JP2003050401A - Optoelectronic device and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optoelectronic device and electronic equipment capable of making stripe shaped electrodes to be avoided surely from being short- circuited with each other on difference in level even when the device and the equipment have constitution in which the stripe shaped electrodes pass through the difference in level. SOLUTION: Since an overcoating film 45 for flattening the ruggedness generated in color filters is formed at lower layer sides of stripe shaped data lines 52 in the counter substrate 7b of a liquid crystal device, difference in level 450 is formed at the boundary part of the formation zone 45a and the non- formation zone 45b of an overcoating film 45. As a result, there is the case where an excessive ITO(indium tin oxide) film 52" remains between the data lines 52, however, since parts passing on the difference in level 450 are made to be constricted parts 525 in the data lines 52, the data lines 52 are never short-circuit with each other by the excessive ITO film 52".

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electro-optical device using an electro-optical material such as liquid crystal and electronic equipment using the electro-optical device. More specifically, the present invention relates to the configuration of stripe electrodes for driving an electro-optical material in an electro-optical device.

[0002]

2. Description of the Related Art In recent years, an electro-optical device such as a liquid crystal device has been widely used as a display portion of electronic equipment such as a mobile phone and a mobile computer. Among such electro-optical devices, for example, a TFD element (Thin Film Dio) that is a two-terminal type non-linear element as an active element is used.
In the active matrix type liquid crystal device using de), the element substrate in which the TFD elements and the pixel electrodes are formed in a matrix and the counter substrate in which the striped electrodes are formed are separated by a predetermined gap via a sealant. The liquid crystal is injected and held in a region defined by a sealant between these substrates.

Here, as shown in FIG. 16, in the counter substrate, a plurality of liquid crystal driving data lines 52, each of which is composed of a stripe-shaped electrode, are arranged in parallel in a region defined by a sealing material 6 with a predetermined interval. And the data line 52 is connected to the mounting area 8 of the liquid crystal driving IC chip.
The wiring portion 520 extends toward 0b.

Further, when displaying a color image in a liquid crystal device, a cross section (A in FIG. 16) at each position of the counter substrate 7b is displayed.
As shown in FIGS. 17A to 17C, a black matrix and a black matrix are provided on the surface side of the transparent substrate 17b which is the base of the counter substrate 7b. A so-called light-shielding film 43, red (R), green (G), and blue (B) color filters 40R, 40G, and 40B, an insulating overcoat layer 45, a data line 52, and an alignment film 68 are laminated in this order. ing. Here, the overcoat layer 45 is the color filter 40 formed on the lower layer side.
R, 40B, 40B is a film for eliminating unevenness caused by R, 40B, and 40B, and is a predetermined region within a region surrounded by the sealing material 6 (surrounded by a two-dot chain line L2 in FIG. 16) on the surface of the counter substrate 7b. Area). For this reason, the data line 52 has the formation region 45a and the non-formation region 45a of the overcoat layer 45, as shown in the enlarged view of the regions surrounded by circles F and G in FIG. It extends with equal width across both sides of 45b. Note that FIG. 16 and FIG.
In (a) and (b), the region where the sealing material 6 is formed is indicated by the one-dot chain line L1, and the boundary between the formation region 45a and the non-formation region 45b of the overcoat layer 45 is the two-dot chain line L.
2, and the formation region of the screen-shielding light-shielding film 44 is indicated by a dotted line L3. The cross section DD ′ shown in FIG. 17 corresponds to the boundary between the formation region 45a and the non-formation region 45b of the overcoat layer 45, and although the overcoat layer 45 is shown, the light shielding films 43, 44, The color filters 40R, 40G, and 40B are not formed here and therefore not shown in the drawing.

In the process of manufacturing the counter substrate 7b having such a structure, when the data line 52 is formed, first, as shown in FIG.
As shown in FIG. 9A, the light shielding films 43 and 44, the color filters 40R, 40G and 40 are formed on the surface of the transparent substrate 17b.
After forming B and the overcoat layer 45 in this order, an ITO film 52 'for forming the data line 52 is formed on the entire substrate surface on the upper layer side of the overcoat layer 45, and then the ITO film 52' is formed. After the photosensitive resist 600 is applied to the entire surface of the substrate, the photosensitive resist 600 is exposed and developed through the exposure mask 610 to form a resist mask 601 for etching as shown in FIG. 19B. . Next, the ITO film 52 'is patterned through the resist mask 601 by a method such as dry etching to form stripe-shaped data lines 52 as shown in FIG. 19C.

[0006]

While the liquid crystal device is strongly required to improve the display quality such as high definition of an image, the pitch of the data lines 52 is further narrowed in the counter substrate 7b. There is a movement to increase the number of data lines 52, but if such measures are taken, the data lines 52
There is a problem in that a defect due to the short circuit of 1 tends to occur. As a result of various studies conducted by the inventors of the present invention on such a problem, a short circuit between the data lines 52 occurs at the boundary between the formation region 45a and the non-formation region 45b of the overcoat layer 45 for the reason described below. I got the knowledge that it is easy to do.

That is, since the overcoat layer 45 is intended to eliminate the unevenness caused by the color filters 40R, 40G, and 40B, for example, 2
It is formed as a thick film of 000 nm to 3000 nm. Therefore, the formation region 45 of the overcoat layer 45
As shown in FIG. 17, a large step 450 is formed at the boundary between “a” and the non-formation area 45 b, and the data line 52 passes over the step 450. Therefore, FIG.
When the exposure step shown in (a) is performed, the resist 600 in the portion that should originally be exposed is not exposed due to the influence of the shadow caused by the step 450, and the portion corresponding to the step 450 has a dotted line L4 in FIG. As shown by, an extra resist mask 601 'remains at the position where the ITO film 600 should be removed. As a result, when the ITO film 52 ′ is patterned, an extra ITO film 52 ″ remains between the data lines 52 as shown in FIG. 18A and FIG. 19C, and this extra ITO film 52 ′ is left. The data line 52 is short-circuited by the film 52 ″.

Even if there is no abnormality in the exposure of the resist 600, when the ITO film 52 'is patterned by dry etching in the patterning process shown in FIG. An extra ITO film 52 ″ may remain between the data lines 52, and the extra ITO film 52 ″ may cause a short circuit between the data lines 52.

Moreover, when the ITO film 52 'is formed by sputtering, the color filter 4 already made of an organic substance is formed on the lower layer side.
When 0R, 40G, and 40B are formed, the ITO film 52 'cannot be sputtered under a high temperature condition in view of the heat resistance of the organic substances that form the color filters 40R, 40G, and 40B. Since the ITO film 52 'sputtered under such a low temperature condition cannot be patterned with high accuracy, an unnecessary ITO film 5 on the step is formed.
There is also the effect that 2 ″ tends to remain.

In view of the above problems, the object of the present invention is to
Provided is an electro-optical device capable of reliably avoiding a short circuit of the striped electrode on the step even if the striped electrode passes over the step, and an electronic device using the electro-optical device. Especially.

[0011]

In order to solve the above problems, according to the present invention, an insulating film is formed in a predetermined region on a first substrate that holds an electro-optical material, and the upper side of the insulating film is formed. Then, in an electro-optical device in which a plurality of striped electrodes extend in parallel over both the region where the insulating film is formed and a region where the insulating film is not formed, the region where the insulating film is formed and the region where the insulating film is not formed are formed below the striped electrode. A step is formed at a portion corresponding to a boundary with the formation region, and the plurality of stripe-shaped electrodes have a narrower electrode width than a portion passing over the step passes over the formation region of the insulating film. It is characterized by being

In the electro-optical device, even when a large step is formed at the boundary between the region where the insulating film formed as an overcoat layer and the like is formed and the region where the insulating film is not formed, and the stripe-shaped electrode passes through the step, the present invention In regard to the plurality of striped electrodes, the electrode width is narrower at the portion passing over the step than in the portion passing over the insulating film formation region. Therefore, even if an extra conductive film remains between the striped electrodes due to an abnormal exposure due to a shadow caused by the step during the exposure for forming the resist mask for patterning the striped electrodes, There is no short circuit between the striped electrodes. In addition, when dry etching for patterning the stripe-shaped electrodes is performed, even if an extra conductive film remains between the stripe-shaped electrodes due to etching abnormalities caused by shadows caused by the steps, stripes are formed on the steps. Electrodes do not short-circuit.

In the present invention, of the plurality of stripe-shaped electrodes, a portion passing over the step is both a portion passing over the insulating film forming region and a portion passing over the insulating film non-forming region. It is preferable that the narrowed portion has a narrower width in comparison. When the width of the striped electrode is narrowed, the electrical resistance of this part increases, but if the structure is confined only on the step where a short circuit is likely to occur, such an increase in electrical resistance should be minimized. You can

In the present invention, of the plurality of striped electrodes, a portion passing over the step and a portion passing over the insulating film non-forming region are compared with a portion passing over the insulating film forming region. The width may be narrowed. A portion of the striped electrode that passes over the region where the insulating film is not formed is drawn into a predetermined pattern as a wiring portion for supplying a signal from the driving IC or the outside. Such a wiring portion has a narrow width. If formed into
Since many wires can be routed in a narrow area,
It is possible to cope with an increase in the number of striped electrodes.

In the present invention, the insulating film is an overcoat film for flattening the unevenness formed by the color filter formed on the lower layer side of the insulating film. When a conductive film for forming the stripe-shaped electrodes is formed by sputtering, if a color filter made of an organic substance is already formed on the lower layer side, the conductive film is sputtered under a high temperature condition in view of the heat resistance of the color filter. Since the conductive film that cannot be formed and is sputtered under such a low temperature condition cannot be patterned with high accuracy, an extra conductive film is likely to remain on the step. Still, in the present invention, since the width of the portion passing over the step is narrower in the plurality of stripe electrodes, even if an extra conductive film is left between the stripe electrodes, the stripe electrodes are separated from each other on the step. Does not short circuit.

In the present invention, the striped electrode is formed by patterning a film formed by sputtering using a photolithography technique. In this case, the striped electrode is composed of a conductive metal oxide film such as an ITO film.

In the present invention, a portion of the striped electrode having a narrower electrode width than a portion passing over the region where the insulating film is formed is a multilayer of the metal oxide film and the metal film. It is preferably structured.
According to this structure, the electric resistance of the portion where the electrode width is narrow can be reduced, so that no signal delay occurs when supplying a signal to the striped electrode.

The electro-optical device to which the present invention is applied is, for example, one of the sealing material provided between the first substrate and the second substrate bonded to the first substrate via a sealing material. A liquid crystal device in which liquid crystal as the electro-optical material is held in a region surrounded by.

The electro-optical device to which the present invention is applied is used as a display portion of electronic equipment such as a mobile phone and a mobile computer.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described with reference to the drawings. In the following description of the embodiments, an active matrix liquid crystal device using a TFD element as an active element is described as an example among various electro-optical devices.

[Configuration of Liquid Crystal Panel] FIG. 1 is a block diagram schematically showing the electrical configuration of the liquid crystal device. Figure 2
(A) and (b) of the counter substrate (first substrate) and the element substrate (second substrate) sandwiching the liquid crystal layer in the liquid crystal panel, respectively, a plan view of one pixel on the element substrate, and a diagram. FIG. 2B is a sectional view taken along the line II ′ of FIG. In addition,
Since the counter substrate used in the liquid crystal device of this embodiment has a common basic configuration, portions having common functions will be denoted by the same reference numerals.

As shown in FIG. 1, in a liquid crystal panel 2 used in a liquid crystal device, a plurality of scanning lines 51 are formed in the row direction (X direction), and a plurality of data lines 52 are arranged in the column direction (Y direction). ) Is formed. A pixel 53 is formed at a position corresponding to each intersection of the scanning line 51 and the data line 52, and in this pixel 53, a liquid crystal layer 54 and a TFD element 56 are connected in series. Each scanning line 51 is driven by the scanning line drive circuit 57, and each data line 52 is driven by the data line drive circuit 58. In this embodiment,
The scanning line driving circuit 57 and the data line driving circuit 58 are respectively configured in a liquid crystal driving IC 8a and a liquid crystal driving IC 8b, which will be described later with reference to FIG.

In FIGS. 2A and 2B, the TFD element 56 includes a first TFD element 56a and a second TFD element formed on a base layer 61 formed on the surface of the element substrate 7a.
The two TFD element elements including the element 56b constitute a so-called back-to-back structure. Therefore, in the TFD element 56, the non-linear current-voltage characteristic is symmetrical in both positive and negative directions. The base layer 61 is made of, for example, tantalum oxide (Ta ₂ O ₅ ) having a thickness of about 50 to 200 nm. 1st T
The FD element 56a and the second TFD element 56b are composed of a first metal layer 62, an insulating layer 63 formed on the surface of the first metal layer 62, and a second metal formed on the surface of the insulating layer 63 so as to be separated from each other. It is constituted by layers 64a and 64b. The first metal layer 62 has, for example, a thickness of 100 to 500.
The insulating layer 63 is formed of a Ta simple film, Ta alloy film, or the like having a thickness of about 10 nm, and the tantalum oxide film having a thickness of 10 to 35 nm formed by oxidizing the surface of the first metal layer 62 by an anodic oxidation method, for example. (Ta ₂ O ₅ ).

The second metal layers 64a and 64b are made of a metal film such as chromium (Cr) and have a thickness of 50 to 300 nm.
It is formed to have a thickness of a certain degree. The second metal layer 64a becomes the scanning line 51 as it is, and the other second metal layer 64b is
It is connected to a pixel electrode 66 made of a transparent conductive material such as ITO (Indium Tin Oxide).

Since the liquid crystal device described below is a transmissive type, the pixel electrode 66 is made of an ITO film.
If the pixel electrode 66 is formed of a light-reflecting material such as Al (aluminum), a reflective liquid crystal device can be configured, and in this case, the backlight device described later is not used. If the pixel electrode 66 is made of a light-reflecting material such as Al (aluminum) and an opening is formed in a part of the pixel electrode 66, a semi-transmissive / semi-reflective liquid crystal device can be constructed. it can. Furthermore, the pixel electrode 6
Even if a semi-transmissive / semi-reflective film is formed on the lower layer side of 6 or the like, a semi-transmissive / semi-reflective liquid crystal device can be constructed. In such a semi-transmissive / semi-reflective liquid crystal device, an image can be displayed by utilizing light from a backlight device at night and by using external light during daytime.

A substrate 17a which constitutes the element substrate 7a
Is formed of, for example, quartz, glass, plastic, or the like, like the substrate 17b (see FIGS. 3 and 4) that constitutes the counter substrate 7a. Here, in the case of the total reflection type, it is not essential that the substrate 17a is transparent, but in the case of the transmission type as in the present embodiment, or in the above-mentioned semi-transmission / semi-reflection type liquid crystal device, It is an essential requirement that the element substrate 17a be transparent.

[Structure of Liquid Crystal Device] The element substrate 7a on which the scanning line 51 and the TFD element 56 are formed in this manner.
Is ITO as described with reference to FIGS. 3 and 4.
A data line 52 made of a transparent conductive material such as is disposed opposite to the counter substrate 7b formed in a stripe shape. In the element substrate 7a and the counter substrate 7b, one row of pixel electrodes 66 and one data line 52 are mutually arranged. They are attached to each other so as to have a facing positional relationship. The detailed configuration of the counter substrate 7b will be described later with reference to FIGS. 5, 6 and 7.

3 and 4 are an exploded perspective view and a sectional view of the liquid crystal device, respectively.

As shown in FIGS. 3 and 4, the liquid crystal device 1
Is, for example, an FPC (Flexible
Printed Circuits (flexible printed circuit boards) 3a and 3b are connected, a light guide 4 is attached to the back side of the liquid crystal panel 2, and a control board 5 is provided on the back side of the light guide 4. .

In the liquid crystal panel 2, the element substrate 7a and the counter substrate 7b are attached to each other by a seal material 6 which is annularly applied to one of these substrates. On the surface of the portion of the element substrate 7a that projects from the counter substrate 7b, an ACF (anisotropic conductive) is formed.
The liquid crystal driving IC 8a is a COG (Chip On Glass) by a seven film (anisotropic conductive film) 9.
It is implemented. A liquid crystal driving IC 8b is COG-mounted by an ACF 9 on a portion of the counter substrate 7b that projects from the element substrate 7a.

As shown in FIG. 4, a plurality of pixel electrodes 66 described with reference to FIGS. 2A and 2B are formed in a matrix on the inner surface of the element substrate 7a, and the outer surface thereof is A polarizing plate 12a as an optical sheet is attached. An alignment film 67 for aligning the alignment of the liquid crystal L is formed on the inner surface of the element substrate 7a. The alignment film 67 is formed, for example, by applying a polyimide solution and then baking the polyimide solution, and the polymer main chain of the polyimide is stretched in a predetermined direction by a rubbing process, so that the liquid crystal L in the liquid crystal L sealed between the substrates is formed. Liquid crystal molecules are oriented along the stretching direction of the alignment film.

The counter substrate 7b will be described in detail later.
A plurality of data lines 52 are formed in stripes on the inner surface, and a polarizing plate 12b as an optical sheet is attached to the outer surface thereof. Then, the element substrate 7a and the counter substrate 7b
The liquid crystal L is sealed in a gap (cell gap) defined by the sealing material 6 between the substrates. An alignment film 6 for aligning the alignment of the liquid crystal L is also formed on the inner surface of the counter substrate 7b.
8 are provided. Similar to the alignment film 67, the alignment film 68 is also formed, for example, by applying a polyimide solution and then baking.

In FIG. 3, a plurality of terminals 13a are formed on the projecting portion of the element substrate 7a, and these terminals are formed at the same time when the pixel electrode 66 is formed on the surface of the element substrate 7a. In addition, a plurality of terminals 13b are also formed on the projecting portion of the counter substrate 7b, and these terminals are formed by the counter substrate 7b.
It is formed at the same time when the data line 52 is formed on the surface of b. A plurality of terminals 22 are provided at the end of the FPC 3b,
Using ACF or the like, those terminals are terminals 1 of the counter substrate 7b.
3b is conductively connected. A plurality of terminals 23 formed on the other end of the FPC 3b are connected to terminals (not shown) of the control board 5. In the FPC 3a, a plurality of panel-side terminals 14 are formed on the back surface side end portion, and a plurality of control board-side terminals 16 are formed on the front surface side at the opposite end portion. Here, a wiring pattern 18 is appropriately formed on the surface of the FPC 3a, the wiring pattern 18 is directly connected to the control board side terminal 16 at one end, and the other end is through a through hole 19. It is connected to the panel terminal 14.

A diffusion plate 27 is attached to the surface of the light guide 4 on the liquid crystal panel 2 side by sticking or the like, and a reflector 28 is attached to the surface of the light guide 4 on the side opposite to the liquid crystal panel 2. Etc. In addition, a plurality of L's serving as light emitting means are provided so as to face the light receiving surface 4a set on one side surface of the light guide 4.
ED (Light Emitting Diode) 2
1 is supported and arranged on the LED substrate 38.

As shown in FIG. 4, the light guide 4 is attached to the back surface side of the liquid crystal panel 2 with a cushioning material 32 made of rubber, plastic, or the like interposed therebetween. The control board 5 is arranged so as to face the surface of the light guide 4 on which the reflection plate 28 is mounted. A terminal 33 for connecting to an external circuit is formed at the end of the control board 5.

In the backlight device of the liquid crystal device 1 having such a structure, when the LED 21 emits light, the light is introduced into the light guide 4, and the introduced light is reflected by the reflection plate 28 and reflected by the liquid crystal panel 2. And is supplied to the liquid crystal panel 2 in a state of being diffused by the diffusion plate 27 so as to have a uniform intensity in the plane. The light supplied is the light guide 4.
The component that has passed through the polarizing plate 12a on the side is supplied to the layer of the liquid crystal L, and the liquid crystal L whose orientation is controlled for each pixel according to the change in the voltage applied between the pixel electrode 66 and the data line 52. An image is displayed outside by modulating each pixel and passing the modulated light through the polarizing plate 12b on the display side.

[Structure of Counter Substrate 7b] FIG. 5 is a plan view of the counter substrate used in the liquid crystal device to which the present invention is applied. FIG. 6 shows the counter substrate shown in FIG.
It is sectional drawing when it cut | disconnects by the B'line, CC 'line, and DD' line. FIGS. 7A and 7B are plan views each showing an enlarged region surrounded by a circle F and a circle G of the counter substrate shown in FIG. In addition, in FIG. 5, FIG. 7A, and FIG. 7B, the region where the sealing material is formed is indicated by a dashed line L1.
A boundary portion between the formation region and the non-formation region of the overcoat layer is shown by a chain double-dashed line L2, and the formation region of the light shielding film for screen partition is shown by a dotted line L3. In addition, D- shown in FIG.
The D ′ cross section corresponds to the boundary portion between the region where the overcoat layer is formed and the region where the overcoat layer is not formed. The overcoat layer is shown, but the light-shielding film and the color filter are not formed here. Not represented.

When performing color display in the liquid crystal device 1, the counter substrate 24b is constructed as described below. First, as shown in FIG. 5, in the counter substrate 7a, a plurality of data lines 52 formed of stripe-shaped electrodes are formed in parallel in a region partitioned by the sealing material 6 at predetermined intervals. At the same time, a wiring portion 520 extends from each of the data lines 52 toward the mounting area 80b of the liquid crystal driving IC chip.

Further, in the counter substrate 7a, the cross section at each position of the counter substrate 7b in FIG. 6 (cross section AA ', BB' in FIG. 5) is shown.
As shown in the cross section, the CC ′ cross section, and the DD ′ cross section), on the surface side of the transparent substrate 17b, a light shielding film 43 called a black matrix, red (R), green (G), and blue ( The color filters 40R, 40G, and 40B of B), the insulating overcoat layer 45, the data line 52, and the alignment film 68 are laminated in this order. Further, a light shielding film 45 for screen screening is formed along the seal material 6 inside the area surrounded by the sealing material 6, and the area surrounded by the light shielding film 45 is an image display area in which an image is displayed. Becomes Therefore, the color filters 40R, 40G, 40B and the light shielding film 4 are provided only inside the area surrounded by the light shielding film 45 for screen cutoff.
3 is formed. As can be seen from FIG. 4, the light shielding film 43 is provided on the pixel electrode 6 formed on the element substrate 7a.
The color filter 40 is formed in a region not facing 6
R, 40G, and 40B are formed in a region facing the pixel electrode 66.

Referring again to FIG. 6, the overcoat layer 45.
Are the color filters 40R, 40R formed on the lower layer side.
It is composed of a thick organic insulating film or inorganic insulating film for eliminating the unevenness caused by B and 40B, and the data line 52 is formed on the upper layer side thereof. The overcoat layer 45 is formed in a region of the surface of the counter substrate 7b that is wider than the region surrounded by the screen shielding light-shielding film 45 but narrower than the region surrounded by the sealing material 6. On the other hand, one end 451 of the data line 52 protrudes from the formation region 45a of the overcoat layer 45, while the sealing material 6 is further formed from the formation region 45a of the overcoat layer 45 on the other side. The liquid crystal driving IC 8b extends to the area where the COG is mounted.
For this reason, the data line 52 is
As shown in (a) and (b), it extends across both the formation region 45a and the non-formation region 45b of the overcoat layer 45. Here, since the overcoat layer 45 is made of a thick insulating film of, for example, 2000 nm to 3000 nm, a large step 450 is formed at the boundary between the formation region 45a and the non-formation region 45b of the overcoat layer 45, and this step 450 is formed. A data line 52 passes above.

Here, in the data line 52, the electrode width of the portion passing over the step 450 is narrower than that of the portion passing over the formation region 45a of the overcoat layer 45. That is, of the data line 52, the portion passing over the step 450 is
A portion passing over the formation region 45a of the overcoat layer 45,
Further, the narrowed portion 525 is narrower in width than both of the portion passing over the non-formation region 45b of the overcoat layer 45. Therefore, when the liquid crystal device 1 is manufactured by the method described below, the data line 52 does not short-circuit on the step 450.

[Manufacturing Method of Liquid Crystal Device 1 and Counter Substrate 7b] FIG. 8 is a process diagram showing a manufacturing method of the liquid crystal device 1 of the present embodiment. 9 and 10 are process cross-sectional views showing the method of manufacturing the counter substrate 7b used in the liquid crystal device 1 of the present embodiment.

As shown in FIG. 8, in manufacturing the liquid crystal device 1 and the liquid crystal panel 2, the active element forming process P is performed.
11 to a sealing material printing step P15, an element substrate forming step, and a light-shielding film forming step P21 to a rubbing treatment step P26.
It is performed separately from the counter substrate forming step.

First, in forming the element substrate 7a, the active element forming step P1 is performed on the surface of the substrate 17a.
After forming the scanning line 51 and the TFD element 56 in 1, the pixel electrode 66 is formed in the pixel electrode forming step P12. Next, in the alignment film process P13, polyimide, polyvinyl alcohol, or the like is formed on the surface of the substrate 17a to have a uniform thickness to form the alignment film 67, and then in the rubbing process process P14, the alignment film 67 is rubbed. Other alignment processing is performed. Next, in the seal material printing process P15, the seal material 6 is applied in an annular shape by a dispenser, screen printing, or the like. An opening 6a for injecting liquid crystal is formed in a part of the sealing material 6.

On the other hand, in forming the counter substrate 7b, first, in the light shielding film forming step P21, FIG.
As shown in FIG. 5, the light shielding films 43 and 44 are formed on a predetermined region of the surface of the transparent substrate 17b by using the photolithography technique. Next, in the color filter forming step P22, as shown in FIG.
G and 40B are formed. Such a color filter 40
R, 40G, and 40B are formed by flexographic printing, a photolithography technique, an inkjet method, or the like. Next, in the overcoat layer forming step P23, as shown in FIG. 9C, an insulative overcoat layer 45 is formed by using flexographic printing or photolithography. Next, in the data line forming step P24, stripe electrodes, that is, the data lines 52 are formed of the ITO film.

First, as shown in FIG. 9 (d),
An ITO film 52 'is formed on the entire surface of the transparent substrate 17b by the sputtering method. Next, as shown in FIG.
After the photosensitive resist 600 is applied to the entire surface of the ITO film 52 ', the photosensitive resist 600 is applied to the exposure mask 61.
After exposure through 0 and development, a resist mask 601 is formed as shown in FIG. Next, the ITO film 52 'is patterned through the resist mask 601 to form the stripe-shaped data line 52 as shown in FIG.

Next, in the alignment film forming step P25, an alignment film 68 of uniform thickness is formed on the data lines 52 and the like with polyimide or the like, and then in the rubbing process step P26, the alignment film 68 is rubbed. Orientation treatment such as treatment is performed. As a result, the counter substrate 7b is completed.

Such a process is performed in the state of a large mother substrate capable of taking a large number of element substrates 7a and counter substrates 7b. Therefore, after the above steps are completed, the mother substrates are attached to each other with the sealing material 6 sandwiched between them (attaching step P31), and then the sealing material 6 is cured by ultraviolet curing or another method (sealing material curing step). P3
2). As a result, an empty panel structure including a plurality of liquid crystal devices is formed. After that, a cutting groove is formed at a predetermined position of the empty panel structure, and the panel structure is cut into strips based on the scribe groove (primary breaking step P33). As a result, a strip-shaped empty panel structure in which the liquid crystal injection opening 6a of the sealing material 6 of each liquid crystal panel is exposed to the outside is formed. Next, after injecting liquid crystal under reduced pressure from the exposed openings 6a for injecting liquid crystal into the panel, each opening 6a is sealed with a resin or the like (liquid crystal injection /
Inlet sealing step P34). After that, a cutting groove is formed again in the panel structure, and the strip-shaped panel structure is cut along the cutting groove to cut out a plurality of liquid crystal panels (secondary break step P35). As shown in FIG. 4, the polarizing plates 12a and 12b are attached to the liquid crystal panel 2 manufactured in this way (polarizing plate attaching step P17). Thereafter, as shown in FIG. 3, the liquid crystal driving ICs 8a and 8b and the control board 5 are mounted, and further F
The liquid crystal device 1 is completed by connecting the PCs 3a and 3b (mounting process P37).

[Effect of this Embodiment] Among the manufacturing steps as described above, in the data line forming step P24 for forming the data line 52 on the counter substrate 7b, an overcoat is applied when exposure is performed as shown in FIG. Due to the influence of the shadow caused by the step 450 formed at the boundary between the formation region 45a and the non-formation region 45b of the layer 45, the resist 600 of the portion that should be originally exposed is not exposed, and the dotted line in FIG. As shown by L4, if the extra resist 601 remains at the position where the ITO film 600 should be removed, the portion where the extra resist 601 remains when the ITO film 52 ′ is patterned is shown in FIG. , (B), and FIG. 10 (c).
As shown in, the extra ITO film 5 is formed between the data lines 52.
2 ″ may remain. Also, the resist 600
Even if no abnormality occurs in the exposure to the ITO film 52 '
When patterning by dry etching
A shadow caused by 50 may leave an extra ITO film 52 ″ between the data lines 52. Moreover, I
When the TO film 52 'is formed by sputtering, since the color filters 40R, 40G, 40B made of an organic substance are already formed on the lower layer side, the color filters 40R, 40G,
In view of the heat resistance of the organic material composing 40B, the ITO film 5
2'cannot be sputtered under high temperature conditions, and IT sputtered under such low temperature conditions.
Since the O film 52 'cannot be patterned with high precision,
An extra ITO film 52 ″ is likely to remain on the step. However, in the present embodiment, in the data line 52, the portion passing over the step 450 passes over the formation region 45a of the overcoat layer 45 and the non-existence of the overcoat layer 45. Since the narrowed portion 525 is narrower than the portion passing over the formation region 45b, the data line 52 is not short-circuited even if an extra ITO film 52 ″ remains on the step 450. Therefore,
The pitch of the data lines 52 can be narrowed.

Further, if the width of the data line 52 is narrowed, the electrical resistance of this portion increases, but in the present embodiment, the constricted portion 525 is provided on the step 450 where a short circuit is likely to occur.
The other portion is a formation region 45 of the overcoat layer 45.
The width is substantially the same as the portion passing over a. Therefore, the increase in the electric resistance of the data line 52 can be minimized.

[Other Embodiments] FIG. 11A,
6B is an enlarged plan view showing positions corresponding to circles F and G in FIG. 5, respectively, in another counter substrate used in the liquid crystal device to which the present invention is applied. 12 (a)-
FIG. 3D is a cross-sectional view showing the configuration of data lines in each counter substrate used in the liquid crystal device to which the present invention is applied.

In the above embodiment, of the data lines 52,
The portion passing over the step 450 is provided with a narrowed portion 525 which is narrower than both the portion passing over the formation region 45a of the overcoat layer 45 and the portion passing over the non-formation region 45b of the overcoat layer 45. Fig. 11
In the counter substrate 7b shown in (a) and (b), the data line 52
Among them, the width of the portion passing over the step 450 and the wiring portion 520 passing through the non-formation region 45b of the overcoat layer 45 is narrower than the portion passing over the formation region 45a of the overcoat layer 45. Since other configurations are the same as those in the above-described embodiment, common portions are denoted by the same reference numerals and illustrated, and description thereof is omitted.

Also in the case of such a configuration, even if an extra ITO film 52 ″ remains between the data lines 52 on the step 450, the data lines 52 are not short-circuited. The wiring portion 520 extending from the data line 52 and passing over the non-formation region 45b of the overcoat layer 45 is obliquely routed so as to converge toward the IC mounting region. Since the large number of wirings can be formed in a narrow area by forming the wiring portion 520 having a narrow width, the striped electrode 52 can be formed.
It is advantageous when the number of is increased.

It should be noted that, in any of the above-mentioned forms, FIG.
As shown in (a), the data line 52 and the wiring portion 52
Although 0 is formed of the ITO film (metal oxide film), the formation region 4 of the overcoat layer 45 in the data line 52 is formed.
As shown in FIGS. 12B, 12C, and 12D, a metal oxide film such as an ITO film and a metal film M are provided for the portion where the electrode width is narrower than the portion passing over 5a. If a structure having a multi-layered structure is adopted, it is possible to reduce the electric resistance of the portion where the electrode width is narrow. Here, the data line 52 shown in FIG. 12B has a structure in which the metal film M is laminated on the upper layer of the metal oxide film such as the ITO film. The data line 52 shown in FIG. 12C has a structure in which a metal film M is stacked under a metal oxide film such as an ITO film. In this case, if the adhesion of the metal film M to the base is weak, or if the elution of impurities from the metal film M into the liquid crystal poses a problem, as shown in FIG.
A metal oxide film such as a TO film, a metal film M, and a metal oxide film such as an ITO film may be laminated in this order.
In addition, if the ITO films above and below the metal film M are formed wide to completely cover the metal film M with the ITO film, problems such as elution of impurities from the metal film M and adhesion can be solved. it can. Here, as the metal film, silver alone, an alloy containing platinum (Pt) or copper (Cu) in addition to about 98% silver, a silver-gold-copper alloy, a silver-ruthenium-copper alloy, or the like can be used. .

Further, in any of the above embodiments, the active matrix type liquid crystal device 1 using the TFD element as the active element has been described as an example, but any electro-optical device formed in a stripe shape on the substrate. The present invention may be applied to a passive matrix type liquid crystal device or other electro-optical devices, and various modifications can be made within the scope of the invention described in the claims.

[Embodiment of Electronic Device] FIG. 13 shows an embodiment in which the liquid crystal device according to the present invention is used as a display device of various electronic devices. The electronic device shown here has a display information output source 70, a display information processing circuit 71, a power supply circuit 72, a timing generator 73, and a liquid crystal device 74. The liquid crystal device 74 also includes a liquid crystal display panel 75 and a drive circuit 76. The liquid crystal device 1 and the liquid crystal panel 2 described above can be used as the liquid crystal device 74 and the liquid crystal panel 75.

The display information output source 70 is a ROM (Read
Only Memory), RAM (Random)
A memory such as an Access Memory), a storage unit such as various disks, a tuning circuit that tunes and outputs a digital image signal, and the like, and a display such as an image signal of a predetermined format based on various clock signals generated by the timing generator 73. Information is supplied to the display information processing circuit 71.

The display information processing circuit 71 is provided with various known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, a clamp circuit, etc., and executes processing of input display information. , And supplies the image signal to the drive circuit 76 together with the clock signal CLK. The drive circuit 76 is a general term for the scanning line drive circuit 57, the data line drive circuit 58, the inspection circuit, etc. in FIG. Further, the power supply circuit 72 supplies a predetermined voltage to each component.

FIG. 14 shows a mobile personal computer which is an embodiment of the electronic apparatus according to the present invention. The personal computer shown here includes a main body 82 having a keyboard 81 and a liquid crystal display unit 83.
Have and. The liquid crystal display unit 83 includes the liquid crystal device 1 described above.

FIG. 15 shows a mobile phone which is another embodiment of the electronic apparatus according to the present invention. The mobile phone 90 shown here has a plurality of operation buttons 91 and the liquid crystal device 1.

[0061]

As described above, in the electro-optical device according to the present invention, a large step is formed at the boundary between the region where the insulating film formed as the overcoat layer and the like is formed and the region where the insulating film is not formed. Even in the case where the striped electrodes pass, the electrode width of the plurality of striped electrodes is narrower than that of the portion passing over the step where the insulating film is formed. Therefore, even when an exposure abnormality occurs due to a shadow caused by a step at the time of exposure for forming a resist mask for patterning the striped electrodes and an extra conductive film remains between the striped electrodes,
There is no short circuit between the striped electrodes on the step.
In addition, when dry etching for patterning the stripe-shaped electrodes is performed, even if an extra conductive film remains between the stripe-shaped electrodes due to etching abnormalities caused by shadows caused by the steps, stripes are formed on the steps. Electrodes do not short-circuit. Therefore, the pitch of the striped electrodes can be narrowed.

[Brief description of drawings]

FIG. 1 is a block diagram schematically showing an electrical configuration of a liquid crystal device.

2 (a) and 2 (b) are plan views of one pixel in an element substrate among a pair of substrates sandwiching a liquid crystal layer in a liquid crystal panel, and II 'in FIG. 2 (a). It is a line sectional view.

FIG. 3 is an exploded perspective view of a liquid crystal device.

FIG. 4 is a cross-sectional view of a liquid crystal device.

FIG. 5 is a plan view of a counter substrate used in a liquid crystal device to which the present invention is applied.

6 is a plan view of the counter substrate shown in FIG.
It is sectional drawing when it cut | disconnects by the B'line, CC 'line, and DD' line.

7 (a) and 7 (b) are enlarged plan views showing regions surrounded by circles F and G of the counter substrate shown in FIG. 5, respectively.

FIG. 8 is a process drawing showing the method of manufacturing a liquid crystal device to which the present invention is applied.

9A to 9D are process cross-sectional views showing a method of manufacturing the counter substrate shown in FIG.

10A to 10C are process cross-sectional views of each process performed subsequent to the process shown in FIG. 9 in the process of manufacturing the counter substrate shown in FIG.

11A and 11B are circles F of FIG. 5, respectively, in another counter substrate used in the liquid crystal device to which the present invention is applied.
3 is a plan view showing an enlarged position corresponding to a circle G. FIG.

12A to 12D are cross-sectional views each showing a configuration of a data line in each counter substrate used in the liquid crystal device to which the present invention is applied.

FIG. 13 is a block diagram showing a configuration of various electronic devices using the liquid crystal device according to the present invention.

FIG. 14 is an explanatory diagram showing a mobile personal computer as an embodiment of an electronic apparatus using the liquid crystal device according to the present invention.

FIG. 15 is an explanatory diagram of a mobile phone as an embodiment of an electronic device using the liquid crystal device according to the invention.

FIG. 16 is a plan view of a counter substrate used in a conventional liquid crystal device.

17 is a plan view of the counter substrate shown in FIG. 16 taken along the line AA ′ in FIG.
It is sectional drawing when it cut | disconnects by the line, BB 'line, CC' line, and DD 'line.

18 (a) and 18 (b) are enlarged plan views showing regions surrounded by circles F and G of the counter substrate shown in FIG. 16, respectively.

FIG. 19 is a process cross-sectional view showing the method of manufacturing the counter substrate shown in FIG. 16.

[Explanation of symbols]

1 Liquid crystal device (electro-optical device) 2 LCD panel 6 sealing material 7a element substrate 8a, 8b Liquid crystal driving IC 17a Substrate constituting element substrate 17b Transparent substrate forming counter substrate 40R, 40G, 40B color filter 43, 44 Light-shielding film 45 Overcoat layer (insulating film) 45a Overcoat layer forming area 45b Overcoat layer non-formed area 51 scan lines 52 data lines (striped electrodes) 52 'ITO film 52 ″ extra ITO film 53 pixels 54 Liquid crystal layer 56 TFD element 57 Scan line drive circuit 58 data line drive circuit 66 pixel electrodes 450 steps 520 wiring part 525 Constricted part 600 photoresist 601 resist mask 610 exposure mask 601 'Extra resist mask

Claims (10)

[Claims] 1. An insulating film is formed in a predetermined region on a first substrate holding an electro-optical material, and an upper layer side of the insulating film extends over both a region where the insulating film is formed and a region where the insulating film is not formed. In the electro-optical device in which a plurality of striped electrodes extend in parallel, a step is formed on a lower layer side of the striped electrode at a portion corresponding to a boundary between a region where the insulating film is formed and a region where the insulating film is not formed, The electro-optical device according to claim 1, wherein the plurality of striped electrodes have a narrower electrode width in a portion passing over the step than in a portion passing over the insulating film formation region. 2. The portion of the plurality of striped electrodes, which passes over the step, passes over the insulating film forming region and over the insulating film non-forming region. An electro-optical device having a narrowed portion that is narrower than both of the above. 3. The insulating film according to claim 1, wherein a portion of the plurality of striped electrodes that passes over the step and a portion that passes over a region where the insulating film is not formed pass through a region where the insulating film is formed. An electro-optical device characterized by being narrower in width. 4. The method according to any one of claims 1 to 3,
The electro-optical device, wherein the insulating film is an overcoat film for flattening unevenness formed by a color filter formed on the lower side of the insulating film. 5. The method according to any one of claims 1 to 4,
The electro-optical device characterized in that the striped electrode is formed by patterning a conductive film formed by sputtering using a photolithography technique. 6. The electro-optical device according to claim 5, wherein the striped electrode is formed of a conductive metal oxide film. 7. The electro-optical device according to claim 6, wherein the striped electrode is formed of an ITO film. 8. The metal oxide film and the metal film according to claim 6, wherein a portion of the stripe-shaped electrode having a narrower electrode width than a portion passing over the formation region of the insulating film is formed. And an electro-optical device having a multilayer structure. 9. The method according to claim 1, wherein
Liquid crystal as the electro-optical substance is held in the region surrounded by the sealing material between the first substrate and the second substrate bonded to the first substrate via the sealing material. An electro-optical device characterized in that 10. An electronic apparatus comprising the electro-optical device according to claim 1 as a display unit.