JP2003080629A - 放熱体 - Google Patents
放熱体Info
- Publication number
- JP2003080629A JP2003080629A JP2001277408A JP2001277408A JP2003080629A JP 2003080629 A JP2003080629 A JP 2003080629A JP 2001277408 A JP2001277408 A JP 2001277408A JP 2001277408 A JP2001277408 A JP 2001277408A JP 2003080629 A JP2003080629 A JP 2003080629A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- foam
- conductive filler
- soft resin
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 107
- 239000011347 resin Substances 0.000 claims abstract description 107
- 239000006262 metallic foam Substances 0.000 claims abstract description 49
- 239000011231 conductive filler Substances 0.000 claims abstract description 48
- 239000006260 foam Substances 0.000 claims abstract description 45
- 229910052751 metal Inorganic materials 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 claims abstract description 29
- 230000035699 permeability Effects 0.000 claims abstract description 23
- 210000000497 foam cell Anatomy 0.000 claims abstract description 11
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 10
- 239000000057 synthetic resin Substances 0.000 claims abstract description 10
- 229920000642 polymer Polymers 0.000 claims description 27
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 229920000058 polyacrylate Polymers 0.000 claims description 7
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 claims description 6
- 229920001155 polypropylene Polymers 0.000 claims description 6
- 150000003949 imides Chemical class 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 229920005573 silicon-containing polymer Polymers 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 229920005830 Polyurethane Foam Polymers 0.000 abstract description 11
- 239000011496 polyurethane foam Substances 0.000 abstract description 11
- 230000005855 radiation Effects 0.000 abstract description 3
- 238000009792 diffusion process Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 50
- 238000010438 heat treatment Methods 0.000 description 18
- 238000000034 method Methods 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 14
- 230000017525 heat dissipation Effects 0.000 description 14
- 229920001296 polysiloxane Polymers 0.000 description 13
- 210000004027 cell Anatomy 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000004873 anchoring Methods 0.000 description 7
- 238000010030 laminating Methods 0.000 description 7
- 238000000576 coating method Methods 0.000 description 6
- 238000001723 curing Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- 229920005862 polyol Polymers 0.000 description 4
- 150000003077 polyols Chemical class 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 229920002943 EPDM rubber Polymers 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- -1 hydroxypropyl Chemical group 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000005056 polyisocyanate Substances 0.000 description 3
- 229920001228 polyisocyanate Polymers 0.000 description 3
- 229920002725 thermoplastic elastomer Polymers 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Natural products CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- GTBGXKPAKVYEKJ-UHFFFAOYSA-N decyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C(C)=C GTBGXKPAKVYEKJ-UHFFFAOYSA-N 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000006261 foam material Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- KCAMXZBMXVIIQN-UHFFFAOYSA-N octan-3-yl 2-methylprop-2-enoate Chemical compound CCCCCC(CC)OC(=O)C(C)=C KCAMXZBMXVIIQN-UHFFFAOYSA-N 0.000 description 1
- NZIDBRBFGPQCRY-UHFFFAOYSA-N octyl 2-methylprop-2-enoate Chemical compound CCCCCCCCOC(=O)C(C)=C NZIDBRBFGPQCRY-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000008247 solid mixture Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 239000006188 syrup Substances 0.000 description 1
- 235000020357 syrup Nutrition 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001277408A JP2003080629A (ja) | 2001-09-13 | 2001-09-13 | 放熱体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001277408A JP2003080629A (ja) | 2001-09-13 | 2001-09-13 | 放熱体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003080629A true JP2003080629A (ja) | 2003-03-19 |
| JP2003080629A5 JP2003080629A5 (https=) | 2008-09-25 |
Family
ID=19101936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001277408A Pending JP2003080629A (ja) | 2001-09-13 | 2001-09-13 | 放熱体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003080629A (https=) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005107487A (ja) * | 2003-09-26 | 2005-04-21 | Samsung Sdi Co Ltd | ディスプレイ装置及びプラズマディスプレイ装置 |
| DE10340681B4 (de) * | 2003-09-04 | 2006-09-28 | M.Pore Gmbh | Verfahren zur Herstellung einer stoffschlüssigen, wärmeleitenden Verbindung zwischen einer offenporigen Schaumstruktur und einem nichtporösen Grundkörper für Wärmeübertrager, insbesonderer Kühlkörper |
| KR100721487B1 (ko) | 2004-09-22 | 2007-05-23 | 주식회사 엘지화학 | 열전도성이 우수한 점착 방열시트 및 그 제조방법 |
| JP2010111714A (ja) * | 2008-11-04 | 2010-05-20 | Yokohama Rubber Co Ltd:The | 熱伝導性エマルジョン |
| JP2016503575A (ja) * | 2012-09-28 | 2016-02-04 | ダウ グローバル テクノロジーズ エルエルシー | 無線通信タワー用の発泡金属コンポーネント |
| WO2018056407A1 (ja) * | 2016-09-23 | 2018-03-29 | 積水化学工業株式会社 | 多孔質体 |
| CN110800388A (zh) * | 2017-07-06 | 2020-02-14 | 株式会社Lg化学 | 复合材料 |
| CN111093969A (zh) * | 2017-09-15 | 2020-05-01 | 株式会社Lg化学 | 复合材料 |
| JP2020534189A (ja) * | 2017-09-22 | 2020-11-26 | エルジー・ケム・リミテッド | 複合材 |
| JP2023127071A (ja) * | 2022-03-01 | 2023-09-13 | 株式会社レゾナック | 積層フィルム |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11176451A (ja) * | 1997-12-11 | 1999-07-02 | Sumitomo Electric Ind Ltd | 傾斜構造を有する金属多孔体とその製造方法及びそれを用いた電池用基板 |
| JP2000101005A (ja) * | 1998-09-17 | 2000-04-07 | Kitagawa Ind Co Ltd | 放熱材 |
-
2001
- 2001-09-13 JP JP2001277408A patent/JP2003080629A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11176451A (ja) * | 1997-12-11 | 1999-07-02 | Sumitomo Electric Ind Ltd | 傾斜構造を有する金属多孔体とその製造方法及びそれを用いた電池用基板 |
| JP2000101005A (ja) * | 1998-09-17 | 2000-04-07 | Kitagawa Ind Co Ltd | 放熱材 |
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10340681B4 (de) * | 2003-09-04 | 2006-09-28 | M.Pore Gmbh | Verfahren zur Herstellung einer stoffschlüssigen, wärmeleitenden Verbindung zwischen einer offenporigen Schaumstruktur und einem nichtporösen Grundkörper für Wärmeübertrager, insbesonderer Kühlkörper |
| JP2005107487A (ja) * | 2003-09-26 | 2005-04-21 | Samsung Sdi Co Ltd | ディスプレイ装置及びプラズマディスプレイ装置 |
| KR100721487B1 (ko) | 2004-09-22 | 2007-05-23 | 주식회사 엘지화학 | 열전도성이 우수한 점착 방열시트 및 그 제조방법 |
| JP2010111714A (ja) * | 2008-11-04 | 2010-05-20 | Yokohama Rubber Co Ltd:The | 熱伝導性エマルジョン |
| JP2016503575A (ja) * | 2012-09-28 | 2016-02-04 | ダウ グローバル テクノロジーズ エルエルシー | 無線通信タワー用の発泡金属コンポーネント |
| JP6346384B1 (ja) * | 2016-09-23 | 2018-06-20 | 積水化学工業株式会社 | 多孔質体 |
| WO2018056407A1 (ja) * | 2016-09-23 | 2018-03-29 | 積水化学工業株式会社 | 多孔質体 |
| KR102183702B1 (ko) | 2017-07-06 | 2020-11-27 | 주식회사 엘지화학 | 복합재 |
| CN110800388A (zh) * | 2017-07-06 | 2020-02-14 | 株式会社Lg化学 | 复合材料 |
| US11602922B2 (en) | 2017-07-06 | 2023-03-14 | Lg Chem, Ltd. | Composite material |
| EP3651560A4 (en) * | 2017-07-06 | 2020-05-13 | LG Chem, Ltd. | COMPOSITE |
| JP2020524749A (ja) * | 2017-07-06 | 2020-08-20 | エルジー・ケム・リミテッド | 複合材 |
| KR20200101885A (ko) * | 2017-07-06 | 2020-08-28 | 주식회사 엘지화학 | 복합재 |
| CN110800388B (zh) * | 2017-07-06 | 2021-01-08 | 株式会社Lg化学 | 复合材料 |
| JP2020533211A (ja) * | 2017-09-15 | 2020-11-19 | エルジー・ケム・リミテッド | 複合材 |
| JP7013075B2 (ja) | 2017-09-15 | 2022-01-31 | エルジー・ケム・リミテッド | 複合材 |
| CN111093969B (zh) * | 2017-09-15 | 2022-08-23 | 株式会社Lg化学 | 复合材料 |
| CN111093969A (zh) * | 2017-09-15 | 2020-05-01 | 株式会社Lg化学 | 复合材料 |
| US11685851B2 (en) | 2017-09-15 | 2023-06-27 | Lg Chem, Ltd. | Composite material |
| JP2020534189A (ja) * | 2017-09-22 | 2020-11-26 | エルジー・ケム・リミテッド | 複合材 |
| JP7086442B2 (ja) | 2017-09-22 | 2022-06-20 | エルジー・ケム・リミテッド | 複合材 |
| US11603481B2 (en) | 2017-09-22 | 2023-03-14 | Lg Chem, Ltd. | Composite material |
| JP2023127071A (ja) * | 2022-03-01 | 2023-09-13 | 株式会社レゾナック | 積層フィルム |
| JP7841287B2 (ja) | 2022-03-01 | 2026-04-07 | 株式会社レゾナック | 積層フィルム |
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