JP2002353619A - 多層配線板、多層配線用基材及びその製造方法 - Google Patents

多層配線板、多層配線用基材及びその製造方法

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Publication number
JP2002353619A
JP2002353619A JP2002076226A JP2002076226A JP2002353619A JP 2002353619 A JP2002353619 A JP 2002353619A JP 2002076226 A JP2002076226 A JP 2002076226A JP 2002076226 A JP2002076226 A JP 2002076226A JP 2002353619 A JP2002353619 A JP 2002353619A
Authority
JP
Japan
Prior art keywords
resin film
copper foil
conductive paste
adhesive layer
multilayer wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002076226A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002353619A5 (enExample
Inventor
Reiji Higuchi
令史 樋口
Shoji Ito
彰二 伊藤
Satoru Nakao
知 中尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP2002076226A priority Critical patent/JP2002353619A/ja
Priority to KR1020020015757A priority patent/KR100573999B1/ko
Priority to US10/102,628 priority patent/US6831236B2/en
Priority to TW91105644A priority patent/TW536926B/zh
Priority to CNB021078718A priority patent/CN100471357C/zh
Publication of JP2002353619A publication Critical patent/JP2002353619A/ja
Priority to US10/920,185 priority patent/US6914199B2/en
Publication of JP2002353619A5 publication Critical patent/JP2002353619A5/ja
Pending legal-status Critical Current

Links

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  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2002076226A 2001-03-23 2002-03-19 多層配線板、多層配線用基材及びその製造方法 Pending JP2002353619A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2002076226A JP2002353619A (ja) 2001-03-23 2002-03-19 多層配線板、多層配線用基材及びその製造方法
KR1020020015757A KR100573999B1 (ko) 2001-03-23 2002-03-22 다층 배선판, 다층 배선판용 기재 및 그 제조 방법
US10/102,628 US6831236B2 (en) 2001-03-23 2002-03-22 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
TW91105644A TW536926B (en) 2001-03-23 2002-03-22 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
CNB021078718A CN100471357C (zh) 2001-03-23 2002-03-25 多层线路板组件,多层线路板组件单元及其制造方法
US10/920,185 US6914199B2 (en) 2001-03-23 2004-08-18 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001085224 2001-03-23
JP2001-85224 2001-03-23
JP2002076226A JP2002353619A (ja) 2001-03-23 2002-03-19 多層配線板、多層配線用基材及びその製造方法

Publications (2)

Publication Number Publication Date
JP2002353619A true JP2002353619A (ja) 2002-12-06
JP2002353619A5 JP2002353619A5 (enExample) 2005-09-08

Family

ID=26611921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002076226A Pending JP2002353619A (ja) 2001-03-23 2002-03-19 多層配線板、多層配線用基材及びその製造方法

Country Status (1)

Country Link
JP (1) JP2002353619A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007134509A (ja) * 2005-11-10 2007-05-31 Sumitomo Electric Ind Ltd 多層プリント配線板の製造方法及び多層プリント配線板
JP2007227420A (ja) * 2006-02-21 2007-09-06 Nippon Steel Chem Co Ltd 多層プリント配線板
JP2008311426A (ja) * 2007-06-14 2008-12-25 Hitachi Cable Ltd 多層配線基板及び多層配線基板の製造方法
KR101262136B1 (ko) 2006-02-21 2013-05-14 신닛테츠 수미킨 가가쿠 가부시키가이샤 다층 프린트 배선판 및 그 제조방법
JP2016152331A (ja) * 2015-02-18 2016-08-22 パナソニックＩｐマネジメント株式会社 プリント配線板及びその製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007134509A (ja) * 2005-11-10 2007-05-31 Sumitomo Electric Ind Ltd 多層プリント配線板の製造方法及び多層プリント配線板
JP2007227420A (ja) * 2006-02-21 2007-09-06 Nippon Steel Chem Co Ltd 多層プリント配線板
KR101262136B1 (ko) 2006-02-21 2013-05-14 신닛테츠 수미킨 가가쿠 가부시키가이샤 다층 프린트 배선판 및 그 제조방법
JP2008311426A (ja) * 2007-06-14 2008-12-25 Hitachi Cable Ltd 多層配線基板及び多層配線基板の製造方法
US8178191B2 (en) 2007-06-14 2012-05-15 Hitachi Cable, Ltd. Multilayer wiring board and method of making the same
JP2016152331A (ja) * 2015-02-18 2016-08-22 パナソニックＩｐマネジメント株式会社 プリント配線板及びその製造方法

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