JPH04250700A - Mounting method for electronic component - Google Patents

Mounting method for electronic component

Info

Publication number
JPH04250700A
JPH04250700A JP3008044A JP804491A JPH04250700A JP H04250700 A JPH04250700 A JP H04250700A JP 3008044 A JP3008044 A JP 3008044A JP 804491 A JP804491 A JP 804491A JP H04250700 A JPH04250700 A JP H04250700A
Authority
JP
Japan
Prior art keywords
component
lead
screen
sop
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3008044A
Other languages
Japanese (ja)
Other versions
JP2965362B2 (en
Inventor
Hiroshi Obara
啓史 小原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP3008044A priority Critical patent/JP2965362B2/en
Publication of JPH04250700A publication Critical patent/JPH04250700A/en
Application granted granted Critical
Publication of JP2965362B2 publication Critical patent/JP2965362B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Image Analysis (AREA)
  • Image Processing (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE:To recognize a divisional visual field even a large-sized SOP component which cannot be contained in one visual field and to mount it by moving it to a next screen as movement of a stationary amount at a side having no lead, and deciding a moving distance of a side having a lead according to coordinates data of a reference lead. CONSTITUTION:When a large-sized SOP component 11 is recognized by four divisions, a screen is so moved over a recognition camera 13 by a robot 12 as to be sequentially recognized for a visual field of upper left, upper right, lower right, lower left parts of the component 11, images are processed by a recognition processor 14 at the respective visual fields, and coordinates data of a reference lead are input to a CPU 15. The CPU 15 so controls the robot 12 through an NC robot controller 16 as to move to a next screen of a stationary amount if the side of the component 11 does not have a lead in a screen moving direction and to move to a next screen of a movable amount decided according to coordinates data of the reference lead if it has the lead in the screen moving direction. Four division recognitions of the component 11 are sequentially conducted to recognize the entire component, its attitude is corrected, etc., and the component 11 is mounted.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は電子部品を表面実装する
電子部品実装方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method for surface mounting electronic components.

【0002】0002

【従来の技術】近年、電子部品は大型化され50角以上
の電子部品が出回りつつある。この動きに対して、4方
向にリードを有するクワット・フラット・パッケージ(
以下QFPという)部品は所定リードを基準にすること
により4分割認識という認識補正方法が確立されている
が、対称な2方向にリードを有するスモール・アウトラ
イン・パッケージ(以下SOPという)部品においては
1視野認識しかできないのが現状である。
2. Description of the Related Art In recent years, electronic components have become larger, and electronic components having a size of 50 squares or more are becoming available. For this movement, a quad flat package with leads in four directions (
For components (hereinafter referred to as QFP), a recognition correction method called 4-division recognition has been established by using a predetermined lead as a reference, but for small outline package (hereinafter referred to as SOP) components that have leads in two symmetrical directions, Currently, only visual field recognition is possible.

【0003】以下、図面を参照しながら上述した4分割
認識の方法について説明する。図3は従来のQFP部品
の4分割認識補正方法を説明するための各視野図である
。図3において、1〜4は36ピンのQFP部品5を4
分割視野認識した際の各視野における画面を示している
。画面1から画面2に視野移動する際には基準リード6
の座標データによって行われている。すなわち、画面1
のカメラ位置と基準リード6のカメラ画素座標により、
XY座標系に展開したときの基準リード6の位置が記憶
される。次に、画面2に移動したときのカメラ位置と基
準リード6aのカメラ画素座標によりXY座標系に展開
したときの基準リード6aの位置が画面1における基準
リード6の位置と一致するように移動量が決定される。 そして、画面2から画面3、さらに、画面3から画面4
に視野移動する際も同様に基準リード7と基準リード7
aの位置、さらに、基準リード8と基準リード8aの位
置が一致するように移動量が決定される。これにより、
QFP部品5全体の視野9を認識することができる。こ
の認識結果によりQFP部品5の保持姿勢や保持位置な
どを補正して、基板上の所定位置にQFP部品5を実装
する。
[0003] The above-mentioned four-division recognition method will be explained below with reference to the drawings. FIG. 3 is a field diagram for explaining a conventional four-division recognition correction method for QFP components. In FIG. 3, 1 to 4 represent 36-pin QFP components 5.
It shows the screen in each field of view when split field of view is recognized. When moving the field of view from screen 1 to screen 2, use reference lead 6.
This is done using coordinate data. That is, screen 1
According to the camera position of and the camera pixel coordinates of the reference lead 6,
The position of the reference lead 6 when developed in the XY coordinate system is stored. Next, the camera position when moving to screen 2 and the camera pixel coordinates of the reference lead 6a are used to adjust the amount of movement so that the position of the reference lead 6a when developed in the XY coordinate system matches the position of the reference lead 6 on screen 1. is determined. Then, from screen 2 to screen 3, and then from screen 3 to screen 4.
Similarly, when moving the field of view to
The amount of movement is determined so that the position of a and the positions of the reference lead 8 and the reference lead 8a match. This results in
The field of view 9 of the entire QFP component 5 can be recognized. Based on this recognition result, the holding posture, holding position, etc. of the QFP component 5 are corrected, and the QFP component 5 is mounted at a predetermined position on the board.

【0004】0004

【発明が解決しようとする課題】しかしながら上記従来
の構成では、SOP部品は画面移動の際の基準リードが
2方向にしか無いため、基準リードが無い辺の方向は移
動量が決まらず、これにより、一括視野認識しかできず
4分割視野認識することができないという問題を有して
いた。
[Problems to be Solved by the Invention] However, in the above-mentioned conventional configuration, since the SOP component has reference leads in only two directions when moving the screen, the amount of movement in the direction of the side without reference leads is not determined. However, this method had the problem that it could only recognize the field of view all at once, and could not recognize the field of view divided into four parts.

【0005】本発明は上記従来の問題を解決するもので
、リードが2方向しか無い大型の電子部品の場合でも分
割視野認識することができて電子部品全体を視野認識す
ることができる電子部品実装方法を提供することを目的
とするものである。
The present invention solves the above-mentioned conventional problems, and provides an electronic component mounting system in which split field of view can be recognized even in the case of a large electronic component with leads in only two directions, and the entire electronic component can be recognized in the field of view. The purpose is to provide a method.

【0006】[0006]

【課題を解決するための手段】上記課題を解決するため
に本発明の電子部品実装方法は、電子部品を認識する際
、前記電子部品の画面移動方向の辺にリードが無い場合
は固定量分次の画面へ移動し、また、前記電子部品の画
面移動方向の辺にリードが有る場合は基準リードの座標
データにより決定された移動量分次の画面へ移動するこ
とにより前記電子部品の分割認識を順次行って前記電子
部品全体を認識し、前記電子部品を実装するものである
[Means for Solving the Problems] In order to solve the above problems, the electronic component mounting method of the present invention, when recognizing an electronic component, if there is no lead on the side of the electronic component in the screen movement direction, a fixed amount of leads are provided. The division recognition of the electronic component is performed by moving to the next screen and, if there is a lead on the side of the electronic component in the screen movement direction, moving to the next screen by the amount of movement determined by the coordinate data of the reference lead. are performed sequentially to recognize the entire electronic component, and then mount the electronic component.

【0007】[0007]

【作用】上記構成により、電子部品のリードの無い辺の
方向は移動量を固定にすることによって1視野に入りき
らない大型の、リードの無い辺を有する電子部品も分割
認識が可能となって大型の電子部品全体を認識すること
が可能となる。
[Function] With the above configuration, by fixing the amount of movement in the direction of the side without leads of the electronic component, it is possible to separate and recognize electronic components that are too large to fit in one field of view and have sides without leads. It becomes possible to recognize the entire large electronic component.

【0008】[0008]

【実施例】以下、本発明の一実施例について図面を参照
しながら説明する。図1は本発明の一実施例の電子部品
実装方法を説明するための電子部品実装装置のブロック
図である。図1において、11は認識対象となるSOP
部品であり、リードを対称な2方向に有している。すな
わち、SOP部品11はリードを持たない辺を対称な位
置に有している。ロボット12はSOP部品11を保持
してX,Y方向に移動自在である。認識カメラ13は保
持されたSOP部品11の下方に位置してSOP部品1
1の各分割切片をそれぞれ認識する。認識カメラ13が
接続される認識処理装置14は、認識カメラ13からの
信号によりSOP部品11の各分割切片を画像処理して
基準リードを検出する。 認識処理装置14が接続されるメインプログラムCPU
15は記憶装置を有し、認識処理装置14からの基準リ
ードの座標データを記憶装置に格納し、この格納された
座標データからSOP部品11の画面移動方向の辺にリ
ードの有無を判断し、SOP部品11の画面移動方向の
辺にリードが有る場合は従来方法により移動量を決定し
、また、SOP部品11の画面移動方向の辺にリードが
無い場合は所定の固定量としての移動量を決定する。メ
インプログラムCPU15に接続されるNCロボットコ
ントローラ16はロボット12に接続され、メインプロ
グラムCPU15からの移動量に応じてロボット12を
駆動制御する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram of an electronic component mounting apparatus for explaining an electronic component mounting method according to an embodiment of the present invention. In Figure 1, 11 is the SOP to be recognized.
It is a component and has leads in two symmetrical directions. That is, the SOP component 11 has sides without leads at symmetrical positions. The robot 12 holds the SOP component 11 and is movable in the X and Y directions. The recognition camera 13 is located below the held SOP component 11 and
Recognize each divided section of 1. A recognition processing device 14 to which the recognition camera 13 is connected performs image processing on each divided section of the SOP component 11 based on a signal from the recognition camera 13 to detect a reference lead. Main program CPU to which the recognition processing device 14 is connected
15 has a storage device, stores the coordinate data of the reference lead from the recognition processing device 14 in the storage device, and determines the presence or absence of a lead on the side of the SOP component 11 in the screen movement direction from the stored coordinate data; If there is a lead on the side of the SOP component 11 in the screen movement direction, the amount of movement is determined by the conventional method, and if there is no lead on the side of the SOP component 11 in the screen movement direction, the amount of movement is determined as a predetermined fixed amount. decide. An NC robot controller 16 connected to the main program CPU 15 is connected to the robot 12 and drives and controls the robot 12 according to the amount of movement from the main program CPU 15.

【0009】上記構成により、以下、その動作を説明す
る。 1.ロボット12は認識対象となるSOP部品11を保
持し、まず、このSOP部品11の左上部分が認識カメ
ラ13上に来るようにロボット12を移動させる。
The operation of the above configuration will be explained below. 1. The robot 12 holds the SOP part 11 to be recognized, and first moves the robot 12 so that the upper left part of the SOP part 11 is above the recognition camera 13.

【0010】2.保持されたSOP部品11の左上部分
を認識カメラ13で4分割切片の第1視野目の画面とし
て認識して認識処理装置14で画像処理し、基準リード
を検出する。そして、基準リードの座標データをメイン
プログラムCPU15の記憶装置に格納する。
2. The upper left part of the held SOP component 11 is recognized by the recognition camera 13 as the first field of view of the quadrant section, and the recognition processing device 14 processes the image to detect the reference lead. Then, the coordinate data of the reference lead is stored in the storage device of the main program CPU 15.

【0011】3.第1視野目の画面から第2視野目の画
面に移動する際には、メインプログラムCPU15の記
憶装置に格納された基準リードの座標データから、メイ
ンプログラムCPU15は、図2のステップS1でSO
P部品11の、次画面への移動方向の辺にリードが存在
するかしないかを判断し、SOP部品11の、次画面へ
の移動方向の辺にリードが存在すれば図2のステップS
2で従来技術で説明した方法により決定した移動量をN
Cロボットコントローラ16に送信してロボット12を
駆動制御し、SOP部品11をSOP部品11の右上部
分を示す第2視野目の画面に移動する。また、SOP部
品11の、次画面への移動方向の辺にリードが存在しな
ければ、図2のステップS3で所定の固定量である移動
量をNCロボットコントローラ16に送信してNCロボ
ットコントローラ16によりロボット12を駆動制御し
、SOP部品11をSOP部品11の右上部分を示す第
2視野目の画面に移動する。
3. When moving from the screen of the first visual field to the screen of the second visual field, the main program CPU 15 uses the coordinate data of the reference lead stored in the storage device of the main program CPU 15 to
It is determined whether a lead exists on the side of the P component 11 in the direction of movement to the next screen. If a lead exists on the side of the SOP component 11 in the direction of movement to the next screen, step S in FIG.
The amount of movement determined by the method explained in the prior art in 2 is N.
The data is transmitted to the C robot controller 16 to drive and control the robot 12, and move the SOP component 11 to the second view screen showing the upper right portion of the SOP component 11. If there is no lead on the side of the SOP component 11 in the direction of movement to the next screen, a predetermined fixed amount of movement is sent to the NC robot controller 16 in step S3 of FIG. The robot 12 is driven and controlled to move the SOP component 11 to the second field of view showing the upper right portion of the SOP component 11.

【0012】4.SOP部品11の右上部分を示す第2
視野目の画面に移動が完了した後、保持されたSOP部
品11の4分割切片である右上部分を認識カメラ13で
認識して認識処理装置14でその右上部分を画像処理し
、基準リードを検出する。そして、基準リードの座標デ
ータをメインプログラムCPU15の記憶装置に格納す
る。
4. The second part showing the upper right part of SOP part 11
After the movement to the field eye screen is completed, the upper right part, which is a quarter section of the held SOP part 11, is recognized by the recognition camera 13, and the recognition processing device 14 processes the image of the upper right part to detect the reference lead. do. Then, the coordinate data of the reference lead is stored in the storage device of the main program CPU 15.

【0013】5.第2視野目の画面から第3視野目の画
面に移動する際には、メインプログラムCPU15の記
憶装置に格納された基準リードの座標データから、メイ
ンプログラムCPU15は、図2のステップS4でSO
P部品11の、次画面への移動方向の辺にリードが存在
するかしないかを判断し、SOP部品11の、次画面へ
の移動方向の辺にリードが存在すれば図2のステップS
5で従来技術で説明した方法により得た移動量をNCロ
ボットコントローラ16に送信してロボット12を駆動
制御し、SOP部品11をSOP部品11の右下部分を
示す第3視野目の画面に移動する。また、SOP部品1
1の、次画面への移動方向の辺にリードが存在しなけれ
ば、図2のステップS6で所定の固定量である移動量を
NCロボットコントローラ16に送信してNCロボット
コントローラ16によりロボット12を駆動制御し、S
OP部品11をSOP部品11の右下部分を示す第2視
野目の画面に移動する。
5. When moving from the screen of the second visual field to the screen of the third visual field, the main program CPU 15 uses the coordinate data of the reference lead stored in the storage device of the main program CPU 15 to
It is determined whether a lead exists on the side of the P component 11 in the direction of movement to the next screen. If a lead exists on the side of the SOP component 11 in the direction of movement to the next screen, step S in FIG.
The amount of movement obtained by the method explained in the prior art section 5 is sent to the NC robot controller 16 to drive and control the robot 12, and the SOP component 11 is moved to the screen of the third field of view showing the lower right part of the SOP component 11. do. Also, SOP part 1
1, if there is no lead on the side in the direction of movement to the next screen, a predetermined fixed amount of movement is sent to the NC robot controller 16 in step S6 of FIG. Drive control, S
The OP component 11 is moved to the second viewing screen showing the lower right portion of the SOP component 11.

【0014】6.SOP部品11の右下部分を示す第3
視野目の画面に移動が完了した後、保持されたSOP部
品11の4分割切片である右下部分を認識カメラ13で
認識して認識処理装置14でその右下部分を画像処理し
、基準リードを検出する。そして、基準リードの座標デ
ータをメインプログラムCPU15の記憶装置に格納す
る。
6. The third part showing the lower right part of SOP part 11
After the movement to the field of view screen is completed, the lower right part, which is a quarter section of the held SOP part 11, is recognized by the recognition camera 13, and the lower right part is image-processed by the recognition processing device 14, and the reference lead is Detect. Then, the coordinate data of the reference lead is stored in the storage device of the main program CPU 15.

【0015】7.第3視野目の画面から第4視野目の画
面に移動する際には、メインプログラムCPU15の記
憶装置に格納された基準リードの座標データから、メイ
ンプログラムCPU15は、図2のステップS7でSO
P部品11の、次画面への移動方向の辺にリードが存在
するかしないかを判断し、SOP部品11の、次画面へ
の移動方向の辺にリードが存在すれば図2のステップS
8で従来技術で説明した方法により得た移動量をNCロ
ボットコントローラ16に送信してロボット12を駆動
制御し、SOP部品11をSOP部品11の左下部分を
示す第4視野目の画面に移動する。また、SOP部品1
1の、次画面への移動方向の辺にリードが存在しなけれ
ば、図2のステップS9で所定の固定量である移動量を
NCロボットコントローラ16に送信してNCロボット
コントローラ16によりロボット12を駆動制御し、S
OP部品11をSOP部品11の左下部分を示す第4視
野目の画面に移動する。
7. When moving from the screen of the third visual field to the screen of the fourth visual field, the main program CPU 15 uses the coordinate data of the reference lead stored in the storage device of the main program CPU 15 to
It is determined whether a lead exists on the side of the P component 11 in the direction of movement to the next screen. If a lead exists on the side of the SOP component 11 in the direction of movement to the next screen, step S in FIG.
The amount of movement obtained by the method explained in 8 in the prior art section is sent to the NC robot controller 16 to drive and control the robot 12, and the SOP component 11 is moved to the fourth view screen showing the lower left part of the SOP component 11. . Also, SOP part 1
1, if there is no lead on the side in the direction of movement to the next screen, a predetermined fixed amount of movement is sent to the NC robot controller 16 in step S9 of FIG. Drive control, S
The OP component 11 is moved to the screen of the fourth visual field showing the lower left portion of the SOP component 11.

【0016】8.このようにして、リードが対称な2方
向にしか無い大型のSOP部品11の場合でも4分割視
野認識することができて、ロボット12によるSOP部
品11全体の保持状態を認識し、この認識結果によりS
OP部品11の保持姿勢や保持位置などを補正する。そ
して、基板上の所定位置にSOP部品11を実装する。
8. In this way, even in the case of a large SOP component 11 whose leads are only in two symmetrical directions, it is possible to recognize the 4-split field of view, recognize the state in which the entire SOP component 11 is held by the robot 12, and use this recognition result to recognize the SOP component 11 as a whole. S
The holding posture, holding position, etc. of the OP part 11 are corrected. Then, the SOP component 11 is mounted at a predetermined position on the board.

【0017】なお、本実施例では4分割視野認識につい
て説明したが、2分割視野認識あるいはそれ以上の複数
分割視野認識についても同様の効果を有する。
[0017] In this embodiment, four-divided field of view recognition has been described, but the same effect can be obtained for two-segmented field of view recognition or recognition of a plurality of more divided fields of view.

【0018】[0018]

【発明の効果】以上のように本発明によれば、次の画面
への移動をリードの無い辺は固定量分の移動とし、リー
ドの有る辺は基準リードの座標データより移動量を決定
するという方法を用いることにより、1視野に入りきら
ない大型のSOP部品でも分割視野認識して実装するこ
とができるものである。
[Effects of the Invention] As described above, according to the present invention, when moving to the next screen, the side without a lead is moved by a fixed amount, and the side with a lead is moved by a fixed amount based on the coordinate data of the reference lead. By using this method, even large SOP components that cannot fit in one field of view can be recognized and mounted in a divided field of view.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】本発明の一実施例の電子部品実装方法を説明す
るための電子部品実装装置のブロック図である。
FIG. 1 is a block diagram of an electronic component mounting apparatus for explaining an electronic component mounting method according to an embodiment of the present invention.

【図2】本発明の一実施例の電子部品実装方法を説明す
るためのフローチャートである。
FIG. 2 is a flowchart for explaining an electronic component mounting method according to an embodiment of the present invention.

【図3】従来のQFP部品の認識補正方法を説明するた
めの視野認識画面図である。
FIG. 3 is a visual field recognition screen diagram for explaining a conventional QFP component recognition correction method.

【符号の説明】[Explanation of symbols]

11    SOP部品 12    ロボット 13    認識カメラ 14    認識処理装置 15    メインプログラムCPU 11 SOP parts 12 Robot 13 Recognition camera 14 Recognition processing device 15 Main program CPU

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】電子部品を認識する際、前記電子部品の画
面移動方向の辺にリードが無い場合は固定量分次の画面
へ移動し、また、前記電子部品の画面移動方向の辺にリ
ードが有る場合は基準リードの座標データにより決定さ
れた移動量分次の画面へ移動することにより前記電子部
品の分割認識を順次行って前記電子部品全体を認識し、
前記電子部品を実装する電子部品実装方法。
Claim 1: When recognizing an electronic component, if there is no lead on the side of the electronic component in the screen movement direction, the electronic component moves to the next screen by a fixed amount, and a lead is placed on the side of the electronic component in the screen movement direction. If there is, the electronic component is recognized as a whole by sequentially performing division recognition of the electronic component by moving to the next screen by the amount of movement determined by the coordinate data of the reference lead,
An electronic component mounting method for mounting the electronic component.
JP3008044A 1991-01-28 1991-01-28 Electronic component recognition method Expired - Fee Related JP2965362B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3008044A JP2965362B2 (en) 1991-01-28 1991-01-28 Electronic component recognition method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3008044A JP2965362B2 (en) 1991-01-28 1991-01-28 Electronic component recognition method

Publications (2)

Publication Number Publication Date
JPH04250700A true JPH04250700A (en) 1992-09-07
JP2965362B2 JP2965362B2 (en) 1999-10-18

Family

ID=11682345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3008044A Expired - Fee Related JP2965362B2 (en) 1991-01-28 1991-01-28 Electronic component recognition method

Country Status (1)

Country Link
JP (1) JP2965362B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997049273A1 (en) * 1996-06-20 1997-12-24 Matsushita Electric Industrial Co., Ltd. Electronic part mounting apparatus
KR100515446B1 (en) * 1998-08-07 2005-11-28 삼성전자주식회사 Electronic component mounting device and mounting control method
JP2015147265A (en) * 2014-02-06 2015-08-20 日産自動車株式会社 assembly apparatus
JP2016004969A (en) * 2014-06-19 2016-01-12 富士機械製造株式会社 Component mounting machine
CN108966637A (en) * 2018-06-21 2018-12-07 苏州微感网络科技有限公司 Producing line maintenance system applied to surface mounting technology

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997049273A1 (en) * 1996-06-20 1997-12-24 Matsushita Electric Industrial Co., Ltd. Electronic part mounting apparatus
KR100515446B1 (en) * 1998-08-07 2005-11-28 삼성전자주식회사 Electronic component mounting device and mounting control method
JP2015147265A (en) * 2014-02-06 2015-08-20 日産自動車株式会社 assembly apparatus
JP2016004969A (en) * 2014-06-19 2016-01-12 富士機械製造株式会社 Component mounting machine
CN108966637A (en) * 2018-06-21 2018-12-07 苏州微感网络科技有限公司 Producing line maintenance system applied to surface mounting technology

Also Published As

Publication number Publication date
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