JP2003017529A5 - - Google Patents

Download PDF

Info

Publication number
JP2003017529A5
JP2003017529A5 JP2002124475A JP2002124475A JP2003017529A5 JP 2003017529 A5 JP2003017529 A5 JP 2003017529A5 JP 2002124475 A JP2002124475 A JP 2002124475A JP 2002124475 A JP2002124475 A JP 2002124475A JP 2003017529 A5 JP2003017529 A5 JP 2003017529A5
Authority
JP
Japan
Prior art keywords
semiconductor
conductive paste
electrodes
semiconductor device
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002124475A
Other languages
English (en)
Japanese (ja)
Other versions
JP3782753B2 (ja
JP2003017529A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002124475A priority Critical patent/JP3782753B2/ja
Priority claimed from JP2002124475A external-priority patent/JP3782753B2/ja
Publication of JP2003017529A publication Critical patent/JP2003017529A/ja
Publication of JP2003017529A5 publication Critical patent/JP2003017529A5/ja
Application granted granted Critical
Publication of JP3782753B2 publication Critical patent/JP3782753B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002124475A 2001-04-25 2002-04-25 半導体装置の製造方法および半導体装置 Expired - Fee Related JP3782753B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002124475A JP3782753B2 (ja) 2001-04-25 2002-04-25 半導体装置の製造方法および半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-127778 2001-04-25
JP2001127778 2001-04-25
JP2002124475A JP3782753B2 (ja) 2001-04-25 2002-04-25 半導体装置の製造方法および半導体装置

Publications (3)

Publication Number Publication Date
JP2003017529A JP2003017529A (ja) 2003-01-17
JP2003017529A5 true JP2003017529A5 (enExample) 2005-08-25
JP3782753B2 JP3782753B2 (ja) 2006-06-07

Family

ID=26614200

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002124475A Expired - Fee Related JP3782753B2 (ja) 2001-04-25 2002-04-25 半導体装置の製造方法および半導体装置

Country Status (1)

Country Link
JP (1) JP3782753B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007012965A (ja) * 2005-07-01 2007-01-18 Nec Tokin Corp Ｉｃチップの実装方法
WO2007031298A1 (de) * 2005-09-14 2007-03-22 Htc Beteiligungs Gmbh Flip-chip-modul und verfahren zum erzeugen eines flip-chip-moduls
JP5119678B2 (ja) * 2007-02-20 2013-01-16 富士通株式会社 実装構造、接続部材の製造方法、および半導体装置
JP5104687B2 (ja) * 2008-09-19 2012-12-19 日本電気株式会社 接合シート及び電子回路装置並びに製造方法
JP6623941B2 (ja) * 2016-06-09 2019-12-25 株式会社デンソー 多層基板の製造方法
JP7448828B2 (ja) * 2021-09-30 2024-03-13 日亜化学工業株式会社 配線基板、発光装置及びそれらの製造方法

Similar Documents

Publication Publication Date Title
US5841192A (en) Injection molded ball grid array casing
US8547701B2 (en) Electronics module and method for manufacturing the same
CN106164680B (zh) 触点间距转换器、电检测装置以及用于制造触点间距转换器的方法
US7992291B2 (en) Method of manufacturing a circuit board
JP2008277750A (ja) 電子素子内蔵印刷回路基板の製造方法
US7247508B2 (en) Semiconductor device with intermediate connector
CN108235562A (zh) 用于将部件嵌入部件承载件中的透气性临时载带
JP4228677B2 (ja) 回路基板
WO2000033375A1 (fr) Couche conductrice anisotrope, puce a semi-conducteur et procede de conditionnement
CN105590914B (zh) 电子元件封装结构及制作方法
CN103748977A (zh) 部件安装印刷电路基板及其制造方法
JP2018125349A5 (enExample)
CN206558490U (zh) 覆盖金属层填充孔或槽的封装结构
JP2003017529A5 (enExample)
US8093712B2 (en) Monolithic molded flexible electronic assemblies without solder and methods for their manufacture
US20090280647A1 (en) Semiconductor through-electrode forming method
US20160234946A1 (en) Process for the production of an electronic card having an external connector and such an external connector
CN104981103A (zh) 用于制造三维电路装置的方法和电路装置
CN111384005B (zh) 微电子封装体、倒装工艺及其应用、微电子器件
JP2870533B1 (ja) 半導体装置およびその製造方法
JP3782753B2 (ja) 半導体装置の製造方法および半導体装置
TWI550728B (zh) 封裝結構及其製造方法
US6982387B2 (en) Method and apparatus to establish circuit layers interconnections
JP3763962B2 (ja) チップ部品のプリント配線基板への搭載方法
CN104254197B (zh) 电路板及其制作方法