JP2002257502A5 - - Google Patents

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Publication number
JP2002257502A5
JP2002257502A5 JP2001059587A JP2001059587A JP2002257502A5 JP 2002257502 A5 JP2002257502 A5 JP 2002257502A5 JP 2001059587 A JP2001059587 A JP 2001059587A JP 2001059587 A JP2001059587 A JP 2001059587A JP 2002257502 A5 JP2002257502 A5 JP 2002257502A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001059587A
Other languages
Japanese (ja)
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JP2002257502A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001059587A priority Critical patent/JP2002257502A/ja
Priority claimed from JP2001059587A external-priority patent/JP2002257502A/ja
Priority to DE60232117T priority patent/DE60232117D1/de
Priority to EP02004297A priority patent/EP1239259B1/en
Priority to US10/086,747 priority patent/US6725557B2/en
Publication of JP2002257502A publication Critical patent/JP2002257502A/ja
Publication of JP2002257502A5 publication Critical patent/JP2002257502A5/ja
Pending legal-status Critical Current

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JP2001059587A 2001-03-05 2001-03-05 厚さ測定装置及び測定方法 Pending JP2002257502A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2001059587A JP2002257502A (ja) 2001-03-05 2001-03-05 厚さ測定装置及び測定方法
DE60232117T DE60232117D1 (de) 2001-03-05 2002-02-28 Verfahren zur Dickenmessung
EP02004297A EP1239259B1 (en) 2001-03-05 2002-02-28 Thickness measuring method
US10/086,747 US6725557B2 (en) 2001-03-05 2002-02-28 Thickness measuring apparatus and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001059587A JP2002257502A (ja) 2001-03-05 2001-03-05 厚さ測定装置及び測定方法

Publications (2)

Publication Number Publication Date
JP2002257502A JP2002257502A (ja) 2002-09-11
JP2002257502A5 true JP2002257502A5 (enExample) 2008-04-03

Family

ID=18919128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001059587A Pending JP2002257502A (ja) 2001-03-05 2001-03-05 厚さ測定装置及び測定方法

Country Status (4)

Country Link
US (1) US6725557B2 (enExample)
EP (1) EP1239259B1 (enExample)
JP (1) JP2002257502A (enExample)
DE (1) DE60232117D1 (enExample)

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* Cited by examiner, † Cited by third party
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ES2329342T3 (es) * 2002-12-11 2009-11-25 Ipsen International Gmbh Procedimiento para medir la cantidad de un componente absorbida por una pieza metalica en el curso de un tratamiento termoquimico.
JP4036268B2 (ja) 2004-08-06 2008-01-23 国立大学法人東北大学 超低膨張ガラス材料の線膨張係数評価方法
JP4792734B2 (ja) * 2004-11-30 2011-10-12 大日本印刷株式会社 接触式膜厚測定機およびその使用方法
JP4947949B2 (ja) * 2005-10-13 2012-06-06 株式会社東京精密 プローバ
JP5083678B2 (ja) * 2006-09-08 2012-11-28 株式会社ブイ・テクノロジー 光学的測長装置
JP4991365B2 (ja) * 2007-03-29 2012-08-01 カヤバ工業株式会社 寸法測定装置及び寸法測定方法
JP2008292374A (ja) * 2007-05-25 2008-12-04 Asahi Kasei Chemicals Corp 微多孔膜の厚みの測定方法及びそれに用いる装置
JP2009147320A (ja) * 2007-11-21 2009-07-02 Horiba Ltd 検査装置
CN101551233B (zh) * 2008-04-01 2011-06-08 深圳富泰宏精密工业有限公司 工件尺寸检测装置
CN101673695B (zh) * 2008-09-08 2011-01-26 京元电子股份有限公司 裸晶粒双面检测设备
KR100925525B1 (ko) * 2009-05-18 2009-11-06 황진성 자동차용 에어백커버의 테어라인 두께측정장치
JP5021014B2 (ja) * 2009-10-30 2012-09-05 日本碍子株式会社 積層体の形成方法
USD696147S1 (en) * 2011-12-09 2013-12-24 Hon Hai Precision Industry Co., Ltd. Optical module for image measuring system
JPWO2013105635A1 (ja) * 2012-01-13 2015-05-11 株式会社ニコン チャンバー装置
CN103217134A (zh) * 2012-01-19 2013-07-24 昆山思拓机器有限公司 一种应用于smt网板测量的夹持机构
SE537530C2 (sv) * 2013-04-26 2015-06-02 Plockmatic Int Ab Häftesframställningsmaskin med tjocklekssensor
CN103398688A (zh) * 2013-08-09 2013-11-20 昆山允可精密工业技术有限公司 一种表面高反薄板材厚度测量仪
CN104236423A (zh) * 2014-08-20 2014-12-24 成都市龙泉通惠实业有限责任公司 一种检测芯板厚度的装置
CN105222664B (zh) * 2015-09-24 2017-11-10 山东太古飞机工程有限公司 客改货飞机隔板结构盲区挠性测量工装
JP6990024B2 (ja) * 2016-12-22 2022-01-12 株式会社ミツトヨ 線膨張係数測定方法および測定装置
JP7255074B2 (ja) * 2018-03-02 2023-04-11 株式会社東京精密 形状測定装置
CN111141191A (zh) 2018-11-05 2020-05-12 康宁股份有限公司 用于确定产品的边缘部分的高度的方法和装置
CN111089705B (zh) * 2019-12-24 2021-08-31 南京宝凯通机械设备有限公司 一种光学镜片检测设备及检测方法
CN113267153B (zh) * 2021-06-10 2023-03-24 淮安帝泰华懋精密科技有限公司 一种fpc板上钢片厚度检测工装及方法

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US2352571A (en) * 1942-03-21 1944-06-27 Goodrich Co B F Thickness-measuring apparatus
GB577231A (en) 1944-03-21 1946-05-09 Stanislaw Richard Kiliszek Improvements in and relating to precision linear-dimension measuring instruments
US2412665A (en) 1944-05-27 1946-12-17 Western Electric Co Measuring apparatus
JPS62150102A (ja) * 1985-12-24 1987-07-04 Toshiba Corp 球体の寸法測定方法
FR2603982A1 (fr) 1986-09-11 1988-03-18 Dynafer Sa Palpeur de mesure de dimensions
JPH0255901A (ja) * 1988-08-22 1990-02-26 Sumitomo Electric Ind Ltd 厚み測定器
WO1991007683A1 (en) * 1989-11-09 1991-05-30 Insystems, Inc. Specimen review station
US4989031A (en) * 1990-01-29 1991-01-29 Nikon Corporation Projection exposure apparatus
US5307149A (en) * 1992-08-14 1994-04-26 Elwin M. Beaty Method and apparatus for zero force part placement
JP2816514B2 (ja) * 1992-11-16 1998-10-27 キヤノン株式会社 光学測定装置
EP0773372B1 (en) * 1995-10-13 2004-12-15 Kitano Engineering Co., Ltd. Rotation holding table for rotating and holding a storage disc thereon and a boss thereof
US5923408A (en) * 1996-01-31 1999-07-13 Canon Kabushiki Kaisha Substrate holding system and exposure apparatus using the same
US6151792A (en) * 1997-03-05 2000-11-28 Olec Corporation Registration system and method
AT411304B (de) * 1997-06-18 2003-11-25 Sez Ag Träger für scheibenförmige gegenstände, insbesondere silizium-wafer
WO1999012194A1 (en) 1997-08-29 1999-03-11 Nikon Corporation Temperature adjusting method and aligner to which this method is applied
JPH11210109A (ja) * 1998-01-28 1999-08-03 Nikon Corp 空調装置、隔壁及び露光装置
US6219931B1 (en) * 1998-03-10 2001-04-24 Northrop Grumman Corporation Target base for a measuring system
US6014886A (en) * 1998-06-30 2000-01-18 Seh America, Inc. Gauge block holder apparatus
JP2000065506A (ja) * 1998-08-24 2000-03-03 Ngk Insulators Ltd 厚さ測定用治具
US6286685B1 (en) * 1999-03-15 2001-09-11 Seh America, Inc. System and method for wafer thickness sorting
JP2000311933A (ja) * 1999-04-27 2000-11-07 Canon Inc 基板保持装置、基板搬送システム、露光装置、塗布装置およびデバイス製造方法ならびに基板保持部クリーニング方法
JP3822388B2 (ja) * 1999-07-09 2006-09-20 株式会社ミツトヨ 変位測定装置
US6496248B2 (en) * 2000-12-15 2002-12-17 Nikon Corporation Stage device and exposure apparatus and method
US6896929B2 (en) * 2001-08-03 2005-05-24 Applied Materials, Inc. Susceptor shaft vacuum pumping

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