JP2003091016A - Device and method for manufacturing liquid crystal device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a press-contacting device for uniformly pressurizing the whole front surface of an electronic part such as a liquid crystal driving IC or a heat seal, etc., against a liquid crystal panel and also uniformly adhering it with a simple structure. SOLUTION: A panel support stand 1 is fixed to the upper end of an elevating/lowering rod 32 which is erected on a table 28 so as to be freely vertically movable. The panel support stand 1 is supported by a spring 33 and the liquid crystal panel 2 is placed on it. The liquid crystal panel 2 is stopped at a position where the swelling part 3c of a transparent baseboard is brought into contact with or comes close to the upper end of a panel receiver 4 by balancing. The IC 15 temporarily adhered onto the baseboard 3c is pressurized by a lowered contact-press head 8 against the baseboard 3c and adhered onto it. The panel support stand 1 is supported by the spring 33 so as to be freely movable by following the movement of the contact-press head 8. Thus the IC 15 is normally stably pressurized against the liquid crystal panel 2 in a fixed state.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrode terminal formed on a transparent substrate of a liquid crystal panel, a TCP, and a liquid crystal driving IC.
The present invention relates to a crimping device for adhering electronic components such as the like and a method for manufacturing a liquid crystal device using the crimping device.

[0002]

2. Description of the Related Art Generally, a liquid crystal panel is formed by enclosing a liquid crystal in a cell gap formed between a pair of opposed transparent substrates. In order to display visible information such as letters, numbers, and patterns with this liquid crystal panel, it is necessary to conductively connect a plurality of electrodes formed on a pair of transparent substrates to a liquid crystal driving IC. As a concrete method of this conductive connection, various methods have been conventionally known.

For example, firstly, ACF (Anisotropic c
There is a method of directly bonding the liquid crystal driving IC on the transparent substrate of the liquid crystal panel using a bonding member such as an onductive film (anisotropic conductive film). According to this method, so-called COG
(Chip On Glass) type liquid crystal panel is manufactured.

Secondly, TCP (Tape Carrier Packa)
ge: Tape carrier package) LCD drive IC
Is conductively connected to the liquid crystal panel. As is well known, the TCP is an FP in which a wiring pattern is formed.
A liquid crystal driving IC is mounted on a C (Flexible Printed Circuit) by using a TAB (Tape Automated Bonding) method. In this case, TCP is conductively connected to the transparent substrate of the liquid crystal panel via ACF, heat seal, or the like.

Thirdly, PCB (Print Circuit Boa
rd: printed circuit board), after bonding the liquid crystal drive IC,
There is a method of conductively connecting the PCB to a liquid crystal panel using heat sealing.

As described above, the liquid crystal driving I
When C is conductively connected, the liquid crystal drive IC itself,
Various electronic components such as TCP and heat seal are connected on the transparent substrate of the liquid crystal panel. Considering now a case where an FPC, which is a component of TCP, is connected to a liquid crystal panel using an ACF, conventionally, a crimping process has been performed using a crimping device as shown in FIG.

That is, the main body of the liquid crystal panel 52 is placed on the panel support base 51, and the protruding portion of the transparent substrate 53a of the liquid crystal panel 52 is placed on the panel receiving base 54. Then, the ACF is placed on the protruding portion of the transparent substrate 53a.
56 is pasted, and the FPC 57 is temporarily adhered thereon. Then, the pressure bonding head 58 heated to a predetermined temperature is lowered to press the FPC 57 against the projecting portion of the transparent substrate 53a with a predetermined pressure, so that the FPC 57 is bonded onto the substrate 53a.

In this conventional crimping device, if the height of the panel support 51 and the height of the panel cradle 54 are accurately set to match the shape of the liquid crystal panel 52, the crimping head 58 makes it uniform. A crimping process can be performed. However, if the panel support base 51 is higher than the predetermined position, as shown in FIG.
The overhanging portions of the PC 57 and the substrate 53a cannot be pressed uniformly. If the panel support base 51 is lower than the predetermined position, the liquid crystal panel 52 is lifted as shown in FIG. 10, and uniform pressing cannot be performed.

Further, as a conventional crimping device, for example, JP-A-4-70816 or JP-A-5-341303.
There is a device disclosed in the publication. Japanese Patent Laid-Open No. 4-70816
In the publication, there is a structure for conductively connecting a carrier tape including an IC chip on a transparent substrate of a liquid crystal panel, and a compression head for pressing the carrier tape against the transparent substrate is supported by an elastic rocking mechanism. A structure is disclosed.

Japanese Patent Laid-Open No. 5-341303 discloses a structure for conductively connecting a liquid crystal driving IC as a TAB component on a substrate of a liquid crystal panel, in which the liquid crystal panel is placed on a support table. Then, a structure is disclosed in which the liquid crystal driving IC is pressed against the substrate by the pressure bonding block. In this structure, the crimping block is driven by using two pressurizing cylinders, so that a constant pressure can be instantaneously applied to the liquid crystal driving IC.

[0011]

[Patent Document 1] Japanese Patent Application Laid-Open No. 4-70816
In the crimping device disclosed in the publication, a supporting base for supporting the main body of the liquid crystal panel is fixedly installed, and a backup jig corresponding to the panel receiving base is vertically movable. However, arranging the backup jig so that it can move up and down complicates the structure, increases the cost, and makes the bonding state between the transparent substrate of the liquid crystal panel and the electronic components such as the FPC unstable. Can be considered.

On the other hand, in the crimping device disclosed in Japanese Unexamined Patent Publication No. 5-341303, the support table for supporting the liquid crystal panel can move in the left and right direction to convey the liquid crystal panel, but in the vertical direction. You cannot move to. Therefore, the above-mentioned problems described with reference to FIGS. 8 to 10 are included.

The present invention has been made in view of the above problems, and uniformly presses the entire surface of an electronic component such as a liquid crystal driving IC and a heat seal against a liquid crystal panel with a simple structure. It is an object of the present invention to provide a crimping device that can adhere evenly.

[0014]

In order to solve the above problems, a liquid crystal panel manufacturing apparatus according to the present invention is a liquid crystal device in which an electronic component is pressure-bonded to the substrate overhang portion of a liquid crystal panel having a main body portion and a substrate overhang portion. The manufacturing apparatus of claim 1, wherein a panel support base that supports the main body of the liquid crystal panel, a panel support base that supports the substrate overhanging portion of the liquid crystal panel, and a pressure bonding head that is arranged to face the panel support base. A resin tape interposed between the crimping head and the electronic component, and a tape supplying means for supplying the resin tape, wherein the crimping head projects the electronic component through the resin tape. It is characterized by being crimped to the part.

In order to solve the above-mentioned problems, a liquid crystal panel manufacturing apparatus according to the present invention is a liquid crystal device manufacturing apparatus for crimping an electronic component to the substrate overhanging portion of a liquid crystal panel having a main body portion and a substrate overhanging portion. A plurality of panel support bases that support the main body of the liquid crystal panel, a panel support base that supports the substrate overhang portion of the liquid crystal panel, a pressure bonding head that is arranged to face the panel support base, and And a guide rail for moving the panel support of the panel support to the crimping work stage where the crimping head faces each other, and the plurality of panel supports are arranged along the guide rail. When the panel support of (1) moves to the crimping work stage, another panel supporting base that has completed the crimping work is separated from the crimping work stage. .

The panel support is preferably moved up and down by a driving device.

It is preferable that the panel support base further comprises reaction force applying means for applying a reaction force to the panel support base, and the panel support base is supported by the reaction force applying means.

In order to solve the above-mentioned problems, a method of manufacturing a liquid crystal panel according to the present invention is a method of manufacturing a liquid crystal device in which an electronic component is pressure-bonded to the substrate overhang portion of a liquid crystal panel having a main body portion and the substrate overhang portion. In the method, a step of crimping the electronic component to the substrate overhanging portion by using a liquid crystal device manufacturing apparatus according to any one of the above, with a resin tape interposed between the crimping head and the electronic component. It is characterized by having.

In the above structure, the reaction force applying means can be constituted by elastic force of a spring or the like, pneumatic pressure, hydraulic pressure or the like as a reaction force source. Further, in the above-described configuration, the liquid crystal driving IC itself, heat seal, TCP (Tape Carrier Package), and the like are conceivable as the electronic components bonded to the liquid crystal panel. When the liquid crystal driving IC itself is directly adhered to the transparent substrate of the liquid crystal panel, that is, COG (Chi
When a liquid crystal panel of the p on glass type is manufactured, an adhesive member such as ACF is interposed between the liquid crystal driving IC and the transparent substrate to bond them. Further, the situation in which the heat seal is adhered to the transparent substrate is a situation that occurs when the PCB having the liquid crystal drive IC mounted thereon is connected to the transparent substrate via the heat seal. Moreover, when TCP is adhered to the transparent substrate, AC is applied between the TCP and the transparent substrate.
An adhesive member such as F or heat seal is interposed.

According to the present invention, each crimping head can perform the crimping process under the best crimping condition without being influenced by other crimping heads. Further, according to a more preferred embodiment of the present invention, since the panel support base supporting the main body of the liquid crystal panel is held in a so-called floating state by the reaction force applying means, the liquid crystal panel follows the movement of the pressure bonding head. Therefore, the liquid crystal panel can always be pressure-bonded with the liquid crystal panel horizontally placed, so that the entire area of the electronic component such as the liquid crystal drive IC can be pressed with a uniform pressure.

Further, since the panel supporting base has a movable structure, the panel supporting base supporting the projecting portion of the substrate of the liquid crystal panel can be fixedly arranged, so that the portion corresponding to the panel supporting base can be moved up and down. As compared with the conventional crimping device, the pressing force applied between the substrate and the electronic component can be stably maintained at a constant magnitude. As a result, the liquid crystal panel and the electronic component can be stably and firmly adhered to each other without variation.
Further, since a drive device for vertically moving the panel pedestal is not required, the structure is simple and the cost is low. The panel support is arranged so as to be movable under the action of the reaction force imparting means, but since this reaction force imparting means does not include a special drive device, it may complicate the structure or increase the cost. Absent.

The panel support is moved in parallel in the same direction as the moving direction of the pressure bonding head as described above.
In addition, the panel support can be arranged so as to be tiltable and movable within a relatively small angle range. This makes it possible to uniformly press the entire surface of the electronic component with the pressure bonding head, even if there are variations in the temporary adhesion state of the electronic component to the liquid crystal panel.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an embodiment of a liquid crystal panel crimping device according to the present invention. This crimping device has a crimping work stage 11, a left panel loading stage 12, and a right panel loading stage 13. A panel positioning unit 16 is disposed on the base 14 in both the left panel loading stage 12 and the right panel loading stage 13. These panel positioning units 16 can rotate about the vertical axis X as indicated by arrow A and can also move in parallel in the front-rear direction as indicated by arrow B.
7 and a guide panel 18 fixed to the upper end of the support frame 17 and long in the lateral direction. By turning the front-rear adjustment knob 19 in either the positive or negative direction, the support frame 17 and the guide panel 18 supported by the support frame 17 are rotated.
Can be translated in the direction of arrow B. Further, by selecting one of the pair of left and right angle adjusting knobs 21 and turning it, the support frame 17 and the guide panel 18 supported thereby can be rotated and moved around the vertical axis X.

A linear guide rail 22 is provided on the base 14 over the three stages of the left panel loading stage 12, the crimping work stage 11, and the right panel loading stage 13. The left table unit 23 and the right table unit 24 are slidably mounted on the guide rails 22. As shown in FIG. 2, the table units 23 and 24 are vertically moved by being guided by a slide table 26 slidably mounted on a guide rail 22 and a guide rod 27 standing on the slide table 26. It has a moving lifting table 28. Lifting table 28
Is driven by an air cylinder 29 arranged on the slide table 26 to move up and down as shown by an arrow C.

Returning to FIG. 1, the left table unit 23
The slide table 26 and the slide table 26 of the right table unit 24 are connected to each other by a connecting plate 31. Also, the left table unit 2
A linear drive device (not shown) is connected to either the 3 or the right table unit 24, and the left table unit 23 and the right table unit 24 are integrally driven on the guide rail 22 by being driven by the linear drive device. Move left and right. This linear drive device can be constructed by any structure, for example, by using a feed screw.

In the state shown in FIG. 1, the left table unit 23 is located on the left panel loading stage 12, and the right table unit 24 is located on the crimping work stage 11. When the left table unit 23 is driven to the crimping work stage 11 by being driven by the linear drive device, the right table unit 2 is correspondingly moved.
4 is automatically carried to the right side panel loading stage 13.

Each of the left table unit 23 and the right table unit 24 is provided with a plurality of panel support bases 1, five in this embodiment. As shown in FIG. 2, these panel support bases 1 are fixed to the upper end of an elevating rod 32 which is supported on an elevating table 28 so as to be vertically movable. As shown in FIG. 4, two lifting rods 32 are provided laterally with respect to one panel support 1, and a balance spring 33 is provided between the lifting rods 32. The balance spring 33 is arranged between the adjusting screw 34 that is screw-fitted to the panel support 1 and the lifting table 28. A guide pin 41 for positioning the liquid crystal panel 2 to be worked from the side direction is fixed to the upper surface of the panel support base 1.

In FIG. 2, a V-groove block 36 is provided at the rear end (left end in the figure) of the panel support 1, and a lock air cylinder 37 supported by a bracket 38 extending from the rear end of the lift table 28. Is the V groove block 36
Is arranged so as to face. The lock piece 39 formed at the tip of the output shaft of the locking air cylinder 37 is formed in the V groove of the V groove block 36 as shown in FIG. 2 when the air cylinder 37 operates and the output shaft extends. Mating. As a result, the panel support 1 is fixedly held, that is, locked so as not to move in any of the up, down, left and right directions.

On the other hand, when the output shaft of the air cylinder 37 is retracted, the lock piece 39 is disengaged from the V groove of the V groove block 36 as shown in FIG. Then, the panel support 1
, The panel support 1 is supported by the lifting rod 32, and the balance spring 3
The elastic force of 3 pushes it upward.
That is, the panel support 1 in this state is in a state of floating in the space only by the elastic force of the balance spring 33,
Therefore, the panel support 1 can freely move in the acting direction of the external force when the external force in the vertical direction is applied thereto.

The panel support base 1 is a lift table 2
Since it is fixed to the upper end of the elevating rod 32 that moves in the vertical direction with respect to 8, the moving direction of the panel support base 1 is regulated in the substantially vertical direction. However, in this embodiment, the fitting between the lifting rod 32 and the lifting table 28 has a slight margin, that is, a gap. Therefore, in addition to the vertical movement of the panel support base 1,
As shown by an arrow D in FIG. 5 and an arrow E in FIG. 4, it is possible to tilt and move within a very small angle range.

In FIG. 2, an air suction opening 54 is opened to the outside on the surface of the panel support 1, and an air passage 53 extending from the opening 54 is formed inside the panel support 1. The air intake device 5 is provided in the air passage 53.
5 is connected, and when the intake device 55 operates, external air is sucked through the opening 54. By this air suction, the liquid crystal panel 2 placed on the panel support 1 is firmly adsorbed and held.

Returning to FIG. 1, a plurality of panel receiving bases 4, five in this embodiment, are arranged side by side on the base 14 in the crimping work stage 11 in parallel with the guide rails 22. A top plate 43 is supported by the support columns 42, and five pressure bonding heads 8 are provided so as to hang down from the top plate 43. These crimping heads 8 are accurately positioned above the individual panel pedestals 4. An air cylinder 44 is provided at an upper position of the top plate 43 so as to correspond to each crimping head 8. The crimping head 8 is driven by these air cylinders 44, and the arrow F in FIG.
Move up and down in the vertical direction as indicated by -F '. Further, a heater (not shown) is built in each crimping head 8, and each crimping head 8 is heated to a predetermined temperature by these heaters.

In FIG. 1, tape take-up reels 46a and 46b are fixedly installed on the left and right side end portions of the top plate 43. A tape 47 made of fluororesin, for example, Teflon (registered trademark), is wound around these reels. As shown in FIG. 2, the fluororesin film tape 47 projects to a position below the pressure bonding head 8. When the pressure bonding head 8 is driven by the air cylinder 44 and moves downward, the fluororesin film tape 47 is pushed down by the pressure bonding head 8 and the reels 46a and 4a.
It moves downward while unrolling from 6b.

In the present embodiment, the five panel pedestals 4 and the five crimping heads 8 corresponding thereto are
The temperature adjustment and the position adjustment can be performed independently. Therefore, the individual crimping heads 8 can be crimped under the best crimping condition without being influenced by other crimping heads.

The operation of the crimping device having the above structure will be described below.

In this embodiment, the COG (Chip On Glass) type liquid crystal panel 2 as shown in FIG. As shown in FIG. 7, the liquid crystal panel 2 includes a first transparent substrate 3a made of glass and a second transparent substrate 3b made of glass, which are joined to each other by a sealing material 7 with a spacer 9 interposed therebetween. It is formed by enclosing the liquid crystal 5 in the cell gap G formed between the substrates. The portion of the liquid crystal panel 2 in which the liquid crystal 5 is enclosed is the main body portion of the liquid crystal panel.

A first transparent electrode 10a is formed on the inner surface of the first transparent substrate 3a, and a second transparent electrode 10b is formed on the inner surface of the second transparent substrate 3b. Then, electrode terminals 48 connected to these transparent electrodes are formed on the projecting portion 3c of the first transparent substrate 3a. Further, a connection terminal 49 for conductively connecting an external circuit is formed at the end of the substrate overhanging portion 3c. In addition, each transparent substrate 3a
Polarizing plates 51a and 51b are attached to the outer surfaces of 3 and 3b, respectively.

When the liquid crystal driving IC 15 is mounted on the liquid crystal panel 2, as shown in FIG. 6, first, the ACF 6 is attached to a predetermined position on the projecting portion 3c of the substrate 3a, and then the ACF 6 is attached. The liquid crystal driving IC 15 is placed on the above, and the liquid crystal driving IC 15 is further pressed against the substrate overhanging portion 3c while being heated to a predetermined temperature. By this thermocompression bonding process, the liquid crystal driving IC 15 and the substrate overhanging portion 3c are fixed to each other by the resin portion of the ACF 6, and at the same time, the input / output bumps of the liquid crystal driving IC 15 are respectively formed by the conductive particles dispersed in the resin. Conductive connection is made to the external connection terminal 49 and the electrode terminal 48 on the substrate.

In the pressure bonding apparatus of this embodiment, the ACF 6 and the liquid crystal driving IC 15 are temporarily adhered to the substrate overhanging portion 3C at a predetermined position.
The work of officially crimping 5, that is, the main crimping is performed by the ACF 6, and the main crimping work will be described below.

In FIG. 1, the left panel loading stage 1
The left table unit 23 is set to 2. At this time, the output shaft of the lock air cylinder 37 is extended and moved as shown in FIG. 2, and the lock piece 39 at the tip of the lock air cylinder 37 is fitted into the V groove block 36 of the panel support base 1, resulting in panel support. The base 1 is in an immovable locked state. Further, the air cylinder 29 on the slide table 26 is in an expanded state, and the lifting table 28 is set at the upper position.

Next, in FIG. 1, the liquid crystal panel 2 to be worked is placed on each panel support base 1 in the left table unit 23, and suction-fixed by air suction. The liquid crystal panel 2 includes an ACF 6 and a liquid crystal driving I.
C15 is temporarily bonded in place. LCD panel 2
3 is placed on the panel support base 1, the side end of the liquid crystal panel 2 is pressed against the guide pin 41 as shown in FIG.
Further, its front end is pressed against the guide panel 18. As a result, the liquid crystal panel 2 is positioned at a fixed position on the panel support 1. The position of the guide panel 18 is shown in FIG.
In front and rear adjustment knob 19 and angle adjustment knob 21
It can be adjusted to a desired position by appropriately turning both or one of them.

After the above work is completed, when a predetermined start switch is operated, a linear driving device (not shown) for driving the table is operated and the left table unit 23 is moved along the guide rail 22 to perform the crimping work stage. Transported to 11. At this time, the right table unit 24 is transported from the crimping work stage 11 to the right panel loading stage 13. When the left table unit 23 is conveyed to the crimping work stage 11 and stopped there, the substrate overhanging portion 3c of the liquid crystal panel 2 on the panel support base 1 in FIG.
It is arranged at an upper position with a proper distance from the panel pedestal 4.

Then, as shown in FIG. 5, the lock air cylinder 37 is actuated to move the lock piece 39 into the V-groove block 3.
6, the panel support 1 is unlocked, and the lifting air cylinder 29 is actuated so that its output shaft retracts and moves. Then, the force pushing the panel support base 1 upward is released, so that the panel support base 1 is moved to the position shown in FIG.
In the direction indicated by arrow G, and stops at a position where the bottom surface of the substrate overhanging portion 3c of the liquid crystal panel 2 comes into contact with or comes close to the upper end of the panel pedestal 4. From a functional point of view, it does not matter whether the liquid crystal panel 2 is stopped while it is in contact with the panel pedestal 4 or when it is stopped in the proximity, that is, when it is slightly floating. However, regarding which state to set, in FIG.
It can be adjusted by turning 4 to change the length of the balance spring 33.

Thereafter, the pressure bonding head 8 moves down along with the fluorine-graded resin film tape 47 as shown by the arrow F and hits the upper surface of the liquid crystal driving IC 15 on the liquid crystal panel 2, and further touches it with a predetermined pressure. Press on. As a result, the ACF 6 interposed between the liquid crystal driving IC 15 and the substrate overhanging portion 3c of the liquid crystal panel 2 is heated and pressed, and as a result, the liquid crystal driving IC 15 moves through the substrate overhanging portion 3c.
Glued to. Thus, the main pressure bonding of the liquid crystal driving IC 15 is completed. The fluorine tilt resin film tape 47 is interposed between the pressure bonding head 8 and the liquid crystal driving IC 15
This is to prevent the pressure bonding head 8 from directly contacting the bonding IC 15.

At the time of this main pressure bonding work, the panel support base 1 is supported by the elastic reaction force of the balance spring 33 in a state of being floated in a substantially space and can freely move in the vertical direction, so that the liquid crystal panel 2 is always horizontal. The pressure is applied by the pressure bonding head 8 while maintaining the state. As a result, the liquid crystal driving IC 15 is stable and strong without variation.
Conductively bonded onto the substrate. Further, in the present embodiment, as shown by arrow E in FIG. 4 and further shown by arrow D in FIG.
Since the panel support 1 can be moved slightly inclining, the pressure bonding head 8 can uniformly press the entire surface of the liquid crystal driving IC 15 even if the temporary adhesion state of the liquid crystal driving IC 15 to the liquid crystal panel 2 varies. .

When the main pressure bonding operation of the liquid crystal driving IC 15 to the liquid crystal panel 2 is completed as described above, the pressure bonding head 8 rises as shown by the arrow F'in FIG. 5, and the air cylinder 29 operates to output the output shaft thereof. Moves to stretch. This extension movement raises the lifting table 28 and returns the panel support 1 to the upper position shown in FIG. Then, as shown in FIG.
Is returned to the left panel loading stage 12 again, and the liquid crystal panel 2 for which the pressure bonding work has been completed is recovered from the panel support 1.

While the left table unit 23 is set on the crimping work stage 11 and the above-described main crimping work is being executed, the operator operates the right panel loading stage 13
The unprocessed liquid crystal panel 2 is loaded into the right side table unit 24 placed at. Crimp work stage 11
When the crimping work for the left side table unit 23 set in the above is completed and the left side table unit 23 is returned to the left side panel loading stage 12, the right side table unit 24 is automatically carried to the crimping work stage 11. Spill, and undergo final crimping work. In this way, the main pressure bonding work is alternately performed on the left table unit 23 and the right table unit 24.

The present invention has been described above with reference to the preferred embodiments, but the present invention is not limited to the embodiments and can be variously modified within the technical scope described in the claims.

For example, in the above embodiment, the present invention is applied to the COG type liquid crystal panel shown in FIG.
That is, the liquid crystal driving IC itself was considered as an electronic component to be pressure-bonded to the liquid crystal panel. However, it goes without saying that the present invention can be applied to the case where other electronic parts such as heat seal and TCP are electrically conductively connected to the liquid crystal panel. In these cases, the pressure bonding head 8 presses heat seal, TCP, or the like.

Further, the number of panel support bases 1 to be prepared for each table unit 23, 24 is not limited to five, but may be less or more and may be one in some cases. In addition to the structure in which two table units are alternately carried to the crimping work stage 11 to perform the crimping work continuously, one table unit is fixedly installed and only the table units are used for crimping. You can also do the work.

[0051]

According to the liquid crystal device manufacturing apparatus or liquid crystal device manufacturing method of the present invention, an electronic component such as a liquid crystal driving IC can be pressure-bonded to a liquid crystal panel with a uniform pressure. Each crimping head can be crimped under the best crimping condition without being affected by other crimping heads.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a liquid crystal panel crimping device according to the present invention.

FIG. 2 is a side view showing a structure of a main part of the crimping device of FIG. 1, particularly a part supporting a liquid crystal panel.

FIG. 3 is a plan view of the structure shown in FIG.

4 is a front view of the structure shown in FIG. 2. FIG.

FIG. 5 is a side view showing a state of the structure shown in FIG. 2 during crimping work.

FIG. 6 is a perspective view showing an example of a liquid crystal panel which is a target of pressure bonding work.

7 is a sectional view showing a sectional structure of the liquid crystal panel of FIG.

FIG. 8 is a cross-sectional view showing an example of a conventional liquid crystal panel crimping device.

9 is a cross-sectional view showing one operation state of the conventional device of FIG.

10 is a cross-sectional view showing another operation state of the conventional device of FIG.

[Explanation of symbols]

1 panel support 2 LCD panel 3c Overhanging part of transparent substrate of liquid crystal panel 4 panel cradle 8 Crimping head 11 Crimping work stage 12 Left panel loading stage 13 Right panel loading stage 14 base 15 Liquid crystal drive ICs (electronic parts) 16 panel positioning unit 22 Guide rail 23 Left table unit 24 Right table unit 33 Balance spring (reaction force applying means) 34 Spring force adjusting screw 54 Air suction opening

Continued front page    F term (reference) 2H088 FA16 FA17 FA20 FA30 HA02                       HA05 MA20                 2H092 GA49 GA50 GA51 GA60 MA32                       MA35 NA25 NA27

Claims (7)

[Claims] 1. A liquid crystal device manufacturing apparatus for crimping an electronic component onto the substrate overhanging portion of a liquid crystal panel having a body portion and a substrate overhanging portion, the panel supporting base supporting the body portion of the liquid crystal panel, A panel pedestal that supports a substrate overhang portion of a liquid crystal panel, a pressure bonding head that is arranged to face the panel pedestal, a resin tape that is interposed between the pressure bonding head and the electronic component, and the resin tape are supplied. Tape feeding means for
The apparatus for manufacturing a liquid crystal device, wherein the pressure-bonding head pressure-bonds the electronic component to the substrate overhanging portion via the resin tape. 2. The apparatus for manufacturing a liquid crystal device according to claim 1, wherein the panel support is moved up and down by a driving device. 3. A reaction force application means for applying a reaction force to the panel support base, wherein the panel support base is supported by the reaction force application means. An apparatus for manufacturing a liquid crystal device according to claim 2. 4. A liquid crystal device manufacturing apparatus for crimping an electronic component onto the substrate overhanging portion of a liquid crystal panel having a body portion and a substrate overhanging portion, the panel supporting base supporting a body portion of the liquid crystal panel. A panel pedestal for supporting the substrate overhanging portion of the liquid crystal panel, a crimp head arranged to face the panel pedestal, and a plurality of panel support pedestals for crimping the panel pedestal and the crimp head to face each other. A guide rail for moving to the work stage, the plurality of panel supports are arranged along the guide rail, and when one panel support is moved to the crimp work stage, the crimp work is performed. Another apparatus for manufacturing a liquid crystal device, characterized in that the other panel support stand is separated from the pressure bonding work stage. 5. The apparatus for manufacturing a liquid crystal device according to claim 4, wherein the panel support is moved up and down by a driving device. 6. A reaction force applying means for applying a reaction force to the panel support base, wherein the panel support base is supported by the reaction force applying means. An apparatus for manufacturing a liquid crystal device according to claim 5. 7. A method for manufacturing a liquid crystal device, comprising manufacturing a liquid crystal panel having a main body portion and a substrate overhanging portion by crimping an electronic component onto the substrate overhanging portion, the liquid crystal according to any one of claims 1 to 6. A method for manufacturing a liquid crystal device, which comprises using a device manufacturing apparatus to press a resin tape between the pressure bonding head and the electronic component to pressure bond the electronic component to the substrate overhang portion. .