JP2002535843A - 改良された研磨パッド、及び、これに関連する方法 - Google Patents

改良された研磨パッド、及び、これに関連する方法

Info

Publication number
JP2002535843A
JP2002535843A JP2000594606A JP2000594606A JP2002535843A JP 2002535843 A JP2002535843 A JP 2002535843A JP 2000594606 A JP2000594606 A JP 2000594606A JP 2000594606 A JP2000594606 A JP 2000594606A JP 2002535843 A JP2002535843 A JP 2002535843A
Authority
JP
Japan
Prior art keywords
polishing
pad
layer
polishing layer
abrasive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000594606A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002535843A5 (https=
Inventor
デイヴィット ビー． ジェームス
リー メルボルン クック
アーサー リチャード ベーカー
Original Assignee
ロデール ホールディングス インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ロデール ホールディングス インコーポレイテッド filed Critical ロデール ホールディングス インコーポレイテッド
Publication of JP2002535843A publication Critical patent/JP2002535843A/ja
Publication of JP2002535843A5 publication Critical patent/JP2002535843A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
    • B24D13/12—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery comprising assemblies of felted or spongy material, e.g. felt, steel wool, foamed latex
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B24D13/147—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face comprising assemblies of felted or spongy material; comprising pads surrounded by a flexible material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2000594606A 1999-01-21 2000-01-21 改良された研磨パッド、及び、これに関連する方法 Pending JP2002535843A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11654799P 1999-01-21 1999-01-21
US60/116,547 1999-01-21
PCT/US2000/001495 WO2000043159A1 (en) 1999-01-21 2000-01-21 Improved polishing pads and methods relating thereto

Publications (2)

Publication Number Publication Date
JP2002535843A true JP2002535843A (ja) 2002-10-22
JP2002535843A5 JP2002535843A5 (https=) 2006-12-28

Family

ID=22367847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000594606A Pending JP2002535843A (ja) 1999-01-21 2000-01-21 改良された研磨パッド、及び、これに関連する方法

Country Status (6)

Country Link
US (2) US6354915B1 (https=)
EP (1) EP1161322A4 (https=)
JP (1) JP2002535843A (https=)
KR (1) KR100585480B1 (https=)
CN (1) CN1137013C (https=)
WO (1) WO2000043159A1 (https=)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006233199A (ja) * 2005-01-31 2006-09-07 Toray Ind Inc 改善された研磨パッドの製造方法
JP2007073796A (ja) * 2005-09-08 2007-03-22 Nihon Micro Coating Co Ltd 研磨パッド及びその製造方法並びに研磨方法
JP2007531275A (ja) * 2004-03-23 2007-11-01 キャボット マイクロエレクトロニクス コーポレイション 低表面エネルギーｃｍｐパッド
JP2010023134A (ja) * 2008-07-16 2010-02-04 Fujibo Holdings Inc 研磨パッド
JP2012000745A (ja) * 2010-05-19 2012-01-05 Toyo Tire & Rubber Co Ltd 研磨パッド
US8094456B2 (en) 2006-01-10 2012-01-10 Toyo Tire & Rubber Co., Ltd. Polishing pad
US8148441B2 (en) 2005-03-08 2012-04-03 Toyo Tire & Rubber Co., Ltd. Polishing pad and manufacturing method thereof
JP2012114454A (ja) * 2000-05-27 2012-06-14 Rohm & Haas Electronic Materials Cmp Holdings Inc 化学機械平坦化用の研磨パッド
US8304467B2 (en) 2005-05-17 2012-11-06 Toyo Tire & Rubber Co., Ltd. Polishing pad
US8303372B2 (en) 2006-08-31 2012-11-06 Toyo Tire & Rubber Co., Ltd. Polishing pad
US8309466B2 (en) 2005-08-30 2012-11-13 Toyo Tire & Rubber Co., Ltd. Polishing pad
WO2013089240A1 (ja) * 2011-12-16 2013-06-20 東洋ゴム工業株式会社 研磨パッド
US8865785B2 (en) 2007-03-28 2014-10-21 Toyo Tire & Rubber Co., Ltd. Polishing pad
KR101464800B1 (ko) * 2007-08-13 2014-11-24 쓰리엠 이노베이티브 프로퍼티즈 컴파니 코팅된 연마 라미네이트 디스크 및 그의 제조 방법
US8993648B2 (en) 2006-08-28 2015-03-31 Toyo Tire & Rubber Co., Ltd. Polishing pad

Families Citing this family (79)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6592443B1 (en) 2000-08-30 2003-07-15 Micron Technology, Inc. Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
SE0003550L (sv) * 2000-10-03 2002-04-04 Pergo Ab Förfarande för framställning av ytelement
US6688956B1 (en) 2000-11-29 2004-02-10 Psiloquest Inc. Substrate polishing device and method
US7059946B1 (en) 2000-11-29 2006-06-13 Psiloquest Inc. Compacted polishing pads for improved chemical mechanical polishing longevity
US6706383B1 (en) 2001-11-27 2004-03-16 Psiloquest, Inc. Polishing pad support that improves polishing performance and longevity
US6579604B2 (en) 2000-11-29 2003-06-17 Psiloquest Inc. Method of altering and preserving the surface properties of a polishing pad and specific applications therefor
US20050266226A1 (en) * 2000-11-29 2005-12-01 Psiloquest Chemical mechanical polishing pad and method for selective metal and barrier polishing
US6684704B1 (en) * 2002-09-12 2004-02-03 Psiloquest, Inc. Measuring the surface properties of polishing pads using ultrasonic reflectance
US6596388B1 (en) 2000-11-29 2003-07-22 Psiloquest Method of introducing organic and inorganic grafted compounds throughout a thermoplastic polishing pad using a supercritical fluid and applications therefor
US6846225B2 (en) * 2000-11-29 2005-01-25 Psiloquest, Inc. Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor
US6575823B1 (en) 2001-03-06 2003-06-10 Psiloquest Inc. Polishing pad and method for in situ delivery of chemical mechanical polishing slurry modifiers and applications thereof
US6764574B1 (en) 2001-03-06 2004-07-20 Psiloquest Polishing pad composition and method of use
US6568997B2 (en) 2001-04-05 2003-05-27 Rodel Holdings, Inc. CMP polishing composition for semiconductor devices containing organic polymer particles
KR100858392B1 (ko) * 2001-04-25 2008-09-11 제이에스알 가부시끼가이샤 반도체 웨이퍼용 연마 패드와, 이를 구비한 반도체웨이퍼용 연마 적층체와, 반도체 웨이퍼의 연마 방법
US6818301B2 (en) * 2001-06-01 2004-11-16 Psiloquest Inc. Thermal management with filled polymeric polishing pads and applications therefor
JP4686912B2 (ja) * 2001-06-15 2011-05-25 東レ株式会社 研磨パッド
JP2003100682A (ja) * 2001-09-25 2003-04-04 Jsr Corp 半導体ウエハ用研磨パッド
US20030207661A1 (en) * 2002-05-01 2003-11-06 Alexander Tregub Annealing of CMP polishing pads
US6811467B1 (en) 2002-09-09 2004-11-02 Seagate Technology Llc Methods and apparatus for polishing glass substrates
US6838169B2 (en) * 2002-09-11 2005-01-04 Psiloquest, Inc. Polishing pad resistant to delamination
JP2005539398A (ja) * 2002-09-25 2005-12-22 ピーピージー インダストリーズ オハイオ， インコーポレイテッド 平坦化するための研磨パッド
WO2004073926A1 (en) * 2003-02-18 2004-09-02 Parker-Hannifin Corporation Polishing article for electro-chemical mechanical polishing
US20040192178A1 (en) * 2003-03-28 2004-09-30 Barak Yardeni Diamond conditioning of soft chemical mechanical planarization/polishing (CMP) polishing pads
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US6852982B1 (en) * 2003-07-14 2005-02-08 Fei Company Magnetic lens
TW200525017A (en) * 2003-09-15 2005-08-01 Psiloquest Inc A polishing pad for chemical mechanical polishing
US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
US7654885B2 (en) * 2003-10-03 2010-02-02 Applied Materials, Inc. Multi-layer polishing pad
CN1301184C (zh) * 2003-12-16 2007-02-21 汪开庆 加工半导体用兰宝石晶体基片的光学研磨机及其加工方法
DE602005006326T2 (de) * 2004-02-05 2009-07-09 Jsr Corp. Chemisch-mechanisches Polierkissen und Polierverfahren
KR100545795B1 (ko) * 2004-02-17 2006-01-24 에스케이씨 주식회사 연마 패드의 기재 패드와 이를 이용한 다층 패드
US7198549B2 (en) * 2004-06-16 2007-04-03 Cabot Microelectronics Corporation Continuous contour polishing of a multi-material surface
US20060046064A1 (en) * 2004-08-25 2006-03-02 Dwaine Halberg Method of improving removal rate of pads
US20060099891A1 (en) * 2004-11-09 2006-05-11 Peter Renteln Method of chemical mechanical polishing, and a pad provided therefore
JP4475404B2 (ja) * 2004-10-14 2010-06-09 Ｊｓｒ株式会社 研磨パッド
US20060154579A1 (en) * 2005-01-12 2006-07-13 Psiloquest Thermoplastic chemical mechanical polishing pad and method of manufacture
KR20060099398A (ko) * 2005-03-08 2006-09-19 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 수계 연마 패드 및 제조 방법
KR100709392B1 (ko) * 2005-07-20 2007-04-20 에스케이씨 주식회사 액상의 비닐계 모노머가 상호침투 가교된 형태를 갖는폴리우레탄 연마 패드
TW200720017A (en) * 2005-09-19 2007-06-01 Rohm & Haas Elect Mat Water-based polishing pads having improved adhesion properties and methods of manufacture
BRPI0714710A2 (pt) 2006-07-14 2013-03-26 Saint Gobain Abrasives Inc artigo abrasivo sem reforÇo
CN100425405C (zh) * 2006-08-03 2008-10-15 南京航空航天大学 冷冻纳米磨料抛光垫及其制备方法
US20080063856A1 (en) * 2006-09-11 2008-03-13 Duong Chau H Water-based polishing pads having improved contact area
KR100771892B1 (ko) * 2007-02-06 2007-11-01 삼성전자주식회사 디싱 현상 없이 평탄화된 막을 구비하는 반도체 소자의제조방법
US7635290B2 (en) * 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
US20090061743A1 (en) * 2007-08-29 2009-03-05 Stephen Jew Method of soft pad preparation to reduce removal rate ramp-up effect and to stabilize defect rate
JP5251877B2 (ja) * 2008-01-30 2013-07-31 旭硝子株式会社 磁気ディスク用ガラス基板の製造方法
WO2009134775A1 (en) * 2008-04-29 2009-11-05 Semiquest, Inc. Polishing pad composition and method of manufacture and use
US8303375B2 (en) 2009-01-12 2012-11-06 Novaplanar Technology, Inc. Polishing pads for chemical mechanical planarization and/or other polishing methods
DE102009030295B4 (de) * 2009-06-24 2014-05-08 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
BR112012014913A2 (pt) * 2009-12-29 2017-03-01 Saint Gobain Abrasifs Sa método para limpeza de uma superfície sólida de conzinha ou banheiro doméstico e artigo comercializado
SG11201402224WA (en) * 2011-11-29 2014-09-26 Nexplanar Corp Polishing pad with foundation layer and polishing surface layer
SG11201608134YA (en) * 2014-04-03 2016-10-28 3M Innovative Properties Co Polishing pads and systems and methods of making and using the same
US9649741B2 (en) 2014-07-07 2017-05-16 Jh Rhodes Company, Inc. Polishing material for polishing hard surfaces, media including the material, and methods of forming and using same
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
SG11201703114QA (en) 2014-10-17 2017-06-29 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10092998B2 (en) * 2015-06-26 2018-10-09 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making composite polishing layer for chemical mechanical polishing pad
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US20180304539A1 (en) 2017-04-21 2018-10-25 Applied Materials, Inc. Energy delivery system with array of energy sources for an additive manufacturing apparatus
KR102567102B1 (ko) 2017-05-12 2023-08-14 주식회사 쿠라레 연마층용 폴리우레탄, 폴리우레탄을 포함하는 연마층과 그 연마층의 개질 방법, 연마 패드 및 연마 방법
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
CN109794863A (zh) * 2019-03-05 2019-05-24 北京国瑞升精机科技有限公司 一种亲水性抛光膜及其制备方法
CN110181828A (zh) * 2019-05-10 2019-08-30 常熟安通林汽车饰件有限公司 一种避免包覆件鼓包的方法
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
CN112372509B (zh) * 2020-11-11 2022-02-25 西安奕斯伟硅片技术有限公司 一种将抛光垫的初始状态转变为亲水性的方法和装置
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN116262329B (zh) * 2021-12-13 2025-07-29 湖北鼎汇微电子材料有限公司 一种抛光垫
CN118493159B (zh) * 2024-07-18 2024-12-31 浙江大学 一种弹性磁电柔性抛光工具头及使用方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997011484A1 (en) * 1995-09-22 1997-03-27 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
WO1998045087A1 (en) * 1997-04-04 1998-10-15 Rodel Holdings, Inc. Improved polishing pads and methods relating thereto

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3100721A (en) * 1961-02-21 1963-08-13 Du Pont Process for producing microporous films and coatings
US4927432A (en) 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing
US5177908A (en) * 1990-01-22 1993-01-12 Micron Technology, Inc. Polishing pad
US5607488A (en) * 1990-05-21 1997-03-04 Wiand; Ronald C. Molded abrasive article and process
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US5247765A (en) * 1991-07-23 1993-09-28 Abrasive Technology Europe, S.A. Abrasive product comprising a plurality of discrete composite abrasive pellets in a resilient resin matrix
US5287663A (en) * 1992-01-21 1994-02-22 National Semiconductor Corporation Polishing pad and method for polishing semiconductor wafers
AU654901B2 (en) * 1992-03-16 1994-11-24 De Beers Industrial Diamond Division (Proprietary) Limited Polishing pad
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US6099394A (en) * 1998-02-10 2000-08-08 Rodel Holdings, Inc. Polishing system having a multi-phase polishing substrate and methods relating thereto
US5554064A (en) * 1993-08-06 1996-09-10 Intel Corporation Orbital motion chemical-mechanical polishing apparatus and method of fabrication
US5394655A (en) * 1993-08-31 1995-03-07 Texas Instruments Incorporated Semiconductor polishing pad
US5489233A (en) * 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
US5533923A (en) * 1995-04-10 1996-07-09 Applied Materials, Inc. Chemical-mechanical polishing pad providing polishing unformity
KR100487455B1 (ko) * 1997-01-13 2005-05-09 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 사진석판술에 의해 유도된 표면 패턴(들)이 있는 연마용 중합체 패드 및 이에 관련된 방법
US6022268A (en) * 1998-04-03 2000-02-08 Rodel Holdings Inc. Polishing pads and methods relating thereto
EP1011922B1 (en) * 1997-04-18 2002-11-06 Cabot Microelectronics Corporation Polishing pad for a semiconductor substrate
US5928070A (en) * 1997-05-30 1999-07-27 Minnesota Mining & Manufacturing Company Abrasive article comprising mullite
GB2334205B (en) * 1998-02-12 2001-11-28 Shinetsu Handotai Kk Polishing method for semiconductor wafer and polishing pad used therein
US6095902A (en) * 1998-09-23 2000-08-01 Rodel Holdings, Inc. Polyether-polyester polyurethane polishing pads and related methods

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997011484A1 (en) * 1995-09-22 1997-03-27 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
WO1998045087A1 (en) * 1997-04-04 1998-10-15 Rodel Holdings, Inc. Improved polishing pads and methods relating thereto

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012114454A (ja) * 2000-05-27 2012-06-14 Rohm & Haas Electronic Materials Cmp Holdings Inc 化学機械平坦化用の研磨パッド
JP2007531275A (ja) * 2004-03-23 2007-11-01 キャボット マイクロエレクトロニクス コーポレイション 低表面エネルギーｃｍｐパッド
JP2006233199A (ja) * 2005-01-31 2006-09-07 Toray Ind Inc 改善された研磨パッドの製造方法
US8148441B2 (en) 2005-03-08 2012-04-03 Toyo Tire & Rubber Co., Ltd. Polishing pad and manufacturing method thereof
US8530535B2 (en) 2005-05-17 2013-09-10 Toyo Tire & Rubber Co., Ltd. Polishing pad
US8304467B2 (en) 2005-05-17 2012-11-06 Toyo Tire & Rubber Co., Ltd. Polishing pad
US8779020B2 (en) 2005-05-17 2014-07-15 Toyo Tire & Rubber Co., Ltd. Polishing pad
US8309466B2 (en) 2005-08-30 2012-11-13 Toyo Tire & Rubber Co., Ltd. Polishing pad
JP2007073796A (ja) * 2005-09-08 2007-03-22 Nihon Micro Coating Co Ltd 研磨パッド及びその製造方法並びに研磨方法
US8094456B2 (en) 2006-01-10 2012-01-10 Toyo Tire & Rubber Co., Ltd. Polishing pad
US8993648B2 (en) 2006-08-28 2015-03-31 Toyo Tire & Rubber Co., Ltd. Polishing pad
US9358661B2 (en) 2006-08-28 2016-06-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad
US8303372B2 (en) 2006-08-31 2012-11-06 Toyo Tire & Rubber Co., Ltd. Polishing pad
US8865785B2 (en) 2007-03-28 2014-10-21 Toyo Tire & Rubber Co., Ltd. Polishing pad
KR101464800B1 (ko) * 2007-08-13 2014-11-24 쓰리엠 이노베이티브 프로퍼티즈 컴파니 코팅된 연마 라미네이트 디스크 및 그의 제조 방법
JP2010023134A (ja) * 2008-07-16 2010-02-04 Fujibo Holdings Inc 研磨パッド
JP2012000745A (ja) * 2010-05-19 2012-01-05 Toyo Tire & Rubber Co Ltd 研磨パッド
WO2013089240A1 (ja) * 2011-12-16 2013-06-20 東洋ゴム工業株式会社 研磨パッド
CN103958125A (zh) * 2011-12-16 2014-07-30 东洋橡胶工业株式会社 抛光垫

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US6500053B2 (en) 2002-12-31
EP1161322A1 (en) 2001-12-12
US20020098782A1 (en) 2002-07-25
KR20010101623A (ko) 2001-11-14
EP1161322A4 (en) 2003-09-24
KR100585480B1 (ko) 2006-06-02
CN1336861A (zh) 2002-02-20
US6354915B1 (en) 2002-03-12

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