JP2003017827A - Mounting structure of high-frequency circuit component mounting board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent high-frequency signals from leaking out partially and a parasitic capacitance from occurring in a high-frequency board and deteriorating its transmission characteristics, when the high-frequency signals are propagated from an external circuit board to the high-frequency board. SOLUTION: A high-frequency board is equipped with a first line conductor 2, a first grounding conductor 3 formed on the top surface of a dielectric board 1, a second line conductor 4, a second grounding conductor 5 formed on the under surface of the dielectric board 1, and a through-conductor 6 and a grounding through conductor 7 formed inside the dielectric board 1. A circuit board 11 is equipped with a connection line conductor 10, which is formed on its top surface to transmit high frequency signals. The above high-frequency board is arranged on the circuit board 11 so as to make the second line conductor 4 confront the connection line conductor 10, while being kept in parallel with it; a metal terminal 12 which is arranged on the peripheral part of the dielectric board 1 and positions its one end 0.2 to 5.0 mm apart from the through-conductor 6 is interposed between the second line conductor 4 and the connection conductor 10; the connection line conductor 10 is positioned outside of the halfway point of the metal terminal 12 and electrically connected to it.

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention
It relates to the mounting structure of the mounting board, such as a microphone
Equipped with semiconductor element for high frequency from b-wave band to millimeter-wave band
For mounting high-frequency circuit component mounting boards to external devices
The present invention relates to a mounting structure suitable for the case. [0002] Conventionally, high frequency signals in the MHz band and the GHz band have been used.
For high frequency circuits or high frequencies such as wireless communication equipment using
-Frequency circuit with high-frequency circuit components such as semiconductor elements
For component mounting boards (hereinafter referred to as high-frequency boards)
Is a high-frequency circuit such as a semiconductor device mounted on a high-frequency substrate
The high frequency of the component and the circuit board on which the high frequency board is mounted
Circuit for electrical transmission of high-frequency signals.
Line conductor for transmitting high-frequency signals
Formed on each side and electrically connected to each other with through conductors
are doing. In addition, gold is used for the line conductor on the lower surface of the high-frequency substrate.
Metal terminals are attached to form an input / output section for high-frequency signals.
You. The metal terminals that serve as input / output sections for high-frequency signals are
The mounted high-frequency board is mounted on the circuit board and
Connect metal terminals attached to the lower surface of the circuit board to the circuit board
Electrical connection to the line conductor for
Will be used after being mounted on a circuit board. An example of such a high-frequency board mounting structure is
Then, for example, a mounting structure as shown in an enlarged sectional view of a main part in FIG.
There is structure. The figure shows a high-frequency substrate with a high-frequency semiconductor element.
A storage package (hereinafter referred to as a semiconductor package)
The case where it comprises is shown. In the semiconductor package shown in FIG.
A high-frequency semiconductor element S is mounted on the upper surface of the substrate 21.
The mounting portion 21a is formed and from the vicinity of the mounting portion 21a.
A first line conductor 22 is formed in the outer peripheral direction, and
A first same-plane ground conductor 23 is provided on both sides of the line conductor 22 of FIG.
Is formed. Further, on the lower surface of the dielectric substrate 21,
From a portion facing one end on the outer peripheral side of the first line conductor 22
A second line parallel to the first line conductor 22 toward the outer peripheral end
A conductor 24 is formed. On both sides of the second line conductor 24,
Two coplanar ground conductors 25 are formed. Also, the dielectric base
Inside the plate 21, a first line conductor 22 and a second line
Penetration for electrically connecting opposing ends of the road conductor 24
Conductor 26 and first coplanar ground conductor 23 and second
Ground through conductor electrically connecting the same plane ground conductor 25
(Not shown) are formed. The semiconductor element mounted on the mounting portion 21a
The child S is connected by a conductive connecting member 28 such as a bonding wire.
Electrically connected to the first line conductor 22, and the mounting portion 21a
A lid (not shown) is attached to the upper surface of the
After tightly sealing, this semiconductor package is
Upper surface of dielectric substrate 29 made of a dielectric material such as a mix
The circuit board 31 on which the connecting line conductor 30 is formed
2 line conductors 24 and connection line conductors 30 in parallel.
And electrically connect the metal terminals 32 between them.
I have. In this example, the lower surface of the dielectric substrate 29 is
Side ground conductor 33 and upper surface side ground conductor 34 formed on the upper surface
And the upper surface side ground conductor 34 and the second same surface ground conductor 25
Are electrically connected. According to such a semiconductor package,
Providing first and second coplanar ground conductors 23, 25
As a result, the first line conductor 22 and the bonding wire
To compensate for discontinuity with the conductive connecting member 28,
Improved isolation of the second line conductors 22 and 24
Can be made. In addition, the ground through conductor has high impedance.
It is possible to supplement the capacitance component to the through conductor 26 of the dance.
To prevent impedance mismatch in the through conductor 26.
Is possible. As a result, the semiconductor element S and the outside
Impedance in the electrical connection to the electrical circuit
Of the high-frequency signal transmission characteristics.
Semiconductor package with low reflection loss
It can be. In the above conventional high-frequency board mounting structure,
Is the shortest transmission line for high-frequency signals
In order to reduce the
One end of the metal terminal 32 overlaps the lower end of the through conductor 26 and is connected.
I have. A connection line for connecting the metal terminal 32
Is the conductor 30 positioned just below the through conductor 26 of the metal terminal 32?
From the outer peripheral side of the dielectric substrate. [0009] However, the above-mentioned problem is not solved.
End of a metal terminal 32 serving as an input / output unit for such a high-frequency signal
Of a high-frequency board that is connected to a through conductor 26
In the structure, the high-frequency signal C shown in FIG.
29 from the connecting line conductor 30 via the metal terminal 32.
When propagating to the second line conductor 24 of the frequency substrate,
The direction of travel of the tip of the child 32 overlapping the through conductor 26
Is changed upward by 90 ° and propagated to the through conductor 26.
However, the traveling direction of the high-frequency signal C is changed by 90 °.
When the signal is propagated, the part of the high-frequency signal C
As shown by D, go straight without changing the direction of travel by 90 °
As a result, components leaking from the connection line conductor 30 occur. Special
In addition, the high-frequency signal has a higher relative dielectric constant than a substance with a lower relative dielectric constant.
The circuit board 31 and the high-frequency
Than the air layer with a relative dielectric constant of 1 between
Dielectric such as alumina ceramics with high electric conductivity of about 9-10
Leaked into the dielectric substrate 29 of the circuit board 31 made of a body
Would. As a result, the transmission characteristics of the high-frequency signal deteriorate.
There was a problem that. Also, in the above-described mounting structure of the high-frequency substrate,
The second line conductor 24 and the gold
Conductive composed of the metal terminal 32 and the connection line conductor 30
And a first and second coplanar ground conductors 23, 25
Effective dielectric constant between the
And the first and second coplanar ground conductors 23,
And 25 easily. Reduce this parasitic capacitance
Otherwise, the resonance point of the electric circuit will drop,
Transmission characteristics were sometimes impaired. Accordingly, the present invention has been made in view of the above-mentioned conventional problems.
It is completed, and its purpose is to
Leakage of high-frequency signals when propagating from the substrate to the high-frequency substrate
Of high-frequency substrates with little deterioration of transmission characteristics
It is to provide a mounting structure. A high-frequency circuit component according to the present invention.
The mounting structure of the mounting board has high-frequency circuit components mounted on the top surface
A dielectric substrate on which a mounting portion to be formed is formed;
High-frequency waves formed on the upper surface from the vicinity of the mounting part toward the outer periphery
A first line conductor for transmitting a signal and the first line conductor
A first coplanar ground conductor formed on both sides of the
A pair of one end on the outer peripheral side of the first line conductor on the lower surface of the body substrate
The first line conductor from the part facing
A second line for transmitting the high-frequency signal formed in parallel
Conductor and second line conductors formed on both sides of the second line conductor.
A coplanar ground conductor, formed inside the dielectric substrate,
The opposite ends of the first and second line conductors are electrically connected to each other.
A through conductor for pneumatic connection and the first and second
And a ground through conductor for electrically connecting the same plane ground conductor.
The high frequency circuit component mounting board
Circuit board on which connection line conductors for transmitting signals are formed
The second line conductor and the connection line conductor are parallel to each other.
, One end between which is 0.2 to
The outer peripheral side of the dielectric substrate is located at a distance of 5.0 mm.
And the connecting line conductor sandwiching the metal terminal
Is positioned on the outer peripheral side from the middle of the metal terminal to electrically connect
Connected. According to the present invention, the high-frequency substrate having the above-described structure is mounted on an upper surface.
On which a connecting line conductor for transmitting high-frequency signals is formed
The second line conductor and the connecting line conductor are placed in parallel on the circuit board.
Opposite, one end between the conductor and 0.2-5.0m from the through conductor
m placed on the outer peripheral side of the dielectric substrate at a distance of m
And the connecting line conductor in the middle of the metal terminal.
From the outside and electrically connected,
Frequency signal from the line conductor for connection on the circuit board via the metal terminal
And propagated to the second line conductor of the high-frequency substrate,
The frequency signal is first transmitted to the second line conductor via the metal terminal.
And then at the connection between the second line conductor and the through conductor
The direction of travel is changed upward by 90 ° and propagates through conductors
Will be done. As a result, a high frequency band of about 1 to 40 GHz
Part of the high-frequency signal is
Can be suppressed from leaking into the dielectric substrate of the circuit board,
-It is possible to minimize dance mismatch
Become. Also, part of the high-frequency signal goes straight through the second line conductor.
High-frequency signal is not
With a higher dielectric constant than the air layer existing between
On the high-frequency substrate side, which is made of an electric conductor and has a through conductor
Flow in. As a result, the high-frequency signal is
It does not leak out to the board etc.
The properties are good. The connection line conductor is provided on the upper surface of the circuit board.
Formed so that it is located from the middle of the metal terminal to the outer periphery
The second line that is electrically connected
Conductor consisting of a track conductor, a metal terminal, and a connection line conductor.
An assembly of electrical conductors, a first co-planar ground conductor and a second
It is possible to reduce the effective dielectric constant between
Wear. Therefore, the above-mentioned conductor assembly and the first same-plane ground
Parasitic between the conductor and the second coplanar ground conductor
The capacity can be reduced. This effective permittivity is
The relative dielectric constant between one end of the metal terminal and the lower end of the through conductor is close to 1.
Small due to the presence of cool air.
As a result, lowering of the resonance frequency can be suppressed,
Transmission characteristics can be improved. Furthermore, impedance
Mismatch can be reduced and extremely transmission
A high-frequency board mounting structure with little deterioration in characteristics
it can. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The mounting structure of the high-frequency substrate of the present invention will be described.
This will be described in detail below. 1 and 2 show the present invention, respectively.
1 shows an example of an embodiment of a mounting structure of a high-frequency substrate.
FIGS. 3 and 4 are a main part sectional view and a main part enlarged sectional view, respectively.
Are top and bottom views of the high-frequency board shown in FIG. 1, respectively.
You. FIG. 5 is a sectional view of a connection portion of the mounting structure shown in FIG.
It is. In the examples of FIGS. 1 and 5, the semiconductor package is used.
High-frequency boards as circuit boards to circuit boards such as motherboards
This shows the structure when implemented. In these figures, reference numeral 1 denotes a dielectric substrate, 1
a is a mounting on which a semiconductor element S such as an IC or an LSI is mounted.
Part, 2 is a first line conductor, 3 is a first coplanar ground conductor, 4
Is a second line conductor, 5 is a second ground conductor, and 6 is a through conductor.
The conductor 7 is a ground through conductor, and these are semiconductor conductors.
A cage is configured. Reference numeral 8 denotes the semiconductor element S and the first
Conductivity of a bonding wire or the like connecting the line conductor 2
It is a connection member. 9 is a dielectric substrate, 10 is a connection line conductor.
And 10a are a lower surface of one end of the metal terminal 12 and a dielectric substrate.
9 and the circuit board 11 is composed of these.
And the second line conductor 4 of the semiconductor package.
The connection line conductor 10 of the circuit board 11 and the metal terminal 1
2 to connect the semiconductor package.
It is mounted on the road board 11. In the present invention, the height of the gap 10a is
0.01 to 0.1 mm is good. If less than 0.01mm
In this case, the occurrence of parasitic capacitance cannot be reduced,
Such a failure due to a decrease in the resonance frequency is likely to occur.
You. Also, if it exceeds 0.1 mm, the contact
It becomes difficult to form the connection line conductor 10. More preferred
Preferably, it is 0.01 to 0.06 mm. The thickness of the metal terminal 12 is 0.05 to 0.8 m
m is less than 0.05 mm, the dielectric substrate 1 and the circuit
The gap with the substrate 11 becomes smaller, and high frequency signals may leak.
There is a potential. Also, when the thickness exceeds 0.8 mm, the metal terminal 12
Side and the wiring conductors of the dielectric substrate 1 and the circuit board 11
The parasitic capacitance generated between the wiring conductors will increase.
In addition, problems due to a decrease in the resonance frequency are likely to occur.
The lower surface of the dielectric substrate 9 of the circuit board 11 is in contact with the lower surface.
A ground conductor 13 and an upper surface side ground conductor 17 are formed on the upper surface,
The upper ground conductor 17 and the second ground conductor 5 are electrically connected to each other.
Connected. A concave portion A is formed at the center of the upper surface of the dielectric substrate 1.
And the mounting portion 1a is provided on the bottom surface of the concave portion A.
Has a dielectric substrate 1 as a flat plate, and a mounting portion 1a
May be formed. The dielectric substrate 1 of the present invention includes a semiconductor element S
A support for supporting aluminum oxide (Al
_Two O _Three ) Sintered body, aluminum nitride (AlN) sintered body
Body, mullite (3Al _Two O _Three ・ 2SiO _Two ) Quality sintered body, charcoal
Silicon nitride (SiC) sintered body, silicon nitride (Si _Three N _Four ) Quality grill
Made of dielectric material such as cement, glass ceramics, etc.
A concave portion A for accommodating the semiconductor element S is provided at the center of the surface.
In a plan view such as a substantially square shape. And the bottom of the recess A
On the surface, the semiconductor element S is made of an adhesive such as brazing material, resin, glass, etc.
It is housed and fixed through. The dielectric substrate 1 is made of, for example, aluminum oxide.
Aluminum oxide, silicon oxide
Organic binder suitable for raw material powders such as silicon oxide and calcium oxide
, Slurry by adding and mixing solvent, plasticizer, dispersant, etc.
This is replaced with a well-known method such as the doctor blade method.
With ceramic green sheet by molding method
After that, this ceramic green sheet is properly punched
And a plurality of sheets are laminated in a predetermined order, and a reducing atmosphere
Manufactured by firing at a temperature of about 1600 ° C
You. The mounting portion 1a is provided on the upper surface of the dielectric substrate 1.
Approximately 0.1 to 1 mm in width from the vicinity to the outer periphery
The first line conductor 2 and the lower surface of the first line conductor 2
A first line extending from a portion facing one end on the peripheral side to an outer peripheral end;
A second line conductor having a width of about 0.1 to 1 mm in parallel with the conductor 2
The body 4 is formed. Also, the inside of the dielectric substrate 1
Electrically connects the first line conductor 2 and the second line conductor 4 to each other.
A through conductor 6 to be connected is formed. These first,
The second line conductors 2 and 4 and the through conductor 6 are semiconductor elements.
For electrically connecting each electrode of S to an external electric circuit.
Functions as an electrical circuit. Note that the first and second line conductors 2
The width of 4 indicates the frequency of the high-frequency signal to be propagated or the semiconductor package.
Set by the size of the cage. The dielectric substrate 1 has a first line on its upper surface.
A first ground conductor 3 on the same plane on both sides of the
The second ground conductor 5 is formed on both sides of the second line conductor 4.
Has been established. The inside of the dielectric substrate 1 is as shown in FIG.
Thus, the first coplanar ground conductor 3 and the second coplanar ground conductor 5
And a ground through conductor 7 for electrically connecting
You. First coplanar ground conductor 3, second coplanar ground conductor 5
Is the conductive property of the first line conductor 2 and the bonding wire etc.
Compensation for discontinuity with the connecting member 8 or the first line conductor
Improved isolation between 2 and 2nd line conductor 4
It has a function to make Further, the ground through conductor 7 has a high
Compensating the capacitance component for the impedance through conductor 6
And the impedance mismatch in the through conductor 6 can be reduced.
It is possible to prevent. As a result, the semiconductor element S and
Impedance in electrical connection with circuit board 11
Of the transmission characteristics of high-frequency signals
Semiconductor package with low reflection loss that can suppress deterioration
Di. In the present embodiment, the first
The one-plane ground conductor 3 and the second same-plane ground conductor 5
Surrounding the second line conductor 4 and the second line conductor 4, respectively.
Is formed continuously and integrally so that
The grounding state can be obtained. The first and second line conductors 2 and 4 of the present invention
Conductor 6, first and second same-plane ground conductors 3, 5 and contact
The ground through conductor 7 is made of tungsten (W), molybdenum (M
o), copper (Cu), silver (Ag), etc.
It is formed from a conductive material. For example, W metallization
If appropriate, add appropriate organic binder and solvent to W powder
The W paste obtained by mixing is used as a through conductor 6, a ground through conductor.
7 is a dielectric substrate 1 in which a through hole is previously formed.
Ceramic green sheet with a well-known screen
Print coating or filling in a predetermined pattern by printing method,
Firing this together with the ceramic green sheet
From the upper surface to the lower surface of the dielectric substrate 1
It is formed on the pattern. These first and second line conductors 2, 4 and
And the first and second coplanar ground conductors 3, 5 are exposed.
Excellent corrosion resistance of nickel, gold, etc.
Metal that has excellent bonding with connecting members such as
It is better to have a thickness of 1-20 μm by plating method
No. In that case, the first and second line conductors 2 and 4 and the
The first ground conductors 3 and 5 are oxidized and corroded.
And the first and second lines
Conductors 2 and 4 and first and second same-plane ground conductors 3 and 5
Strong and easy connection with bonding wires and solder
Can be done. The semiconductor element mounted on the mounting portion 1a
S is connected to a conductive connection member 8 such as a bonding wire.
1 is electrically connected to the line conductor 2 and the upper part of the mounting portion 1a is
A cover body (see FIG.
(Not shown) to hermetically seal the semiconductor element S,
This semiconductor package transmits high frequency signals to the top surface
On the circuit board 11 on which the connection line conductor 10 is formed,
The two line conductors 4 and the connection line conductor 10 are opposed in parallel.
One end between the through conductor 6 and 0.2 to 5.0 mm
Metal disposed on the outer peripheral side of the dielectric substrate 1 at a distance
The terminal line 12 is sandwiched and the connection line conductor 10 is connected to a metal terminal.
12 and located on the outer circumference side for electrical connection.
And the semiconductor element S inside the semiconductor package and the circuit
An external electric circuit of the substrate 11 is electrically connected. The circuit board 11 is likened to the dielectric board 1
If it is made of aluminum oxide sintered body, aluminum oxide
Suitable for raw material powders such as, silicon oxide and calcium oxide
Organic binder, solvent, plasticizer, dispersant, etc.
To form a slurry,
-Ceramic grits by sheet forming method such as blade method.
And green sheet, and then this ceramic green
The sheet is properly punched and tungsten
Conductive paste made of high melting point metal powder such as
Cloth, filling, stacking multiple sheets in a predetermined order, in a reducing atmosphere
Manufactured by firing at a temperature of about 1600 ° C
You. The circuit board 11 is joined to the upper surface thereof
From just under the outer peripheral portion of the dielectric substrate 1 to the outer peripheral end portion of the circuit board 11
, The connecting line conductor 10 and the top-side ground conductor 1
7 and the lower surface side ground conductor 13 are formed. For connection
The width of the line conductor 10 is about 0.1 to 1 mm. The empty space on the lower surface on one end side of the metal terminal 12
The length of the gap 10 a is such that the metal terminal 12 is outside the dielectric substrate 1.
About 1/3 of the length protruding (exposed) from the peripheral end
A degree or higher is preferred. If less than 1/3, the gap 10a
To improve the transmission characteristics of high-frequency signals by providing
Is difficult to develop. Furthermore, the length of the gap 10a
Means that the metal terminals 12 project from the outer peripheral end of the dielectric substrate 1
It is more preferable that the length is about 1/2 or more of the existing length. Furthermore, the sky
The length of the gap 10a is determined from one end of the metal terminal 12 to the dielectric base.
It is preferable that the length be equal to or less than the length reaching the outer peripheral end of the plate 1. So
Exceeding the length will have no effect on reducing parasitic capacitance,
In addition, the stability of bonding of the dielectric substrate 1 is impaired.
You. The gap 10a is fired as described above.
A part of the connecting line conductor 10 thus formed is
Alumina powder etc. is blown at high speed by the well-known sandblasting method.
Can also be formed by attaching and removing
Also formed by using a conventionally known etching method
can do. According to these methods, the gap 10a
Length can be adjusted arbitrarily, including other factors
Also if the length must be changed
The gap 10a can be provided with an appropriate length. In the present invention, the metal terminal 12 is
One end is located on the outer peripheral side at a distance of 0.2 to 5 mm from the through conductor 6.
So that the other end is connected to the connecting line conductor 10.
Place. The distance between one end of the metal terminal 12 and the through conductor 6 is
If it is less than 0.2 mm, the distance between the through conductor 6 and the metal terminal 12 will be small.
Since the separation is short, the distance from the metal terminal 12 to the second line conductor 4 is small.
The propagation of the high-frequency signal B (FIG. 1) is likely to be incomplete.
A part of the high-frequency signal B is propagated to the second line conductor 4.
Leaks straight into the dielectric substrate 9 of the circuit board 11
It becomes. Further, the distance between one end of the metal terminal 12 and the through conductor 6 is set.
If the separation exceeds 5 mm, one end of the metal terminal 12 and the through conductor
6, the distance of the second line conductor 4 becomes longer,
Peedance increases. As a result, the transmission of the high-frequency signal B
Transmission loss tends to increase. Further, the thickness of the metal terminal 12 is 0.05 to
It is preferably 0.8 mm. Less than 0.05mm
If there is, the gap between the dielectric substrate 1 and the circuit board 11 is extremely narrow.
High frequency signal B passes through the second line conductor 4
When propagating to the conductor 6 with its traveling direction changed by 90 °
The high-frequency signal leaked to the dielectric substrate 1
1 to the circuit board 11 via the air layer between the circuit board 11
It is easy to leak. When it exceeds 0.8 mm, it is shown in FIG.
Thus, the capacitance between the side surface of the metal terminal 12 and the dielectric substrate 1
Quantitative component and dielectric of side surface of metal terminal 12 and circuit board 11
The capacitance component between itself and the body substrate 9 increases,
Mismatch easily occurs. The width of the metal terminal 12 is about 0.1 to 1 mm.
Degree, the metal terminal 12 and the second line conductor 4, the connection line
From the viewpoint of connectivity with the road conductor 10, the second line conductor 4,
It is preferable that the width is smaller than the width of the connection line conductor 10. The metal terminal 12 is made of iron (Fe)-
Nickel (Ni) -cobalt (Co) alloy or Fe-Ni
Punching and etching of plate materials such as alloys
Is formed into a predetermined shape. In addition, the metal terminal 12
Between the second line conductor 4 and the connection line conductor 10
Is performed as follows. First, for example, metal terminals
12 between the second line conductor 4 and silver (Ag) -copper (Cu)
The first brazing material, such as wax, is sandwiched and abutted.
Heating them to a temperature above the melting point of the first brazing material.
The metal terminal 12 and the second line conductor 4 are brazed.
You. Thereafter, the metal terminal 1 bonded to the second line conductor 4
2 between the connecting line conductor 10 on the upper surface of the circuit board 11.
A brazing material such as Ag-Cu brazing material having a lower melting point than the first brazing material.
Abutting the brazing material, and make sure that these
By heating to a temperature below the melting point of the first brazing material.
The metal terminal 12, the second line conductor 4, and the connection line
The conductor 10 is brazed. The metal terminal 12 has Ni,
Plating method for metal such as Au which has good conductivity and excellent corrosion resistance
Should be applied to a thickness of 1 to 20 μm,
Oxidative corrosion of the metal terminal 12 can be effectively prevented.
In addition, the metal terminal 12 and the second line conductor 4 or the connecting wire
Good electrical connection with the road conductor 10 can be achieved. The connecting line conductor 10 is about 0.1 to 1 mm.
It is a range of degrees, and metallization of W, Mo, Cu, Ag etc.
It is formed from a conductive material made of a body. For example, W
If it is made of tarized, suitable organic binder for W powder,
The W paste obtained by adding and mixing the solvent is
Conventionally, a ceramic green sheet serving as a dielectric substrate 9 is
Print and apply in a predetermined pattern by a well-known screen printing method
Then, a ceramic green sheet serving as a dielectric substrate 9 is formed.
By firing together with the upper surface of the dielectric substrate 9,
From the lower surface to the lower surface. In this embodiment, as shown in FIG.
The second ground conductor layer 5 on the lower surface of the dielectric substrate 1
The conductive substrate 15 on which the terminals 14 are integrally formed is made of a brazing material.
Can also be joined via an adhesive such as This conductivity
The substrate 15 is made of an Fe—Ni—Co alloy, an Fe—Ni alloy, or the like.
Of, for example, an Fe-Ni-Co alloy
If this ingot (mass) is rolled or stamped
Method by applying a well-known metalworking method such as
It is formed into a shape. Further, as shown in FIG.
The power supply connection terminal 16 can be attached to the lower surface. Thus, according to the present invention, the upper and lower surfaces
Path conductor is formed, and a through conductor connecting between the two line conductors is formed.
High frequency substrate such as semiconductor package that has
When mounting on a circuit board with line conductors for
Good signal impedance mismatch and good transmission characteristics
A favorable mounting structure is possible. The present invention is limited to the above-described embodiment.
It is not intended to depart from the spirit and scope of the present invention.
Various changes are possible. In the above embodiment, the present invention
Semiconductor package containing semiconductor element with high frequency substrate
Was explained in the case of application to
It can be applied to high frequency substrates used for roads etc.
Not even. In the above-described embodiment, the metal terminal 1
2 is a metal solid such as an Fe-Ni-Co alloy or an Fe-Ni alloy.
The metal terminals 12 are made of solder, brazing material, etc.
The present invention can be applied to such cases. According to the present invention, a high frequency circuit component is mounted on the upper surface.
Substrate on which the mounting part to be formed is formed, and on the dielectric substrate
A high-frequency signal formed on the surface from the vicinity of the
A first line conductor for transmission and on both sides of the first line conductor
The formed first coplanar ground conductor and the lower surface of the dielectric substrate
From the portion facing the outer circumferential end of the first line conductor.
High circumference formed parallel to the first line conductor toward the peripheral end
Second line conductor for transmitting a wave signal and second line conductor
A second ground conductor formed on both sides of the
Opposing the first and second line conductors formed inside the plate
Through conductor for electrically connecting the ends of
And a ground conductor for electrically connecting the second coplanar ground conductor.
A high-frequency substrate with a conductor and a high-frequency signal
The circuit board on which the connecting line conductor for transmission is formed is provided with a second
Line conductor and connection line conductor
One end at a distance of 0.2 to 5.0 mm from the through conductor
And sandwich the metal terminals arranged on the outer peripheral side of the dielectric substrate
In both cases, place the line conductor for connection from the middle of the metal terminal to the outer peripheral side.
High frequency signal
From the line conductor for connection on the circuit board via the metal terminal
When propagated to the second line conductor of the plate, the high frequency signal
First, it is propagated to the second line conductor via the metal terminal,
The direction of travel at the connection between the second line conductor and the through conductor
Is changed upward by 90 ° and propagated to the through conductor.
Become. As a result, in the high frequency band of about 1 to 40 GHz
Part of the high-frequency signal from the connection line conductor to the circuit board
Can be suppressed from leaking into the dielectric substrate of
Mismatching can be minimized. In addition, high-frequency signals
A part of the signal goes straight through the second line conductor and tries to leak
High-frequency signals exist between the circuit board and the high-frequency board.
Through conductor made of a dielectric material with a higher dielectric constant than the air layer
Flows into the high-frequency substrate side where is formed. as a result,
High frequency signal leaks out to dielectric board of circuit board etc.
And the transmission characteristics of high-frequency signals are good.
You. The connection line conductor is provided on the upper surface of the circuit board.
Being formed from the middle of the metal terminal to the outer periphery
From the second line conductor and the metal end which are electrically connected
Of conductors composed of conductors and connecting line conductors
And a first coplanar ground conductor and a second coplanar ground conductor
And the effective dielectric constant between them can be reduced. Therefore, the conductive
A body assembly, a first coplanar ground conductor and a second coplanar surface
It is possible to reduce the parasitic capacitance generated with the ground conductor.
it can. This effective permittivity is determined by the
Make sure that air with a relative dielectric constant close to 1 exists between
And smaller. As a result, low resonance frequency
Lowering can be suppressed, and high-frequency transmission characteristics are improved. Further
To reduce the impedance mismatch
Of high-frequency substrates with extremely small degradation of transmission characteristics
Mounting structure.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 shows an example of an embodiment of a mounting structure of a high-frequency board according to the present invention, and is a cross-sectional view of a main part showing a mounting structure in which a high-frequency board as a semiconductor package is mounted on an external circuit board. It is. FIG. 2 is an enlarged sectional view of a main part of FIG. FIG. 3 is a top view of the high-frequency substrate of FIG. 1; FIG. 4 is a bottom view of the high-frequency substrate of FIG. 1; FIG. 5 is a sectional view of a connection portion of a metal terminal in the mounting structure of FIG. 1; FIG. 6 is a cross-sectional view of a main part showing a structure for mounting a conventional high-frequency board on an external circuit board. [Description of Signs] 1: Dielectric substrate 1a: Mounting section 2: First line conductor 3: First same plane ground conductor 4: Second line conductor 5: Second same plane ground conductor 6: Through conductor 7: ground through conductor 9: dielectric substrate 10: connection line conductor 10a: gap 11: circuit board 12: metal terminal S: semiconductor element

Claims (1)

Claims: 1. A dielectric substrate having an upper surface on which a mounting portion for mounting a high-frequency circuit component is formed, and a high-frequency signal formed on the upper surface of the dielectric substrate from the vicinity of the mounting portion to an outer peripheral direction. And a first ground conductor formed on both sides of the first line conductor transmitting the first line conductor, and a lower end of the dielectric substrate opposed to one end on the outer peripheral side of the first line conductor. A second line conductor for transmitting the high-frequency signal formed in parallel with the first line conductor from a portion to be formed toward an outer peripheral end portion, and second same face contact formed on both sides of the second line conductor A ground conductor, a through conductor formed inside the dielectric substrate and electrically connecting opposing ends of the first and second line conductors, and the first and second same-plane ground conductors. Having a ground through conductor for electrical connection The filter circuit component mounting board, the circuit board connecting line conductor is formed to transmit a high-frequency signal to the upper surface, the second
Metal terminal arranged on the outer peripheral side of the dielectric substrate with the line conductor of the above and the connection line conductor facing each other in parallel, with one end located at a distance of 0.2 to 5.0 mm from the through conductor. And mounting the high-frequency circuit component mounting substrate, wherein the connection line conductor is positioned on the outer periphery side of the metal terminal and electrically connected.