JP2002526937A - 界面マイクロ放電現象に対する電気回路の保護装置 - Google Patents

界面マイクロ放電現象に対する電気回路の保護装置

Info

Publication number
JP2002526937A
JP2002526937A JP2000573141A JP2000573141A JP2002526937A JP 2002526937 A JP2002526937 A JP 2002526937A JP 2000573141 A JP2000573141 A JP 2000573141A JP 2000573141 A JP2000573141 A JP 2000573141A JP 2002526937 A JP2002526937 A JP 2002526937A
Authority
JP
Japan
Prior art keywords
audio
electromagnetic
coating
video frequency
absorbing coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000573141A
Other languages
English (en)
Japanese (ja)
Inventor
ジョアネ、ピエール
グイニク、フィリップ
フォンテーヌ、ピエール
Original Assignee
エレクトリシテ ド フランス セルビス ナショナル
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エレクトリシテ ド フランス セルビス ナショナル filed Critical エレクトリシテ ド フランス セルビス ナショナル
Publication of JP2002526937A publication Critical patent/JP2002526937A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0043—Casings being flexible containers, e.g. pouch, pocket, bag
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0281—Conductive fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Textile Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Elimination Of Static Electricity (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Noise Elimination (AREA)
JP2000573141A 1998-09-29 1999-09-28 界面マイクロ放電現象に対する電気回路の保護装置 Pending JP2002526937A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR98/12143 1998-09-29
FR9812143A FR2784000A1 (fr) 1998-09-29 1998-09-29 Dispositif de protection d'un circuit electrique contre les phenomenes de microdecharges d'interface
PCT/FR1999/002300 WO2000019791A1 (fr) 1998-09-29 1999-09-28 Dispositif de protection d'un circuit electrique contre les phenomenes de microdecharges d'interface

Publications (1)

Publication Number Publication Date
JP2002526937A true JP2002526937A (ja) 2002-08-20

Family

ID=9530951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000573141A Pending JP2002526937A (ja) 1998-09-29 1999-09-28 界面マイクロ放電現象に対する電気回路の保護装置

Country Status (5)

Country Link
EP (1) EP1120026A1 (fr)
JP (1) JP2002526937A (fr)
AU (1) AU5868599A (fr)
FR (1) FR2784000A1 (fr)
WO (1) WO2000019791A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010093775A (ja) * 2008-09-11 2010-04-22 Softbank Bb Corp 小型基地局、中継機器、出力装置、妨害方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2811510B1 (fr) * 2000-07-06 2002-10-11 Electricite De France Dispositif de protection d'un circuit electronique contre les parasites engendres dans ce circuit par le phenomene de micro-decharges d'interface
FR2823634B1 (fr) * 2001-04-13 2003-05-30 Pierre Henri Raymond Johannet Dispositif de protection des conducteurs electriques contre les microdecharges d'interface (mdi)
FR2827116A1 (fr) * 2001-07-03 2003-01-10 Pierre Johannet Dispositif de protection des conducteurs et haut-parleurs contre les microdecharges d'interface (mdi)
FR2831385A1 (fr) * 2001-10-23 2003-04-25 Pierre Henri Raymond Johannet Dispositif de protection des conducteurs et lecteurs de disques numeriques contre les microdecharges d'interface (mdi)
FR2834858A1 (fr) * 2002-01-16 2003-07-18 Pierre Henri Raymond Johannet Dispositif de protection des haut-parleurs contre la distorsion ionique de couplage a l'air (dica)
US10219381B2 (en) 2017-03-22 2019-02-26 Carling Technologies, Inc. Circuit board mounted switch with electro static discharge shield
CN113438796B (zh) * 2021-04-29 2022-03-01 武汉芯宝科技有限公司 可吸收瞬间高压脉冲能量的电路板及制作方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3024888A1 (de) * 1980-07-01 1982-02-04 Bayer Ag, 5090 Leverkusen Verbundmaterial zur abschirmung elektromagnetischer strahlung
US5412541A (en) * 1992-12-18 1995-05-02 Tanaka; Tatsuo Specifically configured sheet members or articles for use in improving sound or image quality
FR2754630B1 (fr) * 1996-10-10 2000-12-01 Electricite De France Procede de fabrication d'un conducteur, ou circuit electrique compense en parasites radioelectriques tels que micro-decharges et conducteur ou circuit correspondant

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010093775A (ja) * 2008-09-11 2010-04-22 Softbank Bb Corp 小型基地局、中継機器、出力装置、妨害方法

Also Published As

Publication number Publication date
EP1120026A1 (fr) 2001-08-01
FR2784000A1 (fr) 2000-03-31
WO2000019791A1 (fr) 2000-04-06
AU5868599A (en) 2000-04-17

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