JP2001056480A - Electro-optic device and its production - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable inexpensive manufacture of an electro-optic device which is small in appearance shape by adding contrivances to the formation of electrodes. SOLUTION: This electro-optic device is the electro-optic device for displaying images within a display region V by arranging electro-optic materials, for example, liquid crystals, between a pair of substrates 4a and 4b having electrodes 8a and 8b in the display region V and electrode wiring 15a, 15b and 17 within a non-display region X. A conductive photoresist 20 is laminated on the electrode wiring 15a, 15b and 17 existing within the non-display region X of at least one of a pair of the substrates 4a and 4b. Even when the area of the non-display region X is narrowed, the resistance value of the electrode wiring may be suppressed to a lower level without increasing the film thickness of the electrode wiring 15a, 15b and 17.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electro-optical device for displaying an image using an electro-optical material such as a liquid crystal, and a method for manufacturing the same.

[0002]

2. Description of the Related Art At present, electro-optical devices using various materials as electro-optical materials are known. For example, a liquid crystal device using liquid crystal as an electro-optical device, an optical device using electroluminescence (EL) including a light emitting polymer as an electro-optical material, and a plasma display using a phosphor material as the electro-optical material (PDP)
Also, various electro-optical devices such as an optical device using a field emission device (FED) as an electro-optical material are known.

In the above-described electro-optical device, various types of electro-optical materials are often provided between a pair of substrates, and images such as characters, numerals, figures, and the like are displayed in a display area by the electro-optical action of the electro-optical materials. Is displayed. Also, in order to cause the electro-optical material to perform an electro-optical action, it is common that electrodes formed in a stripe shape, a surface shape or an appropriate pattern shape are formed on each surface of the pair of substrates. is there.

The above-mentioned electrodes are formed in a predetermined pattern such as a stripe pattern in a display area for displaying an image. In addition, an electrode wiring such as an electrode lead wire having a function of transmitting a signal and a terminal line for transmitting / receiving a signal to / from an external circuit is provided.

[0005]

Recently, there has been a strong demand for miniaturizing the external shape of the electro-optical device. Therefore, there has been a strong demand that the non-display area, which does not contribute to the display of an image, be as small as possible. However, if the non-display area is narrowed, it is necessary to form an electrode lead line and the like formed in that area with high definition, and if so, the resistance value of the electrode lead line becomes high, and the electrode lead line is connected to this electrode lead line. However, there is a problem that a load for driving an external circuit to be used increases.

In order to solve this problem, conventionally, a material for forming an electrode, for example, ITO (Indium Tin Oxide)
There has been a measure to increase the film thickness of the electrode to suppress the resistance value of the electrode lead wire and the like. However, when this measure is adopted, there is a problem that the electro-optical device becomes expensive as the thickness of the ITO film increases.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has an electro-optical device having a small external appearance.
It is an object of the present invention to make it possible to manufacture an electrode at low cost by devising the formation of the electrode.

[0008]

(1) In order to achieve the above object, an electro-optical device according to the present invention has an electro-optical material disposed between a pair of substrates, and displays an image in a display area. An electrode is formed in the display area of at least one of the substrates, and the electrode is connected to an electrode wiring provided in a non-display area. A conductive photoresist is provided on the wiring.

According to the electro-optical device having this structure, since the conductive photoresist is provided on the electrode wiring in the non-display area, the material for forming the electrode wiring, for example, the thickness of ITO is increased. Without this, the resistance value of the electrode wiring can be reduced. By reducing the amount of material used for forming the electrode wiring in this manner, the overall price of the electro-optical device can be kept low.

(2) In the electro-optical device according to the above (1), as the electrode wiring, an electrode lead wire connected to the electrode and a terminal wire formed on at least one side edge of the one substrate. Can be considered. When the area of the non-display area of the electro-optical device is to be designed to be small, the area for forming each of the above-described wirings is necessarily reduced. At this time, if a conductive photoresist is provided on these wirings, the resistance values of those wirings can be reduced without increasing the thickness of the wiring material while keeping the area of the non-display area small. Can be suppressed.

(3) In the electro-optical device according to the above item (1) or (2), the conductive photoresist may be formed by including conductive particles in a dispersed state inside the photoresist. it can. According to this configuration, a conductive photoresist can be easily and inexpensively manufactured.

(4) Next, in the method of manufacturing an electro-optical device according to the present invention, an electro-optical material is disposed between a pair of substrates, and an image can be displayed in a display area.
An electrode is formed in the display region of at least one of the substrates, and the electrode is connected to an electrode wiring provided in a non-display region. An electrode material film forming step of forming an electrode material on the surface in a pattern-free manner; a resist film forming step of forming a conductive photoresist on the electrode material in a pattern-free manner; A patterning step of forming both resists in the same pattern as the electrodes in the display area and the electrode wirings in the non-display area; and a conductive step in the display area while leaving a conductive photoresist in the non-display area. And a resist removing step of removing the conductive photoresist.

According to this method of manufacturing an electro-optical device, it is possible to leave the conductive photoresist on the electrode wiring in the non-display area without leaving the conductive photoresist on the electrode in the display area. Accordingly, the resistance value of the electrode wiring can be reduced without increasing the thickness of the material forming the electrode wiring, for example, ITO. By reducing the amount of material used for forming the electrode wiring in this manner, the overall price of the electro-optical device can be kept low.

(5) In the method of manufacturing an electro-optical device according to the above (4), in the patterning step, the formed conductive photoresist is formed by depositing the conductive photoresist on the electrode in the display region and the conductive photoresist on the non-display region. A first exposure step of exposing with the same pattern as the electrode wiring, a development step of performing a development process on the exposed conductive photoresist, and the electrode using the conductive photoresist developed into a predetermined pattern as a mask. An etching step of forming the electrode by etching a material. The resist removing step includes a second exposing step of exposing the conductive photoresist in the display area after the patterning step is completed, and a developing processing of the exposed conductive photoresist. And a developing step of performing the following.

The patterning step and the resist removing step can be realized by any method other than the above. However, with the above configuration, these steps can be realized without cost and time.

(6) In the method of manufacturing an electro-optical device according to the above mode (4) or (5), the electrode wiring includes at least one of an electrode lead line connected to the electrode and the pair of substrates. A terminal wire formed at an edge can be considered.

(7) In the method of manufacturing an electro-optical device according to any one of the above items (4) to (6), the conductive photoresist is formed by including conductive particles in a dispersed state inside the photoresist. can do.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described by taking a liquid crystal device as an example of an electro-optical device.

FIG. 1 shows the liquid crystal device 1 in an exploded state, and FIG. 2 shows a sectional structure of the liquid crystal device 1. The liquid crystal device 1 shown here has a pair of substrates 4a and 4
b, and these substrates are joined to each other at their periphery by the sealing material 6. These substrates 4a and 4b
Is formed by forming electrodes and other necessary elements on a substrate material formed of a hard light-transmitting material such as glass or a flexible light-transmitting material such as plastic.

In FIG. 2, for example, a first electrode 8a acting as a common electrode is formed in a predetermined pattern on a liquid crystal side surface of a substrate material 7a constituting the first substrate 4a, that is, a surface facing the second substrate 4b. Then, an overcoat layer 9a is formed thereon, and an alignment film 11a is further formed thereon. A polarizing plate 12a is attached to the outer surface of the substrate material 7a.

The liquid crystal side surface of the substrate material 7b constituting the second substrate 4b facing the first substrate 4a, ie, the first substrate 4
On the surface facing a, for example, a second electrode 8b acting as a segment electrode is formed in a predetermined pattern, an overcoat layer 9b is formed thereon, and an alignment film 11b is further formed thereon. A polarizing plate 12b is adhered to the outer surface of the substrate material 7b, and a light reflecting plate 10 is further provided outside the polarizing plate 12b.

The light reflecting plate 10 can be replaced by a lighting device such as a backlight. In addition to the above components, other optical elements such as a phase difference plate and a color filter for performing color display can be provided as necessary.

Each of the alignment films 11a and 11b is subjected to a rubbing treatment for imparting an orientation. Further, the polarization axis of the polarizing plate 12a and the polarization axis of the polarizing plate 12b are opposed to each other at a predetermined angle in order to obtain a polarization transmittance required for displaying a visible image.

The first electrode 8a and the second electrode 8b are formed of a light transmitting material such as ITO (Indium Tin Oxide) to a thickness of about 1000 Å, and the overcoat layers 9a and 9b are formed of, for example, silicon oxide, The alignment film 1 is formed of titanium oxide or a mixture thereof to a thickness of about 800 Å.
1a and 11b are made of, for example, polyimide resin
It is formed to a thickness of about 00 Å.

As shown in FIG. 1, the first electrode 8a is formed by arranging a plurality of linear patterns in parallel with each other.
It is formed in a so-called stripe shape, while the second electrode 8b
Is also formed in a stripe shape by arranging a plurality of linear patterns parallel to each other so as to intersect the first electrode 8a. A plurality of points where the electrodes 8a and the electrodes 8b intersect in a dot matrix form pixels for displaying an image. An area defined by the plurality of pixels is a display area V for displaying an image such as a character.

In regions other than the display region V of the first substrate 4a, that is, in the non-display region X, the electrode lead lines 15a connected to the first electrodes 8a and the terminal lines 1 formed at the edge of the substrate are provided.
7 are present. The electrode lead 15a is connected to a central portion of the terminal wire 17, and the terminal wires 17 located on both sides of the central portion are formed to have an appropriate length that does not reach the display region V. A region other than the display region V on the second substrate 4b;
That is, in the non-display area X, an electrode lead line 15b connected to the second electrode 8b is formed.

In this embodiment, the electrode wiring existing in the non-display area X of the first substrate 4a, that is, the electrode lead line 15a
The conductive photoresist 20 is laminated on the terminal wires 17. Then, a conductive layer such as a conductive photoresist is not provided on the first electrode 8a in the display region V.

Further, a conductive photoresist 20 is laminated on the electrode wiring existing in the non-display area X of the second substrate 4b, that is, on the electrode lead line 15b. Then, a conductive layer such as a conductive photoresist is not provided on the second electrode 8b in the display region V.

A photoresist used as a mask when a selective etching process is performed in a patterning process based on a photolithography method is a material having a property that its resistance to a chemical changes when exposed to light, and is generally an insulating material. Material. In contrast, the conductive photoresist 20 used in the present embodiment is a photoresist having conductivity, and such a photoresist includes, for example, conductive particles dispersed in a general photoresist material. Formed.

The first substrate 4a formed as described above
As shown in FIG. 2, a plurality of spacers 13 are dispersed on one of the liquid crystal side surfaces of the second substrate 4b and the sealing material 6 on the liquid crystal side surface of one of the substrates. Thus, it is provided in a frame shape as shown in FIG. As shown in FIG. 2, a conductive material 14 is dispersed inside the seal material 6. Further, a liquid crystal injection port 6a is formed in a part of the sealing material 6, as shown in FIG.

A spacer 13 is provided between the substrates 4a and 4b.
A gap having a uniform dimension, for example, a dimension of about 5 μm, that is, a so-called cell gap is formed, and the liquid crystal 16 is injected into the cell gap through the liquid crystal injection port 6a. After the injection is completed, the liquid crystal injection port 6a is closed. It is sealed with a resin or the like.

In FIG. 1, the first substrate 4a is a second substrate 4
The terminal line 17 is formed on the surface of the substrate overhanging portion 4c.
The electrode lead line 15a extending from the first electrode 8a on the first substrate 4a directly extends to the substrate overhang 4c to form a terminal line 17. Also, the second electrode 8 on the second substrate 4b
The electrode lead 15b extending from the terminal b is connected to the terminal line 17 on the substrate overhang 4c via the conductive material 14 (see FIG. 2) dispersed inside the seal material 6.

Each of the electrodes 8a and 8b, the electrode lead wires 15a and 15b extending therefrom, and the terminal wires 17 are actually formed on the surfaces of the substrates 4a and 4b at extremely small intervals. In FIG. 1, the electrodes and the like are schematically illustrated at intervals wider than the actual intervals in order to clearly show the structure. Further, the electrodes 8a and 8b formed in the display region V are not limited to being formed in a linear shape, but may be formed in an appropriate pattern such as a figure or a symbol.

An external circuit (not shown) equipped with a liquid crystal drive circuit is connected to the substrate overhang 4c. The liquid crystal drive circuit is formed, for example, in the form of an IC chip. This IC chip is formed as an external circuit in the form of a TCP (Tape Carrier Package) using, for example, TAB (Tape Automated Bonding) technology. Part 4
c.

According to the liquid crystal device 1 configured as described above, in FIG. 1, a scanning voltage is applied to one of the first electrode 8a and the second electrode 8b for each row, and furthermore, , A data voltage based on the display image is applied to each pixel. In the pixel portion to which these two voltages are applied, the orientation of the liquid crystal contained in the pixel portion is changed, whereby the light passing through the pixel portion is modulated. Is displayed.

In the present embodiment, the electrode wiring existing in the non-display area X which is an area other than the display area V, ie, the first
For the substrate 4a, the electrode lead wire 15a and the terminal wire 1
7, on the other hand, for the second substrate 4b, the electrode lead line 15b
, The respective wirings 15a, 15b,
The conductive photoresist 20 was laminated on the substrate 17.

For this reason, in the present embodiment, the non-display area X
When the wiring density of the electrode wiring such as the electrode wiring 15a, 15b and the like provided therein is increased due to the reduction of the area of the electrode wiring, that is, even when the electrode wiring has a high-definition pattern, the material for forming the electrode wiring, For example, the resistance value of the electrode wiring can be reduced without increasing the thickness of ITO. The fact that it is not necessary to increase the thickness of ITO means that the amount of ITO used can be kept low, and therefore, the liquid crystal device 1 of the present embodiment can be manufactured at low cost.

An external circuit is connected to the substrate overhang 4c on which the terminal wire 17 is formed via a conductive connection member such as a TCP (Tape Carrier Package) or a heat seal. ACF (Anisotropic C
A bonding agent such as an onductive film (anisotropic conductive film) is used. In a conventional wiring structure in which a conductive photoresist is not laminated on the terminal line 17, the conductive particles in the ACF directly contact the terminal line 17, and thus the ITO, so that the contact property between the two is reduced. Was considered to be insufficient.

On the other hand, if a conductive photoresist is laminated on the terminal line 17 as in the present embodiment, A
The conductive particles in the CF will contact the ITO via the conductive photoresist. In this case, the conductive photoresist has a lower hardness than that of ITO.
When the conductive particles in F contact, a large contact area can be secured, and as a result, the adhesion between the conductive particles in the ACF and the terminal wire 17, that is, the contact can be improved.

Hereinafter, a manufacturing method for manufacturing the liquid crystal device 1 having the above configuration will be described with reference to FIGS.

First, a large-sized first substrate including a plurality of first substrates 4a of FIG. 1 is formed by steps B1 to B4 of FIG. Specifically, in step B1, the first of FIG.
A large-sized first substrate material having a size corresponding to a plurality of substrates 4a is prepared, and a first electrode 8a and an electrode lead 15a are provided on each of the first substrates 4a on the surface of the large-sized first substrate material. And the terminal wire 17 is formed using ITO as a material.

This first electrode forming step B1 is performed, for example, in FIG.
It can be carried out according to the procedure shown in FIG. That is, in step A1, ITO 8a, which is an electrode material, is formed as a non-patterned film on the surface of a large-sized first substrate material 7a, and in step A2, a conductive photoresist 20 is deposited on the ITO film 8a. It is formed as a film without a pattern. The conductive photoresist 20 is formed, for example, by including conductive particles in a generally used insulating photoresist in a dispersed state.

Then, a patterning step is performed in steps A3 to A5. Specifically, first, the formed conductive photoresist 20 is exposed through a photomask 21 having the same pattern as that of the first electrode 8a, the electrode lead line 15a, and the terminal line 17, that is, the first photoresist 8 is exposed.
Exposure is performed (Step A3). Next, using a predetermined developing solution, for example, an alkaline solution having a predetermined concentration, the conductive photoresist 20 is used.
Is subjected to a development process to form a conductive photoresist 20 in a predetermined pattern (step A4).

Next, using the conductive photoresist 20 as a mask, an etching process is performed on the ITO film 8a using a predetermined etching solution (step A5). As a result, the first electrode 8 shown in FIG.
a, the same pattern as the pattern of the electrode lead line 15a and the terminal line 17 is formed by the ITO 8a and the conductive photoresist 2.
0 has a two-layer structure. At this time, the conductive photoresist 20 exists in all the patterns including the pattern in the display region V.

Thereafter, a resist removing step is performed in steps A6 and A7. Specifically, the conductive photoresist 20 after the patterning step is exposed through a photomask 22 having a pattern corresponding to the display region V, that is, a second exposure (step A6). Next, the conductive photoresist 20 is subjected to a developing process using a predetermined developing solution, for example, an alkaline solution having a predetermined concentration, to remove the conductive photoresist 20 in the display region V (Step A).
7). As a result, as shown in FIG. 3G, the conductive photoresist 20 remains on the electrode lead lines 15a and the terminal lines 17 located in the non-display area X, and on the other hand, in the display area V A pattern in which the conductive photoresist 20 has been removed is obtained from above the first electrode 8a.

Next, in step B2 of FIG. 4, the overcoat layer 9a (FIG. 2) is formed on the surface of the large-sized first substrate on which the first electrode 8a and the like are formed by offset printing using, for example, silicon oxide or titanium oxide as a material. Reference). Then, an alignment film 11a (see FIG. 2) is formed thereon by offset printing using, for example, a polyimide resin (Step B3), and a rubbing process is performed on the alignment film 11a (Step B4). As described above, the first electrode 8
a, a large-sized first substrate including a plurality of first substrates 4a (see FIG. 1) on which electrode lead lines 15a and terminal lines 17 are formed.
A substrate is formed.

Next, a large-sized second substrate including a plurality of second substrates 4b of FIG. 1 is formed by steps C1 to C5 of FIG. Specifically, in step C1, the second
A large-sized second substrate material having a size corresponding to a plurality of substrates 4b is prepared, and a second electrode 8b and an electrode lead 15 are provided on each of the second substrates 4b on the surface of the second substrate material.
b is formed using ITO as a material.

The second electrode forming step C1 is performed by the first substrate 4
The process can be performed by the same process as that of FIG. 3 performed to form the first electrode 8a, the electrode lead wire 15a, and the terminal wire 17 on the surface of a. However, in the second electrode forming step C1, the electrode lead line 15 located in the non-display area X
On the other hand, the conductive photoresist 20 remains on the second electrode 8b located in the display region V, and a pattern in which the conductive photoresist 20 has been removed is obtained on the second electrode 8b.

Next, in step C2 of FIG. 4, an overcoat layer 9b (see FIG. 2) is formed on the surface of the large-sized second substrate on which the second electrode 8b and the electrode lead line 15b are formed, for example, by silicon oxide. Is formed by offset printing using titanium oxide as a material. Then, the alignment film 11 is formed thereon by offset printing using, for example, a polyimide resin.
b (see FIG. 2) (Step C3), and a rubbing process is performed on the alignment film 11b (Step C4).

Then, a sealing material 6 (see FIG. 1) is formed in a frame shape by screen printing using, for example, a material obtained by dispersing a conductive material in an epoxy resin (step C5). As described above, a large-sized second substrate including a plurality of second substrates 4b (see FIG. 1) on which the second electrodes 8b and the electrode lead lines 15b are formed is formed.

After the large-sized first substrate and the large-sized second substrate are manufactured as described above, in step D1 of FIG. 4, the large-sized first substrate and the large-sized second substrate are sealed with the sealing material for each liquid crystal device. The substrates 6 are attached to each other by superimposing them and sandwiching them therebetween, that is, by pressurizing under heating.

By this bonding, the conductive material 14 in which the tip of the electrode lead wire 15b on the second substrate 4b and the terminal wire 17 on the first substrate 4a are dispersed in the sealing material 6 (see FIG. 2) Are conductively connected to each other. As described above, FIG.
A large-sized liquid crystal panel structure including a plurality of the liquid crystal devices 1 is formed.

After the large-sized liquid crystal panel structure is manufactured as described above, the first break process is performed on the liquid crystal panel structure, and the liquid crystal injection port 6a (see FIG. 1) is exposed to the outside. A plurality of so-called strip-shaped medium-sized liquid crystal panel structures including a plurality of liquid crystal panel portions in a line are manufactured (step D2). Thereafter, for a plurality of liquid crystal panel structures included in the medium-sized liquid crystal panel structure, liquid crystal is injected through the liquid crystal injection port 6a exposed to the outside, and after the injection is completed, the liquid crystal injection port 6a is sealed with a resin (step). D3).

Next, in a step D4, a second break is performed on the strip-shaped medium-sized liquid crystal panel structure, whereby the liquid crystal device 1 shown in FIG.
The liquid crystal panel structure having the structure to which 2b is not attached is divided one by one. Then, a polarizing plate 12a and a polarizing plate 12b are respectively attached to both front and back surfaces of each divided liquid crystal panel structure (Step D5), and a light reflecting plate 19 is further attached on the polarizing plate 12b. Thereby, the liquid crystal device 1 shown in FIG. 1 is completed. Thereafter, if necessary, an external circuit including a liquid crystal drive circuit and the like is conductively connected to the terminal line 17 formed on the substrate overhang portion 4c.

In the above-described method for manufacturing a liquid crystal device, the electrode forming step shown in FIG. 3 will be considered. This step is
Electrode lead lines 15a, 15b existing in non-display area X
The conductive photoresist 20 is left on the electrode wiring such as the terminal lines 17 and the like, and the conductive photoresist 20 is removed from the first electrode 8a and the second electrode 8b existing in the display region V. This is a process performed with the goal of.

In a patterning process based on a general photolithography method, it is usual that an insulating photoresist is used as a photoresist.
There is a great difference from the electrode forming process shown in FIG. However, there is almost no difference between the processes from step A1 to step A5 in FIG.

In addition, in the general photolithography method, after the etching step A5 is completed, it is sufficient to remove the entire photoresist, and for example, a high-concentration alkaline solution is used after the etching step A5. Generally, a resist stripping step is performed.

On the other hand, in this embodiment, the conductive photoresist 20 must be removed only in the display region V and the conductive photoresist 20 must be left in the non-display region X. After performing the second exposure step A6 after A5, the development processing A
7 has been done.

In this case, the developing step A in the present embodiment
Step 7 is a step which can be performed by substantially the same processing as the resist stripping step in the general photolithography method. Therefore, the electrode forming step of this embodiment is fundamentally different from the general photolithography method in that the step It is considered that the second exposure is performed on the display area V in A6.

That is, as in this embodiment, the patterning step is performed by the first exposure (step A3), the development (step A4) and the etching (step A5), and the resist removing step is performed by the second exposure (step A6). And development (Step A)
According to the method (7), a desired result can be obtained with a slight modification of a general photolithography method, so that it is very easy to realize, and there is almost no increase in cost.

As described above, the present invention has been described with reference to the preferred embodiments. However, the present invention is not limited to the embodiments, and can be variously modified within the scope of the invention described in the claims.

For example, in the embodiment of FIG. 1, a liquid crystal device is exemplified as an electro-optical device. However, other electro-optical devices, for example, an optical device using electroluminescence (EL) as an electro-optical device, a plasma display (PDP), and the like. ) And field emission devices (FE
The present invention can be applied to various electro-optical devices such as an optical device using D).

In the embodiment shown in FIG. 1, a pair of substrates 4a and 4b, a polarizing plate 1
Although the elements such as 2a, 12b and the light reflecting plate 10 have been illustrated, this is merely an example, and other components such as a color filter for color display and a phase difference plate may be used as necessary. Of course you can.

[0064]

According to the electro-optical device of the present invention, since the conductive photoresist is provided on the electrode wiring in the non-display area, for example, on the electrode wiring, the material for forming the electrode wiring is provided. For example, the resistance value of the electrode wiring can be reduced without increasing the thickness of the ITO. By reducing the amount of material used to form the electrode wiring,
The overall price of the electro-optical device can be kept low.

Further, according to the method of manufacturing the electro-optical device according to the present invention, the conductive photoresist is not left on the electrodes in the display area and the conductive photoresist is left on the electrode wirings in the non-display area. Since the resist can be left, the resistance of the electrode wiring can be reduced without increasing the thickness of the material forming the electrode wiring, for example, ITO. By reducing the amount of material used for forming the electrode wiring in this manner, the overall price of the electro-optical device can be kept low.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an embodiment of a liquid crystal device as an example of an electro-optical device according to the invention.

FIG. 2 is a sectional view showing a sectional structure of the liquid crystal device shown in FIG.

FIG. 3 is a process diagram showing a main part of a method for manufacturing an electro-optical device according to the present invention.

FIG. 4 is a process chart showing an example of a method for manufacturing the liquid crystal device shown in FIG.

[Explanation of symbols]

 Reference Signs List 1 liquid crystal device (electro-optical device) 4a, 4b substrate 6 sealing material 7a, 7b substrate material 8a, 8b electrode 10 light reflection plate 15a, 15b electrode lead wire (electrode wire) 16 liquid crystal 17 terminal wire (electrode wire) 20 conductive Photoresist V display area X non-display area

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H092 GA34 GA42 GA51 HA25 HA28 MA10 MA12 MA15 MA17 MA37 NA28 PA01 PA02 PA03 PA04 PA10 PA11 PA12 3K007 AB02 AB05 AB18 BA06 CA01 CB01 CC05 FA01 5G435 AA16 AA17 AA18 BB05 BB06 BB12 CC09 EE HH20 KK05

Claims (7)

[Claims] 1. An electro-optical device having an electro-optical material disposed between a pair of substrates and capable of displaying an image on a display area, wherein an electrode is provided in the display area of at least one of the substrates. An electro-optical device, wherein the electrode is formed, and the electrode is connected to an electrode wiring provided in a non-display area, and a conductive photoresist is provided on the electrode wiring. 2. The electro-optical device according to claim 1, wherein the electrode wiring includes an electrode lead line connected to the electrode and a terminal line formed on at least one side edge of the one substrate. apparatus. 3. The electro-optical device according to claim 1, wherein the conductive photoresist is formed by dispersing conductive particles inside the photoresist. 4. An electro-optical substance is disposed between a pair of substrates, and an image can be displayed in a display area.
An electrode is formed in the display area of at least one of the substrates, and the electrode is connected to an electrode wiring provided in a non-display area. An electrode material film forming step of forming an electrode material on the surface in a non-pattern form; a resist film forming step of forming a conductive photoresist on the electrode material in a non-pattern form; the electrode material and the conductive photo A patterning step of forming both resists in the same pattern as the electrodes in the display area and the electrode wirings in the non-display area; and a conductive pattern in the display area except for a conductive photoresist in the non-display area. And a resist removing step of removing the conductive photoresist. 5. The method according to claim 4, wherein the patterning step includes exposing the formed conductive photoresist in the same pattern as the electrode in the display area and the electrode wiring in the non-display area. An exposure step, a development step of performing development processing on the exposed conductive photoresist, and an etching step of etching the electrode material using the conductive photoresist developed into a predetermined pattern as a mask to form the electrode. A second exposure step of exposing the conductive photoresist in the display area after the patterning step is completed, and a step of exposing the conductive photoresist that has been exposed to light. And a developing step of performing a developing process. 6. The electrode wiring according to claim 4, wherein the electrode wiring includes an electrode lead line connected to the electrode and a terminal line formed on at least one side edge of the pair of substrates. Of manufacturing an electro-optical device. 7. The conductive photoresist according to claim 4, wherein the conductive photoresist is formed by dispersing conductive particles inside the photoresist. A method for manufacturing an electro-optical device.