CN211907462U

CN211907462U - Double-color-temperature lamp band structure without light spots

Info

Publication number: CN211907462U
Application number: CN202020586733.9U
Authority: CN
Inventors: 彭胜钦; 钟云; 陈伟宁
Original assignee: Shenzhen Xinshang Technology Co ltd
Current assignee: Shenzhen Xinshang Technology Co ltd
Priority date: 2020-04-20
Filing date: 2020-04-20
Publication date: 2020-11-10
Anticipated expiration: 2030-04-20

Abstract

The utility model discloses a double-color temperature lamp band structure without light spots, which comprises a LED flip chip, a lamp band substrate, a copper-coated circuit, a lamp band welding area, electrical components and dam glue, wherein the LED flip chip is directly and densely packaged on the lamp band substrate in a double-path way, the surface of the lamp band substrate is covered with a layer of fluorescent glue for protecting a wafer or adjusting the luminous color at the same time, and the lamp band substrate is also provided with the copper-coated circuit for connecting the LED flip chip and the electrical components; two ends of the lamp strip substrate are provided with lamp strip welding areas, and two sides of the LED flip chip are coated with dam glue; the distance between the LED flip chips is less than 1.5 mm. The utility model discloses the interval has been dwindled greatly. Due to the continuous density of the chips, the light-emitting light of the lamp strip can realize continuous and uninterrupted effect, namely, no light spot exists, and the consistency is good.

Description

Double-color-temperature lamp band structure without light spots

Technical Field

The utility model relates to a LED technical field, concretely relates to two colour temperature band structures of no light spot.

Background

The LED strip is a product in which LEDs are mounted on a strip-shaped FPC (flexible printed circuit) or PCB (printed circuit board), and is named as a strip because the product is shaped like a strip. Because of long service life, energy conservation and environmental protection, the method gradually exposes the corner in various decoration industries. The light strip has the following features:

1. soft and can be curled at will.

2. Shearing and extension can be performed.

3. The electric bulb and the passage are completely covered in the flexible plastic, the insulation and waterproof functions are good, and the application safety is ensured.

4. The weather resistance is strong.

5. Not easy to crack and long in service life.

6. The decorative board is easy to make figures, characters and the like, and is widely used for decorating and lighting on buildings, bridges, approaches, gardens, courtyards, stratums, lie boards, furniture, buses, lakes, water bottoms, posters, whiteboards, signs and the like.

As shown in fig. 1, the appearance and components of the conventional dual color temperature light strip are as follows: the lamp strip substrate 1 is usually an FPC flexible printed circuit board, and a hard substrate or a metal substrate may also be used; different partitions and pins are arranged in the LED bracket 2 and used for arranging LED wafers; the LED chip 3 has various colors such as red, blue, green, yellow, white, etc.; the LED lamp beads 4 are generally formed by a blue light chip and coated fluorescent powder, the coated fluorescent powder is different, different color temperatures (such as white/warm white/cold white) are formed, the two lamp beads can independently emit light, and other colors can be mixed by adjusting the light emitting intensity of the two lamp beads; the fixed solder paste 5 is used for connecting pins of conducting the paster lamp beads or other electronic components; the electronic component 6 includes a resistor and the like; the strip substrate connection terminals 7 are used for external input line connections or interconnections between strips.

The disadvantages of the prior art are as follows:

1. the manufacturing process is complex, for example, as shown in fig. 1, a double-color temperature LED patch lamp bead, an LED wafer is fixed in a corresponding area in a bowl cup of an LED support through a die attach adhesive (including conductive and non-conductive adhesives, selected according to actual conditions), an electrode of the LED wafer is connected with a corresponding pin of the LED support through a metal wire (gold wire, silver wire, alloy wire, etc.), then a layer of protective adhesive is covered in the LED support to protect the LED wafer and the metal wire, then the prepared LED patch lamp bead is fixed in a corresponding position of a lamp strip substrate through tin paste or other conductive materials, and then other components, such as a resistor, etc., are fixed according to actual conditions;

2. as described above, the conventional LED strip has a complicated manufacturing process, which generally needs to be divided into two different manufacturing processes, such as an LED patch lamp bead packaging process and a strip finished product assembling process, and the labor manufacturing cost is high;

3. the volume of the LED surface-mounted lamp beads is far larger than that of the LED wafer, and a certain distance is needed, so that the LED surface-mounted lamp beads cannot be densely distributed on the lamp strip substrate;

4. the space between the LED surface-mounted lamp beads is large, the emitted light cannot realize continuous effect, and the light spot is large and poor in consistency when the light is emitted;

5. the light-emitting angle of the LED surface-mounted lamp bead is only about 120 degrees, and the LED surface-mounted lamp bead cannot form shielding when emitting light and outgoing, so that light rays are diffused outwards, and the color mixing effect is poor when condensing light;

to sum up, the utility model designs a two colour temperature band structures of no light spot.

Disclosure of Invention

Aiming at the defects in the prior art, the utility model aims to provide a structure of a dual-color temperature lamp band without light spots, which greatly reduces the space; due to the continuous density of the chips, the light-emitting light of the lamp strip can realize continuous and uninterrupted effect, namely, no light spot exists, and the consistency is good.

In order to achieve the above purpose, the present invention is realized by the following technical solution: a double-color-temperature lamp belt structure without light spots comprises an LED flip chip, a lamp belt substrate, a copper-clad circuit, a lamp belt welding area, an electrical component and dam glue, wherein the LED flip chip is directly and densely packaged on the lamp belt substrate in a double-circuit manner, a layer of fluorescent glue for protecting a wafer or adjusting the light-emitting color at the same time is covered on the surface of the lamp belt substrate, and the copper-clad circuit for connecting the LED flip chip and the electrical component is also arranged on the lamp belt substrate; the lamp area base plate both ends are provided with lamp area bonding region, and LED flip chip both sides coating has the box dam and glues.

Preferably, the fluorescent glue is divided into two kinds of fluorescent glue with different fluorescent powder concentrations, and the two kinds of fluorescent glue are respectively coated on the two paths of wafers.

Preferably, the two fluorescent glues are arranged in parallel and coated on the wafer or one of the fluorescent glues is firstly spotted, and then the first fluorescent glue is completely covered by the other fluorescent glue.

The utility model discloses a direct double-circuit intensive packaging of LED flip chip (and electronic components) is on lamp area base plate (be FPC soft board usually, also can use stereoplasm base plate or metal substrate), covers the fluorescent glue that the luminous colour was perhaps adjusted simultaneously to the one deck protection wafer again on lamp area base plate surface, and does not restrict the coating mode, can only coat and openly also can the positive and negative all coat at the base plate.

The utility model has the advantages that: the utility model has the advantages of reasonable design, the interval has been reduced greatly. Due to the continuous density of the chips, the light-emitting light of the lamp strip can realize continuous and uninterrupted effect, namely, no light spot exists, and the consistency is good.

Drawings

The present invention will be described in detail with reference to the accompanying drawings and specific embodiments;

FIG. 1 is a schematic diagram of a prior art structure;

FIG. 2 is a schematic structural view of the present invention without dam sealant;

FIG. 3 is a schematic structural view of the present invention;

FIG. 4 is a comparison of the present invention and prior art process;

fig. 5 is a flow chart of the dispensing of the present invention.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

Referring to fig. 2 to 5, the following technical solutions are adopted in the present embodiment: a double-color-temperature lamp belt structure without light spots comprises an LED flip chip A, a lamp belt substrate B, copper-clad circuits C, a lamp belt welding area D, an electrical component E and dam glue F, wherein the LED flip chip A is directly and densely packaged on the lamp belt substrate B in a double-path mode, a layer of fluorescent glue for protecting a wafer or adjusting the light emitting color simultaneously covers the surface of the lamp belt substrate B, and the copper-clad circuits C connected with the LED flip chip A and the electrical component E are further arranged on the lamp belt substrate B; and the two ends of the lamp strip substrate B are provided with lamp strip welding areas D, and the two sides of the LED flip chip A are coated with dam glue F.

But this embodiment's LED flip chip double-circuit intensive arrangement is on lamp area base plate, and the minimum interval of chip and chip can be less than 1.5mm, compares with current paster technique (or CSP technique), has reduced the interval greatly. Due to the continuous density of the chips, the light-emitting light of the lamp strip can realize continuous and uninterrupted effect, namely, no light spot exists, and the consistency is good.

As shown in fig. 4, in the manufacturing process of the embodiment, the processes of bonding wires, lamp bead mounting, electronic component welding and the like are reduced, the mode of sealing glue after die bonding of the chip (component) is directly adopted, the production efficiency is greatly improved, and the production labor cost is indirectly reduced. The production process is reduced, meanwhile, the investment of raw materials such as gold threads and the like is reduced, and the cost is further reduced. Therefore, compared with the prior art, the method has the advantages of process and cost.

As shown in fig. 3, the coating is at the colloid of the intensive chip both sides of double-circuit, generally glues for the box dam, and white wall glue does not limit the colour, and this box dam glue coating is in the both sides of double-circuit chip, to the chip formation surrounding effect that has coated the fluorescent glue, because the box dam glue possesses opaque effect, through the height that the control box dam was glued, the luminous angle that can controllable change light, because both sides light is dispersed and is not gone out, so when two kinds of luminous colours were luminous simultaneously, the spotlight effect of formation, the colour mixture effect is better.

The process flow of the specific embodiment is as follows: 1. firstly, filling and sealing enclosure dam glue at two sides of double-path dense chip arrangement to form an enclosure wall effect; 2. encapsulating low-color-temperature fluorescent glue on the single-path chip to form single-path color; 3. and encapsulating the high-color-temperature fluorescent glue to cover the other path of the chip and the low-color-temperature fluorescent glue.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A double-color-temperature lamp band structure without light spots is characterized by comprising an LED flip chip (A), a lamp band substrate (B), a copper-clad circuit (C), a lamp band welding area (D), an electrical component (E) and dam rubber (F), wherein the LED flip chip (A) is directly densely packaged on the lamp band substrate (B) in a double-path mode, the surface of the lamp band substrate (B) is covered with a layer of fluorescent glue for protecting a wafer or adjusting the light-emitting color at the same time, and the copper-clad circuit (C) connected with the LED flip chip (A) and the electrical component (E) is further arranged on the lamp band substrate (B); the lamp strip welding areas (D) are arranged at the two ends of the lamp strip substrate (B), and the dam glue (F) is coated on the two sides of the LED flip chip (A).

2. The structure of claim 1, wherein the two types of fluorescent glue are two types of fluorescent glue with different phosphor concentrations, and the two types of fluorescent glue are coated on the two types of wafers respectively.

3. The structure of claim 2, wherein the two kinds of fluorescent pastes are arranged in parallel and coated on the wafer or one kind of fluorescent paste is first spotted, and then the first kind of fluorescent paste is completely covered by the other kind of fluorescent paste.