JP2003031806A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2003031806A5 JP2003031806A5 JP2002116977A JP2002116977A JP2003031806A5 JP 2003031806 A5 JP2003031806 A5 JP 2003031806A5 JP 2002116977 A JP2002116977 A JP 2002116977A JP 2002116977 A JP2002116977 A JP 2002116977A JP 2003031806 A5 JP2003031806 A5 JP 2003031806A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- mos transistor
- transistor according
- polycrystalline silicon
- conductivity type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002116977A JP2003031806A (ja) | 2001-05-09 | 2002-04-19 | Mosトランジスタ及びその製造方法 |
| US10/143,192 US6905928B2 (en) | 2001-05-09 | 2002-05-09 | MOS transistor apparatus and method of manufacturing same |
| US10/642,036 US20040145001A1 (en) | 2001-05-09 | 2003-08-15 | MOS transistor devices and method of manufacturing same |
| US10/641,908 US6870224B2 (en) | 2001-05-09 | 2003-08-15 | MOS transistor apparatus and method of manufacturing same |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001-138520 | 2001-05-09 | ||
| JP2001138520 | 2001-05-09 | ||
| JP2002116977A JP2003031806A (ja) | 2001-05-09 | 2002-04-19 | Mosトランジスタ及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003031806A JP2003031806A (ja) | 2003-01-31 |
| JP2003031806A5 true JP2003031806A5 (https=) | 2005-09-22 |
Family
ID=26614809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002116977A Pending JP2003031806A (ja) | 2001-05-09 | 2002-04-19 | Mosトランジスタ及びその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (3) | US6905928B2 (https=) |
| JP (1) | JP2003031806A (https=) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7589029B2 (en) | 2002-05-02 | 2009-09-15 | Micron Technology, Inc. | Atomic layer deposition and conversion |
| US7335552B2 (en) * | 2002-05-15 | 2008-02-26 | Raytheon Company | Electrode for thin film capacitor devices |
| US7105425B1 (en) * | 2002-05-16 | 2006-09-12 | Advanced Micro Devices, Inc. | Single electron devices formed by laser thermal annealing |
| KR100493018B1 (ko) * | 2002-06-12 | 2005-06-07 | 삼성전자주식회사 | 반도체 장치의 제조방법 |
| JP3742906B2 (ja) | 2003-05-08 | 2006-02-08 | シャープ株式会社 | 半導体装置の製造方法 |
| US6784103B1 (en) * | 2003-05-21 | 2004-08-31 | Freescale Semiconductor, Inc. | Method of formation of nanocrystals on a semiconductor structure |
| JP4456341B2 (ja) * | 2003-06-30 | 2010-04-28 | 株式会社日立国際電気 | 半導体装置の製造方法および基板処理装置 |
| JP2005079310A (ja) * | 2003-08-29 | 2005-03-24 | Semiconductor Leading Edge Technologies Inc | 半導体装置及びその製造方法 |
| US7296247B1 (en) * | 2004-08-17 | 2007-11-13 | Xilinx, Inc. | Method and apparatus to improve pass transistor performance |
| US8461628B2 (en) * | 2005-03-18 | 2013-06-11 | Kovio, Inc. | MOS transistor with laser-patterned metal gate, and method for making the same |
| JP4958408B2 (ja) * | 2005-05-31 | 2012-06-20 | 三洋電機株式会社 | 半導体装置 |
| US7927948B2 (en) | 2005-07-20 | 2011-04-19 | Micron Technology, Inc. | Devices with nanocrystals and methods of formation |
| US7989290B2 (en) | 2005-08-04 | 2011-08-02 | Micron Technology, Inc. | Methods for forming rhodium-based charge traps and apparatus including rhodium-based charge traps |
| US7575978B2 (en) | 2005-08-04 | 2009-08-18 | Micron Technology, Inc. | Method for making conductive nanoparticle charge storage element |
| JP2007165401A (ja) * | 2005-12-09 | 2007-06-28 | Nec Electronics Corp | 半導体装置および半導体装置の製造方法 |
| US7605030B2 (en) | 2006-08-31 | 2009-10-20 | Micron Technology, Inc. | Hafnium tantalum oxynitride high-k dielectric and metal gates |
| US20080272437A1 (en) * | 2007-05-01 | 2008-11-06 | Doris Bruce B | Threshold Adjustment for High-K Gate Dielectric CMOS |
| US8367506B2 (en) | 2007-06-04 | 2013-02-05 | Micron Technology, Inc. | High-k dielectrics with gold nano-particles |
| US20090065816A1 (en) * | 2007-09-11 | 2009-03-12 | Applied Materials, Inc. | Modulating the stress of poly-crystaline silicon films and surrounding layers through the use of dopants and multi-layer silicon films with controlled crystal structure |
| JP4892579B2 (ja) * | 2009-03-30 | 2012-03-07 | 株式会社日立国際電気 | 半導体装置の製造方法 |
| US8598020B2 (en) * | 2010-06-25 | 2013-12-03 | Applied Materials, Inc. | Plasma-enhanced chemical vapor deposition of crystalline germanium |
| JP5624425B2 (ja) * | 2010-10-14 | 2014-11-12 | 株式会社東芝 | 半導体装置及びその製造方法 |
| US10367089B2 (en) * | 2011-03-28 | 2019-07-30 | General Electric Company | Semiconductor device and method for reduced bias threshold instability |
| US9698019B2 (en) * | 2014-03-14 | 2017-07-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | N-work function metal with crystal structure |
| JP6560112B2 (ja) * | 2015-12-09 | 2019-08-14 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2544752B1 (fr) * | 1983-04-25 | 1985-07-05 | Commissariat Energie Atomique | Procede de croissance amorphe d'un corps avec cristallisation sous rayonnement |
| US4670063A (en) * | 1985-04-10 | 1987-06-02 | Eaton Corporation | Semiconductor processing technique with differentially fluxed radiation at incremental thicknesses |
| US5424244A (en) * | 1992-03-26 | 1995-06-13 | Semiconductor Energy Laboratory Co., Ltd. | Process for laser processing and apparatus for use in the same |
| US5444302A (en) * | 1992-12-25 | 1995-08-22 | Hitachi, Ltd. | Semiconductor device including multi-layer conductive thin film of polycrystalline material |
| KR100362751B1 (ko) * | 1994-01-19 | 2003-02-11 | 소니 가부시끼 가이샤 | 반도체소자의콘택트홀및그형성방법 |
| US5809211A (en) * | 1995-12-11 | 1998-09-15 | Applied Materials, Inc. | Ramping susceptor-wafer temperature using a single temperature input |
| TW315493B (en) * | 1996-02-28 | 1997-09-11 | Tokyo Electron Co Ltd | Heating apparatus and heat treatment apparatus |
| KR100297498B1 (ko) * | 1996-11-20 | 2001-10-24 | 윤덕용 | 마이크로파를이용한다결정박막의제조방법 |
| US6066547A (en) * | 1997-06-20 | 2000-05-23 | Sharp Laboratories Of America, Inc. | Thin-film transistor polycrystalline film formation by nickel induced, rapid thermal annealing method |
| JP4810712B2 (ja) * | 1997-11-05 | 2011-11-09 | ソニー株式会社 | 不揮発性半導体記憶装置及びその読み出し方法 |
| JP3523093B2 (ja) * | 1997-11-28 | 2004-04-26 | 株式会社東芝 | 半導体装置およびその製造方法 |
| US6114258A (en) * | 1998-10-19 | 2000-09-05 | Applied Materials, Inc. | Method of oxidizing a substrate in the presence of nitride and oxynitride films |
| US6437403B1 (en) * | 1999-01-18 | 2002-08-20 | Sony Corporation | Semiconductor device |
| US6288943B1 (en) * | 2000-07-12 | 2001-09-11 | Taiwan Semiconductor Manufacturing Corporation | Method for programming and reading 2-bit p-channel ETOX-cells with non-connecting HSG islands as floating gate |
| KR100425934B1 (ko) * | 2000-12-29 | 2004-04-03 | 주식회사 하이닉스반도체 | 실리콘-게르마늄막 형성 방법 |
| US6670263B2 (en) * | 2001-03-10 | 2003-12-30 | International Business Machines Corporation | Method of reducing polysilicon depletion in a polysilicon gate electrode by depositing polysilicon of varying grain size |
| JP3997731B2 (ja) * | 2001-03-19 | 2007-10-24 | 富士ゼロックス株式会社 | 基材上に結晶性半導体薄膜を形成する方法 |
-
2002
- 2002-04-19 JP JP2002116977A patent/JP2003031806A/ja active Pending
- 2002-05-09 US US10/143,192 patent/US6905928B2/en not_active Expired - Fee Related
-
2003
- 2003-08-15 US US10/641,908 patent/US6870224B2/en not_active Expired - Fee Related
- 2003-08-15 US US10/642,036 patent/US20040145001A1/en not_active Abandoned
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2003031806A5 (https=) | ||
| US7619253B2 (en) | Crystalline semiconductor thin film, method of fabricating the same, semiconductor device, and method of fabricating the same | |
| US6559036B1 (en) | Semiconductor device and method of manufacturing the same | |
| EP2500947B1 (en) | A method of manufacturing a semiconductor device | |
| TWI223834B (en) | Device including an epitaxial nickel silicide on (100) Si or stable nickel silicide on amorphous Si and a method of fabricating the same | |
| KR100656495B1 (ko) | 박막트랜지스터 및 그 제조 방법 | |
| US8809133B2 (en) | Crystalline semiconductor thin film, method of fabricating the same, semiconductor device, and method of fabricating the same | |
| US6905928B2 (en) | MOS transistor apparatus and method of manufacturing same | |
| US7732870B2 (en) | Eliminating metal-rich silicides using an amorphous Ni alloy silicide structure | |
| JPH1187243A5 (https=) | ||
| JP2000114527A (ja) | 半導体装置及びその作製方法 | |
| KR100618614B1 (ko) | 플렉서블 금속 기판 상의 실리콘 박막 형성 방법 | |
| CN100536075C (zh) | 制造薄膜晶体管的方法 | |
| JP7659708B1 (ja) | 半導体素子の製造方法及び半導体素子 | |
| WO2001026143A1 (en) | Method of manufacturing semiconductor device | |
| US6451637B1 (en) | Method of forming a polycrystalline silicon film | |
| US7723197B2 (en) | Method of manufacturing semiconductor device and semiconductor device | |
| TWI359460B (en) | A method of fabricating a polycrystalline semicond | |
| TW200839959A (en) | Method for fabricating semiconductor device | |
| JP3958345B2 (ja) | 半導体装置の製造方法 | |
| JP4670076B2 (ja) | 酸化物薄膜用Pt単結晶電極薄膜の製造方法 | |
| JP2007115786A (ja) | 半導体基板の製造方法及び半導体基板 | |
| TWI636495B (zh) | 多晶半導體薄膜、薄膜電晶體及其製造方法 | |
| CN118056489A (zh) | 结晶化积层结构体的制造方法 | |
| Bouhadda et al. | Gold‐induced crystallization of amorphous germanium deposited on glass: Bilayer and multilayer films |