present invention, in which FIG. 2A is a schematic plan view and FIG. 2B is a schematic sectional view.

3A and 3B are diagrams illustrating a configuration of a third embodiment of the present invention, in which FIG. 3A is a schematic plan view and FIG. 3B is a schematic sectional view.

FIG. 4 is a diagram illustrating a configuration of a fourth embodiment of the present invention, in which (a) is a schematic plan view and (b) is a schematic sectional view.

5A and 5B are diagrams illustrating a configuration of a fifth embodiment of the present invention, in which FIG. 5A is a schematic plan view and FIG. 5B is a schematic sectional view.

6A and 6B are diagrams illustrating a configuration of a sixth embodiment of the present invention, in which FIG. 6A is a schematic plan view and FIG. 6B is a schematic sectional view.

7A and 7B are diagrams illustrating the configuration of a seventh embodiment of the present invention, in which FIG. 7A is a schematic plan view and FIG. 7B is a schematic sectional view.

FIG. 8 is a diagram illustrating a configuration of an eighth embodiment of the present invention, in which (a) is a schematic plan view and (b) is a schematic end view.

9A and 9B are diagrams illustrating a configuration of a ninth embodiment of the present invention, in which FIG. 9A is a schematic plan view and FIG. 9B is a schematic sectional view.

FIG. 10 is a diagram illustrating a configuration of a tenth embodiment of the present invention, in which (a) is a schematic plan view and (b) is a schematic end view.

FIG. 11 is a diagram illustrating a configuration of an eleventh embodiment of the present invention, in which (a) is a schematic plan view and (b) is a schematic sectional view.

12A and 12B are diagrams illustrating an example of a conventional LED light emitting device, FIG. 12A is a schematic plan view, and FIG. 12B is a schematic sectional view.

13A and 13B are diagrams illustrating another example of the conventional LED light emitting device, FIG. 13A is a schematic plan view, and FIG. 13B is a schematic sectional view.

[Explanation of symbols]

1 LED light emitting device 2 Support substrate 3 recess 4 bottom 5 LED 6 electrodes 7 connection terminals 9 Transparent resin 10 circuit patterns 11 Metal protrusion 12 Electrode forming surface 14 openings 15 Upper surface 16 Support 17 Perimeter 18 Gap 19 Bottom position of the open outer circumference 20 Digging section 21 Printed circuit board 22 Inner surface 23 Frame member 24 Dug proximity 28 convex 29 top

Claims (12)

[Claims] 1. An L formed with an electrode only on one surface side.
The ED is mounted on the connection terminal formed in the recess of the supporting substrate having the recess by the flip chip method,
An LED light-emitting device in which light emitted from the electrode formation surface of D is reflected at the bottom of the recess facing the electrode formation surface and is extracted to the opening side of the recess. Between the surface and the bottom of the recess of the supporting base facing the electrode forming surface, a gap whose outer peripheral portion is open is formed, and the gap is higher than the bottom position of the open outer peripheral portion. The connection terminal is formed on the upper surface of the support base formed in the recess of the support base so that the upper surface thereof is located at a position, and the connection terminal is radiated from the electrode formation surface of the LED and is opposed to the electrode formation surface. The LED light-emitting device is characterized in that the light reflected at the bottom portion of the above is passed through the outer peripheral portion where the gap is opened and is extracted to the opening side of the recess. 2. The L according to claim 1, wherein the bottom of the recess forming the gap is formed in a concave shape.
ED light emitting device. 3. A support substrate having a recess is formed by a printed circuit board having a dug portion whose surface is a reflecting surface, and a frame member which surrounds the dug portion and whose inner surface is a reflecting surface. The LED according to claim 1 or 2, wherein the dug-near portion close to the dug-down portion of the printed circuit board is used as the support base, and the connection terminal is formed on the upper surface of the support base. Light emitting device. 4. The LE according to claim 1, wherein the support base is formed integrally with the support base so as to protrude from the bottom of the recess of the support base.
D light emitting device. 5. A convex for reflecting light emitted from the electrode forming surface of the LED toward the outer peripheral portion where the gap is open, at the bottom of the recess of the supporting base facing the electrode forming surface of the LED. The LED light-emitting device according to any one of claims 1 to 4, wherein the LED light-emitting device forms a portion. 6. The LED light emitting device according to claim 5, wherein the convex portion has a dome shape or a conical shape. 7. The LED light emitting device according to claim 5, wherein the convex portion is a polyhedron including a reflecting surface facing the outer peripheral portion where the gap is open. 8. The LED light-emitting device according to claim 5, wherein the convex portion is a convex portion whose top portion forms a cross-shaped ridge line that extends radially outward from the center of the concave bottom portion. 9. The LED light emitting device according to claim 1, wherein the support is columnar. 10. The support base stands up so as to cross the bottom of the recess, and the side surface of the support base is a ridge having a reflecting surface extending downward.
The LED light-emitting device according to claim 2 or 4. 11. The support base is the convex ridge, and the top surface of the ridge is a ridge having a cross shape that extends radially outward from the center of the bottom of the recess. Item 10. The LED light-emitting device according to item 10. 12. The support base has a truncated pyramid shape or a truncated cone shape, and a side surface thereof is a reflective surface, according to any one of claims 1, 2 and 4. LED
Light emitting device.