JP2003008074A - Surface mounting light emitting device and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface mounting light emitting device which can be made thin easily and its manufacturing method. SOLUTION: The surface mounting light emitting device comprises a package comprising a metal substrate 15 having a through hole 14 in the thickness direction and a thin flat plate 13 bonded to one side of the metal substrate to choke the through hole, and an LED chip 16 mounted on the thin flat plate in the through hole. The thin flat plate 13 is separated by an insulating separating part 24 of an insulating resin 13a into a first thin metal plate and a second thin metal plate. The insulating separating part is located on the bottom face of the through hole and the positive and negative electrodes of the LED chip are disposed oppositely to the first and second thin metal plates 13b and 13c, respectively, and connected therewith.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
The present invention relates to a surface mount light emitting device used as a light source for a full color display, a liquid crystal backlight, etc., and a method for manufacturing the same.

[0002]

2. Description of the Related Art Surface-mounted light-emitting devices have been widely used as light sources for in-switch lighting, full-color displays, liquid crystal backlights, and the like. A conventional chip component type light emitting device is, for example, as shown in FIG.
The LED chip 103 is provided on the substrate 1, and the substrate 101 is sealed with the translucent resin 105. here,
On the substrate 101, there are formed plating electrodes 102 made of metal patterns that are separated from each other so as to face each other on the upper surface and the lower surface of the substrate 101 by using electroless plating and electrolytic plating. Then, the LED chip 103 is bonded onto the substrate 101, and the negative electrode and the positive electrode of the LED chip 103 are connected to the plating electrode 102 by the bonding wires 104 and the like, respectively.

Further, in the surface mount type light emitting device shown in FIG. 12, the LED chip 103 installed by the flip chip method is provided in the through hole of the insulating substrate 106 made of white resin or the like, and the LED chip 103 is transparent in the through hole of the insulating substrate. It is sealed using a light-sensitive resin 105.

[0004]

However, as shown in FIG.
Since the conventional chip component type light emitting element shown in (1) requires a certain thickness of the substrate to secure mechanical strength, and has a structure in which the light emitting diode chip 103 is mounted on the substrate 101 by a wire bonding method, There is a limit to the thinning of the chip component type light emitting device. Further, since only the plated electrode 102 mainly conducts the heat generated from the light emitting diode chip 103, there is a problem that the heat radiation is not sufficient. Further, the structure has no reflector around the end of the translucent resin, and the light is not collected sufficiently. Here, the reflector means a side wall that reflects the light emitted from the end portion of the light emitting diode.

Further, the surface-mount type semiconductor device in which the light emitting diode is installed by the flip chip method shown in FIG.
Since the insulating substrate 106 including the reflector portion is made of an insulating material having poor thermal conductivity such as white resin, the heat around the light emitting portion cannot be sufficiently dissipated to the outside. As a result, heat is accumulated inside the light emitting element, causing discoloration of the encapsulating resin and deterioration of the chip quality, and the light emitting efficiency is reduced over time, so that the element life cannot be improved. Further, when emitting blue light or the like, the insulating substrate itself is deteriorated by ultraviolet rays, which causes deterioration of the light reflecting function of the reflector portion, resulting in deterioration of quality over time. However, in the case of this structure, in order to improve heat dissipation, it is necessary to increase the thickness of the member of the conductive portion 13 including the electrode, and as a result, it is difficult to reduce the thickness of the entire product by increasing the thickness thereof. It was

Therefore, an object of the present invention is to provide a surface mount type light emitting device which is improved in heat dissipation and can be easily thinned, and a manufacturing method thereof.

[0007]

In order to achieve the above object, a surface mount type light emitting device according to the present invention has a substrate having a through hole in a thickness direction, and a substrate having the through hole so as to close the through hole. A surface-mounted light-emitting device comprising a package consisting of a thin flat plate joined to one surface, and an LED chip provided on the thin flat plate in the through hole,
The substrate is made of a metal material, and the thin flat plate is separated into a first metal thin plate and a second metal thin plate by an insulating separating portion made of an insulating resin, and the insulating separating portion is formed on the bottom surface of the through hole. It is characterized in that the positive electrode and the negative electrode of the LED chip are connected so as to face the first thin metal plate and the second thin metal plate, respectively.

Since the surface mount type light emitting device formed as described above uses the package in which the metal substrate and the thin flat plate are bonded to each other, an element is formed by the metal substrate in which the through hole is formed. The mechanical strength can be maintained, and even if the thickness of the thin flat plate is thinner than that of the conventional substrate, the mechanical strength can be kept sufficiently high. That is, in the surface mounting type light emitting device according to the present invention, the thickness of the thin flat plate can be made thinner than that of the substrate of the conventional example, so that the surface mounting type light emitting device as a whole can be made thinner.

Further, the thickness of each of the first thin metal plate and the second thin metal plate can be made sufficiently thinner than the substrate in the conventional example of FIG. 12, and thicker than the plated electrode film formed on the substrate. be able to. Therefore, the heat conduction of the first and second metal thin plates can be made larger than that of the conventional plated electrode film, so that a sufficient heat dissipation effect can be obtained and a high current can be passed through the light emitting element.

A plurality of LED chips are provided inside the through hole, and the first thin metal plate is insulated and separated into a plurality of regions corresponding to the respective LED chips. Each electrode is isolated 1
It may be connected to one area.

Further, bumps may be formed on each surface of the first and second metal thin plates facing the outside of the package. With this configuration, the bonding strength (soldering strength) when the surface mount light emitting device is mounted can be maintained higher.

The through hole may have a tapered side surface that widens from the thin flat plate bonding surface toward one surface. With such a tapered side surface, L
The light emitted from the ED chip can be efficiently extracted from the light emitting element.

Further, the substrate may have an oxide film on its surface. When a film made of metal oxide is formed on the surface, the insulating property is further enhanced.

Further, the insulating resin is formed on the outer surface of the package so as to extend from between the first and second metal thin plates to the surface of the first and second metal thin plates. It is preferable. If formed in this way, it is possible to sufficiently prevent a short circuit between the first thin metal plate and the second thin metal plate during mounting.

Further, a method of manufacturing a surface mount light emitting device according to the present invention comprises a substrate having a through hole in a thickness direction and a thin flat plate bonded to one surface of the substrate so as to close the through hole. And a LED chip provided on the thin flat plate in the through hole, the method for manufacturing a surface mount light-emitting device, comprising: An insulating separation step of forming an insulating separation part for insulatingly separating the first metal thin plate and the second metal thin plate, and forming an oxide film and a film of an insulating adhesive material on one surface of the metal substrate. A step of forming a through hole in the thickness direction, and a step of joining the thin flat plate and one surface of the metal substrate so that the insulating separation portion is located on the bottom surface of the through hole of the substrate, the same surface Side has positive and negative electrodes The positive and negative electrodes of the LED chip, characterized in that it comprises a connection step of connecting to face respectively to the first metal sheet and the second sheet metal that.

In the insulating and separating step, in each of the regions to be the thin flat plate, a separating slit for separating the first thin metal plate and the second thin metal plate through the thin metal plate base material in the thickness direction. And a step of filling the separation slit with an insulating resin, and a step of bending the thin metal plate to the mounting surface side, and having an insulating separation portion filled with the insulating resin from the separation slit. This is a step of forming a thin flat plate.

By using this manufacturing method, the surface-mounted light emitting device can be easily manufactured.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

Embodiment 1. FIG. 1a is a perspective view showing a configuration of a surface-mounted light emitting device according to Embodiment 1 of the present invention. The surface mount light emitting device of the first embodiment is
Inside the package 1 including a metal substrate 15 having a through hole 14 penetrating in the thickness direction and a thin flat plate 13 bonded to one surface of the metal substrate 15 so as to close the through hole 14, a nitride-based material is provided. A light emitting diode chip (LED chip) 16 formed of a semiconductor and having n-side (negative) and p-side (positive) electrodes formed on the same side is resin-sealed.

More specifically, the metal substrate 15 has good thermal conductivity and is made of, for example, aluminum or aluminum alloy having a thickness of 0.06 mm to 2.0 mm, and the through hole 14 penetrating in the thickness direction at the central portion. Have. When a metal having good thermal conductivity is used for the substrate, heat can be easily released through the surface in close contact with the metal. Therefore, heat is not accumulated inside the through hole, and deterioration of the chip and discoloration of the translucent sealing resin due to heat can be prevented. here,
By using aluminum or aluminum alloy as the material of the metal substrate, the reflector portion maintains a high reflectance of 90% or more with respect to visible light in almost all wavelength regions,
It is not deteriorated by ultraviolet rays as in the case of using an insulating resin for the substrate. Furthermore, aluminum is a metal material that can be surface treated, so it is not only advantageous in terms of processing, but if it is processed after alumite treatment is applied to the adhesive surface with a thin flat plate, it will be an insulating adhesive due to the surface insulation effect. This is preferable because the insulating property is further increased than when using only a thin plate.

The cross-sectional shape of the through hole 14 may be an ellipse as shown in FIG. 1, or may be a circle or a rectangle other than the ellipse. That is, the present invention is not limited by the cross-sectional shape of the through hole 14 and can be arbitrarily selected from various shapes. In addition, in the through hole 14, the side surface of the through hole is inclined so that the opening diameter of the through hole 14 increases from one surface of the metal substrate 15 (the surface bonded to the thin flat plate) toward the other surface. Is preferred. When the side surface of the through hole 14 is inclined (preferably inclined by 45 degrees with respect to the surface of the metal substrate) in this way, the light emitted from the LED chip 16 toward the side surface of the through hole 14 is reflected by the side surface and is directed upward. Can be output to
The light emitted from the LED chip 16 can be efficiently extracted from the light emitting element.

The thin flat plate 13 is constructed by integrally holding the first metal thin plate 13b and the second metal thin plate 13c, which are insulated from each other in the insulating separation portion 24, by the insulating resin 13a. Here, the color of the insulating resin is preferably a white system having a high reflectance for light. As a result, the first metal sheet between the first and second metal thin plates
And the insulating resin 1 so as to extend on the surface of the second thin metal plate.
Even when 3a is formed, the light emitted from the LED chip 16 can be efficiently extracted from the light emitting element.

In the first embodiment, as shown in FIGS. 1A and 1B, in the package 1, the thin flat plate 13 is made of metal so that the insulating separation portion 24 is located on the bottom surface (immediately below) of the through hole 14. It is configured by being bonded to one surface of the substrate 15. In the first embodiment, the first metal thin plate 13b and the second metal thin plate 13c are directly connected to the electrodes of the mounting substrate without forming bumps. May be formed. This makes it possible to maintain a higher bonding strength (soldering strength) when the surface-mounted light emitting device is mounted, and improve electrical contact with the mounting surface.

Further, in the surface-mounted light emitting device of the first embodiment, the LED chip which is constructed by using the translucent substrate and has the positive electrode and the negative electrode on the same surface side is used.
One of the positive electrode and the negative electrode of the chip, the first metal thin plate 13b, and the other electrode of the LED chip and the second metal thin plate 13c are opposed to each other and are connected by a conductive material. Since it is not necessary to use wires, it is possible to make the entire element thinner. As described above, the LED chip 16 provided in the through hole 14 is sealed with a light-transmitting resin (not shown in FIG. 1).

Since the surface mount light emitting device of the first embodiment configured as described above uses the package 1 in which the metal substrate 15 and the thin flat plate 13 as described above are bonded, the metal substrate 15 is used. The mechanical strength of the entire device can be maintained. As a result, even if the thickness of the thin flat plate 13 is thinner than that of the substrate of the conventional example, the mechanical strength can be kept sufficiently high, and the thinning is possible. In addition, since a white resin substrate has been conventionally used, it is necessary to thicken the conductive portion of the thin flat plate in order to improve heat dissipation. By using a good metal material, the heat dissipation of the substrate is sufficient, so that the thin flat plate can be further thinned.

Further, in the surface mount type light emitting device of the first embodiment, the first metal thin plate 13b and the second metal thin plate 13 are provided.
Each thickness of c can be made thicker than the plated electrode film formed on the substrate in the conventional example of FIG. Therefore, the first thin metal plate 13b and the second thin metal plate 13 are
Since the heat conduction of c can be made larger than that of the conventional plated electrode film, a sufficient heat dissipation effect can be obtained and a high current can be passed through the light emitting element.

As described above, by changing the substrate from the white resin to the metal material, it is possible to further improve the heat dissipation and reduce the thickness of the entire element, and even if a high current is applied to the light emitting element for a long time, the light emission is higher than that of the conventional product. The efficiency can be maintained and the deterioration of the device can be suppressed. For example, the luminous efficiency when current is applied at 40 mA for 300 hours is 20% compared to the conventional product.
The above is also high.

Next, with reference to FIGS. 2 to 9, a method for manufacturing the surface mount light emitting device of the first embodiment will be described. In the following description of the manufacturing method, each component corresponding to one surface-mounted light-emitting device is shown and shown, but in the actual manufacturing process, each process is performed with a plurality of components assembled. Done. (First Step) In the first step, as shown in FIG.
An adhesive film 19 containing an epoxy-based insulating adhesive is thermocompression-bonded and affixed to the lower surface of a metal substrate 15 made of a resin laminated product that is an upper element of the package 1, and is machined using a drill or laser light. The through hole 14 is formed by laser processing. Here, it is preferable to have a narrow cavity structure in which the size of the through hole is approximately the same as the size of the chip installed in the through hole. For example, if a narrow-cavity structure is used in which the size of the through-hole is approximately the same as the size of the chip installed in the through-hole, the luminous intensity and the power are higher than those of the wire-bonding method shown in FIG. Both results are about 1.5 times higher. Further, at this time, as shown in FIG. 2B, the reflection efficiency can be enhanced as described above by forming the reflector portion by inclining the side surface of the through hole 14 using a specially shaped drill or the like.

It is preferable that a white metal such as aluminum or aluminum alloy is used for the metal substrate 15, and the upper surface of the metal substrate 15 is blackened with black ink or the like.
By doing so, the upper surface on the light emitting side becomes black and the light reflecting surface becomes white, so that the difference in lightness and darkness of an image, which is an important factor when used in a full-color display or the like, that is, the contrast can be improved.

In addition, the upper surface of the metal substrate is processed to have irregularities,
It is preferable that the fin effect be provided by increasing the surface area of the metal part because the heat dissipation is further improved. (Second Step) In the second step, the first metal thin plate 13b and the second metal thin plate 13c are formed in each of the regions of the metal thin plate base material having a plurality of regions to be the thin flat plate 13 of the package 1. A separation slit 24a for insulating and separating is formed.

More specifically, in each region of the metal thin plate base material made of, for example, Cu, a copper alloy such as phosphor bronze, or Sn-plated copper foil, the first surface of the back surface 22 of the metal thin plate base material is photographed by a first method. A separation slit 24a for insulating and separating the metal thin plate 13b and the second metal thin plate 13c is formed. (Third step) In the third step, the separation slit 24a
Then, the resin 13a that insulates and holds the first metal thin plate 13b and the second metal thin plate 13c is filled from the separation slit 24a on the bonding surface side of the metal substrate 15. At this time, the insulating resin may be formed so as to extend from between the first and second metal thin plates to the surfaces of the first and second metal thin plates. Next, as shown in FIG. 4a, the shape of the resin 13a is adjusted and solidified using a mold or the like. Further, as shown in FIG. 4b, the first thin metal plate 13b and the second thin metal plate 13c are mechanically bent to the opposite side of the separation slit 24a by bending (forming) to form a contact surface with the mounting substrate. To do. (Fourth Step) In the fourth step, as shown in FIG. 5, the insulating substrate 24 is formed so that the insulating slit 24a is filled with the insulating resin so that the insulating separating portion 24 is located in the through hole of the metal substrate 15. 15 and the thin flat plate 13 are attached to each other via an adhesive film 19 containing an insulating adhesive. At this time, the thin plate 1
It is preferable that the upper surface of the bonding side of No. 3 is roughened by a chemical etching method or a blasting method, whereby the adhesion with the metal substrate 15 can be improved. Further, the package 1 in which the thin flat plate 13 and the metal substrate 15 are bonded together has sufficient mechanical strength due to the metal substrate 15. (Fifth Step) In the fifth step, as shown in FIG. 6, the surface 2 of the first thin metal plate 13b located in the through hole 14 is formed.
6b and the surface 26c of the second thin metal plate 13c, and the inner surfaces of the first thin metal plate 13b and the second thin metal plate 13c are formed with a plating layer 27 made of Ag or Au by electroless plating or electrolytic plating. (Sixth Step) In the sixth step, as shown in FIG. 7, the LED is formed on the first thin metal plate 13b located in the through hole 14.
The chip is mounted, and one of the positive electrode and the negative electrode of the LED chip 16 is connected to the first thin metal plate 13b,
The other electrode of the LED chip is connected to the second metal thin plate 13c.
Connect to. In the method described above, for example, in the case of using an LED chip having a positive electrode and a negative electrode on the same surface side formed by using a transparent substrate, the positive electrode of the LED chip and the first metal thin plate 13b and The negative electrode of the LED chip and the second thin metal plate 13c are opposed to each other and are connected by a conductive material (flip chip method). By using this flip-chip method, it is possible to further reduce the thickness because there is no need to use wires. (Seventh Step) In the seventh step, as shown in FIG. 8, the LED chip 16 is sealed with the transparent resin 31 by filling the inside of the through hole 14 with the transparent resin 31. At this time, the translucent resin 31 may be formed in a convex lens shape so as to protrude from the upper surface of the metal substrate 15 of the package 1 to enhance the light collecting power. (Eighth step) In the eighth step, as shown in FIG. 9, balls made of a conductive material are arranged on the surface of the thin flat plate 13 or a paste-like conductive material is printed and exposed to a high temperature. The bump 32 may be formed by. When printing a paste-like conductive material, a cream-like conductive material can be printed by a screen printing method using a mask, and such a method can shorten the manufacturing period. Becomes The steps up to the eighth step are performed in a state where the parts corresponding to the plurality of surface mount light emitting devices are assembled.

The surface mounting type light emitting device of the first embodiment according to the present invention can be manufactured by the manufacturing method including the above first to eighth steps.

Embodiment 2. Next, a surface mount light emitting device according to a second embodiment of the present invention will be described.

The surface mount type light emitting device of the second embodiment is
Although it is manufactured based on the same concept as in the first embodiment, in the second embodiment, as shown in FIG.
It is characterized in that the package 30 that can mount three LED chips 360 of blue, green, and red is used.

That is, in the surface mounting type light emitting device of the second embodiment, the metal substrate 35 having the through hole 34 penetrating in the thickness direction and the one surface of the metal substrate 35 so as to close the through hole 34 are bonded. Three LED chips 360 are resin-sealed inside a package 30 including the thin flat plate 33.

Here, the cross-sectional shape of the through hole 34 is shown in FIG.
The shape may be an ellipse as shown in FIG. 2, or a circle or a square other than the ellipse, and it can be arbitrarily selected from various shapes. Further, in the through hole 34, the LED
In order to efficiently take out the light emitted from the chip 36, it is preferable to incline the side surface of the through hole 34 as in the first embodiment.

In the thin flat plate 33, the first metal thin plate 33a and the three second metal thin plates 33b, 33c, 33d separated from each other by the insulating separation portion 44 are made of the insulating resin 3.
It is integrated by being insulated by 3e.
Here, in the thin flat plate 33 of the second embodiment, the first thin metal plate 33a and the second thin metal plates 33b, 33c,
A bump may be formed on each of 33d. The first thin metal plate 33a and the second thin metal plates 33b, 33c,
It is preferable that each lower surface of 33d (the surface facing the outside in the surface-mounted light emitting device) is insulated by a resin layer except for the bump portion.

In the second embodiment, as shown in FIG. 10, the package 30 includes at least a part of the second metal thin plate 33b and a part of the second metal thin plate 33c.
Part of the second metal thin plate 33d and the first metal thin plate 33a
The thin flat plate 33 and the metal substrate 35 are bonded to each other so that a part of them is located inside the through hole 34.

Inside the through hole 34 of the package 30 thus constructed, the LED chip 360
Of the positive electrode and the negative electrode of the LED chip 36 are bonded to the first metal thin plate 33a.
Then, the other electrode of the LED chip 36 is connected to the second metal thin plates 33b, 33c, 33d by the flip chip method. By using this flip-chip method, it is possible to further reduce the thickness because there is no need to use wires.

Further, in the surface mount type light emitting device of the second embodiment, as in the first embodiment, the through hole 34 is filled with the light transmitting resin to seal the LED chip 360.

The surface-mounted light-emitting device of the second embodiment configured as described above can be thinned similarly to the first embodiment, and in addition, for example, blue, green, and red LED chips 34 are provided. By installing it, full-color display is possible.

The surface-mounted light emitting device of the second embodiment can be manufactured by the same method as in the first embodiment.

Modified example. In the first and second embodiments described above,
Although the first metal thin plate and the second metal thin plate are directly connected to the electrodes of the mounting substrate without generating bumps, the present invention is not limited to this, and the bumps are formed and mounted by the eighth step. You may make it mount on a board | substrate.

That is, as shown in FIG. 9, a thin flat plate composed of a first metal thin plate 13b having bumps and a second metal thin plate 13c may be used.

On the other hand, in the embodiment in which the bumps are not formed, the first metal thin plate 13b and the second metal thin plate 1 are formed.
In 3c, notches are formed in the portions located at both ends of the bonding surface of the chip. By forming the notch in this way, the bonding area can be increased when bonded to the mounting substrate, and thus the adhesive strength can be improved.
Further, for example, metal plating that facilitates soldering may be applied to the cutout portion so that the connection is made at the cutout portion. However, the notch is not an essential component in the present invention.

In the above-described first and second embodiments, the thin flat plate 13 or 33 and the metal substrate 15 or 33 are combined to form the package 1 or 30. As described above, with such a configuration, the surface mount type light emitting device alone can maintain sufficient mechanical strength.

Further, the present invention is not limited to the case where one or three LED chips are described in the first and second embodiments, and the number of LED chips can be arbitrarily selected. For example, two colors of red and yellow may be used, and by doing so, the emission color can be expanded.

[0048]

As described above in detail, the first surface-mount light-emitting device according to the present invention has a metal substrate having a through hole, and first and second electrodes insulated from each other in an insulating separation portion.
And a thin flat plate formed by interposing an insulating resin between the thin metal plate and the thin flat plate so that the insulating separation portion is located in the through hole. With such a configuration, even if the thickness of the thin flat plate is thinner than that of the conventional insulating substrate or resin layer, the mechanical strength of the element can be maintained by the metal substrate. In addition, since the metal substrate improves the heat dissipation more than twice as compared with the conventional one, the thickness of the surface-mounted light emitting device as a whole can be reduced, and further the metal reflector can emit blue light including ultraviolet rays. Since the parts do not deteriorate, it is possible to extend the life of the light emitting element.

The second surface-mounted light-emitting device according to the present invention is provided with a thin flat plate in which the first and second thin metal plates are insulated by an insulating resin in the insulating and separating portion, and the above-mentioned flat plate is provided on the thin flat plate. Since the LED chip is mounted and resin-sealed, the LED chip can be thin as in the first surface-mounted light-emitting device, and the configuration can be simplified.

Further, according to the first and second surface mount light emitting device manufacturing methods of the present invention, the first and second surface mount light emitting devices can be easily manufactured.

[Brief description of drawings]

FIG. 1A is a perspective view showing a configuration of a surface-mounted light emitting device according to a first embodiment of the present invention. b ... It is sectional drawing which shows the structure of the surface mount type light emitting device of Embodiment 1 which concerns on this invention.

2A is a schematic cross-sectional view for explaining a first step in the manufacturing method according to the first embodiment. FIG. b ... It is a schematic cross-sectional view for explaining the first step in the manufacturing method of the first embodiment.

FIG. 3 is a schematic cross-sectional view for explaining a second step in the manufacturing method according to the first embodiment.

FIG. 4 a is a schematic cross-sectional view for explaining a third step in the manufacturing method according to the first embodiment. b ... It is a schematic cross-sectional view for explaining a third step in the manufacturing method of the first embodiment.

FIG. 5 is a schematic cross-sectional view for explaining a fourth step in the manufacturing method according to the first embodiment.

FIG. 6 is a schematic cross-sectional view for explaining a fifth step in the manufacturing method according to the first embodiment.

FIG. 7 is a schematic cross-sectional view for explaining a sixth step in the manufacturing method according to the first embodiment.

FIG. 8 is a schematic cross-sectional view for explaining a seventh step in the manufacturing method according to the first embodiment.

FIG. 9 is a schematic cross-sectional view for explaining an eighth step in the manufacturing method according to the first embodiment.

FIG. 10 is a perspective view showing a configuration of a surface-mounted light emitting device according to a second embodiment of the present invention.

FIG. 11 is a perspective view showing a configuration of a conventional surface mount light emitting device.

FIG. 12 is a perspective view showing a structure of a conventional surface mount light emitting device having a structure different from that of FIG.

[Explanation of symbols]

1,30 ... Package, 13, 33 ... Thin flat plate, 13a, 33e ... Insulating resin, 13b, 33a ... the first thin metal plate, 13c, 33b, 33c, 33d ... second metal thin plate, 14, 34 ... through holes, 15, 35 ... Metal substrate, 16, 36 ... LED chips, 32 ... bump, 19 ... Adhesive film, 24, 44 ... Insulation separation part, 24a ... Separation slit 27 ... Plating layer, 104 ... conductive wire, 31, 105 ... Translucent resin, 106 ... Insulating substrate 360 ... LED chip using a nitride-based semiconductor, 361 ... Blue LED chip, 362 ... Green LED chip, 363 ... Red LED chip.

Claims (8)

[Claims] 1. A package comprising a substrate having a through hole in a thickness direction and a thin flat plate bonded to one surface of the substrate so as to close the through hole, and a thin flat plate on the thin flat plate in the through hole. A surface mount type light emitting device including an LED chip provided in the substrate, wherein the substrate is made of a metal material, and the thin flat plate is made of an insulating resin.
Is separated into a metal thin plate and a second metal thin plate, the insulating separation portion is located on the bottom surface of the through hole, and the positive electrode and the negative electrode of the LED chip are the first metal thin plate and the second metal thin plate. A surface-mounted light-emitting device, which is connected to a thin metal plate so as to face each other. 2. A plurality of LED chips are provided inside the through hole, and the first thin metal plate is insulated and separated into a plurality of regions corresponding to the respective LED chips.
2. The surface mount light emitting device according to claim 1, wherein each positive electrode of the ED chip is connected to one region which is insulated and separated. 3. The first surface facing the outside of the package.
A bump is formed on each surface of the first and second metal thin plates.
Alternatively, the surface-mounted light-emitting device according to item 2. 4. The surface mount light emitting device according to claim 1, wherein the through hole has a tapered side surface that widens from the thin flat plate bonding surface toward one surface. . 5. The surface mount light emitting device according to claim 1, wherein the substrate has an oxide film on its surface. 6. The insulating resin extends from the space between the first and second metal thin plates to the surface of the first and second metal thin plates on the outer surface of the package. The surface-mounted light-emitting device according to any one of 1 to 5. 7. A package comprising a substrate having a through hole in the thickness direction and a thin flat plate bonded to one surface of the substrate so as to close the through hole; and a thin flat plate on the thin flat plate in the through hole. A method for manufacturing a surface-mounted light-emitting device comprising an LED chip provided, wherein a first metal thin plate and a second metal thin plate are formed in each region of a metal thin plate base material which is a thin flat plate of the package. An insulation separation step of forming an insulation separation part for insulation separation; a step of forming an oxide film and a film of an insulating adhesive material on one surface of the metal substrate, and forming a through hole in the thickness direction, A bonding step of bonding the thin flat plate and one surface of the metal substrate so that the insulating separation portion is located on the bottom surface of the through hole of the substrate; and a positive LED chip having a positive electrode and a negative electrode on the same surface side. The electrode and the negative electrode are the first gold Method for producing a surface-mounted light emitting device which comprises a connection step of connecting each to face the sheet and the second sheet metal. 8. The insulating separation step penetrates the metal thin plate base material for separating the first metal thin plate and the second metal thin plate in the thickness direction in each of the regions to be the thin flat plate. An insulating separation part filled with the insulating resin from the separation slit, including a step of forming a separation slit, a step of filling the separation slit with an insulating resin, and a step of bending the thin metal plate toward a mounting surface side. The method for manufacturing a surface-mounted light-emitting device according to claim 7, which is a step of forming a thin flat plate having.