JP4581405B2 - Electro-optical device and electronic apparatus - Google Patents

Description

The present invention relates to an electro-optical device, a method for manufacturing the electro-optical device, and an electronic apparatus including the electro-optical device.
In particular, the present invention includes an electro-optical device, a method for manufacturing an electro-optical device, and an electro-optical device that prevent electrostatic breakdown through a dummy pattern formed outside the display area in order to make the background color uniform. It relates to electronic equipment.

Conventionally, a pixel is formed by intersecting a scan electrode formed on one of a pair of substrates opposed to each other and a data electrode formed on the other substrate in a dot matrix form, and a voltage applied to these pixels A liquid crystal display device that displays an image such as a character by modulating light that passes through a liquid crystal substance included in the pixel by turning on and off is widely used.
Such a liquid crystal display device usually has a first substrate having a first wiring pattern (scanning electrode), a second substrate having a second wiring pattern (data electrode) and a pixel electrode, and the first substrate. Arranged along the outer peripheral surfaces of the first substrate and the second substrate, and sealed between the first substrate and the second substrate, and a sealing material for bonding the first substrate and the second substrate together Liquid crystal.

In such a liquid crystal display device, the first wiring pattern and the second wiring pattern are usually extended to an outer area of the display area (hereinafter referred to as a non-display area). Further, the lead wiring for connecting the driving IC and the wiring patterns thereof is also formed in the non-display area by a transparent electrode or the like.
Many liquid crystal display devices are incorporated in electronic devices in a state where the liquid crystal display device is visually recognized including the non-display area. Therefore, it is desirable that the color of the non-display area (hereinafter referred to as the background color) visually recognized when the voltage is off is equal to the color of the display area.

Therefore, the dummy pattern is formed so as to overlap the first wiring pattern or the second wiring pattern facing each other in the non-display area as well as the first wiring pattern and the second wiring pattern overlapping in the display area. Then, by making the cell gap uniform between the first substrate and the second substrate into which the liquid crystal is injected, the colors of the non-display region and the display region are substantially equal when the voltage is off. An electro-optical device is disclosed. More specifically, an electro-optical device including a first substrate including an electrode that receives a predetermined voltage and a second substrate including a dummy electrode facing a part of the electrode, the second substrate 17, there are a plurality of regions in which dummy electrodes 428 and 430 having different pattern shapes are formed, and the ratio of the wiring width to the wiring pitch of the dummy electrodes 428 and 430 in the plurality of regions is as follows. In this electro-optical device, dummy electrodes 428 and 430 are provided so as to be substantially the same (see, for example, Patent Document 1).
JP 2001-10031 A (Claim 1, FIG. 1)

However, in the electro-optical device described in Patent Document 1, depending on the distance between the dummy pattern and the end portion of the substrate, a metal frame or a foreign object may come into contact with the dummy pattern, and static electricity may be generated. . Accordingly, there has been a problem that static electricity is transmitted to the wiring pattern through the dummy pattern, and electrostatic breakdown is likely to occur.
In addition, static electricity generated by rubbing or peeling charging accumulates in the wiring pattern, and when the static electricity is discharged through the dummy pattern, the alignment film surface may be damaged greatly, resulting in display defects. there were.
In order to solve such a problem, it is conceivable to increase the distance between the dummy pattern and the wiring pattern. However, considering the background color and the problem of uniform cell gap, the distance is increased. There is a limit to this, and it has been difficult to reliably prevent the occurrence of electrostatic breakdown or the like in the wiring pattern.

Accordingly, the inventors of the present invention have made diligent efforts to divide the dummy pattern formed at a predetermined position in each substrate constituting the electro-optical device, and to provide a gap for electrical insulation as described above. The present invention has been completed by finding that it is possible to solve various problems.
That is, according to the present invention, in an electro-optical device, the occurrence of electrostatic breakdown through a dummy pattern for uniform cell gap is prevented, and the occurrence of background color unevenness is prevented, thereby achieving long-term reliability. An object is to provide an excellent electro-optical device. Another object of the present invention is to provide an efficient manufacturing method of such an electro-optical device and to efficiently provide an electronic apparatus including such an electro-optical device.

According to the present invention, the first substrate and the second substrate that are disposed to face each other with the sealant interposed therebetween, and the electro-optical material sandwiched between the first substrate and the second substrate are included. In the electro-optical device, the first substrate includes a first wiring pattern extending over a display region and a non-display region, and the second substrate includes a second wiring pattern and a shape of the first wiring pattern. wherein formed on the non-display area in response to a dummy pattern that is spaced apart from the second wiring pattern, provided with a, a gap that divides the dummy pattern comprises at least one, the gap is An electro-optical device is provided which is provided in a region inside a region where the sealing material is provided, and can solve the above-described problem.

  In configuring the electro-optical device of the present invention, the second wiring pattern is formed over the display area and the non-display area, and the first substrate corresponds to the shape of the second wiring pattern. It is preferable that a dummy pattern that is formed in the non-display area and is spaced apart from the first wiring pattern is provided, and at least one gap that divides the dummy pattern is provided.

  In configuring the electro-optical device of the present invention, it is preferable that the gap is provided in a region inside the region where the sealing material is provided.

  In constructing the electro-optical device of the present invention, the width (A) of the gap between the dummy patterns in the second substrate is determined from the distance (B) between the dummy pattern and the second wiring pattern. It is preferable to reduce the size.

  In configuring the electro-optical device of the present invention, it is preferable that the side of the dummy pattern that faces the second wiring pattern is arranged in parallel with the second wiring pattern.

Further, in configuring the electro-optical device according to the present invention, it is preferable that the areas of the divided dummy pattern pieces are substantially equal in the dummy pattern.
Note that each of the divided dummy pattern pieces includes a case in which the dummy pattern pieces excluding the dummy pattern pieces at both ends of the divided dummy pattern pieces are included.

  In configuring the electro-optical device of the present invention, the second substrate includes a plurality of regions having different dummy pattern line widths, and the dummy pattern line widths with respect to the pitch intervals of the dummy patterns in the respective regions. It is preferable that the ratios of these are substantially equal.

  In constructing the electro-optical device of the present invention, the width (A) of the gap between the dummy patterns is set to a value within the range of 10 to 20 μm, and the dummy pattern and the second wiring pattern are between The distance (B) is preferably set to a value in the range of 30 to 100 μm.

  In configuring the electro-optical device of the present invention, it is preferable that the distance (C) between the dummy pattern and the edge of the second substrate is set to a value within a range of 0.3 to 3 mm.

  Still another embodiment of the present invention is an electronic apparatus including any of the electro-optical devices described above.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments relating to an electro-optical device, an electro-optical device manufacturing method, and an electronic apparatus including the electro-optical device according to the invention will be specifically described below with reference to the drawings.
However, this embodiment shows one aspect of the present invention and does not limit the present invention, and can be arbitrarily changed within the scope of the present invention.

[First Embodiment]
1st Embodiment contains the 1st board | substrate and 2nd board | substrate which are opposingly arranged through a sealing material, and the electro-optical material pinched | interposed between the said 1st board | substrate and 2nd board | substrate. An electro-optical device. The first substrate includes a first wiring pattern extending over the display area and the non-display area, and the second substrate is not displayed corresponding to the second wiring pattern and the shape of the first wiring pattern. A dummy pattern formed in the region and spaced apart from the second wiring pattern is provided, and at least one gap for dividing the dummy pattern is provided.
Hereinafter, with reference to FIGS. 1 to 10 as appropriate, a liquid crystal display provided with a predetermined dummy pattern on each of the first substrate and the second substrate in the electro-optical device according to the first embodiment of the present invention. The apparatus will be described as an example.
FIG. 1A shows the dummy pattern 41 having the first wiring pattern 19 and the gap 43 on the first substrate 12 when the liquid crystal display device 10 of the first embodiment is viewed in plan. FIG. 1B is a diagram illustrating a second wiring pattern (data electrode 26 and routing wiring) on the second substrate 14 when the liquid crystal display device 10 of the first embodiment is viewed in plan. 28) is a diagram showing a dummy pattern 41 having a pixel electrode 20 and a gap 43, the contents of which will be described later.

1. Basic Structure of Liquid Crystal Display Device First, referring to FIGS. 2 to 3, the basic structure of a liquid crystal display device as an electro-optical device according to the first embodiment of the present invention, that is, a cell structure, wiring, or a retardation plate The polarizing plate will be specifically described. 2 is a schematic perspective view showing a liquid crystal panel 200 constituting the liquid crystal display device according to the first embodiment of the present invention, and FIG. 3 is a schematic schematic cross-sectional view of the liquid crystal panel 200.
The liquid crystal panel 200 shown in FIG. 2 is a liquid crystal panel 200 having an active matrix type structure using a TFD element (Thin Film Diode), and an illumination device such as a backlight or a front light or a case body (not shown). Etc. are appropriately attached as necessary to obtain a liquid crystal display device.
In this embodiment, a liquid crystal panel having an active matrix structure using a TFD element will be described as an example. However, a liquid crystal panel having a passive matrix structure or a non-linear element such as a TFT element (Thin Film Transistor) is used. It may be a liquid crystal panel having an active matrix structure.

(1) Cell structure As shown in FIG. 2, a liquid crystal panel 200 is disposed opposite to a first substrate 12 having a base plate 13 made of a glass plate, a synthetic resin plate, or the like, and similarly, a glass plate or a synthetic resin plate. Etc. are bonded to each other through a sealing material 230 such as an adhesive. Then, after the liquid crystal is injected into the space formed by the first substrate 12 and the second substrate 14 into the inner portion of the sealing material 230 through the opening 230a, the sealing material 231 is filled with the liquid crystal. The cell structure is sealed.
That is, as shown in FIG. 3, it is preferable that the liquid crystal 232 is filled between the first substrate 12 and the second substrate 14 and sealed.
In the following description, an example will be described in which the first glass substrate is used as the base of the first substrate, and the second glass substrate is used as the base of the second substrate.

(2) Wiring As shown in FIG. 2, a plurality of stripe-shaped data electrodes (second wiring patterns) 26 are formed on the inner surface of the second glass substrate 27 (the surface facing the first glass substrate 13). It is preferable to form a plurality of stripe-shaped scanning electrodes (first wiring patterns) 19 on the inner surface of the first glass substrate 13 (the surface facing the second glass substrate 27). Further, it is preferable that the first wiring pattern 19 on the first substrate 12 is conductively connected to the routing wiring 28 on the second glass substrate 27 through a sealing material 230 containing conductive particles. .
In addition, a pixel electrode made of a transparent conductor such as ITO (indium tin oxide) is connected to the data electrode through a TFD element, and intersection regions between the pixel electrode and the scanning electrode are arranged in a matrix to form a large number of data electrodes. A pixel is constituted, and the arrangement of these many pixels constitutes the liquid crystal display region A as a whole.
In the following description, it is assumed that the second wiring pattern includes a data electrode and a lead wiring.

Further, as shown in FIG. 2, the second glass substrate 27 has a substrate overhanging portion 14T that projects outward from the outer shape of the first glass substrate 13, and on the substrate overhanging portion 14T, Preferably, the data electrode 26, the lead wiring 28, and the external connection terminal 219 including a plurality of wiring patterns independently formed are formed.
A semiconductor element (IC) 261 with a built-in liquid crystal driving circuit and the like is provided on the substrate extension 14T so as to be conductively connected to the data electrode 26, the lead wiring 28, and the external connection terminal 219. It is preferable that it is mounted.
Furthermore, it is preferable that the flexible wiring substrate 110 is mounted on the end portion of the substrate extension portion 14T so as to be conductively connected to the external connection terminal 219.

(3) Retardation Plate and Polarizing Plate In the liquid crystal panel 200 shown in FIG. 2, as shown in FIG. 3, the retardation plate so that a clear image display can be recognized at a predetermined position of the first glass substrate 13. It is preferable that the (¼ wavelength plate) 250 and the polarizing plate 251 are disposed.
Also on the outer surface of the second glass substrate 27, it is preferable that a retardation plate (¼ wavelength plate) 240 and a polarizing plate 241 are disposed.

2. First substrate (color filter substrate)
(1) Basic Configuration As shown in FIG. 3, the first substrate 12 basically includes a first glass substrate 13, a colored layer 16, a light shielding layer 18, a first wiring pattern 19, It is preferable that it is comprised from these.
Further, as shown in FIG. 3, a colored layer 16 is formed for each pixel on the first substrate 12, and a planarizing layer (surface protective layer or overcoat) made of a transparent resin such as an acrylic resin or an epoxy resin is formed thereon. Layer) 215 is preferably covered. In this way, a color filter is formed by the colored layer 16 and the planarization layer (surface protective layer) 215. It is also preferable to provide an insulating layer (not shown) for improving electrical insulation.

(2) Colored layer In addition, the colored layer 16 shown in FIG. 3 is usually made to exhibit a predetermined color tone by dispersing colorants such as pigments and dyes in a transparent resin. An example of the color tone of the colored layer is a primary color filter composed of a combination of three colors R (red), G (green), and B (blue), but is not limited to this. ), M (magenta), C (cyan), and other various color tones.
Such a colored layer usually has a predetermined color by applying a colored resist made of a photosensitive resin containing a coloring material such as a pigment or a dye on the surface of the substrate, and removing unnecessary portions by a photolithography technique (etching method). A colored layer having a pattern can be formed. And when forming the colored layer of a some color tone, the said process is repeated.
In addition, a stripe arrangement is often used as the arrangement pattern of the colored layers, but various pattern shapes such as an oblique mosaic arrangement and a delta arrangement can be adopted in addition to the stripe arrangement.

(3) Light Shielding Layer Further, as shown in FIG. 3, a light shielding layer (sometimes referred to as a black matrix or a black mask) 18 is formed in an inter-pixel region between the colored layers 16 formed for each pixel. It is preferable to do.
Examples of such a black matrix 18 include those in which three colorants of R (red), G (green), and B (blue) are dispersed in a resin or other base material, or black pigments or dyes. A material in which a coloring material such as a resin is dispersed in a resin or other base material can be used. In addition, since an excellent shielding effect can be obtained without using a black material such as carbon, an R (red) layer, a G (green) layer, and a B (blue) layer can be obtained using an additive color method. A layer structure is also preferable.

(4) First wiring pattern (scanning electrode)
As shown in FIG. 3, it is preferable to form a first wiring pattern 19 made of a transparent conductor such as ITO (indium tin oxide) on the planarizing layer 215. The first wiring pattern 19 is preferably formed in a stripe shape in which a plurality of transparent electrodes extending over the display area and the non-display area are arranged in parallel.
Further, the height (thickness) of the first wiring pattern is preferably set to a value within the range of 1 to 20 μm, and more preferably set to a value within the range of 2 to 15 μm.
This is because if the height (thickness) of the first wiring pattern is less than 1 μm, the value of the electrical resistance may be excessively increased. On the other hand, if the height of the first wiring pattern exceeds 20 μm, the cell gap may vary or it may be difficult to reduce the thickness of the electro-optical device.
Moreover, it is preferable to make the distance between the adjacent 1st wiring patterns 19 into the value within the range of 20-50 micrometers, and it is more preferable to set it as the value within the range of 22-45 micrometers. That is, it is preferable to determine the distance between the adjacent first wiring patterns 19 in consideration that the particle size of the conductive particles contained in the sealing material is usually about 10 μm.
This is because when the distance is less than 20 μm, static electricity is generated between the adjacent first wiring patterns, and electrostatic breakdown is likely to occur, which may cause a display defect or the like. On the other hand, when the distance exceeds 50 μm, the area other than the pixel region becomes large, and it may be difficult to display a high-definition image.

Moreover, it is preferable that the edge part position of the 1st wiring pattern in a 1st board | substrate exists inside the outer edge of a sealing material. That is, as shown in FIG. 1A, when the liquid crystal display device is seen through in plan, the first wiring pattern 19 is disposed so as not to exist outside the outer edge 230a of the sealing material 230. Is preferred.
However, the first wiring pattern on the first substrate usually needs to be electrically connected to the lead wiring on the second substrate through a sealing material containing conductive particles. Therefore, as shown in FIG. 1A, the end position of the first wiring pattern 19 is preferably present outside the inner edge of the sealing material 230. By configuring in this way, the first wiring pattern and the routing wiring on the second substrate are electrically connected, and the occurrence of electrostatic breakdown due to contact of a metal frame or a foreign object is surely prevented. Can do.
Moreover, it is preferable that the edge part position of the some 1st wiring pattern which exists in each edge | side of the 1st board | substrate 12 is uniform. That is, as shown in FIG. 1A, end portions 19 a of a plurality of first wiring patterns 19 existing on one side of the edge portion 13 a of the first glass substrate 13, and the first glass substrate 13. It is preferable that the distance to the edge portion 13a is substantially equal.
This is because the contact area between each wiring pattern and the sealing material is made uniform by configuring in this way. Therefore, the conduction characteristics between each wiring pattern and the lead wiring on the second substrate are kept good, and an excellent image display can be realized. In addition, with this configuration, the cell gap of the electro-optical device can be made uniform.

(6) Dummy Pattern (6) -1 Basic Configuration As shown in FIG. 1A, the liquid crystal display device according to the first embodiment includes a second wiring on the second substrate facing each other on the first substrate. Corresponding to the shape of the pattern, a dummy pattern 41 is formed in a non-display area (an area other than the area 40 where the second wiring pattern and the pixel electrode overlap) and is spaced apart from the first wiring pattern 19 described above. It has.
That is, by providing such a dummy pattern, the cell gap between the display area and the non-display area can be made uniform, and the background color unevenness can be eliminated. Therefore, it is preferable to form such a dummy pattern in the non-display area including the area where the sealing material adheres on the first substrate.
Further, the material constituting the dummy pattern is preferably a material having transparency in order to make the background color uniform with the display area. In particular, since it can be formed in the same process and the background color can be easily uniformed, it is more preferably the same material as the first wiring pattern, specifically, indium tin oxide. It is preferable that it is a thing.

In addition, the dummy pattern 41 includes at least one gap 43 that is divided into the display region 40 side and the edge portion 13a side of the first glass substrate 13 for electrical insulation. Yes.
That is, by providing a predetermined gap, even when a metal frame or a foreign object comes into contact with the dummy pattern from the outside, the influence of static electricity reaches the first wiring pattern through the dummy pattern. This is because this can be effectively prevented. Therefore, it is possible to prevent electrostatic breakdown in the first wiring pattern and the like.
This configuration prevents static electricity from discharging from the first wiring pattern to the external metal frame or the like via the dummy pattern, and is effective for damage to the alignment film in such a case. Can be prevented.

(6) -2 Position of Gap As shown in FIG. 1A, it is preferable to provide a gap in a region inside the dummy pattern 41 with respect to the region where the sealing material 230 is provided.
This reason is because it becomes unnecessary to consider the relationship between the particle size of the electroconductive particle contained in a sealing material, and the width | variety of a gap | interval by comprising in this way. That is, when a gap is formed in the region where the sealing material is provided, the dummy pattern pieces may be electrically connected to each other through the conductive particles in the sealing material. Therefore, by providing a gap in the area inside the area where the sealing material is provided, the dummy pattern pieces are prevented from conducting through the conductive particles, and electrostatic breakdown in the first wiring pattern or the like is prevented. Can be effectively prevented.

(6) -3 Width of the gap As shown in FIG. 4, the width (A) of the gap 43 provided in the dummy pattern 41 is preferably set to a value in the range of 10 to 20 μm.
The reason for this is that when the gap width (A) of the dummy pattern is less than 10 μm, when a metal frame or foreign matter comes into contact with the dummy pattern from the outside, the gap between the divided dummy patterns also exceeds the gap. This is because static electricity may be transmitted. Therefore, eventually, it becomes difficult to prevent the occurrence of electrostatic breakdown in the first wiring pattern or the like. On the other hand, if the width (A) of the gap of the dummy pattern exceeds 20 μm, unevenness of the background color may be visually recognized in the gap portion.
Therefore, the width (A) of the gap between the dummy patterns is more preferably set to a value within the range of 12 to 19.5 μm, and further preferably set to a value within the range of 15 to 19 μm.

(6) -4 Number of gaps Further, regarding the number of gaps provided in the dummy pattern, it is preferable to provide at least one, but it is possible to more reliably prevent the occurrence of electrostatic breakdown in the first wiring pattern or the like. It is also preferable to provide a plurality.
The reason for this is that when there is only one gap, depending on the width, static electricity may be transmitted across the gap between the divided dummy pattern pieces. This is because it is difficult to reliably prevent destruction. Therefore, when a plurality of gaps are provided, even if static electricity is transmitted across the gap at one place, the possibility of the influence of static electricity on the first wiring pattern or the like is low.
However, if the number of gaps becomes too large, it becomes difficult to control the formation, and therefore the number of gaps provided in the dummy pattern is more preferably in the range of 2 to 5.

(6) -5 Shape of the gap The shape of the gap provided in the dummy pattern is not particularly limited, and can be, for example, a shape as shown in FIGS. Among these, since it is easy to form in the manufacturing process and is less likely to be visually recognized as uneven background color, a linear shape as shown in FIGS. 5A to 5B is preferable.
Furthermore, the positional relationship between the gaps provided in the adjacent dummy patterns is not particularly limited, and an arrangement as shown in FIGS. 6A to 6B can be considered, but it can be easily formed in the manufacturing process. Therefore, as shown in FIG. 6B, it is preferable that the gaps respectively provided in the adjacent dummy patterns are arranged in the same straight line.

(6) -6 Area of Dummy Pattern Piece Further, regarding the area of each dummy pattern piece divided by the gap in the dummy pattern, each dummy pattern 41 constituting each dummy pattern 41 is shown in FIG. It is preferable that the dummy pattern pieces 49 have substantially the same area.
This is because the dummy pattern including the gap can be formed with high accuracy by such a configuration. Further, even when the dummy pattern is charged, it is possible to make it possible to effectively prevent the static electricity from being transmitted between the dummy patterns by making the difference between the charges accumulated in the respective dummy pattern pieces as uniform as possible. .
Note that each of the divided dummy pattern pieces includes a case in which the dummy pattern pieces excluding the dummy pattern pieces at both ends of the divided dummy pattern pieces are included.

(6) -7 Distance to First Wiring Pattern As shown in FIG. 4, the distance (B) between the dummy pattern 41 and the first wiring pattern 19 is within a range of 30 to 100 μm. It is preferable to use a value.
The reason for this is that when the distance (B) is less than 30 μm, when the static electricity is transmitted across the gap in the dummy pattern including the gap, the first wiring pattern is also affected by the static electricity. This is because there is a case where it will be lost. On the other hand, if this distance (B) exceeds 100 μm, background color unevenness may be easily recognized.
Therefore, the distance (B) between the dummy pattern and the first wiring pattern is more preferably set to a value within the range of 35 to 80 μm, and further preferably set to a value within the range of 40 to 60 μm. .
It should be noted that the distance (B) between the dummy pattern and the first wiring pattern is the first pattern in the dummy pattern 41 including the respective gaps, as shown in FIGS. It means a linear distance between the portion 44 closest to the wiring pattern 19 and the first wiring pattern 19.

In addition, as shown in FIG. 4, it is preferable that the distance (B) between the dummy pattern 41 and the first wiring pattern 19 is larger than the width (A) of the gap 43 provided in the dummy pattern 41. .
The reason for this is that, when the static electricity is transmitted across the gap provided in the dummy pattern, the static electricity is prevented from being transmitted between the dummy pattern and the first wiring pattern. This is because it can be done. Therefore, it is possible to effectively prevent electrostatic breakdown from occurring in the first wiring pattern or the like.
With this configuration, it is possible to effectively prevent static electricity from being discharged from the first wiring pattern to an external metal frame or the like via the dummy pattern.

Further, as shown in FIGS. 4 and 7A, in the dummy pattern 41, it is preferable to arrange the side 42 facing the first wiring pattern 19 in parallel with the first wiring pattern 19. .
This is because the first wiring pattern 19 and the dummy pattern 41 are less likely to be electrically connected as compared with the case where the first wiring pattern 19 and the dummy pattern 41 are arranged as shown in FIG. Because. That is, when the dummy pattern is arranged as shown in FIG. 7B, when the dummy pattern 41 is charged, the charge concentrates on the end portion 41b closest to the first wiring pattern 19, and the first pattern It becomes easy to become a conductive state between the wiring patterns. In order to alleviate such a state, it is effective that the portion closest to the first wiring pattern is not a point but a line or a surface. Therefore, by arranging the dummy pattern as shown in FIG. 7A, the charges at the end positions of the dummy pattern can be dispersed.

(6) -8 Distance to the edge of the substrate As shown in FIG. 4, the distance (C) between the dummy pattern 41 and the edge of the first glass substrate 13a is in the range of 0.3 to 3 mm. It is preferable to set the value within the range.
The reason for this is that when the distance (C) is less than 0.3 mm, a metal frame or a foreign object can easily come into contact with the dummy pattern from the outside. On the other hand, static electricity is transmitted and electrostatic breakdown or the like is likely to occur. On the other hand, if the distance (C) exceeds 3 μm, the first substrate and thus the electro-optical device may be increased in size.
Therefore, it is more preferable to set the distance (C) between the dummy pattern and the edge 13a of the first glass substrate 13 to a value within the range of 0.5 to 2.8 mm, and 0.7 to 2.5 mm. More preferably, the value is within the range.
The distance (C) between the dummy pattern 41 and the edge portion 13a of the first glass substrate 13 is the same as that in the dummy pattern 41 including a gap, as shown in FIGS. It means the linear distance between the portion 48 closest to the edge 13a of one glass substrate 13 and the edge 13a of the substrate.

(6) -9 Line Width Regarding the line width of the dummy pattern, as shown in FIG. 8, there are a plurality of dummy patterns 41 a and 41 b having different line widths Wd on the first substrate 12. The ratio of the line width Wd to the pitch interval Wp is preferably substantially equal to each other.
That is, as shown in FIG. 1B, the line widths of the data electrode 26 and the lead wiring 28 on the second substrate 14 are usually different for each region. Therefore, as shown in FIG. 1A, the line widths of the dummy patterns 41 formed on the first substrate 12 so as to oppose them differ from region to region. In such a case, if the ratio of the line width of the dummy pattern to the pitch interval of the dummy pattern is different in each area, the cell gap in the non-display area becomes non-uniform in each area. Unevenness may occur. Therefore, as shown in FIG. 8, in each region where the line width Wd of the dummy pattern is different, the ratio of the line width Wd of the dummy pattern to the pitch interval Wp of the dummy pattern is made substantially equal to each other. It is possible to prevent unevenness from occurring.

(7) Alignment film (first alignment film)
Further, as shown in FIG. 3, it is preferable that a first alignment film 217 made of polyimide resin or the like is formed on the first wiring pattern 19.
The reason for this is that by providing the alignment film 217 as described above, when the first substrate 12 is used in a liquid crystal display device or the like, the alignment drive of the electro-optical material (liquid crystal) can be easily performed by applying a voltage. This is because it can.

3. Second substrate (element substrate)
(1) Basic Structure As shown in FIGS. 2 and 3, the other second substrate 14 facing the first substrate 12 is basically a second glass substrate 27 and a second wiring pattern. It is preferable that the data electrode 26 and the lead wiring 28 are connected to each other, and the pixel electrode 20 connected to the data electrode 26 via a TFD element (not shown).
Further, when the second substrate needs a reflection function, for example, in a transflective liquid crystal display device used for a mobile phone or the like, a reflection function is provided between the second glass substrate and the pixel electrode. It is preferable to provide a layer (semi-transmissive reflector). This reflective layer is preferably composed of a metal thin film made of aluminum, aluminum alloy, chromium, chromium alloy, silver, silver alloy or the like. Moreover, it is preferable that the reflective layer is provided with a reflective portion having a reflective surface and an opening for each pixel.
Further, as shown in FIG. 3, it is preferable that a second alignment film 224 made of the same polyimide resin or the like as the first alignment film 217 in the first substrate 12 is formed on the data electrode 26. .
In the example of the liquid crystal display device of the first embodiment, the colored layer is provided on the first glass substrate 13, but it is also preferable to provide the colored layer on the second glass substrate 27.

(2) Second Wiring Pattern (2) -1 Data Electrode Further, as shown in FIG. 1B, the second substrate is provided with a data electrode 26 which is one of the second wiring patterns. Is preferred. As shown in FIG. 1B, the data electrode 26 is preferably configured in a stripe shape in which a plurality of metal films extending over the display area and the non-display area are arranged in parallel.
As shown in FIG. 1B, the data electrode extends outside the sealing material 230 and extends to the substrate overhanging portion 14T of the second glass substrate 27, and one end side is an external connection terminal. 219 is preferably a part of 219.

(2) -2 Leading Wiring Moreover, it is preferable to provide the lead wiring 28 which is one of the second wiring patterns on the second substrate as shown in FIG. The routing wiring 28 is also preferably configured in a stripe shape in which a plurality of metal films are arranged in parallel.
Further, it is preferable that the routing wiring extends outside the sealing material 230 and extends to the substrate overhanging portion 14T in the second glass substrate 27, and one end side is a part of the external connection terminal 219. . Then, as shown in FIGS. 9A to 9C, the end portion of the routing wiring 28 on the side where the external connection terminal 219 is not provided is the first through the sealing material 230. The first wiring pattern 19 on the substrate 12 is preferably electrically connected.
9A to 9C, the routing wiring 28 on the second substrate 14 in the liquid crystal panel, the second wiring pattern 19 on the first substrate 12, the sealing material 230, The schematic plan view which shows is shown. That is, FIG. 9A shows the first substrate in which the lead wiring 28 is formed up to two sides perpendicular to the side of the second substrate 14 on which the external connection terminal 28a is provided. 12 shows an example in which the first wiring pattern 19 on 12 is electrically connected. FIG. 9B shows the first substrate 12 in which the lead wiring 28 is formed up to one side perpendicular to the side of the second substrate 14 on which the external connection terminal 28 a is provided. An example in which the first wiring pattern 19 is electrically connected is shown. Further, FIG. 9C shows the side of the second substrate 14 on the side where the external connection terminal 28a is provided and the portion where the data electrode 26 does not exist, and the routing wiring 28 and the second wiring 14. In this example, electrical connection with the first wiring pattern 19 on one substrate 12 is shown.
As described above, there are various modes for the wiring pattern of the routing wiring. In any case, as described above, the wiring pattern on the first substrate is made to correspond to the shape of the wiring pattern of the routing wiring. By forming the dummy pattern, the cell gap is made uniform.

(2) -3 End Position Further, as shown in FIG. 1B, the second wiring pattern (data electrode 26 and routing) on the side where the external connection terminal 219 is not provided on the second substrate 14 is provided. It is preferable that end portions 26a and 28a including the wiring 28. The same applies hereinafter exist inside the outer edge 230a of the sealing material 230 in the same manner as the end portion of the scan electrode in the first substrate described above. That is, it is possible to reliably prevent the occurrence of electrostatic breakdown due to the contact of a metal frame or foreign matter.

(3) Dummy pattern Also in the second substrate, as in the first substrate, in order to equalize the cell gap between the non-display area and the display area and eliminate the unevenness of the background color, FIG. As shown in FIG. 4, the non-display area (the area other than the area 40 where the first wiring pattern and the data electrode overlap) is formed corresponding to the shape of the first wiring pattern on the first substrate facing each other. A dummy pattern 41 is provided. In order to prevent electrostatic breakdown due to static electricity transmitted to the second wiring pattern (data electrode) 26 and the like via the dummy pattern 41, the display area 40 side and the second glass substrate It is characterized by having at least one or more gaps 43 for electrical insulation by dividing into 27 edge portions 27a side.
Since the dummy pattern provided on the second substrate can be the same as the dummy pattern provided on the first substrate described above, description thereof is omitted here.
Note that the first wiring pattern on the opposing first substrate is a scanning matrix and a scanning electrode in a liquid crystal panel having a passive matrix structure or an active matrix structure using a TFD element (Thin Film Diode). It means the routing wiring connected to the electrode. Further, in a liquid crystal panel having an active matrix structure using TFT elements (Thin Film Transistors), it means a divided or patterned common electrode.

(4) Two-terminal nonlinear element A TFD element is typical as a two-terminal nonlinear element.
Such a TFD element preferably has a sandwich structure composed of an element first electrode (first metal film), an insulating film, and an element second electrode (second metal film). Here, examples of the first metal film and the second metal film include tantalum (Ta), titanium (Ti), aluminum (Al), and chromium (Cr). The insulating film is preferably configured by anodizing such a metal material. Examples thereof include tantalum oxide (Ta ₂ O ₅ ) and aluminum oxide (Al ₂ O ₃ ).
The active element exhibits diode switching characteristics in positive and negative directions and becomes conductive when a voltage equal to or higher than a threshold is applied between both terminals of the first metal film and the second metal film.
In addition, regarding the configuration of the two-terminal nonlinear element, the two TFD elements are arranged such that the second glass is interposed between the first wiring pattern or the second wiring pattern (data line) and the pixel electrode. It is preferable that the first TFD element and the second TFD element are formed on the substrate and have opposite diode characteristics.
Furthermore, although the first TFD element and the second TFD element are provided with separate second metal films, it is preferable that the insulating film and the first metal film are respectively common.
In addition to the TFD element, a non-linear element such as a TFT (thin film transistor) element can also be used.

(5) Pixel electrode Moreover, it is preferable to form the pixel electrode which consists of transparent conductors, such as ITO (indium tin oxide), on a 2nd board | substrate as a pixel electrode.
And it is preferable to provide the slit as an orientation control means in the edge part of a pixel electrode. This is because by providing such a slit, it is possible to control the alignment direction of the liquid crystal molecules and obtain an image display excellent in viewing angle characteristics.

[Second Embodiment]
According to a second embodiment of the present invention, a first substrate and a second substrate that are arranged to face each other with a sealant interposed therebetween, and an electro-optical material sandwiched between the first substrate and the second substrate The first substrate has a first wiring pattern that spans the display region and the non-display region, and the second substrate corresponds to the second wiring pattern and the shape of the first wiring pattern. Thus, the electro-optical device manufacturing method includes a dummy pattern formed in a non-display area and spaced apart from the second wiring pattern.
The method further includes a step of forming at least one gap for dividing the dummy pattern.
Hereinafter, an embodiment of a method for manufacturing an electro-optical device according to the present invention will be described in detail with reference to FIGS. 11 to 15, taking as an example a method for manufacturing a liquid crystal display device having an active matrix structure having TFD elements. explain.

1. Structure As an electro-optical device to be manufactured, a liquid crystal display device using a first substrate and a second substrate as its counter substrate will be described as an example. Regarding the configurations of the first substrate and the second substrate, Since it is the same as that of 1st Embodiment, description here is abbreviate | omitted.

(1) Manufacture of first substrate (color filter substrate) (1) -1 Formation of color filter As shown in FIG. 11 (a), on the first glass substrate 13, a portion corresponding to an image display region In addition, it is preferable to sequentially form the coloring layer 16 and the light shielding layer 18.
The colored layer 16 is formed by applying a photosensitive resin made of a transparent resin or the like in which a coloring material such as a pigment or a dye is dispersed on the first glass substrate 13 or the like, and sequentially performing pattern exposure and development processing thereon. It can also be formed by applying. In addition, when forming the colored layer 16 of several colors in an array, the said process is repeated for every color.
Moreover, it is preferable to form the light shielding layer 18 by superimposing the colored layers 16. Alternatively, it is also preferable to form the light shielding layer 18 using a black material such as carbon.

(1) -2 Formation of Protective Film Next, as shown in FIG. 11B, a translucent protective layer 215 </ b> X is formed on the entire surface of the first substrate 12. This translucent protective layer 215X can be made of, for example, an acrylic resin, an epoxy resin, an imide resin, a fluororesin, or the like. These resins are applied onto a substrate in an uncured state having fluidity, and are cured by appropriate means such as drying, photocuring, and thermosetting. As a coating method, a spin coating method, a printing method, or the like can be used.
Next, the light-transmitting protective layer 215X is patterned by using a photolithography technique to form a protective film 215 limited to the image display region as shown in FIG. Through this step, it is preferable that the translucent material is omitted from the translucent protective layer 215X from the area other than the image display area, that is, from the almost same area as the area disposed outside the sealant 230 shown in FIG. . This is because the cell gap can be made uniform by carrying out in this way.

(1) -3 Formation of First Wiring Pattern Next, as shown in FIG. 11 (d), a transparent conductive material made entirely of a transparent conductive material such as ITO (indium tin oxide) is formed on the protective film 215. It is preferable to form the layer 19X. The transparent conductive layer 19X can be formed by sputtering, for example. Then, it is preferable to pattern the transparent conductive layer 19X using a photolithography technique to form the first wiring pattern 19 as shown in FIG.
More specifically, first, as shown in FIGS. 12A to 12B, a transparent conductive layer 19X made of a transparent conductive material is formed on the entire first glass substrate 13 including the protective film 215. . Here, as shown in FIG. 12B, it is also preferable to form a base layer 81 made of Ta ₂ O ₅ , SiO ₂ or the like in advance when the transparent conductive layer 19X is laminated. This is because the crystallinity and the like of the formed transparent conductive layer 19X can be made uniform, and the adhesion of the transparent conductive layer to the protective film and the glass substrate can be improved.
Next, as shown in FIG. 12C, after applying a predetermined resist material 86 'on the transparent conductive layer 19X, as shown in FIG. 12D, a predetermined mask pattern 87 is applied and exposed. Then, by developing, as shown in FIG. 12E, a resist material 86 is applied and then patterned into a predetermined shape. Then, as shown in FIG. 12F, after the etching process is performed on the transparent conductive material 19X, the resist material is peeled off by exposure and development again.
In this way, it is preferable to form the first wiring pattern 19 having a predetermined pattern (not shown) as shown in FIGS. 12 (g) and 11 (d). It has been found that the first wiring pattern formed in this way generates little static electricity. In addition, FIG.11 (d) has shown the figure which looked at the XX cross section of FIG.12 (g) in the arrow direction.

(1) -4 Formation of Dummy Pattern Next, although not shown, it is preferable to form a dummy pattern including a gap as described in the first embodiment in a non-display area on the first substrate. At this time, it is preferable to perform the dummy pattern forming step simultaneously with the step of forming the first wiring pattern.
This is because the dummy pattern can be formed efficiently without increasing the number of steps by carrying out in this way. Accordingly, it is possible to efficiently obtain an electro-optical device that makes the background color uniform and causes less electrostatic breakdown in the first wiring pattern.

(2) Manufacture of second substrate (element substrate) (2) -1 Formation of routing wiring The data electrode and routing wiring as the second wiring pattern are formed on the second glass substrate by sputtering or the like. A conductive metal material, for example, chromium, aluminum, titanium, molybdenum, etc. is generally formed on the entire surface to a thickness of 50 to 300 nm, and then patterned using a photolithography technique or an etching method. It is preferably formed by.
Hereinafter, a detailed description will be given with reference to FIGS.

First, as shown in FIG. 13A, a conductive metal film material 26 'is laminated on the entire surface of a glass substrate 27 by sputtering or the like. At this time, although not shown, since the adhesion between the glass substrate and the metal film material can be improved, an insulation made of tantalum oxide (Ta ₂ O ₅ ) or the like is formed on the glass substrate 27 of the second substrate 14. It is also preferable to form a film.
Next, as shown in FIG. 13B, a resist material 82 is applied over the entire surface. After that, as shown in FIG. 13C, for example, only a position corresponding to the opening 83b is irradiated with light through a photomask 83 having an opening 83b, and after pattern exposure, FIG. Development is performed to leave a resist 82 'only at a location corresponding to the opening 83b of the mask.
Next, as shown in FIG. 14A, after removing the conductive metal film material 26 ′ in the portion not covered with the resist 25 ′ by an etching method, as shown in FIG. 14B, The resist 25 'is removed to form a patterned data electrode 26 and the like.
Next, as shown in FIG. 14C, the oxide film 23 is preferably formed by oxidizing the surface of the data electrode 26 and the like by an anodic oxidation method. More specifically, after immersing the glass substrate 27 on which the data electrode 26 and the like are formed in an electrolytic solution such as a citric acid solution, a predetermined voltage is applied between the electrolytic solution and the data electrode 26 and the like. Thus, it is preferable to oxidize the surface of the data electrode 26 and the like. Although the thickness of the oxide film 23 can be changed as appropriate, it is usually preferable to set the thickness within a range of 10 to 50 nm.

  The data electrode and the lead wiring formed as described above are the data electrode and the lead wiring on the side where the external connection terminal is not provided, like the end of the first wiring pattern on the first substrate. It is preferable to form the film by controlling the position of the end portion. Note that details of the end positions of the data electrodes and the like can be the same as the end positions of the first wiring pattern described in the first embodiment, and thus description thereof is omitted here.

(2) -2 Formation of TFD element Next, although not shown, after the element first electrode is formed by the same method as the method for forming the data electrode and the like, the element is again formed on the element first electrode by sputtering or the like. It is preferable to form a metal film over the entire surface and pattern it using a photolithography method to form a second electrode to form a TFD element.

(2) -3 Formation of Pixel Electrode Next, although not shown, after forming a transparent conductive layer made of a transparent conductive material such as ITO (indium tin oxide or the like) by sputtering or the like, using a photolithography technique. It is preferable to form the pixel electrode 20 by patterning as shown in FIG.

(2) -4 Formation of Dummy Pattern Next, although not shown, it is preferable to form a dummy pattern including a gap as formed on the first substrate in a non-display area on the second substrate. At this time, since the dummy pattern can be efficiently formed without increasing the number of steps, it is preferable to perform the dummy pattern forming step simultaneously with the step of forming the pixel electrode.

(3) Bonding Step (3) -1 Printing of Sealing Material Next, as shown in FIG. 15A, on the first substrate, the sealing material 230 mainly composed of an epoxy resin or the like is subjected to screen printing or It is preferably formed by patterning with a dispenser so as to surround the display region.
At this time, with respect to the printing position of the sealing material, as shown in FIG. 15A, printing is performed with the outer edge 230a of the sealing material 230 and the end portion 19a of the first wiring pattern 19 substantially matched. Is preferred. The reason is that by printing a sealing material at such a position, when the first substrate and the second substrate are bonded to each other through a pre-bake process described later, the end portion of the first wiring pattern is attached. This is because it is easy to be present inside the outer edge of the sealing material. Moreover, it is because the contact area of a sealing material and a 1st wiring pattern can be ensured comparatively large. Furthermore, since the end portion of the first wiring pattern can be used as a guide for alignment, it is possible to facilitate the printing positioning of the sealing material. Therefore, it is possible to reliably establish conduction between the first wiring pattern and the routing wiring on the second substrate, and it is possible to effectively prevent the occurrence of electrostatic breakdown due to the contact of the metal frame or foreign matter.
In this embodiment, the sealing material is formed on the first substrate, but printing may be performed on the second substrate.

(3) -2 Prebaking Next, it is preferable that the first glass substrate on which the sealing material patterned in a predetermined shape is printed is subjected to low temperature treatment (prebaking) to evaporate the solvent in the sealing material.
At this time, it is preferable to pre-bake under reduced pressure under a temperature condition lower than the curing temperature of the sealing material. For example, it is preferable to carry out under a temperature condition of about 35 to 70 ° C. and a pressure condition of 50 to 90 kPa. This is because by performing the pre-baking process under such conditions, the solvent remaining in the sealing material can be efficiently evaporated and the sealing material can be sufficiently degassed. Therefore, after the electro-optical device is manufactured, display unevenness due to bubbles in the sealing material, disconnection, and the like can be effectively prevented.
Further, when the seal material is pre-baked, as shown in FIG. 15B, the viscosity of the seal material 230 decreases, the width of the seal material 230 increases, and the outer edge 230a of the seal material 230 It is preferable that the first wiring pattern 19 is located outside the end 19a. By carrying out in this way, when the first substrate and the second substrate are bonded together, it becomes easy for the end portion of the first wiring pattern to exist inside the outer edge of the sealing material. Because. Moreover, it is because the contact area of a sealing material and a 1st wiring pattern can be enlarged.

(3) -3 Crimping Then, after the second substrate is overlapped and bonded to the first substrate on which the sealing material is laminated, the first substrate and the first substrate are bonded to each other with heating. It is preferable to bond two substrates. At this time, as shown in FIG. 15C, the predetermined end portions of the first wiring pattern 19, the data electrode 26, and the routing wiring 28 are present inside the outer edge 230 a of the sealing material 230. It is preferable to bond them together.
In this way, when the first substrate and the second substrate are bonded together, the first wiring pattern on the first substrate and the external connection terminal on the second substrate are not provided. The data electrode and the lead wiring can be prevented from being exposed to the outside. Accordingly, it is possible to obtain an electro-optical device that can effectively prevent the occurrence of electrostatic breakdown due to contact with a metal frame or a foreign object.

(4) Injection of liquid crystal and arrangement of polarizing plate Next, after injecting an electro-optical material (liquid crystal) into the space formed by the first substrate and the second substrate and into the inner part of the sealing material, It is preferable to seal with a sealing material or the like. For example, a normally black mode liquid crystal display device can be obtained by disposing polarizing plates on the outer surfaces of the first substrate and the second substrate and controlling the alignment direction of the liquid crystal molecules.

[Third Embodiment]
As a third embodiment according to the present invention, an electronic apparatus including the liquid crystal display device according to the first embodiment will be specifically described.

FIG. 16 is a schematic configuration diagram showing the overall configuration of the electronic apparatus of the present embodiment. This electronic apparatus includes a liquid crystal panel 200 and a control unit 1200 for controlling the liquid crystal panel 200. In FIG. 16, the liquid crystal panel 200 is conceptually divided into a panel structure 200 </ b> A and a drive circuit 200 </ b> B composed of a semiconductor element (IC) or the like. The control unit 1200 preferably includes a display information output source 1210, a display processing circuit 1220, a power supply circuit 1230, and a timing generator 1240.
The display information output source 1210 includes a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), a storage unit such as a magnetic recording disk or an optical recording disk, and a tuning unit that tunes and outputs digital image signals. It is preferable that the display information is supplied to the display information processing circuit 1220 in the form of an image signal of a predetermined format based on various clock signals generated by the timing generator 1240.

The display information processing circuit 1220 includes various known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, and executes processing of input display information. It is preferable to supply the image information to the driving circuit 200B together with the clock signal CLK. Further, the driving circuit 200B preferably includes a scanning line driving circuit, a data line driving circuit, and an inspection circuit. The power supply circuit 1230 has a function of supplying a predetermined voltage to each of the above-described components.
In the electronic apparatus of this embodiment, a liquid crystal display device in which a dummy pattern including a predetermined gap is formed in a non-display area on the first substrate and the second substrate is used. Therefore, the background color can be made uniform, and the occurrence of electrostatic breakdown can be reduced and an electronic device having excellent reliability can be obtained.

  According to the present invention, by forming a dummy pattern including a predetermined gap, it is possible to make the background color uniform and prevent the occurrence of electrostatic breakdown, and electro-optical using liquid crystal molecules as an electro-optical material Devices and electronic devices such as mobile phones and personal computers, liquid crystal televisions, viewfinder type / monitor direct view type video tape recorders, car navigation devices, pagers, electrophoresis devices, electronic notebooks, calculators, word processors, work Stations, videophones, POS terminals, electronic devices with touch panels, devices using electron-emitting devices (FED: Field Emission Display, SCEED: Surface-Conduction Electron-Emitter Display), inorganic or organic electroluminescence devices, plasma display devices Can be used for etc.

In addition, the electro-optical device and the electronic apparatus according to the invention are not limited to the illustrated examples described above, and it is needless to say that various changes can be made without departing from the gist of the invention. For example, the liquid crystal panel shown in each of the above embodiments has an active matrix structure having a TFD element, but an active matrix type electro-optical device using other active elements (active elements) such as TFTs (thin film transistors). It can also be applied to a passive matrix electro-optical device.
Further, the liquid crystal panel of the above embodiment has a so-called COG type structure, but a flexible wiring board or a TAB board is connected to a liquid crystal panel that is not a structure in which a semiconductor element (IC chip) is directly mounted, for example, a liquid crystal panel. It may be configured as described above.

(A) is a schematic plan view showing a main part of a first substrate used in the electro-optical device according to the first embodiment of the present invention, and (b) is an electric diagram of the first embodiment according to the present invention. It is a schematic plan view which shows the principal part of the 2nd board | substrate used for an optical apparatus. 1 is a schematic perspective view showing an external appearance of a liquid crystal panel constituting an electro-optical device according to a first embodiment of the invention. It is a schematic sectional drawing which shows a liquid crystal panel typically. It is a figure provided in order to demonstrate arrangement | positioning of a 1st wiring pattern and a dummy pattern. (A)-(d) is a figure provided in order to demonstrate the shape of the gap | interval of a dummy pattern. (A)-(b) is a figure provided in order to demonstrate arrangement | positioning of the gap | interval of a dummy pattern. It is a figure provided in order to demonstrate the distance of the dummy pattern containing a gap | interval, a wiring pattern, and the edge part of a board | substrate. It is a figure provided in order to demonstrate the ratio of the line width of a dummy pattern with respect to the pitch space | interval of a dummy pattern. (A)-(c) is a figure provided in order to demonstrate the conduction | electrical_connection position of the routing wiring on a 2nd board | substrate, and the 1st wiring pattern on a 1st board | substrate, respectively. It is a figure provided in order to demonstrate the example of wiring of the 2nd board | substrate used for the electro-optical apparatus of a passive matrix type structure. (A)-(d) is sectional drawing which shows the manufacturing process for forming a 1st board | substrate (the 1). (A)-(g) is sectional drawing which shows the manufacturing process for forming a 1st board | substrate (the 2). (A)-(d) is sectional drawing which shows the manufacturing process for forming a 2nd board | substrate (the 1). (A)-(d) is sectional drawing which shows the manufacturing process for forming a 2nd board | substrate (the 2). (A)-(c) is a top view which shows the manufacturing process of an electro-optical apparatus. It is a block diagram which shows schematic structure of embodiment of the electronic device which concerns on this invention. It is a top view which shows the structure of the dummy pattern of the conventional electro-optical apparatus.

Explanation of symbols

10: electro-optical device (liquid crystal display device), 12: first substrate (color filter substrate), 13: first glass substrate, 13a: edge of substrate, 14: second substrate (element substrate), 27 : Second glass substrate, 19: first wiring pattern (scanning electrode), 19a: end of first wiring pattern, 26: second wiring pattern (data electrode), 26a: end of data electrode, 28, 29: second wiring pattern (leading wiring), 28a: end of leading wiring, 41: dummy pattern, 43: gap, 200: liquid crystal panel, 230: sealing material, 230a: outer edge of sealing material

Claims (9)

An electro-optical device comprising: a first substrate and a second substrate arranged to face each other via a sealing material; and an electro-optical material sandwiched between the first substrate and the second substrate. The first substrate includes a first wiring pattern that spans a display region and a non-display region, and the second substrate corresponds to the second wiring pattern and the shape of the first wiring pattern. A dummy pattern formed in a display area and spaced apart from the second wiring pattern, and at least one gap for dividing the dummy pattern, wherein the gap is provided with the sealing material. An electro-optical device is provided in a region inside the region. The second wiring pattern is formed over a display area and a non-display area, and the first substrate is formed in the non-display area corresponding to the shape of the second wiring pattern, and The electro-optical device according to claim 1, further comprising a dummy pattern spaced apart from the first wiring pattern, and at least one gap that divides the dummy pattern. The width (A) of the gap between the dummy patterns in the second substrate is made smaller than a distance (B) between the dummy pattern and the second wiring pattern. The electro-optical device according to 1 or 2 . Wherein the dummy pattern, wherein the opposite sides to the second wiring pattern, an electro-optic according to any one of claims 1 to 3, characterized in that arranged in parallel with said second wiring pattern apparatus. Wherein the dummy pattern, the electro-optical device according to any one of claims 1 to 4, characterized in that to equalize the areas of the divided respective dummy pattern pieces substantially. In the second substrate, there are a plurality of regions where the line widths of the dummy patterns are different, and the ratio of the line width of the dummy pattern to the pitch interval of the dummy patterns in each region is substantially equal. The electro-optical device according to any one of claims 1 to 5 . The width (A) of the gap between the dummy patterns is set to a value within the range of 10 to 20 μm, and the distance (B) between the dummy pattern and the second wiring pattern is within the range of 30 to 100 μm. the electro-optical device according to any one of claims 1 to 6, characterized in that the values. And the dummy pattern, any one of claim 1 to 7, characterized in that a value within the range distance (C) of 0.3~3mm between the edge of the second substrate, The electro-optical device according to 1. An electronic apparatus comprising the electro-optical device according to any one of claims 1-8.

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