JP2002248562A - 噴流半田槽 - Google Patents
噴流半田槽Info
- Publication number
- JP2002248562A JP2002248562A JP2001048395A JP2001048395A JP2002248562A JP 2002248562 A JP2002248562 A JP 2002248562A JP 2001048395 A JP2001048395 A JP 2001048395A JP 2001048395 A JP2001048395 A JP 2001048395A JP 2002248562 A JP2002248562 A JP 2002248562A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- jet
- molten solder
- molten
- work
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Molten Solder (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001048395A JP2002248562A (ja) | 2001-02-23 | 2001-02-23 | 噴流半田槽 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001048395A JP2002248562A (ja) | 2001-02-23 | 2001-02-23 | 噴流半田槽 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002248562A true JP2002248562A (ja) | 2002-09-03 |
| JP2002248562A5 JP2002248562A5 (enExample) | 2008-04-03 |
Family
ID=18909672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001048395A Pending JP2002248562A (ja) | 2001-02-23 | 2001-02-23 | 噴流半田槽 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002248562A (enExample) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4949159A (enExample) * | 1972-09-19 | 1974-05-13 | ||
| JPS6182965A (ja) * | 1984-09-28 | 1986-04-26 | Ginya Ishii | 噴流はんだ装置のはんだ酸化防止方法 |
| JPH05327203A (ja) * | 1992-05-20 | 1993-12-10 | Sony Corp | フローはんだ付け装置 |
| JPH0890217A (ja) * | 1994-09-16 | 1996-04-09 | Taisei Kaken:Kk | 自動半田付け方法、自動半田付け装置、噴射孔型半田噴流 ノズル及びフラックス塗布ブラシ装置 |
| JP2000196230A (ja) * | 1998-12-25 | 2000-07-14 | Aiwa Co Ltd | プリント基板の半田付け装置 |
-
2001
- 2001-02-23 JP JP2001048395A patent/JP2002248562A/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4949159A (enExample) * | 1972-09-19 | 1974-05-13 | ||
| JPS6182965A (ja) * | 1984-09-28 | 1986-04-26 | Ginya Ishii | 噴流はんだ装置のはんだ酸化防止方法 |
| JPH05327203A (ja) * | 1992-05-20 | 1993-12-10 | Sony Corp | フローはんだ付け装置 |
| JPH0890217A (ja) * | 1994-09-16 | 1996-04-09 | Taisei Kaken:Kk | 自動半田付け方法、自動半田付け装置、噴射孔型半田噴流 ノズル及びフラックス塗布ブラシ装置 |
| JP2000196230A (ja) * | 1998-12-25 | 2000-07-14 | Aiwa Co Ltd | プリント基板の半田付け装置 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080215 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080215 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100903 |
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| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100908 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20110105 |