JP2003037392A - Method for attaching electronic component and device therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To attach an electronic component in high speed while avoiding interference of an attached electronic component including a previous step with a suction nozzle. SOLUTION: First, a CPU 601 clears all data of a matrix table 610 stored in a RAM 603, and acquires an NC data showing which component is attached to any coordinate position and calculates an ordinate of a target position to obtain the cell position of a target cell. Next, the CPU 601 judges using the NC data whether or not an electronic component is already attached by an upstream-side attaching device. It judges that the electronic component is attached up to step number 004 on the basis of a control symbol M, and updates a data of cell value of the matrix table 610 that corresponds to a cell at the attaching position of an attachment electronic component and adjacent thereto. In addition, the CPU 601 judges whether or not there is a safe area without interference with the attached electronic component (including a previous step) in step number 005 or later, and when it judges that there is a safe area, cycle time is not limited, and if not so, the electronic component is attached after increasing the cycle time.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus that mounts electronic components by vertically moving an electronic component suction nozzle provided on a mounting head and horizontally moving an XY table on which a printed circuit board is mounted. The present invention relates to an electronic component mounting method and device suitable for use in a component mounting device.

[0002]

2. Description of the Related Art Electronic components are mounted in this type of electronic component mounting apparatus by an overlapping operation of a relative horizontal movement between a suction nozzle that sucks an electronic component and vertically moves it, and a table on which a printed circuit board is placed. Done. Therefore, when the electronic components are mounted at a narrow pitch, the interference between the already mounted electronic components and the electronic component to be newly mounted becomes a problem. That is, after mounting a relatively thick component,
If you try to mount an electronic component at an adjacent position, it will interfere with the vertical movement of the suction nozzle, and in extreme cases, the suction nozzle you are going to mount may contact the corners of the already mounted electronic component. There may be a situation where it becomes impossible to wear it.

Therefore, when there is a risk of interference, that is, the relatively oblique movement locus generated by the overlapping movement of the suction nozzle and the XY table can interfere with the electronic components already mounted on the printed circuit board. However, there is a limit to the distance that the XY table can move horizontally within a predetermined mounting tact.

[0004]

For this reason, conventionally, when a tall electronic component is mounted in the previous step (upstream side electronic component mounting apparatus), the spine is mounted when the electronic component is mounted in the step. In order to avoid interference between the tall component and the suction nozzle, the height data of the tallest component among the mounted electronic components in the previous process is used uniformly. Therefore, even if the mounting tact due to the vertical movement of the suction nozzle does not have to be lengthened (tact down), the length is uniformly lengthened, which is a factor that impedes the speedup of electronic component mounting by the electronic component mounting device. .

Therefore, an object of the present invention is to speed up the mounting of electronic parts while avoiding the interference between the mounted electronic parts including the previous process and the suction nozzle.

[0006]

Therefore, the first invention is
The electronic component has a relative oblique movement locus in the vertical direction due to the overlap movement of the suction nozzle that vertically sucks the electronic component and vertically moves it and the relative horizontal movement of the table on which the printed circuit board is placed. Is a method of mounting electronic components on the substrate, and when the electronic component is mounted by the upstream side mounting device, the diagonal movement loci are set by the upstream side mounting device every time the electronic component is mounted. If there is a possibility of interference that touches the mounted electronic components including the above, if there is a possibility of interference, tact down control is performed to lengthen the mounting tact of the electronic component to be mounted, and if there is no possibility of interference. The feature is that the tact is not restricted.

A second aspect of the invention is a relative diagonal movement of a suction nozzle that vertically sucks an electronic component and vertically moves it, and a relative horizontal movement of a table on which a printed circuit board is placed. A method of mounting an electronic component on a substrate having a locus, wherein the coordinates on the table or the substrate are in XY directions according to the size of the electronic component mounted on the substrate. It is divided into cells with a predetermined size area and expressed in a two-dimensional matrix, and the cell value indicating the predetermined tact limit including the presence or absence of mounted electronic components at each cell position is stored as matrix data, and the mounting data is stored. According to the above, there is a cell position calculating step of calculating a cell position of a target cell to be mounted on the two-dimensional matrix, and a case where electronic components are mounted by the upstream mounting device. Each time an electronic component is mounted, by referring to the cell value of the target cell of the electronic component to be mounted, the diagonal movement trajectory touches a mounted electronic component including a plurality of mountings by the upstream mounting device. Interference possibility determination process for determining the presence or absence of possibility, and tact control process for performing tact down control that lengthens the mounting tact of the electronic component to be mounted according to the cell value of the target cell when there is a possibility of interference. And a cell value updating step of updating the cell value of the target cell and a predetermined cell located in the vicinity thereof after mounting the electronic component.

In a third aspect of the invention, the cell value is multivalued according to the thickness of the mounted electronic component, and in the interference possibility determining step, the cell value of the target cell of the electronic component to be mounted is predetermined. It is characterized in that it is judged that there is a possibility of interference when the threshold value of is exceeded.

A fourth aspect of the invention is characterized in that the predetermined threshold value is determined according to the thickness of the electronic component to be mounted.

A fifth aspect of the invention is characterized in that the predetermined cell includes eight cells adjacent to the target cell in eight directions.

A sixth aspect of the present invention is an overlap movement of a suction nozzle for sucking an electronic component and moving vertically and a relative horizontal movement of a table on which a printed circuit board is mounted.
An electronic component mounting apparatus that mounts the electronic component on the substrate with a relatively oblique movement trajectory in the vertical direction, and mounts the electronic component when the upstream side mounting device mounts the electronic component. Whenever there is a possibility of interference, the oblique movement trajectory determines whether there is a possibility of interference with the mounted electronic component including the plurality of mountings by the upstream mounting device. A tact control means for performing tact down control for lengthening the mounting tact of the electronic component to be mounted and controlling so as not to limit the tact when there is no possibility of interference.

Further, a seventh aspect of the present invention is characterized by an overlap movement between a suction nozzle that vertically sucks an electronic component and vertically moves it, and a relative horizontal movement of a table on which a printed circuit board is mounted.
An electronic component mounting apparatus for mounting the electronic component on the substrate, the electronic component mounting device having a relatively oblique movement trajectory in the vertical direction, wherein the coordinates on the table or the substrate are mounted on the substrate. Cells are divided into cells each having a predetermined size in the XY directions according to the size of the cell and expressed in a two-dimensional matrix, and cell values indicating a predetermined tact limit including the presence or absence of mounted electronic components at each cell position are matrixed. Storage means for storing as data, cell position calculation means for calculating a cell position of a target cell to be mounted on the two-dimensional matrix in accordance with the mounting data, and electronic component mounting by the upstream mounting device. Refers to the cell value of the target cell of the electronic component to be mounted every time the electronic component is mounted, so that the diagonal movement locus can also be used for a plurality of mountings by the upstream mounting device. If there is a possibility of interference, the length of the mounting cycle of the electronic component to be mounted can be increased according to the cell value of the target cell. And tact control means for performing tact down control, and cell value updating means for updating the cell value of the target cell and a predetermined cell located in the vicinity thereof after mounting the electronic component.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below.
A description will be given based on the figure. FIG. 1 is a plan view showing a schematic configuration of an electronic component mounting apparatus. As shown in FIG. 1, the electronic component mounting apparatus 1 sandwiches the apparatus body 2 and moves left and right to supply an arbitrary electronic component. It comprises a supply system 3 and a mounting system 4 for mounting electronic parts on the printed circuit board B. The device body 2 includes an index unit (not shown) which is a main body of a drive system, and a rotary table 12 connected to the index unit.
And a plurality of (1
(Two) mounting heads 13 are provided.

The rotary table 12 is intermittently rotated by the index unit at an intermittent pitch corresponding to the number of mounting heads 13. The turntable 12
When is intermittently rotated, the suction nozzle 14 mounted on each apparatus head 13 appropriately faces the supply system 3 and the mounting system 4, sucks the electronic components supplied from the supply system 3, and then conveys the components electronically to the mounting system 4 for mounting. The printed board B introduced into the system 4 is mounted by vertical movement.

The mounting system 4 includes an XY table 31 for moving the mounted substrate B in the X-axis direction and the Y-axis direction, and an X-axis table 31.
A carry-in / carry-out path 32 and a carry-in / carry-out path 33 arranged on the left and right of the Y table 31, and a printed circuit board B on the carry-in / carry path 32.
To the XY table 31, and at the same time a substrate transfer device 34 that transfers the printed circuit board B on the XY table 31 to the carry-out / transport path 33.

The printed circuit board B sent to the downstream end of the carry-in / carry path 32 is transferred by the board transfer device 34 to XY.
The board B on the XY table 31 which has been moved onto the table 31 and at the same time mounting of the electronic components has been completed is transferred to the carry-out transfer path 33 by the board transfer device 34. And
The substrate B introduced onto the XY table 31 is appropriately moved in the XY directions by the XY table 31, and each mounting head 1
Corresponding to the electronic components sent one after another by 3, the component mounting portion is made to face the apparatus position, and the electronic components are mounted by the vertical movement of each suction nozzle 14.

Next, FIG. 2 is a block diagram of a control system showing an embodiment of the electronic component mounting apparatus of the present invention. In FIG. 2, the control unit 6 includes a control unit main body 60, a touch panel 61, and an external storage device (hereinafter referred to as ES) 62 such as a hard disk or a magneto-optical disk. The touch panel 61 is a means for inputting, editing, and displaying the electronic component mounting apparatus 1, and has a display screen as a so-called monitor, and the operator performs various touch input operations on the monitor screen (display screen). It is possible to confirm and grasp them by inputting instruction data, performing an operation such as editing, and displaying the edited result and various error displays.

The ES 62 includes an NC program area 621 for storing a numerical control (NC) program and a parts library data area 62 for storing parts library data.
2, a component terminal development data area 623 for storing component terminal development data, and another area 624 for storing other various programs and various data.

The NC program is a program for mounting electronic components on a board based on NC data prepared in advance, and which electronic component is located on the board at which position (X and Y directions, angular position) in the NC data. Whether or not to be attached to is set as layout data. In addition, the component library data includes data regarding all electronic components that can be handled by the electronic component mounting device. Specifically, the component dimension data, the terminal form of the target component, unit terminal data regarding the pitch, It is all-terminal arrangement data and all-missing-terminal arrangement data regarding the arrangement of all terminals.

As shown in FIG. 5, the NC data includes X-coordinates, Y-coordinates, and angular positions (θ
(Direction) and the like, mounting coordinates which are the arrangement number data of the component supply device constituting the supply system 3, control symbols and the like. The control symbol "M" indicates that the electronic component has been mounted in the previous step (mounting device on the upstream side).

The control unit main body 60 includes a CPU 601 and an R
OM602, RAM603, input / output controller (IO
C) 604 and an external storage controller (ESC) 605, which are mutually connected via an internal bus 606.
The ROM 602 contains various control programs including a screen display device and a control device for the above-described data expansion processing, as well as a program for system startup. Also, where relevant to the present invention, the procedure shown by the flowchart in FIG. 3 is also programmed and recorded. The details will be described later.

The RAM 603 is used as an internal storage means of the control unit main body 60, for example, in various work areas and buffers when it is developed as the above-mentioned individual position data. The ROM 602 is related to the present invention.
The matrix table shown in FIG. 4 is generated and stored according to the program stored in. The details will be described later.

The IOC 604 includes a rotary table 12,
The XY table 31 and the component recognition unit 8 (the line sensor 9 and the component recognition (C
It is connected to a peripheral device such as a CD) camera 10), a touch panel 61 in the control unit 6, and an external input device 65 different from the electronic component mounting device 1. And IOC
A control unit 604 controls input / output of various control signals and various data between these peripheral devices and the control unit main body 60 according to a command from the CPU 601. ESC605 is CPU6
In accordance with the command from 01, drive and control ES62,
Input / output of various control signals and various data between S62 and the control unit main body 60 is controlled.

With the above-described configuration, the CPU 601 uses the work area of the RAM 603, the save area of the ES 62, and the like in accordance with the built-in program of the ROM 602, the control program stored in the ES 62, and the like to perform data expansion processing, component mounting processing, etc. Performs the entire data processing required for the electronic component mounting apparatus 1 of IOC604 and ESC
Through 605, the entire electronic component device mounting 1 is controlled.

The external input device 65 is the touch panel 6
1, an input unit 651 similar to 1, a control unit 652 similar to the control unit main body 60 described above, and a storage unit 653 similar to ES62.
In addition to the control unit 6, the control unit 6 is configured so that various data can be input, created, and processed, and is connected to the control unit 6 via a network capable of data communication (transmission / reception). That is, in the following description, it is assumed that a data processing device is incorporated in the main body of the electronic component mounting device 1 (also serving as the control unit 6), but it is configured as the external input device 65. It can also be connected to the electronic component mounting apparatus 1 by a communication means. Also, ES6
When 2 is a storage medium that is detachable from the main body, such as a magneto-optical disk, various data input through the external input device 65, which is a component data input device, is stored in the removable storage medium. By loading it again as ES62 of the control unit 6 of the electronic component mounting apparatus 1, various input data can be utilized as data of the electronic component mounting apparatus 1 without a communication means.

FIG. 4 is a diagram cited for explaining the operation of the embodiment of the present invention, and is a diagram showing the structure of the matrix table 610 allocated and stored in the RAM 603 shown in FIG.

The matrix table 610 is a table in which the coordinates assigned to the XY table 31 described above are divided into cells in appropriate areas, which are represented by a two-dimensional matrix, and the storage areas of the RAM 603 are assigned in correspondence with the cells. . The size of one cell is determined in consideration of the size of the electronic component to be mounted, and here, the electronic component mounting apparatus 1
Can be assigned in units of an integer fraction of the smallest electronic component that can be mounted. Therefore, a plurality of cells are usually occupied by one electronic component. In the following description, for simplicity, 1
It is assumed that one cell is allocated to each electronic component.

Each time an electronic component is mounted, the CPU 601
Calculates at least one cell (target cell) corresponding to the mounting target from the coordinate position to be mounted on the board B, and writes the value in the corresponding area (matrix table 610) of the RAM 603 allocated to the cells located in the vicinity. Here, the neighborhood means eight cells in the up, down, left, and right diagonal directions adjacent to the cell corresponding to the mounting position. In FIG. 4, it is assumed that the X mark indicates the mounting cell position, and the eight cells (circle mark) diagonally surrounding the X mark (circle mark) are located in the vicinity. Also, the matrix table 610
The value (cell value) written in the corresponding cell area is set to "1" when there is a risk of causing interference with electronic components to be mounted thereafter, and is set to "0" when there is no risk. "1", "0"
Is uniquely determined by the size of the electronic component to be mounted. The value set in the cell area of the RAM 603 is
It is updated every time an electronic component is mounted in the vicinity.

Next, when trying to mount a new electronic component, the CPU 601 performs coordinate calculation based on the program stored in the ROM 602, and when the corresponding cell (target cell) is determined, the cell located in the vicinity of that cell is determined. The content of the cell area of the RAM 603 (matrix table 610) corresponding to the above is referred to, and when it is “1”, it is notified to the head unit 7 (suction nozzle) that performs tact control with tact down, and when it is “0”, there is no tact restriction.

In the above example, the presence / absence of tact limitation is defined by two values. However, in order to perform precise control, it is expressed by multiple values, cell values are classified according to the thickness of electronic parts, and threshold values are used. , Tact restrictions in neighboring cell areas may be defined. As a comparatively simple example, it is conceivable that the tact limit is set for values other than “0”, the degree of the tact limit is changed depending on the value, and “0” is set for no tact limit. Further, for example, the cell value of the mounting position (target cell) is set to "3", the cell value of the adjacent cell is set to "2", and the cell value outside thereof is set to "1". Furthermore, the cell value may be changed stepwise according to the thickness of the mounted electronic component.

Further, for example, the matrix table 6 shown in FIG.
10, when the current position is point C, when mounting an electronic component at point B ((b) moving from point C to point B and mounting), there is a risk of interference, but it is mounted at point A ( (A) Move from point C to point A to wear)
There is no need for tact down. Therefore, it is possible to judge the cell value of each cell in consideration of the current position, the target position, or the locus of movement at that time, and determine whether or not it is safe, or to what extent tact restriction is applied. it can.

Next, FIG. 3 is a schematic flowchart showing the operation by the above-mentioned control. Hereinafter, the schematic operation will be described with reference to the flowchart of FIG.

First, the CPU 601 clears all the data in the matrix table 610 allocated and stored in a specific area of the RAM 603 (step S1). Then, NC data indicating which chip component is mounted at which coordinate position is obtained from the NC program area 621, the coordinates of the target position are calculated, and the cell position of the corresponding cell (target cell) is obtained (step S2).

Next, the CPU 601 determines from the NC data whether or not the electronic component has been mounted in the previous step (mounting device on the upstream side) "installed" (step S3). That is, if the step number is 001, it is determined from the control symbol "M" that "mounted", and the matrix table 610 (corresponding to the mounted position of the mounted electronic component and the cells located in the vicinity thereof) RAM603)
The cell value data of is updated (step S9), and it is checked whether all electronic components have been mounted (step S1).
0), no, so the coordinate calculation of the target position in the next step number 002 is performed and the cell position of the corresponding cell is obtained (step S2). To step number 004 (because it is "mounted"), steps S2, S3, S9, and S10 are repeated.

Then, the coordinates of the target position in the next step number 005 are calculated, the cell position of the corresponding cell is obtained (step S2), and it is determined whether or not the cell is "mounted" (step S3). At this time, since it is not mounted yet, the cell value data of the target cell position (and the vicinity thereof if necessary) is acquired (step S4), and when the new electronic component is mounted by the cell value, It is determined whether or not it is a safe area where there is no interference with the mounted electronic components (including all the plurality of electronic components mounted in the previous process) (step S5).

If it is determined to be safe, no tact restriction is set (step S6), and if it is determined to be dangerous, tact down (step S7) is set / instructed, and the electronic component is mounted at the target position (step S6). Step S8).

Then, the cell value data in the matrix table 610 (RAM 603) corresponding to the mounting position of the mounted electronic component and the cells located in the vicinity of the mounting position are updated (step S9). Finally, it is checked whether all the electronic components have been mounted (step S10), and if not, a series of processes from the coordinate calculation process of the target position (step S2) to the matrix data update process (step S9) is performed. repeat.

That is, after step number 005, it is judged whether or not it is a safe area where there is no interference with electronic components which have already been mounted (including mounting in the previous process) (step S5), and safety is determined. If it is determined that steps S2, S3, S4, S5, S6, S8 and S are performed without limiting the tact time.
9 and S10, if not safe, tact down and steps S2, S3, S4, S5, S7, S8, S9, S
Via 10.

As described above, according to the present invention, the XY table coordinates are divided into cells in an appropriate area and expressed by a two-dimensional matrix, and presence / absence of mounted electronic components including the preceding process at each cell position is determined. By storing in the matrix table (RAM 603) the cell value indicating the predetermined takt limit including, by simply referring to each cell value, it is possible to determine whether or not the electronic component is already mounted at the cell position, and Since the tact limit can be easily and quickly grasped, the tact limit at each cell position can be grasped easily and quickly, and the tact control can be conducted easily and quickly. In addition, since the cell value of the target cell and a predetermined cell located in the vicinity of the electronic cell is updated after mounting the electronic component, the position of the mounted component including the previous process is always based on the latest and optimum cell value. Tact control based on judgment and tact restriction is possible. Also,
Every time an electronic component is mounted, the cell position of the target cell to be mounted on the two-dimensional matrix is calculated, and the cell value of the target cell is referenced, so that the diagonal movement locus includes the pre-installed electronic components. Since the presence / absence of interference that touches a component is determined, high-speed processing can be performed for the position determination of the mounted component and the presence / absence determination of the possibility of interference based on that as well. Depending on the value, the tact down control that lengthens the mounting tact of the electronic component to be mounted is performed, so the average mounting tact can be shortened compared to the case where the tact down is uniformly performed as in the past. The mounting can be performed easily and quickly, and the operating rate can be improved as a whole.

It should be noted that the two-dimensional matrix data of a plurality of electronic components mounted in the previous process (upstream device) is transferred every time the substrate is transferred from the previous process to the subsequent process (downstream device), that is, the substrate transfer signal. In addition to the output from the previous process to the subsequent process, the subsequent process may be collectively acquired from the previous process.

Further, as described above, the cell value is multi-valued and stored according to the thickness of the mounted electronic component, and when the cell value of the target cell of the mounted electronic component exceeds the predetermined threshold value. The tact control can be performed by determining that there is a possibility of interference. Generally, even if the movement trajectory of the electronic component to be mounted is the same, the possibility of interference varies depending on the thickness of the mounted electronic component, but in this case, the cell value becomes multivalued according to the thickness of the electronic component. Therefore, it is easy and quick to determine whether there is a possibility of interference with the mounted parts (including the previous process) in the vicinity by simply determining whether the cell value of the target cell exceeds a predetermined threshold value. Can be determined. That is, even when mounting electronic components of various thicknesses,
Appropriate tact control can be performed easily and quickly according to their thickness, and electronic parts can be easily and quickly mounted.

Further, the above-mentioned predetermined threshold value may be determined according to the thickness of the electronic component to be mounted. In general, even if the suction nozzle that sucks an electronic component has the same movement locus, the movement locus of the electronic component (for example, the movement locus of the lower end of the electronic component) is different (shifted) depending on the thickness of the mounted electronic component. However, in this case, since the predetermined threshold value is determined according to the thickness of the electronic component to be mounted, the cell value of the target cell is simply determined by determining whether or not it exceeds the predetermined value. It is possible to easily and quickly determine whether there is a possibility of interference with a mounted component in the vicinity. That is, even when electronic components having various thicknesses are mounted, it is possible to perform finer tact control in accordance with the thicknesses and easily and quickly mount the electronic components.

In the above embodiment, the mounting system is
Only the example in which the rotary table is intermittently rotated at an intermittent pitch corresponding to the number of mounting nozzles is shown, but the present invention is not limited to this, and an XY stage is movably arranged on a substrate and mounted on each XY stage. Even an electronic component mounting apparatus having a head (suction nozzle) mounted thereon can be similarly applied by dividing the coordinates on the substrate into cells and expressing them in a two-dimensional matrix.

Although the embodiments of the present invention have been described above, various alternatives, modifications or variations can be made by those skilled in the art based on the above description, and the present invention is within the scope without departing from the spirit thereof. It is intended to cover various alternatives, modifications or variations.

[0045]

As described above, according to the present invention, it is possible to speed up the mounting of electronic components while avoiding the interference between the mounted electronic components including the plurality of electronic components mounted in the previous process and the suction nozzle. it can.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of a schematic structure of an electronic component mounting apparatus.

FIG. 2 is a block diagram of a control system of the electronic component mounting apparatus.

FIG. 3 is a flowchart showing an operation in mounting control of the embodiment.

FIG. 4 is a diagram showing a data structure of a matrix table assigned to a RAM in FIG.

FIG. 5 is a diagram showing NC data.

[Explanation of symbols]

6 control unit 60 Control unit body 601 CPU 603 RAM 62 External storage device (ES) 621 NC program area

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Okamoto Manabu             2-5-3 Keihan Hondori, Moriguchi City, Osaka Prefecture             Within Yo Denki Co., Ltd. F-term (reference) 5E313 AA01 AA11 CC03 CD02 CD04                       DD49 EE02 EE03 FF24 FF29                       FG01

Claims (7)

[Claims] 1. An overlap movement between a suction nozzle that vertically sucks an electronic component and vertically moves it and a relative horizontal movement of a table on which a printed circuit board is placed has a relatively oblique movement locus in the vertical direction. In the electronic component mounting method of mounting the electronic component on the substrate, if the electronic component is mounted by the upstream mounting device, the diagonal movement locus is set to the upstream mounting every time the electronic component is mounted. If there is a possibility of interference with the mounted electronic components, including multiple mountings by the device, if there is a possibility of interference, tact down control is performed to lengthen the mounting tact of the electronic component to be mounted, and there is a possibility of interference. An electronic component mounting method, characterized in that the tact is not restricted when there is no such problem. 2. A relative oblique movement locus is provided in the vertical direction by overlapping movement of a suction nozzle that vertically sucks an electronic component and vertically moves it, and a relative horizontal movement of a table on which a printed circuit board is placed. An electronic component mounting method for mounting the electronic component on the substrate, wherein the coordinates on the table or the substrate are areas of a predetermined size in the XY directions according to the size of the electronic component mounted on the substrate. Cells are expressed by a two-dimensional matrix, and cell values indicating a predetermined tact limit including the presence or absence of mounted electronic components at each cell position are stored as matrix data. A cell position calculating step of calculating a cell position of a target cell to be mounted on the dimensional matrix, and an electronic part when mounting the electronic component by the upstream mounting device. By referring to the cell value of the target cell of the electronic component to be mounted every time the product is mounted, there is a possibility that the diagonal movement locus may interfere with a mounted electronic component including a plurality of mountings by the upstream mounting device. An interference possibility determination step of determining the presence or absence, and a tact control step of performing a tact down control for lengthening the mounting tact of the electronic component to be mounted according to the cell value of the target cell when there is a possibility of interference, and an electronic And a cell value updating step of updating the cell value of the target cell and a predetermined cell located in the vicinity of the target cell, after mounting the component. 3. The cell value is multivalued according to the thickness of the mounted electronic component, and in the interference possibility determination step, the cell value of the target cell of the mounted electronic component exceeds a predetermined threshold value. The electronic component mounting method according to claim 2, wherein it is determined that there is a possibility of interference when the electronic component mounting method is performed. 4. The predetermined threshold value is determined according to the thickness of the electronic component to be mounted.
Electronic component mounting method described in. 5. The predetermined cell includes 8 of the target cells.
The electronic component mounting method according to claim 2, wherein eight cells adjacent to each other in the direction are included. 6. A relatively oblique movement locus is provided in the vertical direction by overlapping movement of a suction nozzle that vertically sucks an electronic component and vertically moves it and a relative horizontal movement of a table on which a printed circuit board is placed. And an electronic component mounting device for mounting the electronic component on the substrate, and when the electronic component is mounted by the upstream mounting device, the diagonal movement trajectory is the upstream mounting when the electronic component is mounted. Interference possibility determination means that determines whether there is a possibility of interference with already mounted electronic components, including multiple mountings by the device, and tact down control that lengthens the mounting tact of electronic components to be mounted when there is a possibility of interference. And a tact control unit that controls so as not to limit the tact when there is no possibility of interference. 7. A relatively diagonal movement locus is provided in the vertical direction by overlapping movement of a suction nozzle that vertically sucks an electronic component and vertically moves the table and a table on which a printed circuit board is placed. And an electronic component mounting apparatus for mounting the electronic component on the substrate, wherein a coordinate on the table or the substrate has a predetermined size in the XY direction according to the size of the electronic component mounted on the substrate. And a storage means for storing as a matrix data cell values indicating a predetermined tact limit including the presence or absence of mounted electronic components at each cell position, which is expressed by a two-dimensional matrix. Cell position calculation means for calculating the cell position of the target cell to be mounted on the two-dimensional matrix, and if there is electronic component mounting by the upstream side mounting device, Each time the electronic component is mounted, by referring to the cell value of the target cell of the electronic component to be mounted, there is a possibility that the diagonal movement locus may interfere with the mounted electronic component including a plurality of mountings by the upstream mounting device. Interference possibility determining means for determining the presence or absence of, and, if there is a possibility of interference, according to the cell value of the target cell, tact control means for performing tact down control for lengthening the mounting tact of the electronic component to be mounted, An electronic component mounting apparatus comprising: a cell value updating unit that updates a cell value of a target cell and a predetermined cell located in the vicinity thereof after mounting the electronic component.