JP2003045952A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2003045952A5 JP2003045952A5 JP2002142168A JP2002142168A JP2003045952A5 JP 2003045952 A5 JP2003045952 A5 JP 2003045952A5 JP 2002142168 A JP2002142168 A JP 2002142168A JP 2002142168 A JP2002142168 A JP 2002142168A JP 2003045952 A5 JP2003045952 A5 JP 2003045952A5
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- layer
- ceramic sprayed
- mounting apparatus
- sprayed layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims 11
- 239000000113 methacrylic resin Substances 0.000 claims 7
- 238000000034 method Methods 0.000 claims 7
- 238000004519 manufacturing process Methods 0.000 claims 6
- 239000007788 liquid Substances 0.000 claims 4
- 239000002994 raw material Substances 0.000 claims 4
- 230000002093 peripheral effect Effects 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 1
- 229910010293 ceramic material Inorganic materials 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002142168A JP2003045952A (ja) | 2001-05-25 | 2002-05-16 | 載置装置及びその製造方法並びにプラズマ処理装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001-156489 | 2001-05-25 | ||
| JP2001156489 | 2001-05-25 | ||
| JP2002142168A JP2003045952A (ja) | 2001-05-25 | 2002-05-16 | 載置装置及びその製造方法並びにプラズマ処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003045952A JP2003045952A (ja) | 2003-02-14 |
| JP2003045952A5 true JP2003045952A5 (enExample) | 2005-09-15 |
Family
ID=26615694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002142168A Pending JP2003045952A (ja) | 2001-05-25 | 2002-05-16 | 載置装置及びその製造方法並びにプラズマ処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003045952A (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004082007A1 (ja) | 2003-03-12 | 2004-09-23 | Tokyo Electron Limited | 半導体処理用の基板保持構造及びプラズマ処理装置 |
| US20050042881A1 (en) * | 2003-05-12 | 2005-02-24 | Tokyo Electron Limited | Processing apparatus |
| JP4369765B2 (ja) * | 2003-07-24 | 2009-11-25 | 京セラ株式会社 | 静電チャック |
| JP4421874B2 (ja) * | 2003-10-31 | 2010-02-24 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| KR100697557B1 (ko) * | 2005-02-24 | 2007-03-21 | 주식회사 에이디피엔지니어링 | 플라즈마 처리장치 및 온도조절판 제조방법 |
| JP2007005740A (ja) * | 2005-06-23 | 2007-01-11 | Creative Technology:Kk | 静電チャック電位供給部の構造とその製造及び再生方法 |
| JP4942471B2 (ja) * | 2005-12-22 | 2012-05-30 | 京セラ株式会社 | サセプタおよびこれを用いたウェハの処理方法 |
| JP5518071B2 (ja) * | 2008-08-19 | 2014-06-11 | ラム リサーチ コーポレーション | 静電チャック用エッジリング |
| JP6497248B2 (ja) * | 2015-07-13 | 2019-04-10 | 住友電気工業株式会社 | ウェハ保持体 |
| US11911863B2 (en) | 2019-09-11 | 2024-02-27 | Creative Technology Corporation | Attachment and detachment device |
| KR102387231B1 (ko) * | 2020-07-17 | 2022-04-15 | 와이엠씨 주식회사 | 정전척의 유전체 층의 봉공처리방법 |
| KR102626584B1 (ko) * | 2020-12-24 | 2024-01-18 | 도카로 가부시키가이샤 | 정전 척 및 처리 장치 |
| JP7619862B2 (ja) * | 2021-03-30 | 2025-01-22 | 東京エレクトロン株式会社 | 基板載置台の研磨方法及び基板処理装置 |
| JP7698590B2 (ja) * | 2022-01-19 | 2025-06-25 | 日本特殊陶業株式会社 | 保持装置および保持装置の製造方法 |
| CN115295459A (zh) * | 2022-08-26 | 2022-11-04 | 苏州众芯联电子材料有限公司 | 静电卡盘加热件制作工艺、静电卡盘制作工艺、静电卡盘 |
-
2002
- 2002-05-16 JP JP2002142168A patent/JP2003045952A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2003045952A5 (enExample) | ||
| KR102811708B1 (ko) | 증착된 표면 피쳐들을 가진 기판 지지 어셈블리 | |
| KR101981766B1 (ko) | 정전기 척 aln 유전체 수리 | |
| KR102098926B1 (ko) | 반도체 적용을 위한 희토류 옥사이드 기반 내침식성 코팅 | |
| KR101831665B1 (ko) | 금속 본딩된 보호 층을 갖는 기판 지지 조립체 | |
| TWI434817B (zh) | Ceramic - metal joint and its preparation method | |
| KR101932429B1 (ko) | 내 플라즈마 코팅막, 이의 제조 방법 및 내 플라즈마성 부품 | |
| US20180108517A1 (en) | Coating architecture for plasma sprayed chamber components | |
| KR20070037516A (ko) | 기판 테이블, 그 제조 방법 및 플라즈마 처리 장치 | |
| TW201917816A (zh) | 半導體製造裝置用元件及其製法 | |
| JP2006080314A5 (enExample) | ||
| JP2010129845A (ja) | 静電チャック及びその製造方法 | |
| CN102105621A (zh) | 耐等离子的陶瓷涂覆体 | |
| JP2003264223A (ja) | 静電チャック部品および静電チャック装置およびその製造方法 | |
| CN1864255A (zh) | 具有非烧结aln的静电吸盘及其制备方法 | |
| JP3613472B2 (ja) | プラズマエッチング装置用部材及びその製造方法 | |
| JP2003264169A5 (enExample) | ||
| JP2014120764A (ja) | ドライエッチング反応室チャンバの上部電極およびその製造方法 | |
| JP2002134481A (ja) | 真空処理装置用部材 | |
| JP4064835B2 (ja) | 静電チャック及びその製造方法 | |
| JPH01240243A (ja) | 電極およびその製造方法 | |
| US12087613B2 (en) | Wafer placement table and method of manufacturing the same | |
| JP2004047653A5 (enExample) | ||
| JPH09246238A (ja) | プラズマエッチング用平板状基台およびその製造方法 | |
| TW502368B (en) | Electrostatic chuck and method for manufacturing the same |