JP2003078300A - Electronic-component mounting apparatus and program - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic-component mounting apparatus which can avoid an obstacle existing in a conveyance route of an electronic component and to provide a program. SOLUTION: The electronic-component mounting apparatus (10) is an electronic-component mounting apparatus which generates a production program containing a plurality of data required for producing a circuit board (1), and in which a mounting head (60) sucks the electronic component (C) from a component suction position (31) on the basis of the production program so as to be conveyed up to a mounting position (2) on the circuit board. An operator can instruct the production program about the conveyance route R1 a detour R2 of the electronic component. Consequently, when the obstacle exists in the conveyance route, the operator sets the detour, and is possible to prevent a state that the electronic component being conveyed interferes with the obstacle.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and a program for mounting electronic components on a circuit board.

[0002]

2. Description of the Related Art In an electronic component mounting apparatus for mounting electronic components on a circuit board, a suction nozzle vacuum-sucks an electronic component supplied from an electronic component supply unit under the control of a control unit and maintains this suction state. As it is, move to a predetermined position on the circuit board along the preset transport path,
Electronic components are mounted on the circuit board. Here, the control means controls the driving of the above-described various devices according to, for example, a program (hereinafter, referred to as a "production program") described below.

The production program includes board data including data relating to the size and shape of the circuit board, mounting data including the mounting position and mounting order of electronic components on the circuit board, and recognition of electronic components sucked by the suction nozzle. Based on the image of the component data such as the shape and type of the electronic component referred to when performing the suction, the suction data including the suction position of the electronic component by the suction nozzle, and the state in which the suction nozzle suctions the electronic component, It is a program including vision data such as data used when correcting the suction position of a component.

In addition, the production program also includes a transfer path for the electronic component by the suction nozzle, and an algorithm for determining the transfer path is such that the time required from the suction of the electronic component to the mounting is minimized. Route, ie
A method of automatically selecting a path connecting a straight line from the suction position of the electronic component to the mounting position on the board is used.

[0005]

However, in the electronic component mounting apparatus as described above, for example, the mounted electronic components existing in the transport path, or the electronic components mounted on the portion protruding above the circuit board are not provided. There is a case where the electronic components are brought into contact with each other and fallen during transportation, or a mounted electronic component is displaced, which may reduce workability of the electronic component mounting work.

SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus and a program capable of avoiding obstacles existing in a transportation path of electronic components in consideration of the above problems.

[0007]

In order to solve the above problems, an electronic component mounting apparatus (10) according to claim 1 includes a production program including a plurality of data required for producing a circuit board (1). And the mounting head section (60) sucks the electronic component (C) from the component suction position (31) based on the production program and conveys the electronic component (C) to the mounting position (2) on the circuit board to mount the electronic component (C). The component mounting apparatus is characterized in that an operator can specify a transport route (R1 or avoidance route R2) of an electronic component in the production program.

According to the electronic component mounting apparatus of the first aspect, the worker can specify the transport route of the electronic component in the production program. Therefore, for example, when an obstacle exists in the transport route, the worker By setting a path for avoiding this obstacle, it is possible to avoid a situation where the electronic component being conveyed comes into contact with the obstacle, and it is possible to improve the workability of the electronic component mounting work.

An electronic component mounting apparatus according to a second aspect is the electronic component mounting apparatus according to the first aspect, in which an operator rotates the electronic component in a horizontal plane at an arbitrary position on the transportation path according to the production program. It is characterized in that the rotation angle (D) for making it can be designated.

According to the electronic component mounting apparatus of the second aspect, the same effect as that of the first aspect can be obtained, and, for example,
When there are two obstacles on the transport route, by rotating the electronic component by the specified rotation angle, it is possible to easily pass between the two obstacles, which improves the workability of the electronic component mounting work. Can be improved.

According to another aspect of the present invention, there is provided an electronic component mounting apparatus, which mounts an electronic component from a component suction position, conveys the electronic component to a mounting position on a circuit board and mounts the electronic component, and is necessary for producing a circuit board. A control unit (9) for controlling the driving of the mounting head based on a production program including a plurality of data.
0) and an avoidance route (R2) for avoiding the obstacle (O) when the controller determines that the obstacle (O) exists on the transport route of the electronic component. ) Is calculated.

According to the electronic component mounting apparatus of the third aspect, when the electronic component is transported from the component pick-up position to the mounting position based on the production program, if an obstacle is present in the transport path, control is performed. Part determines the avoidance route for avoiding obstacles and carries the electronic components along the avoidance route, so it is possible to avoid the situation where the electronic components being conveyed come into contact with the obstacles, and the electronic component mounting work The workability of can be improved.

An electronic component mounting apparatus according to a fourth aspect is the electronic component mounting apparatus according to the third aspect, wherein the control section comprises:
A rotation angle for rotating the electronic component in a horizontal plane at an arbitrary position on the transport path is calculated.

According to the electronic component mounting apparatus of the fourth aspect, the same effect as that of the third aspect can be obtained, and, for example,
When there are two obstacles on the transport route, by rotating the electronic component by the specified rotation angle, it is possible to easily pass between the two obstacles, which improves the workability of the electronic component mounting work. Can be improved.

An electronic component mounting apparatus according to a fifth aspect is the electronic component mounting apparatus according to the third or fourth aspect, wherein each electronic component is an electronic component that calculates the avoidance route in the production program. It is characterized in that whether or not it can be specified.

According to the electronic component mounting apparatus of the fifth aspect, the same effect as that of the third or fourth aspect can be obtained, and
Since it is possible to specify in the production program whether or not each electronic component is an electronic component that calculates an avoidance route, for electronic components that are specified not to calculate the avoidance route, Since it is not necessary to judge whether or not there is an obstacle, it is possible to shorten the work time of the electronic component mounting work.

According to a sixth aspect of the present invention, a computer causes a computer to pick up an electronic component on a mounting head portion of an electronic component mounting apparatus based on a production program including a plurality of data necessary for producing a circuit board. The function of adsorbing and transporting to the mounting position on the circuit board to mount, and the function of judging the presence or absence of obstacles on the transport path of electronic parts,
And a function of calculating an avoidance route for avoiding an obstacle.

According to the program of claim 6, when the electronic component mounting apparatus determines that there is an obstacle on the conveyance route of the electronic component, a function of calculating an avoidance route for avoiding the obstacle is provided. Can be executed,
By carrying the electronic component along the avoidance path, it is possible to avoid the situation where the electronic component being carried comes into contact with an obstacle, and it is possible to improve the workability of the electronic component mounting work.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of an electronic component mounting apparatus according to the present invention will be described below with reference to the drawings. In addition,
The drawings are merely schematic representations to the extent that the invention can be understood, and are not intended to limit the invention to the illustrated examples.

As shown in FIGS. 1 and 4, the electronic component mounting apparatus 10 conveys the circuit board 1 in the left-right direction (X direction) and positions the conveyed circuit board 1 at a predetermined position. A part 20, a component supply device 30 that stores a plurality of electronic components C and supplies the electronic components C,
The component supply device installation section 40 for installing the component supply device 30, and the electronic components C that are vacuum-sucked at the component suction position 31 set on the component supply device 30 and set on the circuit board 1. Mounting position 2 for each part C
At the suction nozzle 50 for releasing the suction and mounting the electronic component C on the circuit board 1, the mounting head portion 60 and the mounting head portion 6 that move in the XY directions while holding the suction nozzle 50.
0 is moved in the XY directions and is moved integrally with the mounting head positioning portion 70 (timing belt 71, rotary motor 72) and the mounting head portion 60 for positioning at a predetermined position, and the suction state, shape, etc. of the electronic component C are recognized. Component recognition device 8
0, the electronic component mounting apparatus 10 and the control unit 90 for controlling the drive of these apparatuses.

As shown in FIG. 2, the control unit 90 corrects the data concerning the size and shape of the circuit board 1, the data serving as the reference position for positioning the circuit board 1 and the BOC for correcting the position of the circuit board 1. Mark position, etc. (board data)
A board data storage unit 91a, a mounting data storage unit 91b that stores the mounting position 2 of the electronic component C, mounting sequence data and the like (mounting data), and when recognizing the electronic component C sucked by the suction nozzle 50. The component data storage unit 91c that stores data (component data) related to the shape and type of the electronic component C referred to in FIG. 1, the data of the component suction position 31, the suction force data of the suction nozzle 50, and the like (suction data) are stored. Suction data storage unit 91d, component recognition device 80
A vision data storage unit 91e that stores, for example, data (vision data) that is used when correcting the suction position of the electronic component C based on the image recognized in 1. is provided.
Further, the control unit 90 drives the board transfer positioning unit 20, the component supply device 30, the suction nozzle 50, the mounting head unit 60, the mounting head positioning unit 70, and the component recognition device 80, and a drive control unit 92 that performs various drive controls. Arithmetic processing unit 93 for processing programs, input unit 9 such as keyboard and mouse
4, a display unit 95 such as a monitor, a program storage unit 96 that stores an arithmetic processing program 96a executed by the arithmetic processing unit 93, and the like.

The drive control unit 92 and the arithmetic processing unit 93 each include a CPU for performing arithmetic processing, a RAM serving as a work area of the CPU, and the like. In addition, the board data storage unit 91a, the mounting data storage unit 91b, the component data storage unit 9
1c, the adsorption data storage unit 91d, the vision data storage unit 91e, and the program storage unit 96 are configured by a storage medium. The board data storage unit 91a,
The mounting data storage unit 91b, the component data storage unit 91c, the suction data storage unit 91d, the vision data storage unit 91e, and the program storage unit 96 may each be a storage area of one storage medium or separate storage media. May be.

The arithmetic processing unit 93 reads the arithmetic processing program 96a from the program storage unit 96 and performs various processes according to the arithmetic processing program 96a. That is, the arithmetic processing unit 93 that executes the arithmetic processing program 96a displays a data input screen or the like on the display unit 95. Further, the arithmetic processing unit 93 stores the board data based on the input signal from the input unit 94 by the operator in the board data storage unit 91a, the mounting data in the mounting data storage unit 91b, and the component data in the component data storage unit. The suction data is stored in the suction data storage unit 91d, and the vision data is stored in the vision data storage unit 91e.

Further, the arithmetic processing section 93 refers to the board data, the mounting data, the component data, the suction data and the vision data stored in the respective data storage sections to generate a production program including these data, This production program is output to the drive control unit 92. Here, the production program includes a transport route R1 when the mounting head unit 60 transports the electronic component C from the component suction position 31 to the mounting position 2.
(See FIG. 4) are included. As an algorithm used when determining the transport route R1, a method of automatically selecting a route connecting the component suction position 31 and the mounting position 2 with a straight line is used.

Before performing the mounting work of the electronic component C on the circuit board 1, first, the arithmetic processing unit 93 determines whether or not the mounting work of the electronic component C can be normally performed according to the production program. Simulation to do so. In this simulation, when the mounting head unit 60 linearly transports the electronic component C from the component suction position 31 to the mounting position 2 in accordance with the mounting order of the electronic components C recorded in the mounting data, the simulation is performed on the transport route R1. Obstacle O
(See FIG. 4) is included, and if there is an obstacle O, a route (avoidance route R2) for avoiding the obstacle O is included. . The obstacle O may be, for example, an electronic component C already mounted on the circuit board 1 or a portion where the surface of the circuit board 1 protrudes upward.

Hereinafter, the arithmetic processing unit 9 at the time of simulation
The flow of processing according to No. 3 will be described with reference to FIGS. 3 and 4. First, the mounting head unit 60 is moved to the component suction position 31 on the component supply device 30, and the suction nozzle 50 sucks the electronic component C. Then, the transport route R1 that linearly connects the component suction position 31 to the mounting position 2 is determined (step S1). And at that time, the circuit board 1 has already been
The presence or absence of the obstacle O on the transport path R1 is determined in consideration of the position and shape of the electronic component C mounted on the board, the shape of the circuit board 1, and the like (step S2). And step S2
In Yes, that is, when it is determined that the obstacle O does not exist, the process proceeds to step S4, the mounting head unit 60 is moved to the mounting position 2 along the transport route R1, and the electronic component C is mounted.

When it is determined No in step S2, that is, when the obstacle O is present, the process proceeds to step S3, and the avoidance route R2 that avoids the obstacle O and reaches the mounting position 2 is determined. The avoidance route R2 is determined by, for example, two points A, B (hereinafter,
It is called "avoidance position". ) XY coordinates are determined, and the route passing through the component suction position 31, the avoidance positions A and B, and the mounting position 2 is set as the avoidance route R2.

Here, as the avoidance route R2, for example, 2
A path for passing between the two obstacles O is determined, and the electronic component C is rotated in a horizontal plane based on the distance between the two obstacles O and the shape of the electronic component C in a state of being sucked by the suction nozzle 50. If it is determined that the rotation angle D is required, the rotation angle D is calculated. Then, in step S4, the mounting head unit 60 is moved to the mounting position 2 along the avoidance route R2. If necessary, the electronic component C is rotated by the rotation angle D and passed between the two obstacles O and moved to the mounting position 2. Then, the electronic component C is mounted on the circuit board 1.

By performing the above-described processing in the mounting order of the electronic components C, the simulation for determining whether or not the electronic components C can be normally mounted according to the production program is completed. Then, when the avoidance route R2 is calculated in the above-described simulation, each avoidance route R2 is stored in the mounting data storage unit 91b as the mounting data, for example.

When the electronic component C is actually mounted, the drive control unit 92 follows the production program output from the arithmetic processing unit 93 and the avoidance route R2 in the mounting data, and the board transfer positioning unit 20. Parts supply device 30,
The drive of the suction nozzle 50, the mounting head unit 50, the mounting head positioning unit 70, and the component recognition device 80 is controlled. That is, the drive control unit 92 causes the circuit board transfer positioning unit 20 to transfer the circuit board 1 to position the circuit board 1. After that, the drive control unit 92 moves the mounting head unit 60 to the component suction position 31 on the component supply device 30, and causes the suction nozzle 50 to suck the electronic component C. Then, when it is determined that the electronic component C is sucked normally based on the image obtained from the component recognition device 80, the mounting head unit 60 is placed on the circuit board 1 along the transport route R1 or the avoidance route R2. The electronic component C is moved to the mounting position 2, the suction state of the suction nozzle 50 is released, and the electronic component C is mounted on the circuit board 1.

Electronic component mounting apparatus 1 shown in this embodiment
According to 0, when the electronic component C is transported from the component suction position 31 to the mounting position 2 based on the production program, if the obstacle O is present in the transport route R1, the arithmetic processing unit 93 causes the obstacle to be detected. Since the avoidance route R2 for avoiding O is determined and the electronic component C is conveyed along the avoidance route R2, it is possible to avoid the situation where the electronic component C being conveyed comes into contact with the obstacle O, and the electronic component C is prevented. The workability of mounting work can be improved.

Further, when the operator inputs the mounting order of the electronic components C as the mounting data from the input unit 94, in the case of the conventional electronic component mounting apparatus, for example, a relatively large obstacle O may occur. Although the mounting order of the electronic components C is determined as late as possible, the mounting sequence is determined in consideration of the shape of the electronic components C, the mounting position 2 on the circuit board 1, and the like. According to the apparatus 10, since the arithmetic processing unit 93 determines the avoidance route R2 during simulation, it is possible to shorten the setup time when the operator inputs the mounting data, that is, before the electronic component mounting work is started.

The present invention is not limited to the above-described embodiment, and various improvements and design changes may be made without departing from the spirit of the present invention. For example, in the present embodiment, the arithmetic processing unit 93 of the control unit 90 calculates the rotation angle D of the electronic component C as necessary, rotates the electronic component by the rotation angle D, and then the two obstacles. Although it is supposed to pass between O, but not limited to this,
For example, the avoidance route R2 that passes over the obstacle O may be calculated. Further, in the simulation, when it is determined that the obstacle O exists on the transport route R1 of the electronic component C, the arithmetic processing unit 93 determines the avoidance route R2 of the obstacle O, but the present invention is not limited to this. Alternatively, the operator may determine the avoidance route R2 and the rotation angle D as necessary. In this case, the operator inputs the avoidance route R2 and the rotation angle D via the input unit 94,
For example, it is stored as the mounting data in the mounting data storage unit 91b.

In addition, for example, in the mounting data, each electronic component C
May have a configuration capable of designating whether or not the electronic component C calculates the avoidance route R2.
In this case, with respect to the electronic component C designated not to calculate the avoidance route R2, the obstacle O on the transport route R1.
Since it is not necessary to determine whether or not there is, it is possible to shorten the time required for simulation. Further, although the avoidance route R2 is determined by the arithmetic processing unit 93 at the time of simulation, the avoidance route R2 may be determined during the mounting work of the electronic component C, for example.

[0035]

According to the electronic component mounting apparatus of the first aspect, the operator can specify the transport route of the electronic component in the production program. Therefore, for example, when an obstacle exists in the transport route, By setting the route for avoiding the obstacle by the worker, it is possible to avoid the situation where the electronic component being conveyed interferes with the obstacle, and the workability of the electronic component mounting work can be improved.

According to the electronic component mounting apparatus of the second aspect, the same effect as that of the first aspect can be obtained, and, for example,
When there are two obstacles on the transport route, by rotating the electronic component by the specified rotation angle, it is possible to easily pass between the two obstacles, which improves the workability of the electronic component mounting work. Can be improved.

According to the electronic component mounting apparatus of the third aspect, when an electronic component is transported from the component suction position to the mounting position based on the production program, if an obstacle is present in the transport path, control is performed. Part determines the avoidance route for avoiding obstacles and carries the electronic components along the avoidance route, so it is possible to avoid the situation where the electronic components being conveyed interfere with the obstacles, and the electronic component mounting work The workability of can be improved.

According to the electronic component mounting apparatus of the fourth aspect, the same effect as that of the third aspect can be obtained, and, for example,
When there are two obstacles on the transport route, by rotating the electronic component by the specified rotation angle, it is possible to easily pass between the two obstacles, which improves the workability of the electronic component mounting work. Can be improved.

According to the electronic component mounting apparatus of the fifth aspect, the same effect as that of the third or fourth aspect can be obtained, and
Since it is possible to specify in the production program whether or not each electronic component is an electronic component that calculates the avoidance route, for the electronic component that is specified not to calculate the avoidance route, Since it is not necessary to determine whether or not there is an obstacle above, the work time of the electronic component mounting work can be shortened.

According to the sixth aspect of the present invention, when the electronic component mounting apparatus determines that an obstacle exists on the conveyance route of the electronic component, a function of calculating an avoidance route for avoiding the obstacle. Can be executed,
By carrying the electronic component along the avoidance route, it is possible to avoid the situation where the electronic component being carried interferes with the obstacle, and the workability of the electronic component mounting work can be improved.

[Brief description of drawings]

FIG. 1 is a perspective view of essential parts showing an electronic component mounting apparatus according to an embodiment.

FIG. 2 is a block diagram showing a structure of an electronic component mounting apparatus.

FIG. 3 is a flowchart showing a flow of processing by an arithmetic processing unit.

FIG. 4 is a plan view showing a transport route and an avoidance route.

[Explanation of symbols]

C electronic components D rotation angle O obstacle R1 transport route R2 avoidance route 1 circuit board 2 Mounting position 10 Electronic component mounting equipment 31 Parts suction position 60 mounting head 90 Control unit

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Claims (6)

[Claims] 1. A production program including a plurality of data necessary for producing a circuit board is generated, and a mounting head portion adsorbs an electronic component from a component adsorption position based on the production program, An electronic component mounting apparatus for transporting to a mounting position and mounting the electronic component mounting apparatus, wherein an operator can specify a transport path of the electronic component in the production program. 2. The electronic component mounting apparatus according to claim 1, wherein a worker can specify a rotation angle for rotating the electronic component in a horizontal plane at an arbitrary position on the transport path in the production program. An electronic component mounting apparatus characterized by being present. 3. A mounting head unit for sucking an electronic component from a component suction position, transporting it to a mounting position on a circuit board and mounting it, and a production program including a plurality of data necessary for producing the circuit board. An electronic component mounting apparatus including a control unit that controls the driving of the mounting head, wherein the control unit avoids the obstacle when the control unit determines that an obstacle is present on the transport path of the electronic component. An electronic component mounting apparatus, characterized in that it calculates an avoidance path. 4. The electronic component mounting apparatus according to claim 3, wherein the control unit calculates a rotation angle for rotating the electronic component in a horizontal plane at an arbitrary position on the transport path. Electronic component mounting device. 5. The electronic component mounting apparatus according to claim 3, wherein the production program can specify whether or not each electronic component is an electronic component that calculates the avoidance route. A characteristic electronic component mounting device. 6. A circuit board, wherein a computer causes a mounting head portion of an electronic component mounting apparatus to suck an electronic component from a component suction position based on a production program including a plurality of data necessary for producing a circuit board. It is characterized by realizing the function of conveying and mounting to the upper mounting position, the function of judging the presence or absence of obstacles on the conveying route of electronic parts, and the function of calculating the avoidance route for avoiding obstacles. And the program.