JP2003110213A5 - - Google Patents

Description

Next, a second mounting structure according to the present invention is a mounting structure in which a plurality of wiring boards are electrically connected to each other with a gap and laminated, and from the upper layer substrate and the lower layer substrate of the wiring substrate The first electronic component mounted on the same surface as the conductive terminal for connection of both wiring substrates formed on the surface of each substrate and in the region other than the conductive terminal on at least one wiring substrate selected, and the upper layer A second electronic component connecting the opposing conductive terminals of the wiring substrate of the lower layer and the wiring substrate in the lower layer, and a connection material for electrically connecting the conductive terminals and the second electronic component ; The present invention is characterized in that the opposing conductive terminals of the lower wiring substrate are connected via the terminal electrodes of the second electronic component.

In the embodiment and the comparative example of the present invention, only the configuration in which the wiring board is stacked in two layers is described as an example of the mounting structure for the sake of simplicity, but more layers may be stacked. Moreover, it can be used not only for mounting between memory boards, but also for mounting all kinds of parts such as package parts, electrolytic capacitors, chip parts such as diodes and switches, lead parts, and bare mounting of ICs. Further, the binder resin of the conductive adhesive, the type of the conductive particles, and the type of the electrode metal are not limited to those described in the examples.

Claims (13)

A mounting structure in which a plurality of wiring boards are electrically connected to each other with a gap and stacked,
The at least one wiring substrate selected from the upper layer substrate and the lower layer substrate of the wiring substrate is mounted on the same surface as the conductive terminal for connection of both wiring substrates formed on the surface of each substrate and in a region other than the conductive terminal Electronic components,
A conductive member for connecting opposing conductive terminals of the upper layer wiring board and the lower layer wiring board;
A mounting structure comprising: a connecting material for electrically connecting the conductive terminal and the conductive member product. A mounting structure in which a plurality of wiring boards are electrically connected to each other with a gap and laminated, wherein at least one wiring board selected from the upper layer substrate and the lower layer substrate of the wiring substrate has a surface on each substrate A first electronic component mounted in the same plane as the conductive terminals for connection of both formed wiring boards and in a region other than the conductive terminals, and a conductive terminal facing the wiring board in the upper layer and the wiring board in the lower layer A second electronic component to be connected, and a connection material for electrically connecting the conductive terminal and the second electronic component , wherein the conductive terminals facing the upper and lower wiring boards are the second A mounting structure characterized by being connected through terminal electrodes of an electronic component.   The mounting structure according to claim 2, wherein the electronic component is a chip component.   The mounting structure according to claim 2, wherein the conductive member is a chip component having an external connection terminal in the vertical direction.   The mounting structure according to claim 2, wherein the conductive member is a chip component in which only the terminal electrode is formed on the surface of the ceramic body.   The mounting structure according to claim 2, wherein the conductive member is a semiconductor component having external connection terminals on the front and back.   The mounting structure according to any one of claims 1 to 6, wherein the connection material is a solder.   The melting point of the solder used for any one of the connection material of the conductive member and the first wiring board or the connection material of the conductive member and the second wiring board is higher than the melting point of the solder used for the other. The mounting structure described in.   The mounting structure according to any one of claims 1 to 6, wherein the connection material is a conductive adhesive.   7. The method according to claim 1, wherein one of the connecting material of the conductive member and the upper layer wiring board or the connecting material of the conductive member and the lower layer wiring board is a conductive adhesive, and the other is a solder. Implementation structure described. A mounting structure used for a card-type electronic device in which a plurality of wiring boards are electrically connected in a thickness direction and stacked,
At least one wiring substrate selected from the upper layer substrate and the lower layer substrate of the wiring substrate, an electronic component mounted on the same surface as the conductive terminal formed on the surface of each substrate and in a region other than the conductive terminal;
A conductive member for connecting opposing conductive terminals of the upper layer wiring board and the lower layer wiring board;
A mounting structure for a card type electronic device, comprising a connecting material for electrically connecting the conductive terminal and the conductive member product.   The mounting structure for a card-type electronic device according to claim 11, wherein the conductive member is a chip part.   The mounting structure for a card-type electronic device according to claim 11, wherein the conductive member is a chip component in which only the terminal electrode is formed on the surface of the ceramic body.