JP2002232197A - 電子部品実装方法 - Google Patents

電子部品実装方法

Info

Publication number
JP2002232197A
JP2002232197A JP2001029616A JP2001029616A JP2002232197A JP 2002232197 A JP2002232197 A JP 2002232197A JP 2001029616 A JP2001029616 A JP 2001029616A JP 2001029616 A JP2001029616 A JP 2001029616A JP 2002232197 A JP2002232197 A JP 2002232197A
Authority
JP
Japan
Prior art keywords
electronic component
flexible substrate
base plate
component mounting
mounting method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001029616A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002232197A5 (enExample
Inventor
Minoru Yamamoto
実 山本
Kunio Sakurai
邦男 櫻井
Kurayasu Hamazaki
庫泰 濱崎
Hiroshi Ota
博 大田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2001029616A priority Critical patent/JP2002232197A/ja
Publication of JP2002232197A publication Critical patent/JP2002232197A/ja
Publication of JP2002232197A5 publication Critical patent/JP2002232197A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2001029616A 2001-02-06 2001-02-06 電子部品実装方法 Pending JP2002232197A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001029616A JP2002232197A (ja) 2001-02-06 2001-02-06 電子部品実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001029616A JP2002232197A (ja) 2001-02-06 2001-02-06 電子部品実装方法

Publications (2)

Publication Number Publication Date
JP2002232197A true JP2002232197A (ja) 2002-08-16
JP2002232197A5 JP2002232197A5 (enExample) 2005-02-10

Family

ID=18893938

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001029616A Pending JP2002232197A (ja) 2001-02-06 2001-02-06 電子部品実装方法

Country Status (1)

Country Link
JP (1) JP2002232197A (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3435157B1 (ja) 2002-05-13 2003-08-11 株式会社 大昌電子 保持搬送用治具及び保持搬送方法
JP2005129921A (ja) * 2003-10-01 2005-05-19 Shin Etsu Polymer Co Ltd 薄板用固定治具
US7077908B2 (en) 2003-05-30 2006-07-18 Matsushita Electric Industrial Co., Ltd. Substrate holder
JP2006203118A (ja) * 2005-01-24 2006-08-03 Sumitomo Bakelite Co Ltd フレキシブルプリント配線板
US7105221B2 (en) 2001-07-19 2006-09-12 Toray Industries, Inc. Circuit board, laminated member for circuit board, and method for making laminated member for circuit board
JP2008288553A (ja) * 2007-05-18 2008-11-27 Augux Co Ltd 集積回路を実装するラベル型フレキシブル回路基板の製作方法およびその構造
US7517419B2 (en) 2004-04-16 2009-04-14 Panasonic Corporation Substrate support jig, circuit board production apparatus, and method of producing circuit board
EP1589796A4 (en) * 2003-01-23 2009-08-05 Toray Industries PLATE FOR A PCB, METHOD FOR PRODUCING A PCB, DEVICE FOR PRODUCING A PCB
CN101951730A (zh) * 2010-10-11 2011-01-19 卓盈微电子（昆山）有限公司 单片柔性线路板载板
US8234780B2 (en) 2008-02-27 2012-08-07 Universal Instruments Corporation Substrate carrier system
JP2017045794A (ja) * 2015-08-25 2017-03-02 大日本印刷株式会社 部品実装薄膜配線基材の製造方法

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7534361B2 (en) 2001-07-19 2009-05-19 Toray Industries, Inc. Methods for making laminated member for circuit board, making circuit board and laminating flexible film
US7105221B2 (en) 2001-07-19 2006-09-12 Toray Industries, Inc. Circuit board, laminated member for circuit board, and method for making laminated member for circuit board
JP3435157B1 (ja) 2002-05-13 2003-08-11 株式会社 大昌電子 保持搬送用治具及び保持搬送方法
EP1589796A4 (en) * 2003-01-23 2009-08-05 Toray Industries PLATE FOR A PCB, METHOD FOR PRODUCING A PCB, DEVICE FOR PRODUCING A PCB
US7077908B2 (en) 2003-05-30 2006-07-18 Matsushita Electric Industrial Co., Ltd. Substrate holder
CN100428875C (zh) * 2003-05-30 2008-10-22 松下电器产业株式会社 基底保持器
JP2005129921A (ja) * 2003-10-01 2005-05-19 Shin Etsu Polymer Co Ltd 薄板用固定治具
US7517419B2 (en) 2004-04-16 2009-04-14 Panasonic Corporation Substrate support jig, circuit board production apparatus, and method of producing circuit board
JP2006203118A (ja) * 2005-01-24 2006-08-03 Sumitomo Bakelite Co Ltd フレキシブルプリント配線板
JP2008288553A (ja) * 2007-05-18 2008-11-27 Augux Co Ltd 集積回路を実装するラベル型フレキシブル回路基板の製作方法およびその構造
US8234780B2 (en) 2008-02-27 2012-08-07 Universal Instruments Corporation Substrate carrier system
CN101951730A (zh) * 2010-10-11 2011-01-19 卓盈微电子（昆山）有限公司 单片柔性线路板载板
JP2017045794A (ja) * 2015-08-25 2017-03-02 大日本印刷株式会社 部品実装薄膜配線基材の製造方法

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