CN102664178A - Full-colored surface-mounted device - Google Patents
Full-colored surface-mounted device Download PDFInfo
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- CN102664178A CN102664178A CN2012101666491A CN201210166649A CN102664178A CN 102664178 A CN102664178 A CN 102664178A CN 2012101666491 A CN2012101666491 A CN 2012101666491A CN 201210166649 A CN201210166649 A CN 201210166649A CN 102664178 A CN102664178 A CN 102664178A
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Abstract
The invention discloses a full-colored surface-mounted device which comprises a substrate and four front pads. The four front pads isolating from one another are arranged on the front surface of the substrate. A red wafer, a green wafer and a blue wafer are fixing on three of the four front pads, the substrate is black, other four back pads isolating from one another are arranged on the back surface of the black substrate correspondingly, the black substrate is provided with four pores having an internally coated conductive layer, each pore is communicated with a front pad and a corresponding back pad electrically, sides of the black substrate are provided with four welding areas, and each welding area is covered by a conductor which is electrically connected with a corresponding back pad. The high-performance black substrate is adopted, a circuit on the front surface of the substrate is led to the back surface to form the welding conductive layer on the sides of the substrate, so that the full-colored surface-mounted device is black almost on the whole when viewed from the visible part of a lighting surface of the device, proneness to light reflection and blurred screen is avoided, and good displaying with high contrast and high definition is achieved.
Description
Technical field
The present invention relates to the LED technical field, relate more specifically to a kind of full-color surface mount device that is applicable to indoor LED display.
Background technology
In recent years, LED display relies on superiority such as its unique low price, low consumption, high brightness, long-life playing the part of important role in the flat panel display field always, and in one quite long from now on period, also has sizable development space.LED display has advantages such as high brightness, sliceable use, convenient, flexible, efficient low-consume, makes it show in large tracts of land, and particularly the application in fields such as physical culture, advertisement, finance, exhibition, traffic is quite extensive.Wherein, The full-color surface mount device (SMD) that is used for LED display all has straight cutting lamp unsurpassable characteristics and advantage aspect many because of it in that color rendition, colour consistency, visual angle, picture whole structure and structure are frivolous etc., so the full-color product of SMD will become the development main flow direction of following display screen.
As shown in Figure 1; The structure of surface mount device 1 commonly used comprises substrate 2 and four metal pad 3a, 3b, 3c and 3d being arranged on substrate front side in the prior art; Wherein three pad 3a, 3b, last red, green, blue wafer 4a, 4b and the 4c of being respectively arranged with of 3c; Adopt white pcb board to be used as substrate 2 in this structure, four corners of substrate 2 are provided with metal level and the bottom surface that the circuit-line of metal pad 3 is introduced substrate 2 from the front of substrate 2 are welded with convenience.Yet; As shown in Figure 1; The surface mounting technology of this structure is easy to generate following defective: substrate 2 the front showed is white substrate and circuit-line, be easy to generate reflectively, contrast is not high; Make that the whole illumination effect of being realized of device is very undesirable, can not satisfy of the requirement of LED market the high-contrast and the high definition of indoor demonstration.
Therefore, be necessary to provide a kind of full-color surface mount device to address the aforementioned drawbacks with high-contrast, high definition.
Prior art:
Full-color surface mount device 1 substrate 2
Wafer 4a, 4b and 4c
First embodiment:
Full-color surface mount device 10 substrates 11
Back side pad 112a, 112b, 112c and 112d
Pore 113a, 113b, 113c and 113d
Wafer 12 encapsulation blob of viscoses 13
Second embodiment:
Full-color surface mount device 20 substrates 21
/ 4th bronze medal posts, 215 pitch-dark layers 216
Wafer 22 encapsulation blob of viscoses 23
Summary of the invention
The purpose of this invention is to provide a kind of full-color surface mount device to meet the need of market with high-contrast, high definition.
To achieve these goals; The technical scheme that the present invention adopts is: a kind of full-color surface mount device is provided; It comprises substrate and is arranged at four isolated each other front pads on the substrate front side; Wherein be fixed with the red, green, blue wafer respectively on three front pads, said substrate is a black substrate, and the back side of said black substrate is provided with and four front pads, four each other isolated back side pads one to one; Offer the pore of plating conductive layer in four on the said black substrate; A front pad of each said pore electrical communication and a corresponding back side pad, the side of said black substrate are provided with and four back side pads, four welding regions one to one, are coated with the electric conductor that electrically connects the respective back surfaces pad on each said welding region.
Its further technical scheme is: said black substrate is complete black FR-4BT resin-based copper-clad plate.
Its further technical scheme is: said black substrate is rectangular, and four corners of said black substrate all offer the quadrant hole, and each said welding region is made up of the circular arc camber in the said quadrant hole.
Its further technical scheme is: said electric conductor is an electroplated metal layer, and said electroplated metal layer covers said circular arc camber fully.
Its further technical scheme is: also circular arc camber extends to the periphery that quadrant hole, place is positioned at substrate front side one side to said electroplated metal layer from the place.
Its further technical scheme is: said electric conductor is 1/4th bronze medal posts, and said 1/4th bronze medal posts just embed in the said quadrant hole fully.
Its further technical scheme is: a side of exposing on said 1/4th bronze medal posts in substrate front side is coated with pitch-dark layer.
Its further technical scheme is: filling has the copper post in the said pore, and the diameter of said copper post is identical with the pore size of said pore.
Its further technical scheme is: the front of said black substrate is coated with vaporific encapsulation blob of viscose, and said vaporific encapsulation blob of viscose is evenly mixed by the spread powder of epoxide-resin glue and tool mixed light and modifying function.
Its further technical scheme is: said spread powder is the spherical micropowder of organic silica gel resin, and said spread powder accounts for 3% ~ 15% of said vaporific encapsulation blob of viscose gross mass.
Compared with prior art; Full-color surface mount device provided by the invention adopts high performance black substrate to replace traditional white substrate; Through punching on black substrate the circuit of substrate front side is caused the back side and forms the welding electric conductor in substrate side surfaces, avoid exposing wiring, thereby can guarantee that device sees that from light-emitting area viewable portion in the past all is a black extremely greatly in the front; Avoid being prone to reflective and colored screen phenomenon, thereby realize the good display effect of high-contrast and high definition.
Through following description and combine accompanying drawing, it is more clear that the present invention will become, and these accompanying drawings are used to explain embodiments of the invention.
Description of drawings
Fig. 1 is the front schematic view of existing full-color surface mount device.
Fig. 2 is the front schematic view of full-color surface mount device first embodiment of the present invention.
Fig. 3 is the schematic rear view of full-color surface mount device shown in Figure 2.
Fig. 4 is the stereogram of full-color surface mount device shown in Figure 2.
Fig. 5 is another stereogram of full-color surface mount device shown in Figure 2.
Fig. 6 is the front schematic view of full-color surface mount device second embodiment of the present invention.
Fig. 7 is the schematic rear view of full-color surface mount device shown in Figure 6.
Fig. 8 is the stereogram of full-color surface mount device shown in Figure 6.
Fig. 9 is another stereogram of full-color surface mount device shown in Figure 6.
Each description of reference numerals is following among the figure:
Embodiment
To combine the accompanying drawing in the embodiment of the invention below, the technical scheme among the embodiment is carried out clear, intactly description, similar assembly label is represented similar assembly in the accompanying drawing.Obviously, below only be the present invention's part embodiment with the embodiment that describes, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
At first please with reference to Fig. 2 to Fig. 5, it has showed first embodiment of the full-color surface mount device of the present invention.In the present embodiment; Full-color surface mount device 10 comprises substrate 11, red, green, blue wafer 12 (figure does not show) and encapsulation blob of viscose 13, and wherein, said substrate 11 is a black substrate 11; This black substrate 11 is made up of complete black FR-4BT resin-based copper-clad plate; Should complete black FR-4BT resin-based copper-clad plate be that (Bismaleimide is BMI) with cyanate (cyanat eester, CE) the synthetic important a kind of special high-performance baseplate material that is used for PCB (printed circuit board) that makes of resin by BMI; Has very high high glass transition temperature (Tg); Performances such as outstanding dielectric property, low-thermal-expansion rate, good mechanical characteristic adopt this black substrate 11 can avoid producing the reflective harmful effect of Denging, increase the contrast of device.
In the present embodiment; The front of said black substrate 11 is provided with four isolated each other front pad 111a, 111b, 111c and 111d; The back side of said black substrate 11 correspondingly is provided with four isolated each other back side pad 112a, 112b, 112c and 112d, and each front pad 111a, 111b, 111c and 111d and back side pad 112a, 112b, 112c and 112d are and are plated in black substrate 11 lip-deep metal pads.In the present embodiment; The rectangular area at substrate 11 positive middle parts is the packaging area 131 of encapsulation blob of viscose 13; Above-mentioned four front pad 111a, 111b, 111c and 111d are positioned at this rectangular area; Wherein three front pads have at least the subregion to be positioned at same straight line, thus the red, green, blue wafer 12 that is installed on respectively on above-mentioned three front pad 111a, 111b and the 111c can on substrate, arrange in line, it is with respect to traditional " article " font arrangement mode; The colour cast problem reduces, and contrast increases.Particularly; According to traditional connected mode; One of them electrode of each wafer 12 is communicated with one of them front pad through plain conductor; Its another electrode is connected with that public front pad 111d outside said three front pad 111a, 111b and the 111c through plain conductor; Each wafer 12 is through crystal-bonding adhesive wafer firmly to be fixed on the respective metal pad with being connected of each metal pad, and wafer is fixed on after the metal pad, on said packaging area 131, covers encapsulation blob of viscose 13 to carry out sealing and fixing.
Preferably, the encapsulation blob of viscose 13 of present embodiment is vaporific, and this encapsulation blob of viscose 13 forms through in epoxide-resin glue, sneaking into spread powder equably, plays the effect of stress absorption, UV absorption and even light mixing.Preferably, the spread powder of adding epoxide-resin glue accounts for 3% ~ 15% of whole encapsulation blob of viscose 13 gross masses.In the present embodiment; Its preferable amount is 5% of encapsulation blob of viscose 13 gross masses; The vaporific encapsulation blob of viscose 13 that forms based on this proportioning compare traditional do not mix spread powder separately by transparent enclosure blob of viscose that epoxide-resin glue constituted; It can make the visible angle of device increase greatly, is increased to 150 degree ~ 160 degree by 125 original degree.The spread powder that present embodiment adopts is the spherical micropowder of organic siliconresin, and its concrete property is as shown in table 1.
| Outward appearance | The white micropowder |
| 105 ℃/3Hr of fugitive constituent (%) | 1.0 |
| Density | 1.3 |
| Average grain diameter (μ m) | 2.0 |
| Refractive index | 1.43 |
Table 1
Continuation is with reference to Fig. 2 to Fig. 5; In the present embodiment; Offer four pore 113a, 113b, 113c and 113d on the said black substrate 11; Each central point at said four pore 113a, 113b, 113c and place, 113d position line successively can form a rectangle also promptly four pore 113a, 113b, 113c and 113d are arranged in rectangle on black substrate 11; Each pore 113a (113b, 113c or 113d) links to each other with a front pad 111a (111b, 111c or 111d) and corresponding back side pad 112a (112b, 112c or 112d) simultaneously; Plating conductive layer (indicating) in the said pore 113a (113b, 113c or 113d) and with front pad 111a (111b, 111c and 111d) in its region and corresponding back side pad 112b (112b, 112c and 112d) electrical communication, thus with circuit from substrate 11 positive conductings to its back side.
Preferably; All clog in each pore 113a (113b, 113c or 113d) copper post 114 is arranged; The pore size of the diameter of said copper post 114 and each said pore 113a (113b, 113c or 113d) is identical blocking hole fully, thereby prevents that the positive encapsulation blob of viscose 13 of substrate 11 from causing the welding difficulty because the HTHP effect is overflow to the back metal pad in encapsulation process.In addition, two bottom surfaces of copper post 114 expose respectively and on the front and back of substrate 11, make its functional areas that still can be used as metal pad use, convenient welding and placement red, green, blue chip 12.
In the present embodiment; Said black substrate 11 rectangular shapes; Each corner in its four corners all is processed to a quadrant hole, and the circular arc camber in each quadrant hole is a welding region, is coated with the electric conductor that electrically connects the respective back surfaces pad on each welding region; Preferably; In the present embodiment, said electric conductor is electroplated metal layer 115 (comprises and be electroplate with certain thickness copper, nickel, three kinds of metal levels of gold from the inside to surface), and said electroplated metal layer 115 covers said circular arc camber fully and extends to the steadiness that the periphery that is positioned at substrate 11 positive sides is connected with substrate 11 with further reinforcement electroplated metal layer 115; Avoid electroplated metal layer 115 to come off (said electroplated metal layer 115 only cover in the circular arc camber and do not extend to substrate front side and also can realize) understandably.
Please with reference to Fig. 6 to Fig. 9, it has showed second embodiment of the full-color surface mount device of the present invention.In the present embodiment; Full-color surface mount device 20 comprises black substrate 21, red, green, blue wafer 22 and encapsulation blob of viscose 23 equally; Whole most of structure is identical with the full-color surface mount device 10 shown in first embodiment; Its main distinction point is: the electric conductor that is arranged in the present embodiment in the welding region is 1/4th bronze medal posts 215; Said 1/4th bronze medal posts 215 just embed in the quadrant hole of substrate 11 corners fully, also are that said 1/4th bronze medal posts 215 have the cross section identical with said quadrant hole and its two sides are just fair mutually with the front and back of said substrate 11.Preferably, sides of exposing on said 1/4th bronze medal posts in substrate 11 fronts are coated with pitch-dark layer 216 to add the black region in large substrates 21 fronts, further improve contrast.
As stated; Full-color surface mount device provided by the invention adopts high performance black substrate to replace traditional white substrate; Circuit through punching on black substrate with substrate front side causes the back side and forms the welding electric conductor in substrate side surfaces; Avoid exposing wiring in the front; Thereby can guarantee from light-emitting area see in the past viewable portion remove the encapsulation blob of viscose the zone all (like Fig. 6 of second embodiment and shown in Figure 8) or almost all (like Fig. 2 of first embodiment and shown in Figure 4) be black, avoid easy reflective and colored screen phenomenon, thus the good display effect of realization high-contrast and high definition.In addition, the used encapsulation blob of viscose of the present invention is to adopt epoxide-resin glue evenly to sneak into to be mixed with the spread powder of mixed light and modifying function (absorb stress and absorb UV) in right amount, thereby further improves all round properties of this full-color device on optics, structure and reliability.
Need to prove that other structure of the full-color surface mount device of the present invention is well known to those skilled in the art, and repeats no more at this.
Invention has been described more than to combine most preferred embodiment, but the present invention is not limited to the embodiment of above announcement, and should contain various modification, equivalent combinations of carrying out according to essence of the present invention.
Claims (10)
1. full-color surface mount device; Comprise substrate and be arranged at four isolated each other front pads on the substrate front side; Wherein be fixed with the red, green, blue wafer respectively on three front pads; It is characterized in that: said substrate is a black substrate; The back side of said black substrate is provided with and four front pads, four each other isolated back side pads one to one, offers the pore of plating conductive layer in four on the said black substrate, a front pad of each said pore electrical communication and a corresponding back side pad; The side of said black substrate is provided with and four back side pads, four welding regions one to one, is coated with the electric conductor that electrically connects the respective back surfaces pad on each said welding region.
2. full-color surface mount device as claimed in claim 1 is characterized in that: said black substrate is complete black FR-4BT resin-based copper-clad plate.
3. full-color surface mount device as claimed in claim 1; It is characterized in that: said black substrate is rectangular; Four corners of said black substrate all offer the quadrant hole, and each said welding region is made up of the circular arc camber in the said quadrant hole.
4. full-color surface mount device as claimed in claim 3 is characterized in that: said electric conductor is an electroplated metal layer, and said electroplated metal layer covers said circular arc camber fully.
5. full-color surface mount device as claimed in claim 4 is characterized in that: also circular arc camber extends to the periphery that quadrant hole, place is positioned at substrate front side one side to said electroplated metal layer from the place.
6. full-color surface mount device as claimed in claim 3 is characterized in that: said electric conductor is 1/4th bronze medal posts, and said 1/4th bronze medal posts just embed in the said quadrant hole fully.
7. full-color surface mount device as claimed in claim 6 is characterized in that: a side of exposing on said 1/4th bronze medal posts in substrate front side is coated with pitch-dark layer.
8. full-color surface mount device as claimed in claim 1 is characterized in that: filling has the copper post in the said pore, and the diameter of said copper post is identical with the pore size of said pore.
9. full-color surface mount device as claimed in claim 1 is characterized in that: the front of said black substrate is coated with vaporific encapsulation blob of viscose, and said vaporific encapsulation blob of viscose is evenly mixed by the spread powder of epoxide-resin glue and tool mixed light and modifying function.
10. full-color surface mount device as claimed in claim 9 is characterized in that: said spread powder is the spherical micropowder of organic silica gel resin, and said spread powder accounts for 3% ~ 15% of said vaporific encapsulation blob of viscose gross mass.
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| CN2012101666491A CN102664178A (en) | 2012-05-25 | 2012-05-25 | Full-colored surface-mounted device |
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| CN2012101666491A CN102664178A (en) | 2012-05-25 | 2012-05-25 | Full-colored surface-mounted device |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104377293A (en) * | 2014-11-29 | 2015-02-25 | 木林森股份有限公司 | Support for small-size multi-color LEDs |
| CN104409618A (en) * | 2014-12-05 | 2015-03-11 | 木林森股份有限公司 | Small-sized colorful LED lamp bead |
| CN107924962A (en) * | 2015-08-12 | 2018-04-17 | Lg伊诺特有限公司 | Light-emitting component and the display device with the light-emitting component |
| CN108511431A (en) * | 2018-05-21 | 2018-09-07 | 佛山市国星光电股份有限公司 | A kind of LED display unit group and display panel |
| CN113394327A (en) * | 2021-06-11 | 2021-09-14 | 深圳市洲明科技股份有限公司 | Packaging method and packaging structure of LED display screen and LED display screen |
| CN114413187A (en) * | 2022-01-27 | 2022-04-29 | 深圳市稳耀半导体科技有限公司 | Novel-structure LED module indicator lamp with blind hole multilayer PCB as carrier |
| CN115360186A (en) * | 2022-08-23 | 2022-11-18 | 深圳市天成照明有限公司 | CHIP LED packaging structure and processing technology |
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| CN104377293A (en) * | 2014-11-29 | 2015-02-25 | 木林森股份有限公司 | Support for small-size multi-color LEDs |
| CN104409618A (en) * | 2014-12-05 | 2015-03-11 | 木林森股份有限公司 | Small-sized colorful LED lamp bead |
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| CN113394327A (en) * | 2021-06-11 | 2021-09-14 | 深圳市洲明科技股份有限公司 | Packaging method and packaging structure of LED display screen and LED display screen |
| CN114413187A (en) * | 2022-01-27 | 2022-04-29 | 深圳市稳耀半导体科技有限公司 | Novel-structure LED module indicator lamp with blind hole multilayer PCB as carrier |
| CN115360186A (en) * | 2022-08-23 | 2022-11-18 | 深圳市天成照明有限公司 | CHIP LED packaging structure and processing technology |
| CN115360186B (en) * | 2022-08-23 | 2024-01-26 | 深圳市天成照明有限公司 | CHIP LED packaging structure and processing technology |
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Application publication date: 20120912 |