JP2003115488A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JP2003115488A
JP2003115488A JP2001307318A JP2001307318A JP2003115488A JP 2003115488 A JP2003115488 A JP 2003115488A JP 2001307318 A JP2001307318 A JP 2001307318A JP 2001307318 A JP2001307318 A JP 2001307318A JP 2003115488 A JP2003115488 A JP 2003115488A
Authority
JP
Japan
Prior art keywords
film
polishing
barrier metal
wiring
copper film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001307318A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003115488A5 (enExample
Inventor
Junji Noguchi
純司 野口
Toshinori Imai
俊則 今井
Takeshi Fujiwara
剛 藤原
Nobuhiro Konishi
信博 小西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2001307318A priority Critical patent/JP2003115488A/ja
Publication of JP2003115488A publication Critical patent/JP2003115488A/ja
Publication of JP2003115488A5 publication Critical patent/JP2003115488A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2001307318A 2001-10-03 2001-10-03 半導体装置の製造方法 Pending JP2003115488A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001307318A JP2003115488A (ja) 2001-10-03 2001-10-03 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001307318A JP2003115488A (ja) 2001-10-03 2001-10-03 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2003115488A true JP2003115488A (ja) 2003-04-18
JP2003115488A5 JP2003115488A5 (enExample) 2005-06-23

Family

ID=19126796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001307318A Pending JP2003115488A (ja) 2001-10-03 2001-10-03 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP2003115488A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100635875B1 (ko) * 2004-12-30 2006-10-18 매그나칩 반도체 유한회사 반도체 소자의 금속 배선 형성 방법
CN100353521C (zh) * 2004-10-12 2007-12-05 台湾积体电路制造股份有限公司 使用化学机械研磨法制造半导体元件的内连线结构的方法
US8728934B2 (en) 2011-06-24 2014-05-20 Tessera, Inc. Systems and methods for producing flat surfaces in interconnect structures
US9997412B1 (en) 2016-12-09 2018-06-12 Samsung Electronics Co., Ltd. Methods of manufacturing semiconductor devices
CN113370001A (zh) * 2021-05-25 2021-09-10 上海工程技术大学 一种硅衬底化学机械抛光方法
CN114227527A (zh) * 2020-09-09 2022-03-25 中国科学院微电子研究所 研磨试剂及其制备方法、化学机械研磨方法及其装置
KR20250142778A (ko) 2024-03-22 2025-09-30 가부시키가이샤 토쿄 세이미쯔 Cmp장치 및 그 연마온도 제어방법

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100353521C (zh) * 2004-10-12 2007-12-05 台湾积体电路制造股份有限公司 使用化学机械研磨法制造半导体元件的内连线结构的方法
KR100635875B1 (ko) * 2004-12-30 2006-10-18 매그나칩 반도체 유한회사 반도체 소자의 금속 배선 형성 방법
US9812360B2 (en) 2011-06-24 2017-11-07 Tessera, Inc. Systems and methods for producing flat surfaces in interconnect structures
US9123703B2 (en) 2011-06-24 2015-09-01 Tessera, Inc. Systems and methods for producing flat surfaces in interconnect structures
US9318385B2 (en) 2011-06-24 2016-04-19 Tessera, Inc. Systems and methods for producing flat surfaces in interconnect structures
US9558998B2 (en) 2011-06-24 2017-01-31 Tessera, Inc. Systems and methods for producing flat surfaces in interconnect structures
US8728934B2 (en) 2011-06-24 2014-05-20 Tessera, Inc. Systems and methods for producing flat surfaces in interconnect structures
US10199275B2 (en) 2011-06-24 2019-02-05 Tessera, Inc. Systems and methods for producing flat surfaces in interconnect structures
US10804151B2 (en) 2011-06-24 2020-10-13 Tessera, Inc. Systems and methods for producing flat surfaces in interconnect structures
US9997412B1 (en) 2016-12-09 2018-06-12 Samsung Electronics Co., Ltd. Methods of manufacturing semiconductor devices
CN114227527A (zh) * 2020-09-09 2022-03-25 中国科学院微电子研究所 研磨试剂及其制备方法、化学机械研磨方法及其装置
CN113370001A (zh) * 2021-05-25 2021-09-10 上海工程技术大学 一种硅衬底化学机械抛光方法
KR20250142778A (ko) 2024-03-22 2025-09-30 가부시키가이샤 토쿄 세이미쯔 Cmp장치 및 그 연마온도 제어방법

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