JP2003110213A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2003110213A5 JP2003110213A5 JP2001305664A JP2001305664A JP2003110213A5 JP 2003110213 A5 JP2003110213 A5 JP 2003110213A5 JP 2001305664 A JP2001305664 A JP 2001305664A JP 2001305664 A JP2001305664 A JP 2001305664A JP 2003110213 A5 JP2003110213 A5 JP 2003110213A5
- Authority
- JP
- Japan
- Prior art keywords
- mounting structure
- conductive
- substrate
- conductive member
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims 4
- 239000000919 ceramic Substances 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001305664A JP2003110213A (ja) | 2001-10-01 | 2001-10-01 | 実装構造体及びカード型電子機器用実装構造体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001305664A JP2003110213A (ja) | 2001-10-01 | 2001-10-01 | 実装構造体及びカード型電子機器用実装構造体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2003110213A JP2003110213A (ja) | 2003-04-11 |
JP2003110213A5 true JP2003110213A5 (de) | 2005-05-12 |
Family
ID=19125417
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001305664A Withdrawn JP2003110213A (ja) | 2001-10-01 | 2001-10-01 | 実装構造体及びカード型電子機器用実装構造体 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2003110213A (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010199171A (ja) * | 2009-02-24 | 2010-09-09 | Shinko Electric Ind Co Ltd | チップ部品実装配線基板 |
-
2001
- 2001-10-01 JP JP2001305664A patent/JP2003110213A/ja not_active Withdrawn
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7902652B2 (en) | Semiconductor package and semiconductor system in package using the same | |
US8449339B2 (en) | Connector assembly and method of manufacture | |
US9607935B2 (en) | Semiconductor chip package with undermount passive devices | |
EP1724832A3 (de) | Mehrschichtiges Modul gebildet aus aufeinander gestapelten Modulen und dessen Herstellungsverfahren | |
US7692102B2 (en) | Electronic circuit device | |
US4949220A (en) | Hybrid IC with heat sink | |
KR101167453B1 (ko) | 전자부품 내장형 인쇄회로기판 및 그 제조방법 | |
US20070252263A1 (en) | Memory package structure | |
US11004695B2 (en) | Power semiconductor module arrangement having a base plate and a contact element | |
JP2003110213A5 (de) | ||
US20050023659A1 (en) | Semiconductor chip package and stacked module having a functional part and packaging part arranged on a common plane | |
US8569881B2 (en) | Semiconductor device | |
JP2009277940A (ja) | 半導体パッケージ、実装用回路基板および実装構造体 | |
CN112117252A (zh) | 半导体装置封装 | |
WO2012129118A1 (en) | Circuit protection device | |
US10881006B2 (en) | Package carrier and package structure | |
US20200196433A1 (en) | Method for mounting component | |
JP2879503B2 (ja) | 面実装型電子回路装置 | |
JPH05226518A (ja) | 混成集積回路装置 | |
JP2005340535A (ja) | 電子部品実装基板 | |
CN101771017B (zh) | 基板结构与包含该基板结构的半导体封装构造 | |
JPS63102390A (ja) | 混成集積回路 | |
US20120162946A1 (en) | Electronic device | |
JP2021005690A (ja) | 半導体モジュール | |
KR20140126571A (ko) | 회로기판 |