JP2003163308A - シールドされた準同軸導体を有する基板上に形成された集積デカップリングネットワーク - Google Patents

シールドされた準同軸導体を有する基板上に形成された集積デカップリングネットワーク

Info

Publication number
JP2003163308A
JP2003163308A JP2002313966A JP2002313966A JP2003163308A JP 2003163308 A JP2003163308 A JP 2003163308A JP 2002313966 A JP2002313966 A JP 2002313966A JP 2002313966 A JP2002313966 A JP 2002313966A JP 2003163308 A JP2003163308 A JP 2003163308A
Authority
JP
Japan
Prior art keywords
quasi
capacitor
metal
substrate
transmission line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002313966A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003163308A5 (enExample
Inventor
Lewis R Dove
ルイス・アール・ダブ
John F Casey
ジョン・エフ・ケイシー
Anthony R Blume
アンソニー・アール・ブルーム
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of JP2003163308A publication Critical patent/JP2003163308A/ja
Publication of JP2003163308A5 publication Critical patent/JP2003163308A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/209—Vertical interconnections, e.g. vias
    • H10W44/212—Coaxial feed-throughs in substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/216—Waveguides, e.g. strip lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2002313966A 2001-10-30 2002-10-29 シールドされた準同軸導体を有する基板上に形成された集積デカップリングネットワーク Pending JP2003163308A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/021380 2001-10-30
US10/021,380 US6534844B1 (en) 2001-10-30 2001-10-30 Integrated decoupling networks fabricated on a substrate having shielded quasi-coaxial conductors

Publications (2)

Publication Number Publication Date
JP2003163308A true JP2003163308A (ja) 2003-06-06
JP2003163308A5 JP2003163308A5 (enExample) 2005-12-15

Family

ID=21803857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002313966A Pending JP2003163308A (ja) 2001-10-30 2002-10-29 シールドされた準同軸導体を有する基板上に形成された集積デカップリングネットワーク

Country Status (4)

Country Link
US (1) US6534844B1 (enExample)
JP (1) JP2003163308A (enExample)
KR (1) KR20030036004A (enExample)
DE (1) DE10230111A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112005430A (zh) * 2018-04-25 2020-11-27 株式会社村田制作所 毫米波模块

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3852670A (en) * 1973-10-29 1974-12-03 Zenith Radio Corp Tuner with integral input filter
US4775573A (en) * 1987-04-03 1988-10-04 West-Tronics, Inc. Multilayer PC board using polymer thick films
US5639989A (en) * 1994-04-19 1997-06-17 Motorola Inc. Shielded electronic component assembly and method for making the same
DE19632200C2 (de) * 1996-08-09 2002-09-05 Bosch Gmbh Robert Multichipmodul
US5982635A (en) * 1996-10-23 1999-11-09 Concept Manufacturing, Incorporated Signal adaptor board for a pin grid array
US6255730B1 (en) * 1999-04-30 2001-07-03 Agilent Technologies, Inc. Integrated low cost thick film RF module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112005430A (zh) * 2018-04-25 2020-11-27 株式会社村田制作所 毫米波模块
CN112005430B (zh) * 2018-04-25 2022-01-18 株式会社村田制作所 毫米波模块

Also Published As

Publication number Publication date
KR20030036004A (ko) 2003-05-09
US6534844B1 (en) 2003-03-18
DE10230111A1 (de) 2003-05-22

Similar Documents

Publication Publication Date Title
US7563645B2 (en) Electronic package having a folded package substrate
US5977631A (en) Semiconductor device including a semiconductor package with electromagnetic coupling slots
JPH073830B2 (ja) 集積回路の試験装置
JPH1041434A (ja) 半導体装置およびその製造方法
JPH05266808A (ja) 空中経路によって補償されたマイクロ波装置
JP2003519925A (ja) 相互接続装置および方法
US4419818A (en) Method for manufacturing substrate with selectively trimmable resistors between signal leads and ground structure
KR100711365B1 (ko) Ｄｃ 전력을 공급하며 노이즈 감쇠를 위한 노이즈 필터를구비하는 전자장치
US7197818B2 (en) Method and structures for implementing customizable dielectric printed circuit card traces
JPH08293416A (ja) ノイズフィルタ
JP4616968B2 (ja) インターポーザを使用した高周波用半導体装置
JP2003163308A (ja) シールドされた準同軸導体を有する基板上に形成された集積デカップリングネットワーク
JP2002164658A (ja) モジュール基板
JP3868386B2 (ja) ノイズフィルタ実装基板
US20040085150A1 (en) Terminations for shielded transmission lines fabricated on a substrate
JP2004112143A (ja) 高周波信号用導体の接続構造、および半導体集積回路パッケージ
JPH03258101A (ja) 回路基板
JP2988599B2 (ja) 配線板および高速ｉｃパッケージ
JP4795154B2 (ja) ノイズフィルタ実装基板
JPH053402A (ja) 混成集積回路装置
JP2002368355A (ja) プリント配線板
CN115413121B (zh) 电路基板
JP2000031650A (ja) プリント基板
JP2802375B2 (ja) 電気素子・光素子混載回路の周波数特性伸張法
JPH08264592A (ja) フィルタ及び、又は共振子のための構造体

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20051031

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20051031

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20081024

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20081028

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20090327