JP2002226584A - 回復可能な結晶化度を有する溶融加工可能な熱可塑性ランダムコポリイミドおよびその製造方法 - Google Patents

回復可能な結晶化度を有する溶融加工可能な熱可塑性ランダムコポリイミドおよびその製造方法

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Publication number
JP2002226584A
JP2002226584A JP2001390580A JP2001390580A JP2002226584A JP 2002226584 A JP2002226584 A JP 2002226584A JP 2001390580 A JP2001390580 A JP 2001390580A JP 2001390580 A JP2001390580 A JP 2001390580A JP 2002226584 A JP2002226584 A JP 2002226584A
Authority
JP
Japan
Prior art keywords
melt
dianhydride
odpa
copolyimide
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001390580A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002226584A5 (https=
Inventor
Brian C Auman
シー．オウマン ブライアン
Jr William R Corcoran
アール．コーコラン ジュニア ウイリアム
John R Dodd
アール．ドッド ジョン
Mark A Guidry
エー．ガイドリー マーク
John D Summers
ディー．サマーズ ジョン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2002226584A publication Critical patent/JP2002226584A/ja
Publication of JP2002226584A5 publication Critical patent/JP2002226584A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1017—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)amine
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1014—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)anhydrid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Treatment Of Fiber Materials (AREA)
JP2001390580A 2000-12-21 2001-12-21 回復可能な結晶化度を有する溶融加工可能な熱可塑性ランダムコポリイミドおよびその製造方法 Pending JP2002226584A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/742,860 US6476177B2 (en) 2000-12-21 2000-12-21 Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes
US09/742,860 2000-12-21

Publications (2)

Publication Number Publication Date
JP2002226584A true JP2002226584A (ja) 2002-08-14
JP2002226584A5 JP2002226584A5 (https=) 2005-07-14

Family

ID=24986541

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001390580A Pending JP2002226584A (ja) 2000-12-21 2001-12-21 回復可能な結晶化度を有する溶融加工可能な熱可塑性ランダムコポリイミドおよびその製造方法

Country Status (4)

Country Link
US (1) US6476177B2 (https=)
EP (1) EP1217026B1 (https=)
JP (1) JP2002226584A (https=)
DE (1) DE60114131T2 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009041309A1 (ja) * 2007-09-28 2009-04-02 Fujifilm Corporation 溶融押出装置及び熱可塑性樹脂フィルムの製造方法
WO2012081644A1 (ja) * 2010-12-15 2012-06-21 宇部興産株式会社 ポリイミドシームレスベルト、その製造方法、ポリイミド前駆体溶液組成物
KR101430974B1 (ko) 2007-12-27 2014-08-19 에스케이씨코오롱피아이 주식회사 폴리이미드 필름 및 그 제조방법
JPWO2022085619A1 (https=) * 2020-10-22 2022-04-28

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6852826B2 (en) * 2001-12-21 2005-02-08 Kanera Corporation Manufacturing method of polyamic acid, and polyamic acid solution
US6956098B2 (en) * 2002-09-20 2005-10-18 E. I. Du Pont De Nemours And Company High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto
US7452944B2 (en) * 2004-06-28 2008-11-18 Sabic Innovative Plastics Ip B.V. Miscible polyimide blends
US20060194070A1 (en) * 2005-02-25 2006-08-31 Joshua Croll Polyetherimide film and multilayer structure
US8263691B2 (en) * 2006-02-21 2012-09-11 Sabic Innovative Plastics Ip B.V. Release agent for transparent polyimide blends
US20080118730A1 (en) * 2006-11-22 2008-05-22 Ta-Hua Yu Biaxially oriented film, laminates made therefrom, and method
US20080119616A1 (en) 2006-11-22 2008-05-22 General Electric Company Polyimide resin compositions
US8399573B2 (en) 2006-11-22 2013-03-19 Sabic Innovative Plastics Ip B.V. Polymer blend compositions
US8784993B2 (en) 2010-12-15 2014-07-22 General Electric Company High temperature high frequency magnet wire and method of making
WO2013003397A2 (en) * 2011-06-28 2013-01-03 E. I. Du Pont De Nemours And Company Polyimide-coated fillers
CN105778092B (zh) * 2016-03-09 2018-03-16 哈尔滨工业大学 一种聚醚酰亚胺高温热缩管及其制备方法
US10487177B2 (en) * 2016-08-04 2019-11-26 Tetramer Technologies, Inc. Copolymers exhibiting improved thermo-oxidative stability
CN106313474B (zh) * 2016-08-16 2019-04-19 李泽英 用于制备热塑性聚合物制品的挤出装置、设备和方法
CN112574565B (zh) * 2020-12-08 2023-04-25 黄山金石木塑料科技有限公司 低热膨胀芳香类冷压型聚酰亚胺树脂及其合成方法和应用

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3489725A (en) 1965-10-12 1970-01-13 American Cyanamid Co Process for the preparation of polyimides using a melt polymerization technique
US3803085A (en) 1972-12-29 1974-04-09 Gen Electric Method for making polyetherimides
US4073773A (en) 1976-12-30 1978-02-14 General Electric Company Melt polymerization method for making polyetherimides
US4281100A (en) 1979-05-09 1981-07-28 General Electric Company Injection moldable polyetherimide oligomers and method for making
US4485140A (en) 1983-09-21 1984-11-27 E. I. Du Pont De Nemours And Company Melt-fusible polyimides
US4590258A (en) 1983-12-30 1986-05-20 International Business Machines Corporation Polyamic acid copolymer system for improved semiconductor manufacturing
US4552931A (en) 1984-09-11 1985-11-12 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Process of end-capping a polyimide system
US4883718A (en) 1985-02-12 1989-11-28 Mitsui Toatsu Chemicals, Inc. Flexible copper-clad circuit substrate
GB2174399B (en) 1985-03-10 1988-05-18 Nitto Electric Ind Co Colorless transparent polyimide shaped articles and their production
US4837300A (en) 1985-06-20 1989-06-06 The United States Of America As Represented By The Administration Of The National Aeronautics And Space Administration Copolyimide with a combination of flexibilizing groups
JP2622678B2 (ja) 1987-01-12 1997-06-18 チッソ株式会社 溶融成形可能な結晶性ポリイミド重合体
US5116939A (en) 1987-08-11 1992-05-26 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polyimide processing additives
JP2574162B2 (ja) 1988-01-06 1997-01-22 チッソ株式会社 低融点ポリイミド共重合体
US5106938A (en) 1989-06-08 1992-04-21 General Electric Company Melt crystalline polyetherimides
US5077382A (en) 1989-10-26 1991-12-31 Occidental Chemical Corporation Copolyimide odpa/bpda/4,4'-oda or p-pda
US5171828A (en) 1989-10-26 1992-12-15 Occidental Chemical Corporation Copolyimide ODPA/BPDA/4,4'-ODA or P-PDA
US5145937A (en) 1989-11-09 1992-09-08 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polyimides with carbonyl and ether connecting groups between the aromatic rings
US5166308A (en) 1990-04-30 1992-11-24 E. I. Du Pont De Nemours And Company Copolyimide film with improved properties
US5268447A (en) 1990-06-01 1993-12-07 Mitsui Toatsu Chemicals, Inc. Readily processable polyimide and preparation process of same
EP0459801B1 (en) 1990-06-01 1997-08-06 MITSUI TOATSU CHEMICALS, Inc. Readily processable polyimide and preparation process of same
US5268446A (en) 1990-08-24 1993-12-07 Mitsui Toatsu Chemicals, Incorporated Readily processable polyimide and preparation process of same
DE69115171T2 (de) 1990-08-27 1996-05-15 Du Pont Flexible Polyimid-Mehrschichtlaminate und ihre Herstellung.
US5202412A (en) 1990-10-02 1993-04-13 E. I. Du Pont De Nemours And Company Polyimide copolymer precursors
US5219977A (en) 1990-12-17 1993-06-15 E. I. Du Pont De Nemours And Company Tetrapolyimide film containing oxydipthalic dianhydride
US5484879A (en) 1990-12-17 1996-01-16 Occidental Chemical Corporation Polyimides containing fluorine
EP0518543B1 (en) 1991-06-10 1997-03-12 MITSUI TOATSU CHEMICALS, Inc. Polyimide and process for the preparation thereof
US5406124A (en) 1992-12-04 1995-04-11 Mitsui Toatsu Chemicals, Inc. Insulating adhesive tape, and lead frame and semiconductor device employing the tape
US5302652A (en) 1992-12-15 1994-04-12 E. I. Du Pont De Nemours And Company Process for preparing a pigmented polyimide shaped article
US5478913A (en) 1993-12-22 1995-12-26 E. I. Du Pont De Nemours And Company Melt-processible polyimides with high Tg
US5502157A (en) 1994-08-31 1996-03-26 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Copolyimides prepared from ODPA, BTDA and 3,4'-ODA
US5478916A (en) 1994-09-01 1995-12-26 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Solvent resistant copolyimide
US5464928A (en) 1994-09-01 1995-11-07 The United States Of America As Represented By The United States National Aeronautics And Space Administration Direct process for preparing semi-crystalline polyimides
US5741883A (en) * 1994-12-16 1998-04-21 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Tough, soluble, aromatic, thermoplastic copolyimides
US6048959A (en) * 1994-12-16 2000-04-11 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Tough soluble aromatic thermoplastic copolyimides
US6114494A (en) * 1998-12-03 2000-09-05 Ranbar Electrical Materials, Inc. Polyimide material and method of manufacture

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009041309A1 (ja) * 2007-09-28 2009-04-02 Fujifilm Corporation 溶融押出装置及び熱可塑性樹脂フィルムの製造方法
JP2009083312A (ja) * 2007-09-28 2009-04-23 Fujifilm Corp 溶融押出装置及び熱可塑性樹脂フィルムの製造方法
KR101430974B1 (ko) 2007-12-27 2014-08-19 에스케이씨코오롱피아이 주식회사 폴리이미드 필름 및 그 제조방법
WO2012081644A1 (ja) * 2010-12-15 2012-06-21 宇部興産株式会社 ポリイミドシームレスベルト、その製造方法、ポリイミド前駆体溶液組成物
JPWO2022085619A1 (https=) * 2020-10-22 2022-04-28
JP7791097B2 (ja) 2020-10-22 2025-12-23 株式会社カネカ 非熱可塑性ポリイミドフィルム、複層ポリイミドフィルム、及び金属張積層板

Also Published As

Publication number Publication date
EP1217026A2 (en) 2002-06-26
US20020128424A1 (en) 2002-09-12
EP1217026B1 (en) 2005-10-19
DE60114131T2 (de) 2006-07-27
US6476177B2 (en) 2002-11-05
EP1217026A3 (en) 2003-03-26
DE60114131D1 (de) 2005-11-24

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