JP2003080629A5 - - Google Patents

Download PDF

Info

Publication number
JP2003080629A5
JP2003080629A5 JP2001277408A JP2001277408A JP2003080629A5 JP 2003080629 A5 JP2003080629 A5 JP 2003080629A5 JP 2001277408 A JP2001277408 A JP 2001277408A JP 2001277408 A JP2001277408 A JP 2001277408A JP 2003080629 A5 JP2003080629 A5 JP 2003080629A5
Authority
JP
Japan
Prior art keywords
heat
metal foam
resin layer
soft resin
conductive filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001277408A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003080629A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001277408A priority Critical patent/JP2003080629A/ja
Priority claimed from JP2001277408A external-priority patent/JP2003080629A/ja
Publication of JP2003080629A publication Critical patent/JP2003080629A/ja
Publication of JP2003080629A5 publication Critical patent/JP2003080629A5/ja
Pending legal-status Critical Current

Links

JP2001277408A 2001-09-13 2001-09-13 放熱体 Pending JP2003080629A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001277408A JP2003080629A (ja) 2001-09-13 2001-09-13 放熱体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001277408A JP2003080629A (ja) 2001-09-13 2001-09-13 放熱体

Publications (2)

Publication Number Publication Date
JP2003080629A JP2003080629A (ja) 2003-03-19
JP2003080629A5 true JP2003080629A5 (https=) 2008-09-25

Family

ID=19101936

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001277408A Pending JP2003080629A (ja) 2001-09-13 2001-09-13 放熱体

Country Status (1)

Country Link
JP (1) JP2003080629A (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10340681B4 (de) * 2003-09-04 2006-09-28 M.Pore Gmbh Verfahren zur Herstellung einer stoffschlüssigen, wärmeleitenden Verbindung zwischen einer offenporigen Schaumstruktur und einem nichtporösen Grundkörper für Wärmeübertrager, insbesonderer Kühlkörper
KR100529112B1 (ko) * 2003-09-26 2005-11-15 삼성에스디아이 주식회사 다공성 열전달 시트를 갖는 디스플레이 장치
KR100721487B1 (ko) 2004-09-22 2007-05-23 주식회사 엘지화학 열전도성이 우수한 점착 방열시트 및 그 제조방법
JP5176878B2 (ja) * 2008-11-04 2013-04-03 横浜ゴム株式会社 熱伝導性エマルジョン
MX2015004050A (es) * 2012-09-28 2015-07-06 Dow Global Technologies Llc Componentes de espuma metalica para torre de comunicacion inalambrica.
WO2018056407A1 (ja) * 2016-09-23 2018-03-29 積水化学工業株式会社 多孔質体
KR102159504B1 (ko) * 2017-07-06 2020-09-24 주식회사 엘지화학 복합재
KR102191614B1 (ko) * 2017-09-15 2020-12-15 주식회사 엘지화학 복합재
KR102191615B1 (ko) 2017-09-22 2020-12-15 주식회사 엘지화학 복합재
JP7841287B2 (ja) * 2022-03-01 2026-04-07 株式会社レゾナック 積層フィルム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11176451A (ja) * 1997-12-11 1999-07-02 Sumitomo Electric Ind Ltd 傾斜構造を有する金属多孔体とその製造方法及びそれを用いた電池用基板
JP2951327B1 (ja) * 1998-09-17 1999-09-20 北川工業株式会社 放熱材

Similar Documents

Publication Publication Date Title
US6483707B1 (en) Heat sink and thermal interface having shielding to attenuate electromagnetic interference
JPH065751A (ja) 金属フォーム放熱器
TW549011B (en) Dissipation of heat from a circuit board having bare silicon chips mounted thereon
US6616999B1 (en) Preapplicable phase change thermal interface pad
US20080179314A1 (en) Positive Temperature Heating Element with Heat Sinks
JP2003080629A5 (https=)
CN103228120A (zh) 利用潜热的延迟散热片
US20040069452A1 (en) Thermal interface wafer and method of making and using the same
JP5165490B2 (ja) 放熱シートの製造方法
CN111542934B (zh) 柔性热电装置
CN206614861U (zh) 石墨材料散热片
JP2017208505A (ja) 構造体、その構造体を含む電子部品および電子機器
JP2010098004A (ja) ヒートシンクおよびその製造方法
JP2005159318A (ja) 熱伝導体
CN206562400U (zh) 一种cpu散热用导热泡棉垫片
CN110960253A (zh) 一种超声探头及面阵超声探头
US20090188259A1 (en) Integrated Thermoelectric Cooling Element and Positive Temperature Coefficient Heater
CN205793910U (zh) 一种导热硅胶片
JP2004214429A (ja) 積層プリント基板の放熱構造
JPH11186003A (ja) Ptc素子の放熱構造
TW499749B (en) A cooling device for electronic components
CN115581031B (zh) 相变散热装置及其制作方法
US20050155354A1 (en) Heat radiator
KR20200033702A (ko) 열 전도 부재
CN108454185A (zh) 石墨材料散热片