JP2002344138A - Method for manufacturing ceramic laminate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic laminate with high precision at low costs. SOLUTION: After a first green sheet is burned, a conductive pattern is formed on the first green sheet, and a plurality of second green sheets, on which conductive patterns are formed, are laminated and pressed on the sintered first green sheet. Since this laminate is burned, shrinkage of the second green sheets in a plane direction can be prevented. Consequently, deterioration of precision due to a shrinkage error can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a ceramic laminate such as a multilayer ceramic printed wiring board and a multilayer ceramic electronic component.

[0002]

2. Description of the Related Art In recent years, with the demand for high-density mounting, this type of ceramic laminate has been required to have high manufacturing accuracy. For example, a multilayer ceramic printed wiring board, which is one form of a ceramic laminate, is required to have a high-precision conductive pattern so that components having a narrow pitch can be reliably mounted. In addition, when components such as resistors, capacitors, and inductors are embedded in a printed wiring board, the characteristics of each component are required to be highly accurate. In addition, multilayer ceramic electronic components, such as multilayer capacitors, multilayer inductors, and multilayer dielectric filters, which are forms of the ceramic multilayer body, are required to have high-precision characteristics.

[0003] This type of ceramic laminate is generally
It is manufactured by laminating green ceramic sheets to which a conductive paste has been applied, and firing this laminate under predetermined conditions. Since the green ceramic sheet shrinks in this firing step, the size of the green ceramic sheet and the application pattern of the conductive paste must be designed in advance in consideration of the shrinkage. However, since the degree of shrinkage is determined by baking conditions and the like, there is a limit in improving the accuracy even if design is performed in consideration of shrinkage.

[0004]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, Japanese Patent Application Laid-Open Nos. 4-243978 and 5-10
The techniques described in JP-A-2666, JP-A-5-327220, JP-A-5-167253, and JP-A-6-97661 have been proposed. In each of these techniques, an unsintered sheet or the like is attached to one or both of an upper surface and a lower surface of a green ceramic sheet and then fired, and after sintering, the unsintered sheet is removed. Thereby, the contraction of the green ceramic sheet in the plane direction is prevented. However, in these techniques, it is necessary to prepare a separate member such as an unsintered sheet, and it is necessary to attach and remove the unsintered sheet, so that it has been difficult to reduce the cost.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a manufacturing method capable of manufacturing a ceramic laminate at high accuracy and at low cost.

[0006]

In order to achieve the above object, according to the present invention, there is provided a first firing step of firing a green ceramic sheet to obtain a sintered ceramic body, and forming a green ceramic sheet on the sintered ceramic body. A method for manufacturing a ceramic laminate, comprising: a lamination step of laminating ceramic sheets to obtain a laminate; and a second firing step of firing the laminate.

According to the present invention, since the sintered ceramic body fired in the first firing step does not shrink in the second firing step, the green ceramic sheets stacked in the laminating step are flattened in the second firing step. It can be prevented from contracting in the direction. Therefore, for example, a layer that does not require high accuracy, such as a layer that does not require formation of a conductor, is fired in the first firing step, and a layer that requires high accuracy is fired in the second firing step. If this is the case, the ceramic laminate can be manufactured with high precision. Further, since it is not necessary to prepare a separate member to prevent shrinkage in the plane direction unlike the prior art, a low-cost and high-precision ceramic laminate can be manufactured.

According to a second aspect of the present invention, in the method for manufacturing a ceramic laminate according to the first aspect, a conductor forming step of forming a conductor on the surface of the sintered ceramic body is provided after the first firing step. We propose one that is characterized.

According to the present invention, the shrinkage of the sintered ceramic body in the planar direction can be prevented in the second sintering step.
In the conductor forming step, it is possible to form a conductor with high precision without considering shrinkage.

Further, a third aspect of the present invention proposes a method of manufacturing a ceramic laminate according to the second aspect, wherein a thin film conductor is formed in the conductor forming step.

According to the present invention, since the thin film conductor is formed in the conductor forming step, it is possible to form a conductor having lower conductivity and excellent high frequency characteristics as compared with the case where the conductor and the ceramic are co-fired.

According to a fourth aspect of the present invention, there is provided a method of manufacturing a ceramic laminate according to the third aspect, wherein the conductor forming step forms a thin film conductor by a dry process. Suggest. According to a fifth aspect of the present invention, there is provided the method of manufacturing a ceramic laminate according to the fourth aspect, wherein the conductor forming step forms a thin film conductor by a wet process.

According to a sixth aspect of the present invention, in the method of manufacturing a ceramic laminate according to any one of the first to fifth aspects, a conductive paste is printed in the laminating step. A proposal is made of stacking green ceramic sheets and simultaneously firing the green ceramic sheet and the conductive paste in the second firing step.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) A first embodiment of the present invention will be described with reference to FIGS. In this embodiment, a printed wiring board which is an example of a ceramic laminate will be described. FIG. 1 is a cross-sectional view of a printed wiring board manufactured according to the first embodiment, and FIG. 2 is a flowchart illustrating a manufacturing process of the printed wiring board according to the first embodiment.

As shown in FIG. 1, the printed wiring board 10 includes a plurality of ceramic layers 11 to 14 and respective ceramic layers 11 to 1.
There are provided conductor patterns 15 formed on the four layers and on the surface, and via holes 16 interconnecting the conductor patterns 15 formed on different layers. The via hole 16 is filled with a conductor having the same composition as the conductor pattern 15.

Next, the manufacturing process of the printed wiring board 10 will be described. As shown in FIG. 2, first, a first green sheet is formed (Step S1). Specifically, a ceramic slurry is prepared by putting a ceramic powder, an organic binder and the like and a dispersion medium into a ball mill and mixing them sufficiently. Here, the ceramic powder is, for example, a mixed powder of Al ₂ O ₃ , SiO ₂ , B ₂ O ₃ , CaO, and MgO. The organic binder is, for example, polyvinyl butyral. The dispersion medium is, for example, toluene or IPA. Then, a first green sheet is formed from the slurry by a doctor blade method or the like. In the doctor blade method, a slurry is flowed on a base film made of polyethylene terephthalate (PET) or the like, and the thickness is adjusted by a gap with the doctor blade. Thereafter, this is dried to obtain a green sheet having a predetermined thickness. Here, the first green sheet is formed in a size in consideration of a shrinkage ratio in a subsequent firing step. Also, a via hole is formed in the first green sheet as needed. This first green sheet is sintered in a later firing step to become the ceramic layer 11 shown in FIG.

Next, the first green sheet is fired under predetermined firing conditions (step S2). This firing step sinters the first green sheet to form the ceramic layer 11
Becomes That is, in this firing step, the first green sheet contracts to the size of the ceramic layer 11.

Next, a conductor pattern is formed on the surface of the sintered first green sheet (step S3). Specifically, the thin film conductor is formed by using a dry process such as vacuum evaporation or sputtering, or a wet process such as electroless plating. Here, it is almost unnecessary to consider the contraction in the plane direction when forming the conductor pattern.

Next, a plurality of second green sheets are formed (step S4). Specifically, a slurry is formed from a raw material having the same composition as the first green sheet, and a second green sheet is formed from the slurry by the same process as in step S1. Here, the size of the second green sheet is formed to be substantially the same as the size of the ceramic layers 12 to 14 without considering the shrinkage in the plane direction. In addition, since it shrinks in the thickness direction in the subsequent baking process, it is necessary to prepare the thickness in a dimension in consideration of shrinkage. Also, a via hole is formed in the second green sheet as needed.

Next, a conductor pattern is formed on the second green sheet (step S5). Specifically, first,
For example, a conductive powder is prepared by mixing a metal powder such as Cu, Ni, and Ag-Pd with a dispersion medium. Next, this conductive paste is printed by a screen printing method or the like. here,
In forming the conductor pattern, it is almost unnecessary to consider the contraction in the plane direction.

Next, a plurality of second green sheets on which the conductive paste is printed are laminated on the first green sheet sintered in a predetermined order, and these are integrally pressed (step S6).

Next, the laminate is fired under predetermined firing conditions (step S7). Thereby, the second green sheet and the conductive paste printed on the green sheet are simultaneously fired. At this time, since the second green sheet is laminated with the ceramic layer 11 sintered in step S2, the second green sheet hardly shrinks in the planar direction.

Finally, a predetermined portion of the sintered laminate is overcoated to obtain a printed wiring board as an example of the ceramic laminate.

As described above, in the method for manufacturing a ceramic laminate according to the present embodiment, the first green sheet is fired first, and then a plurality of second green sheets are stacked. The shrinkage of the green sheet 2 in the plane direction can be suppressed. Therefore, the second
The manufacturing accuracy of the conductor pattern formed on the green sheet and the second green sheet is improved. Further, since a step of removing a member for suppressing shrinkage in the planar direction is not required, a ceramic laminate can be manufactured at a lower cost as compared with the above-described conventional method.

Further, since the conductor pattern formed on the first green sheet is formed after the firing of the first green sheet, the production accuracy of the conductor pattern is improved. In particular, in the present embodiment, since the conductive pattern is formed by a thin film forming method such as a dry process or a wet process, compared with a conductive pattern obtained by simultaneously firing a conductive paste and a green sheet, The characteristics are good.

(Second Embodiment) A second embodiment of the present invention will be described with reference to the drawings. In the present embodiment, a laminated dielectric filter which is an example of a ceramic laminated body will be described. FIG. 3 is an external perspective view of a multilayer dielectric filter manufactured according to the second embodiment, and FIG.
FIG. 5 is an exploded perspective view of a multilayer body of the multilayer dielectric filter manufactured according to the embodiment, and FIG. 5 is a flowchart illustrating a manufacturing process of the multilayer dielectric filter according to the second embodiment.

As shown in FIG. 3, the laminated dielectric filter 100 is composed of a laminated body 10 formed by laminating a dielectric and a conductor.
1, a pair of input / output terminals 102 attached to both ends of the multilayer body 101, and a ground terminal 103 formed on the outer surface of the multilayer body 101.

The input / output terminal 102 has a main portion 102a extending in the laminating direction at the center of both end surfaces 101a parallel to the laminating direction of the laminated body 101, and an upper and lower surface 101b perpendicular to the laminating direction from the end surface 101a. And a wraparound portion 102b formed by wraparound.

The ground terminal 103 is formed from the entire side surface 101c parallel to the laminating direction of the laminated body 101 to the end surfaces 101a and the end portions of the upper and lower surfaces 101b. That is, the ground terminal 103 is formed by a main portion 103 a
And the end face 101a and the upper and lower faces 101 from the side face 101c.
and a wraparound portion 103b formed so as to wrap around the end of b.

As shown in FIG. 4, the laminate 101 has an integrated structure in which a dielectric layer 110 on which no conductor is formed and a plurality of dielectric layers 111 to 119 on which conductors of a predetermined pattern are formed are laminated. . Each of the dielectric layers 110 to 119 includes
For example, it is made of a BaTiO ₃ -based ceramic sintered body having a dielectric property.

The first ground electrode 121 is formed on the dielectric layer 111. First ground electrode 121
Are exposed on the long side of the dielectric layer 111 and are connected to the main portion 103a of the ground terminal 103. Also, the first
The ground electrode 121 is not formed at the end on the short side of the dielectric layer 111. First, when the first ground electrode 121 is formed on the entire surface of the dielectric layer 111, the bonding strength between the dielectric layer 111 and the dielectric layer 110 is reduced. Second, the ground terminal 10
3 to prevent a short circuit between the input / output terminal 3 and the input / output terminal 102.
Further, the first ground electrode 121 is connected to the input / output terminal 10.
The center of the side opposite to 2 has a shape drawn toward the center of the dielectric layer 111.

The dielectric layer 111 has an input / output terminal 1
Capacitor forming electrodes 122 and 123 connected to the main part 102a of No. 02 are formed. These capacitance forming electrodes 122 and 123 are arranged in the lead-in portion of the first ground electrode 121 described above. Thereby, the capacitance forming electrode 12
A predetermined capacitance is formed between the first ground electrode 121 and the second ground electrode 123. The capacitance forming electrodes 122 and 123
Part thereof is formed so as to overlap with the wraparound portion 102b of the input / output terminal 102 via the dielectric layer 110.

On the dielectric layer 112, rectangular wavelength shortening electrodes 124, 125 and 126 formed in parallel with each other are formed. The wavelength shortening electrodes 124 to 126 are
The dielectric layer 112 extends in the short direction. That is, each of the wavelength shortening electrodes 124 to 126 extends in a direction orthogonal to a direction connecting the pair of input / output terminals 102. One end of each of the wavelength shortening electrodes 124 to 126 is connected to the dielectric layer 1.
12, and is connected to the main portion 103a of the ground terminal 103. This wavelength shortening electrode 12
4 to 126 are disposed so as to overlap with first resonance element pieces 127 to 129 described later via the dielectric layer 112. Thus, the wavelength shortening electrodes 124 to 126 and the first
Since the resonance element pieces 127 to 129 are capacitively coupled, an effect of shortening the wavelength of the resonance element can be obtained.

On the dielectric layer 113, rectangular first resonance element pieces 127, 128 and 129 are formed. This first
The resonance element pieces 127 to 129 are connected to the pair of input / output terminals 1.
02 extends in a direction perpendicular to the direction connecting the two. The first resonance element pieces 127 to 129 are arranged on the dielectric layer 113 on the side where the wavelength shortening electrodes 124 to 126 are formed. Further, the first resonance element piece 127
To 129 are disposed so as to overlap with second resonance element pieces 134 to 136 described later via the dielectric layer 113.
Further, via holes (not shown) are formed at one ends of the first resonance element pieces 127 to 129. The first resonance element pieces 127 to 129 are formed in the via holes (not shown).
Are connected to the second resonance element pieces 134 to 136 and the third resonance element pieces 143 to 145 via the.

The coupling electrode 130 is formed on the dielectric layer 114. The coupling electrode 130 is formed on the dielectric layer 114.
Is formed so as to extend in the longitudinal direction of the dielectric layer 114 substantially in the vicinity of the center. The coupling electrode 130 has a rectangular coupling portion 130a formed at both ends and a connecting line portion 130b which connects the coupling portions 130a and has a width smaller than the coupling portion 130a.
Consists of One coupling portion 130a of the coupling electrode 130
Are arranged at positions overlapping the vicinity of the center of the first resonance element piece 127 and the second resonance element piece 134 with the dielectric layers 113 and 114 interposed therebetween. The other coupling portion 130a of the coupling electrode 130 is disposed at a position where the vicinity of the center of the first resonance element piece 128 and the second resonance element piece 135 overlaps with the dielectric layers 113 and 114 therebetween. Also, the dielectric layer 1
14, lands 131 to 133 connected to via holes (not shown) of the dielectric layer 113 are formed. The via holes (not shown) are formed at the positions where the lands 131 to 133 are formed.

On the dielectric layer 115, stripline type second resonance element pieces 134, 135, and 136 are formed so as to be parallel to each other. Each second resonance element piece 135
136 extend in a direction orthogonal to the direction connecting the pair of input / output terminals 102. Each of the second resonance element pieces 134 to
One end of 136 is connected to the wavelength shortening electrodes 124 to 126.
Of the ground terminal 103 on the side where is not connected
a. The other end of each of the second resonance element pieces 134 to 136 is opposed to the ground terminal 103 to which the wavelength shortening electrodes 124 to 126 are connected at a predetermined distance. The via holes (not shown) are formed on the open ends of the second resonance element pieces 134 to 136.

The input / output electrodes 137 and 138 connected to the main portion 102a of the input / output terminal 102 are connected to the input / output second resonance element pieces 134 and 136 of the three second resonance elements 134 to 136. ing. Input / output electrode 137
And 138, input / output units 137a, 138a arranged at the ends of the dielectric layer 115, and the input / output units 137
a, 138a and connection lines 137b, 138b connecting the second resonance element pieces 134, 136. Connection line 1
37b and 138b are formed in a meandering linear shape,
The second resonance element piece 13 is located at a position slightly open from the center.
4,136. Note that the connection line portion 137b,
The connection position between the 138b and the second resonance element pieces 134 and 136 may be appropriately moved to the open end side or the short-circuit end side according to a filter characteristic to be a design target.

The coupling electrode 139 is formed on the dielectric layer 116. The coupling electrode 139 is formed on the dielectric layer 116.
Is formed so as to extend in the longitudinal direction of the dielectric layer 116 substantially in the vicinity of the center. The coupling electrode 139 includes a rectangular coupling portion 139a formed at both ends and a connecting line portion 139b which connects the coupling portions 139a and has a width smaller than the coupling portion 139a.
Consists of One coupling portion 139a of the coupling electrode 139
Are arranged at positions overlapping the vicinity of the center of the second resonance element piece 135 and a third resonance element piece 144 described later with the dielectric layers 115 and 116 interposed therebetween. The other coupling portion 139a of the coupling electrode 139 is located near the center of the second resonance element piece 136 and a third resonance element piece 145, which will be described later, and the dielectric layer 11.
5 and 116 are disposed at positions overlapping each other.
The lands 140 to 142 connected to via holes (not shown) of the dielectric layer 115 are formed in the dielectric layer 116. Via holes (not shown) are formed at positions where the lands 140 to 142 are formed.

On the dielectric layer 117, rectangular third resonance element pieces 143 to 145 are formed. The shape and arrangement of the third resonance element pieces 143 to 145 are the same as those of the first resonance element pieces 127 to 129. Third resonance element piece 143
145 are connected to via holes (not shown) in the dielectric layer 116. Thereby, the first resonance element pieces 127 to 129, the second resonance element pieces 134 to 136,
The ends of the third resonance element pieces 143 to 145 are connected.

On the dielectric layer 118, rectangular wavelength shortening electrodes 146 to 148 formed in parallel with each other are formed. The shape and arrangement of the wavelength shortening electrodes 146 to 146 are the same as those of the wavelength shortening electrodes 124 to 126.

On the dielectric layer 119, a second ground electrode 149 and capacitance forming electrodes 150 and 151 are formed. The second ground electrode 149 has the same shape as the first ground electrode 121. Further, regarding the shape and arrangement of the capacitance forming electrodes 150 and 151, the capacitance forming electrodes 122 and 123 formed on the dielectric layer 111 are formed.
Is the same as

Next, a method of manufacturing the laminated dielectric filter will be described. First, the dielectric layers 115 to 11
A first green sheet corresponding to No. 9 is formed (step S21). Specifically, a ceramic slurry is obtained by mixing and stirring a predetermined amount of an organic binder, an organic solvent, or water with a dielectric ceramic material in which, for example, BaTiO ₃ or the like is a main raw material and SiO ₂ or the like is mixed as an additive. Next, a first green sheet is formed from the ceramic slurry by a tape molding method such as a doctor blade method. The first green sheet is formed with a size in consideration of shrinkage in a subsequent firing step.

Next, after perforating the first green sheet with a punch or a laser as required, a conductive paste is printed in a predetermined shape by screen printing, intaglio printing, letterpress printing, or the like ( Step S22). Here, of the first green sheets corresponding to the dielectric layers 115 to 119, other dielectric layers 116 to 11 except for the dielectric layer 115 forming the second resonance element pieces 134 to 136 are used.
9 is printed with a conductive paste.

Next, the first green sheet is laminated and pressed by using a press device to obtain a sheet laminate (step S23). Here, the lamination order of the first green sheets is implemented so as to have the configuration described with reference to FIG.

Next, the sheet laminate is fired under predetermined temperature and atmosphere conditions (step S24). Thereby, the first green sheet and the conductive paste are sintered to form the dielectric layer and the respective electrodes.

Next, the second resonance element pieces 134 to 136 and the input / output electrodes 137 and 138 are provided on the surface of the sintered sheet laminate, that is, on the upper surface of the dielectric layer 115 in FIG.
Is formed (step S25). Specifically, the thin film conductor is formed by using a dry process such as vacuum evaporation or sputtering, or a wet process such as electroless plating. Here, it is almost unnecessary to consider the contraction in the plane direction when forming the conductor pattern.

Next, a second green sheet corresponding to the dielectric layers 110 to 114 is formed (step S2).
6). Specifically, a ceramic slurry is prepared from a raw material having the same composition as the first green sheet, and a second green sheet is prepared from the slurry. here,
The size of the second green sheet is formed to be substantially the same as the size of the dielectric layers 110 to 114 without considering shrinkage in the planar direction. In addition, since it shrinks in the thickness direction in the subsequent baking process, it is necessary to form the thickness in a size in consideration of shrinkage.

Next, after perforating the second green sheet with a punch or a laser as required, a conductive paste is printed in a predetermined shape by a screen printing method, an intaglio printing method, a relief printing method, or the like ( Step S27).

Next, the second green sheet is placed on the upper surface of the above-mentioned sheet laminate, and is laminated and pressed by using a press device (step S28). The lamination order of the sheet laminate and the second green sheet is implemented so as to have the configuration described with reference to FIG.

Next, the sheet laminate is fired under predetermined temperature and atmosphere conditions (step S29). Thus, a laminate 101 is obtained. In this firing step, since the second green sheet is laminated integrally with the already-sintered laminate, the second green sheet hardly shrinks in the plane direction.

Finally, the input / output terminal 102 and the ground terminal 103 are formed on the outer surface of the multilayer body 101 to obtain the multilayer dielectric filter 100 (step S30).

As described above, in the method for manufacturing a ceramic laminate according to the present embodiment, first, the dielectric layers 115 to 119 are formed.
Is fired, and then the second green sheets corresponding to the dielectric layers 110 to 114 are laminated, so that the shrinkage of the second green sheet in the planar direction during firing is suppressed. be able to. Therefore, the manufacturing accuracy of the dielectric layers 110 to 114 and the electrodes formed on the layers is improved. Further, since a step of removing a member for suppressing shrinkage in the planar direction is not required, a ceramic laminate can be manufactured at a lower cost as compared with the above-described conventional method.

The second resonance element pieces 134 to 136 formed on the dielectric layer 115 and the input / output electrodes 137 and 13
Since 8 is formed on the sintered first green sheet, the manufacturing accuracy of each electrode is improved. In particular, in the present embodiment, the second resonance element pieces 134 to 136 and the input / output electrodes 137 and 138 are formed by a thin film forming method such as a dry process or a wet process. The laminated dielectric filter 100 has better quality characteristics (Q) as compared with a filter formed by using. That is, in this type of laminated dielectric filter, quality characteristics particularly in a high frequency band are important. One of the factors for improving the quality characteristics is the conductivity of the conductor forming the resonance element. In this embodiment, a resonance element having a higher conductivity can be formed more easily and more reliably than that formed by simultaneous firing, so that quality characteristics can be improved.

The embodiment of the present invention has been described above, but the present invention is not limited to this. The scope of the invention is indicated by the appended claims, and all modifications that fall within the meaning of each claim are included in the present invention.

That is, in the first embodiment, the printed wiring board has been described as an example of the ceramic laminate.
The layer structure and material of the printed wiring board may be other than those described in the present embodiment. Further, the present invention can be applied to a printed wiring board in which a resistor, a capacitor, an inductor, and a resonance element are embedded in an inner layer.

In the second embodiment, the multilayer dielectric filter has been described as an example of the ceramic multilayer body. However, the present invention can be applied to other multilayer electronic components. For example, it is a multilayer ceramic capacitor, a multilayer ceramic inductor, or the like.

[0057]

As described in detail above, according to the present invention,
The sintered ceramic body fired in the first firing step is a second ceramic body.
Since the green ceramic sheets laminated in the laminating step can be prevented from shrinking in the planar direction in the second firing step because they do not shrink in the firing step. Therefore, for example, a layer that does not require high accuracy, such as a layer that does not require formation of a conductor, is fired in the first firing step, and a layer that requires high accuracy is fired in the second firing step. If this is the case, the ceramic laminate can be manufactured with high precision. Further, since it is not necessary to prepare a separate member to prevent shrinkage in the plane direction unlike the prior art, a low-cost and high-precision ceramic laminate can be manufactured.

[Brief description of the drawings]

FIG. 1 is a sectional view of a printed wiring board manufactured according to a first embodiment;

FIG. 2 is a flowchart illustrating a manufacturing process of the printed wiring board according to the first embodiment.

FIG. 3 is an external perspective view of a multilayer dielectric filter manufactured according to a second embodiment.

FIG. 4 is an exploded perspective view of a laminated body of the laminated dielectric filter manufactured according to the second embodiment.

FIG. 5 is a flowchart illustrating a manufacturing process of the multilayer dielectric filter according to the second embodiment.

[Description of Symbols] 10 ... printed wiring board, 11-14 ... ceramic layer, 15 ...
Conductor pattern, 16: via hole, 100: laminated dielectric filter, 101: laminated body, 102: input / output terminal, 1
03: ground terminal, 121: first ground electrode, 1
22, 123, 150, 151 ... capacitance forming electrode, 124
To 126: wavelength shortening electrode, 127 to 129: first resonance element piece, 130, 139: coupling electrode, 134 to 136
.., Second resonance element pieces, 143 to 146, third resonance element pieces, 149, second ground electrode

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E001 AB03 AH01 AH09 5E082 AB03 KK01 5E346 AA12 AA24 CC02 CC17 CC32 CC37 CC39 DD16 DD17 DD23 DD34 EE24 EE30 FF01 GG04 GG06 GG08 GG09 HH21 HH33

Claims (6)

[Claims] A first firing step of firing a green ceramic sheet to obtain a sintered ceramic body; a laminating step of stacking a green ceramic sheet on the sintered ceramic body to obtain a laminate; And a second firing step of firing the ceramic laminate. 2. The method for producing a ceramic laminate according to claim 1, further comprising a conductor forming step of forming a conductor on a surface of the sintered ceramic body after the first firing step. 3. The method according to claim 2, wherein a thin film conductor is formed in the conductor forming step. 4. The method according to claim 3, wherein in the conductor forming step, the thin film conductor is formed by a dry process. 5. The method according to claim 3, wherein the conductor forming step forms the thin film conductor by a wet process. 6. The green ceramic sheet on which a conductive paste is printed in the laminating step, and the green ceramic sheet and the conductive paste are simultaneously fired in the second firing step. 5. The method for producing a ceramic laminate according to any one of the above items 5.