JP2003149418A - 幾何ビームスプリッタおよびその作製方法 - Google Patents
幾何ビームスプリッタおよびその作製方法Info
- Publication number
- JP2003149418A JP2003149418A JP2002206914A JP2002206914A JP2003149418A JP 2003149418 A JP2003149418 A JP 2003149418A JP 2002206914 A JP2002206914 A JP 2002206914A JP 2002206914 A JP2002206914 A JP 2002206914A JP 2003149418 A JP2003149418 A JP 2003149418A
- Authority
- JP
- Japan
- Prior art keywords
- beam splitter
- holes
- coating
- metal layer
- transmittance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000000576 coating method Methods 0.000 claims abstract description 81
- 239000011248 coating agent Substances 0.000 claims abstract description 64
- 230000005540 biological transmission Effects 0.000 claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 238000005286 illumination Methods 0.000 claims abstract description 18
- 238000009826 distribution Methods 0.000 claims abstract description 12
- 230000001788 irregular Effects 0.000 claims abstract description 11
- 238000001393 microlithography Methods 0.000 claims abstract description 9
- 238000012545 processing Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 39
- 238000002834 transmittance Methods 0.000 claims description 39
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- 229910052782 aluminium Inorganic materials 0.000 claims description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 22
- 230000003287 optical effect Effects 0.000 claims description 16
- 238000002310 reflectometry Methods 0.000 claims description 16
- 238000000151 deposition Methods 0.000 claims description 14
- 230000008021 deposition Effects 0.000 claims description 13
- 239000000356 contaminant Substances 0.000 claims description 7
- 230000001965 increasing effect Effects 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 230000002708 enhancing effect Effects 0.000 claims description 5
- 238000013532 laser treatment Methods 0.000 claims description 5
- 239000012780 transparent material Substances 0.000 claims description 5
- 239000003463 adsorbent Substances 0.000 claims description 3
- 238000007740 vapor deposition Methods 0.000 claims 2
- 230000001419 dependent effect Effects 0.000 claims 1
- 238000012625 in-situ measurement Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 72
- 239000011148 porous material Substances 0.000 description 10
- 238000005259 measurement Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000036961 partial effect Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 230000003595 spectral effect Effects 0.000 description 3
- MZQZQKZKTGRQCG-UHFFFAOYSA-J thorium tetrafluoride Chemical compound F[Th](F)(F)F MZQZQKZKTGRQCG-UHFFFAOYSA-J 0.000 description 3
- 239000002250 absorbent Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000004980 dosimetry Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 229910000449 hafnium oxide Inorganic materials 0.000 description 2
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 2
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 230000005469 synchrotron radiation Effects 0.000 description 2
- 238000003631 wet chemical etching Methods 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 150000002222 fluorine compounds Chemical group 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/1073—Beam splitting or combining systems characterized by manufacturing or alignment methods
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/108—Beam splitting or combining systems for sampling a portion of a beam or combining a small beam in a larger one, e.g. wherein the area ratio or power ratio of the divided beams significantly differs from unity, without spectral selectivity
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/14—Beam splitting or combining systems operating by reflection only
- G02B27/142—Coating structures, e.g. thin films multilayers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/14—Beam splitting or combining systems operating by reflection only
- G02B27/147—Beam splitting or combining systems operating by reflection only using averaging effects by spatially variable reflectivity on a microscopic level, e.g. polka dots, chequered or discontinuous patterns, or rapidly moving surfaces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70066—Size and form of the illuminated area in the mask plane, e.g. reticle masking blades or blinds
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Optical Elements Other Than Lenses (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Optical Filters (AREA)
- Surface Treatment Of Optical Elements (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10136507.1 | 2001-07-17 | ||
| DE10136507A DE10136507A1 (de) | 2001-07-17 | 2001-07-17 | Geometrischer Strahlteiler und Verfahren zu seiner Herstellung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003149418A true JP2003149418A (ja) | 2003-05-21 |
| JP2003149418A5 JP2003149418A5 (enExample) | 2005-10-20 |
Family
ID=7693229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002206914A Pending JP2003149418A (ja) | 2001-07-17 | 2002-07-16 | 幾何ビームスプリッタおよびその作製方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6809871B2 (enExample) |
| EP (1) | EP1278094B1 (enExample) |
| JP (1) | JP2003149418A (enExample) |
| DE (2) | DE10136507A1 (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008175929A (ja) * | 2007-01-17 | 2008-07-31 | Nikon Corp | 反射鏡の製造方法及び光学機器 |
| JP2014534643A (ja) * | 2011-11-15 | 2014-12-18 | カール・ツァイス・エスエムティー・ゲーエムベーハー | ミラーの配置 |
| KR20150058228A (ko) * | 2012-09-17 | 2015-05-28 | 칼 짜이스 에스엠티 게엠베하 | 미러 |
| JP2019148693A (ja) * | 2018-02-27 | 2019-09-05 | 株式会社オーク製作所 | 投影露光装置 |
| JP2019148694A (ja) * | 2018-02-27 | 2019-09-05 | 株式会社オーク製作所 | 投影露光装置 |
| JP2022520735A (ja) * | 2019-02-25 | 2022-04-01 | サイマー リミテッド ライアビリティ カンパニー | 深紫外線光源のための光学素子 |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10136507A1 (de) * | 2001-07-17 | 2003-04-03 | Zeiss Carl | Geometrischer Strahlteiler und Verfahren zu seiner Herstellung |
| GB0413243D0 (en) * | 2004-06-14 | 2004-07-14 | Imp College Innovations Ltd | Transmissive element |
| DE102004060721B4 (de) * | 2004-12-17 | 2008-07-10 | Carl Zeiss Smt Ag | Verfahren zur Auswahl von optischen Materialien |
| US7600527B2 (en) | 2005-04-01 | 2009-10-13 | Fike Corporation | Reverse acting rupture disc with laser-defined electropolished line of weakness and method of forming the line of weakness |
| US20070002777A1 (en) * | 2005-05-31 | 2007-01-04 | Glowpoint, Inc. | Video-communication interface |
| US20070012665A1 (en) * | 2005-07-12 | 2007-01-18 | Hewlett-Packard Development Company Lp | Laser ablation |
| DE102006030757A1 (de) * | 2005-07-18 | 2007-02-01 | Carl Zeiss Smt Ag | Polarisationsoptimiertes Beleuchtungssystem |
| US8270086B1 (en) | 2006-12-04 | 2012-09-18 | Bae Systems Oasys Llc | Uni-directional beam splitter coating |
| DE102011080052A1 (de) | 2011-07-28 | 2013-01-31 | Carl Zeiss Smt Gmbh | Spiegel, optisches System mit Spiegel und Verfahren zur Herstellung eines Spiegels |
| US9851177B2 (en) * | 2013-10-04 | 2017-12-26 | Bae Systems Information And Electronic Systems Integration Inc. | Coating for light security |
| US10976562B2 (en) | 2017-10-10 | 2021-04-13 | Kla Corporation | Nano-structured non-polarizing beamsplitter |
| WO2019145005A1 (en) * | 2018-01-23 | 2019-08-01 | Danmarks Tekniske Universitet | An apparatus for carrying out raman spectroscopy |
| US11662513B2 (en) | 2019-01-09 | 2023-05-30 | Meta Platforms Technologies, Llc | Non-uniform sub-pupil reflectors and methods in optical waveguides for AR, HMD and HUD applications |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1253138A (en) * | 1915-02-16 | 1918-01-08 | Brewster Film Corp | Light-splitting device for color photography. |
| JPS60181704A (ja) | 1984-02-29 | 1985-09-17 | Canon Inc | 真空紫外用反射ミラー |
| JPS63107082A (ja) * | 1986-06-20 | 1988-05-12 | Mitsubishi Electric Corp | レ−ザ出力制御装置 |
| JPS63192010A (ja) | 1987-02-04 | 1988-08-09 | Washino Kikai Kk | レ−ザ光分割装置 |
| JP2629693B2 (ja) | 1987-02-26 | 1997-07-09 | 松下電器産業株式会社 | エキシマレーザ用ミラー |
| DE3802998A1 (de) | 1988-02-02 | 1989-08-10 | Basf Ag | Verfahren zur herstellung einer duennen roentgenamorphen aluminiumnitrid- oder aluminiumsiliciumnitridschicht auf einer oberflaeche |
| DE3803014A1 (de) | 1988-02-02 | 1989-08-10 | Basf Ag | Verfahren zur herstellung einer duennen roentgenamorphen aluminiumnitrid- oder aluminiumsiliciumnitrid-schicht auf einer oberflaeche |
| US4989936A (en) | 1989-12-21 | 1991-02-05 | At&T Bell Laboratories | Fabrication of optical components utilizing a laser |
| DE4022745A1 (de) | 1990-07-18 | 1992-01-23 | Hans Lang Gmbh & Co Kg Ing | Verfahren zum anbringen von konfigurationen, wie schriften, bildern o. dgl., auf der rueckseite eines spiegels |
| US5302259A (en) * | 1991-04-30 | 1994-04-12 | Reginald Birngruber | Method and apparatus for altering the properties in light absorbing material |
| US5367143A (en) * | 1992-12-30 | 1994-11-22 | International Business Machines Corporation | Apparatus and method for multi-beam drilling |
| US5841099A (en) * | 1994-07-18 | 1998-11-24 | Electro Scientific Industries, Inc. | Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets |
| DE4437896C1 (de) | 1994-10-22 | 1996-05-15 | Leica Lasertechnik | Scan-Vorrichtung für konfokale Mikroskope |
| CN1130602C (zh) | 1996-02-23 | 2003-12-10 | Asm石版印刷公司 | 光学系统的照明单元和用于重复地将掩模图案成像在基片上的装置 |
| US5850309A (en) | 1996-03-27 | 1998-12-15 | Nikon Corporation | Mirror for high-intensity ultraviolet light beam |
| JPH11311704A (ja) | 1998-02-26 | 1999-11-09 | Nikon Corp | 紫外光用ミラー |
| DE10136507A1 (de) * | 2001-07-17 | 2003-04-03 | Zeiss Carl | Geometrischer Strahlteiler und Verfahren zu seiner Herstellung |
| DE10145184B4 (de) * | 2001-09-13 | 2005-03-10 | Siemens Ag | Verfahren zum Laserbohren, insbesondere unter Verwendung einer Lochmaske |
-
2001
- 2001-07-17 DE DE10136507A patent/DE10136507A1/de not_active Withdrawn
-
2002
- 2002-07-13 EP EP02015747A patent/EP1278094B1/de not_active Expired - Lifetime
- 2002-07-13 DE DE50204438T patent/DE50204438D1/de not_active Expired - Fee Related
- 2002-07-16 JP JP2002206914A patent/JP2003149418A/ja active Pending
- 2002-07-17 US US10/196,226 patent/US6809871B2/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008175929A (ja) * | 2007-01-17 | 2008-07-31 | Nikon Corp | 反射鏡の製造方法及び光学機器 |
| JP2014534643A (ja) * | 2011-11-15 | 2014-12-18 | カール・ツァイス・エスエムティー・ゲーエムベーハー | ミラーの配置 |
| US9658533B2 (en) | 2011-11-15 | 2017-05-23 | Carl Zeiss Smt Gmbh | Arrangement of a mirror |
| KR20150058228A (ko) * | 2012-09-17 | 2015-05-28 | 칼 짜이스 에스엠티 게엠베하 | 미러 |
| JP2015534110A (ja) * | 2012-09-17 | 2015-11-26 | カール・ツァイス・エスエムティー・ゲーエムベーハー | ミラー |
| JP2018185521A (ja) * | 2012-09-17 | 2018-11-22 | カール・ツァイス・エスエムティー・ゲーエムベーハー | ミラー |
| KR102150996B1 (ko) | 2012-09-17 | 2020-09-03 | 칼 짜이스 에스엠티 게엠베하 | 미러 |
| JP2019148693A (ja) * | 2018-02-27 | 2019-09-05 | 株式会社オーク製作所 | 投影露光装置 |
| JP2019148694A (ja) * | 2018-02-27 | 2019-09-05 | 株式会社オーク製作所 | 投影露光装置 |
| JP2022520735A (ja) * | 2019-02-25 | 2022-04-01 | サイマー リミテッド ライアビリティ カンパニー | 深紫外線光源のための光学素子 |
| JP7209104B2 (ja) | 2019-02-25 | 2023-01-19 | サイマー リミテッド ライアビリティ カンパニー | 深紫外線光源のための光学素子 |
| US11784452B2 (en) | 2019-02-25 | 2023-10-10 | Cymer, Llc | Optical element for a deep ultraviolet light source |
Also Published As
| Publication number | Publication date |
|---|---|
| US6809871B2 (en) | 2004-10-26 |
| DE10136507A1 (de) | 2003-04-03 |
| DE50204438D1 (de) | 2006-02-16 |
| EP1278094A2 (de) | 2003-01-22 |
| US20030026001A1 (en) | 2003-02-06 |
| EP1278094A3 (de) | 2003-12-03 |
| EP1278094B1 (de) | 2005-10-05 |
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