JP2002222753A - Aligner and method of adjusting position of its light source - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make excellent mix-and-match executable even when the lamp, etc., of a light source is exchanged without degrading the degree of telecentricity on an axis when exchanging the lamp, etc. SOLUTION: An aligner is provided with a sensor 14 which detects the angle between a light ray CL passing the light quantity centroid of light which illuminates the optical axis of a projection optical system 11 or the center of an illuminating area on the image surface 12 of the optical system 11 and the optical axis of the optical system 11 and light-source position adjusting means 17 and 20, etc., which move the lamp 1 in three axial directions crossing each other at right angles. A pattern plotted on an original plate is projected upon a substrate coated with a photosensitive material by moving the lamp 1 in at least two axial directions by means of the adjusting means 17 and 20 based on the detected results of the sensor 14, and illuminating the original plate with the light emitted from the lamp 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus for illuminating an original such as a mask on which a pattern is written using light emitted from an exposure light source and transferring and exposing the pattern to a substrate coated with a photosensitive agent. The present invention relates to an exposure apparatus used in a lithography process for manufacturing a semiconductor element, a liquid crystal display element, an imaging element (such as a CCD) or a thin-film magnetic head, and a light source position adjustment method thereof. ing.

[0002]

2. Description of the Related Art Light from a divergent light source, such as a high-pressure mercury lamp, is condensed by a condensing mirror to uniformly illuminate a mask on which a pattern is drawn, and the pattern is coated with a photosensitive agent using a projection optical system. An exposure apparatus that performs projection exposure on a substrate that has been used is used in a lithography process for manufacturing a semiconductor element or the like. In a high-pressure mercury lamp or the like, the light emission intensity decreases due to wear of the cathode / anode and blackening of the bulb while the light is emitted, and when the lamp reaches the end of its life, it goes out, ruptures, and turns off. Therefore, high pressure mercury lamps and the like need to be replaced when they reach a predetermined life. When the lamp is replaced, the tolerance of the lamp itself (cathode position, anode position, pole spacing, axial misalignment, etc.) and the reproducibility of the position of the lampholder holding the lamp will cause the lamp to emit light (bright spots). The positional relationship of the exposure apparatus changes, and the optical performance changes. Therefore, when the lamp is replaced, the lamp needs to be aligned.

As a conventional method of aligning a lamp, there is a method of adjusting the illuminance of a surface to be illuminated to be maximum, and a method of adjusting the illuminance of the surface to be illuminated proposed in the specification of Japanese Patent No. 2809081. A method for improving the uniformity and adjusting the light source position so that the average illuminance is the highest, JP-A-10-13512
A method of adjusting a light source position based on a light intensity distribution at a position having a relationship between a surface to be illuminated and a pupil, which is proposed in Japanese Patent Laid-Open Publication No. 3 (KOKAI) No. 3 (1999), is known.

[0004]

[Problems to be Solved by the Invention] In recent lithography processes, a mix-and-match system (Mix & Match system) in which exposure is performed in a plurality of exposure apparatuses instead of performing all the steps in one exposure apparatus is mainly used. It has become. This is because the fineness of the pattern varies depending on the process, so the fine pattern is exposed by a state-of-the-art exposure device, and the resolution is not high for coarse patterns, but the throughput is high and the running cost is low. This is to reduce the production cost by performing exposure with an apparatus having a low level. To obtain the optical performance required by this mix and match,
The conventional lamp alignment method is insufficient, and there is a problem that mixing and matching cannot be performed satisfactorily. Hereinafter, the optical performance required for performing mix and match will be described.

In the case of mix-and-match, in order to perform exposure with a plurality of exposure apparatuses, it is necessary to match the image forming positions between the apparatuses. In order to adjust the imaging position, there is a factor called telecentricity (parallelism between the light beam CL passing through the center of gravity of the light and the optical axis CL shown in FIG. 3 and the optical axis) in addition to suppressing variations in magnification and aberration between the apparatuses. In a process of manufacturing a semiconductor device or the like, when a process is performed later, the wiring formed in the previous process overlaps and a step occurs on the substrate. For this reason, when the amount of displacement from the image plane is different based on the step, the transfer position may be displaced by the step. For example, as shown in FIG. 3, it is assumed that there is a situation where a light beam CL passing through the center of gravity of the light amount is not perpendicular to the plate surface of the substrate but is oblique to the substrate having a step. In such a situation, when a lattice pattern as shown in FIG. 4A is exposed, an image is formed at the center of gravity of the light amount. Therefore, an image exposed on the substrate is shown in FIG. As a result, the lattice interval is extended at the step. In other words, in an exposure apparatus in which the light beam CL passing through the center of the light quantity is obliquely incident on the substrate, it is not possible to perform faithful pattern transfer when the substrate has a step. Therefore, as shown in FIG. 5, it is necessary for the light beam CL passing through the center of gravity of the light amount to be perpendicular to the plate surface of the substrate, that is, parallel to the optical axis in order to perform a good mix and match. . In particular, the light beam CL passing through the center of gravity of the light amount on the optical axis of the exposure apparatus
The degree of parallelism between the optical axis and the optical axis is called on-axis telecentricity, and is expressed by the amount of image shift when the substrate is defocused by 1 μm.
As shown in FIG. 3, when the angle formed by the light beam CL passing through the center of gravity of the light amount and the optical axis is large, "the on-axis telecentricity is poor".
The case where the light beam CL passing through the center of gravity of the light amount is parallel to the optical axis as shown in FIG.

The on-axis telecentricity is an amount that does not occur if the optical system is all coaxial, but is an amount that occurs due to the inclination of optical components, eccentricity such as optical axis deviation, and optical axis deviation between units. This is an amount that is also generated due to eccentricity such as a deviation of the optical axis of the lamp with respect to the condensing mirror and a tilt within the tolerance of the lamp. For this reason, the positional reproducibility of the candlestick is low, and there is a possibility that the on-axis telecentricity is deteriorated at the time of lamp replacement due to variations within the tolerance of each lamp. However, when adjusted by the lamp position adjustment method as in the prior art, the deteriorated on-axis telecentricity cannot be corrected, and the on-axis telecentricity changes to replace the lamp, and good mix-and-match cannot be performed. There was a problem.

[0007] The present invention provides an exposure apparatus and a light source position adjusting method capable of performing a good mix-and-match even when the lamp or the like is replaced without exacerbating the axial telecentricity when the lamp or the like of the light source is replaced. The purpose is to do.

[0008]

In order to achieve the above object, the present invention illuminates an original on which a pattern is drawn using light generated from a light source, and applies the pattern to a photosensitive agent by a projection optical system. An exposure apparatus for projecting onto the coated substrate, a unit for measuring an angle formed by a light ray passing through the center of gravity of the amount of illumination light illuminating the optical axis on the image plane of the projection optical system and the optical axis, and the light source Light source position adjusting means for moving the light source in three axis directions orthogonal to each other, wherein the light source is adjusted in at least two axial directions by the light source position adjusting means based on the measurement result of the angle measuring means. And In addition, the projection lens is a catadio optical system,
In the case where an off-axis area is used as an imaging area, such as an Offner optical system, instead of a means for measuring the angle formed by the light beam passing through the center of gravity and the optical axis, the amount of illumination light illuminating the optical axis. A means for measuring an angle formed between a light ray passing through the center of gravity of the illumination light illuminating the center of the illumination area and the optical axis is used.

Further, the present invention provides an exposure apparatus for illuminating an original on which a pattern is drawn using light generated from a light source and projecting the pattern onto a substrate coated with a photosensitive agent by a projection optical system. A first measuring means for measuring an angle between a light ray passing through the center of gravity of the amount of illumination light illuminating the optical axis on the image plane of the projection optical system and the optical axis, and a second measuring means for measuring the illuminance on the substrate Measuring means, and light source position adjusting means for moving the light source in three axial directions orthogonal to each other, the light source position adjusting means sets the light source to the optical axis based on the measurement result of the first measuring means. The light source may be moved in two orthogonal axes directions, and the light source may be moved in the optical axis direction based on the measurement result of the second measuring means. In the case where the projection lens has an off-axis region as an image forming region, such as a catadio optical system or an Offner optical system, as the first measuring means, the illumination light for illuminating the center of the illumination region is used. Means for measuring the angle between a light beam passing through the center of gravity and the optical axis is used.

Further, the present invention provides an exposure apparatus which illuminates an original on which a pattern is drawn by using light generated from a light source and projects the pattern onto a substrate coated with a photosensitive agent by a projection optical system. A first measuring means for measuring an angle between a light ray passing through the center of gravity of the illumination light illuminating the optical axis on the image plane of the projection optical system and the optical axis; A second measuring means for measuring the shape of the light source distribution; and a light source position adjusting means for moving the light source in three orthogonal directions orthogonal to each other, wherein the light source position adjusting means comprises:
The light source is moved in two axial directions orthogonal to the optical axis based on the measurement result of the first measuring means, and the light source is moved in the optical axis direction based on the measurement result of the second measuring means. It may be characterized. In the case where the projection lens has an off-axis region as an image forming region, such as a catadio optical system or an Offner optical system, as the first measuring means, the illumination light for illuminating the center of the illumination region is used. Means for measuring the angle between a light beam passing through the center of gravity and the optical axis is used.

The present invention also provides a light source of an exposure apparatus that illuminates an original on which a pattern is drawn by using light generated from a light source and projects the pattern onto a substrate coated with a photosensitive agent by a projection optical system. In the position adjustment method, an angle between a light ray passing through the center of gravity of the amount of illumination light illuminating the optical axis on the image plane of the projection optical system and the optical axis is measured, and the light source is determined based on the angle measurement result. May be moved in at least two axial directions to adjust the light source position. In this case, it is desirable to adjust the position of the light source to a position where a light beam passing through the center of gravity of the light quantity becomes parallel to the optical axis. When the projection lens has an off-axis region as an image forming region, such as a catadio optical system or an Offner optical system, the light passing through the center of gravity of the amount of illumination light illuminating the optical axis and the optical axis Instead of the means for measuring the angle formed by the optical axis, a means for measuring the angle formed by the light axis passing through the center of gravity of the amount of illumination light and the optical axis for illuminating the center of the illumination area is used.

The present invention also provides a light source of an exposure apparatus that illuminates an original on which a pattern is drawn using light generated from a light source and projects the pattern onto a substrate coated with a photosensitive agent by a projection optical system. In the position adjustment method, while measuring the angle between a light ray passing through the center of gravity and the optical axis of the amount of illumination light that illuminates the optical axis on the image plane of the projection optical system, and measuring the illuminance on the substrate, The light source is moved in two axial directions orthogonal to the optical axis based on the measurement result of the angle,
The position of the light source may be adjusted by moving the light source in the optical axis direction based on the measurement result of the illuminance on the substrate. In this case, it is desirable to adjust the position of the light source to a position where the measured value of the illuminance on the image plane is maximized. In the case where the projection lens has an off-axis region as an image forming region, such as a catadio optical system or an Offner optical system, the light passing through the center of gravity of the amount of illumination light illuminating the optical axis and the optical axis Instead of the means for measuring the angle formed by the optical axis, a means for measuring the angle formed by the light axis passing through the center of gravity of the amount of illumination light and the optical axis for illuminating the center of the illumination area is used.

Further, the present invention provides a light source of an exposure apparatus for illuminating an original on which a pattern is drawn using light generated from a light source and projecting the pattern onto a substrate coated with a photosensitive agent by a projection optical system. In the position adjustment method, an angle between a light ray passing through the center of gravity of the amount of illumination light illuminating the optical axis on the image plane of the projection optical system and the optical axis is measured, and an effective angle on a pupil plane of the projection optical system is measured. Measuring the light source distribution, moving the light source in two axial directions orthogonal to the optical axis based on the measurement result of the angle, and moving the light source in the optical axis direction based on the measurement result of the effective light source distribution It may be characterized in that the position of the light source is adjusted. In this case, it is desirable to adjust the position of the light source to a position where the effective light source distribution becomes a desired distribution. In the case where the projection lens has an off-axis region as an image forming region, such as a catadio optical system or an Offner optical system, the light passing through the center of gravity of the amount of illumination light illuminating the optical axis and the optical axis Instead of the means for measuring the angle formed by the optical axis, a means for measuring the angle formed by the light axis passing through the center of gravity of the light quantity of the illumination light illuminating the center of the illumination area and the optical axis is used. The present invention is also applicable to a method for manufacturing a semiconductor device, wherein a device is manufactured by using any one of the above-described methods for adjusting a light source position of an exposure apparatus.

In the exposure apparatus or the light source position adjusting method according to the present invention, the lamp is replaced by measuring the on-axis telecentricity so as to improve the on-axis telecentricity. This makes it possible to perform exposure with a good on-axis telecentricity, and to perform good mix-and-match.

The position of the three axes of the lamp may be controlled by looking at the on-axis telecentricity. However, by adjusting only the optical axis deviation, the on-axis telecentricity can be improved. Only two axes are adjusted by looking at the on-axis telecentricity, and in the optical axis direction, the illuminance on the image plane is maximized as in the related art.
Alternatively, the adjustment may be made by checking the effective light source distribution on the pupil plane of the projection optical system.

Further, according to the present invention, a manufacturing apparatus group for various processes including any of the above exposure apparatuses is installed in a semiconductor manufacturing factory, and a semiconductor device is manufactured by a plurality of processes using the manufacturing apparatus group. And a method of manufacturing a semiconductor device having a process. Connecting the group of manufacturing apparatuses via a local area network, and performing data communication of information on at least one of the group of manufacturing apparatuses between the local area network and an external network outside the semiconductor manufacturing plant. Preferably, a database provided by a vendor or a user of the exposure apparatus is accessed via the external network to obtain maintenance information of the manufacturing apparatus by data communication, or a semiconductor manufacturing factory different from the semiconductor manufacturing factory It is preferable to perform production management by performing data communication with the external network via the external network.

Further, the present invention provides a manufacturing apparatus group for various processes including any one of the above-described exposure apparatuses, a local area network connecting the manufacturing apparatus group, and an external network outside the factory from the local area network. The present invention is also applicable to a semiconductor manufacturing factory that has a gateway that enables the data communication of information on at least one of the manufacturing apparatus groups.

The present invention also relates to a maintenance method for any one of the above-described exposure apparatuses installed in a semiconductor manufacturing factory, wherein a vendor or a user of the exposure apparatus uses a maintenance database connected to an external network of the semiconductor manufacturing factory. Providing access to the maintenance database from within the semiconductor manufacturing plant via the external network, and storing the maintenance information stored in the maintenance database on the semiconductor manufacturing plant side via the external network. To the maintenance method of the exposure apparatus having the step of transmitting to the exposure apparatus.

According to the present invention, in any one of the above-described exposure apparatuses, the apparatus further includes a display, a network interface, and a computer that executes network software, and transmits maintenance information of the exposure apparatus through a computer network. It may be characterized in that it is possible to do so. The network software is connected to an external network of a factory where the exposure apparatus is installed, and provides a user interface on the display for accessing a maintenance database provided by a vendor or a user of the exposure apparatus on the display. It is preferable to be able to obtain information from the database via.

[0020]

(First Embodiment) FIG. 1 is a block diagram showing an exposure apparatus according to an embodiment of the present invention. In FIG. 1, reference numeral 1 denotes a divergent light source such as a high-pressure mercury lamp. 3
Denotes a shutter, which controls an exposure amount by opening and closing. 4
Is an internal reflection member, which has the function of making the uneven light source distribution uniform on the incident surface on the exit surface. However, the inner reflection member 4
If the length is finite, it cannot be completely uniformized, and the influence of the optical axis deviation of the lamp 1 and the inclination of the internal reflection member 4 appears on the exit surface. Reference numeral 5 denotes a condenser lens, which substantially forms an image of the exit surface of the inner reflecting member 4 on the incident surface of the fly-eye lens 6. The fly-eye lens 6 is an integrator that performs wavefront division, and forms a secondary light source image on the exit surface. Reference numeral 7 denotes a condenser lens, which illuminates the surface of the masking blade 8 with uniform illuminance in a superimposed manner by using a large number of secondary light source images formed on the exit surface of the fly-eye lens 6 as an effective light source.

Reference numeral 8 denotes a masking blade, which is a stop for limiting the size of the illumination area. Reference numeral 9 denotes an imaging lens, which uniformly illuminates the reticle surface by projecting the position of the masking blade 8 onto the reticle surface. Reference numeral 10 denotes a reticle as an original on which a pattern is written. The reticle 10 is projected by a projection optical system 11 onto a substrate coated with a photosensitive agent placed on an image plane 12 of the projection optical system. Reference numeral 13 denotes a stage, which can move the sensor 14 to a desired position when measuring a step at the time of performing exposure and optical performance such as uneven illuminance and on-axis telecentricity.

Reference numeral 15 denotes a half mirror for splitting light for controlling the exposure amount from the optical path, and reference numeral 16 denotes a sensor for measuring the exposure amount for controlling the exposure amount. Reference numeral 17 denotes a computer that performs control and calculation according to the outputs of the sensors 14 and 16. Reference numeral 20 denotes a lamp stage, which is a computer 1
7 is driven to adjust the position of the lamp 1 in accordance with a command from the controller 7.

FIG. 2 is a configuration diagram showing that the on-axis telecentricity is measured using the exposure apparatus according to the embodiment shown in FIG. To measure the on-axis telecentricity, a pinhole is placed on an axis at a position conjugate to the image plane 12 of the projection optical system 11, and the light intensity distribution is measured at a position defocused from the image plane 12, thereby obtaining an image plane. The angle distribution at 12 may be measured.

In the embodiment shown in FIG. 1, the method of measuring the on-axis telecentricity is as follows.
A pinhole is formed on the image plane 12 of the projection optical system 11 conjugate with the surface of the masking blade 8, and the stage 13 is moved in the optical axis direction to defocus the sensor 14 from the image plane 12 of the projection optical system 11. The image plane 12 of the projection optical system 11
Measure the position distribution at the place defocused from. The position distribution may be measured by moving the sensor 14 on the measurement surface, or may be measured collectively by a flat sensor.
From the data measured by the sensor 14, the computer 17 calculates the center of gravity of the light quantity and calculates the on-axis telecentricity.

FIG. 7 is a flowchart showing the lamp position adjusting method according to the first embodiment of the present invention.
This will be described below. Lamp 1 reaches its end of life,
Alternatively, when the lamp 1 is replaced for some reason, in step S1, the exposure apparatus is driven to measure the on-axis telecentricity shown in FIG. 2 and the on-axial telecentricity is measured.
In step S2, the computer 17 determines whether or not the measured value of the on-axis telecentricity is within a standard value.
Based on this determination, in step S3, the computer 1
7, the lamp stage 20 is controlled to adjust the position of the lamp 1 so that the on-axis telecentricity becomes good. When it is confirmed that the measured value of the on-axis telecentricity is within the standard value, the lamp position adjustment ends. The position of the lamp 1 as a light source may be adjusted by measuring the on-axis telecentricity and adjusting the position of the lamp 1 so as to follow the on-axis telecentricity. The on-axis telecentricity may be measured by shaking the position of the lamp 1 within the reproducibility range, and the lamp 1 may be adjusted to a position where the on-axis telecentricity is the best. By adjusting the light source position in this manner, exposure can be performed with a good on-axis telecentricity even when the light source is replaced, and good mix and match can be performed. When the projection lens has an off-axis region as an imaging region, such as a catadio optical system or an Offner optical system, the illumination light for illuminating the center of the illumination region is used instead of the on-axis telecentricity. The position of the light source may be adjusted by measuring the angle between the light axis passing through the center of gravity of the light quantity and the optical axis. In that case, to measure the angle between the light axis passing through the center of gravity and the optical axis of the amount of illumination light that illuminates the center of the illumination area, a pinfall is placed at the center of the illumination area, and the position distribution is determined at the defocused position. Should be measured.

(Second Embodiment) The second embodiment of the present invention utilizes the fact that the on-axis telecentricity occurs mainly due to the eccentricity in the direction perpendicular to the optical axis. The on-axis telecentricity is tracked in two directions perpendicular to the optical axis, and the illuminance is adjusted to be maximum in the optical axis direction. FIG. 8 shows a flowchart of the lamp position adjusting method according to the present embodiment,
Hereinafter, the present embodiment will be described. When the lamp is replaced, first, as in the first embodiment, step S1 is performed.
In step S2, the computer 17 determines whether or not the measured value of the on-axis telecentricity is within a standard value. If the value of the on-axis telecentricity is not within the standard value, the lamp position is adjusted by driving the lamp stage 20 in two directions perpendicular to the optical axis to a position where a good on-axis telecentricity is obtained in step S4. . Next, when the value of the on-axis telecentricity is within the standard value, in step S5, the masking blade 8 is opened, the stage 13 is driven, and the sensor 14 is arranged on the image plane 12 of the projection optical system 11,
Measure the image plane illuminance. In step S6, it is determined whether the measured value of the image plane illuminance is the maximum illuminance, and the computer 17 drives the lamp stage 20 in the optical axis direction to a position where the maximum image plane illuminance is obtained based on the determination result. The lamp position is controlled (step S10). When it is confirmed by the lamp position control that the value of the measured image plane illuminance is the maximum illuminance, the lamp position adjustment ends. By adjusting the light source position in this manner, exposure can be performed with good on-axis telecentricity even when the light source is replaced, good mix and match can be performed, and throughput can be improved with maximum image plane illuminance. High exposure can be performed. When the projection lens has an off-axis region as an imaging region, such as a catadio optical system or an Offner optical system, the illumination light for illuminating the center of the illumination region is used instead of the on-axis telecentricity. The position of the light source may be adjusted by measuring the angle between the light axis passing through the center of gravity of the light quantity and the optical axis.

(Third Embodiment) A third embodiment of the present invention utilizes the fact that the on-axis telecentricity is generated mainly by eccentricity in a direction perpendicular to the optical axis. In this case, the on-axis telecentricity is tracked in two directions perpendicular to the optical axis, and adjustment is made in the optical axis direction so as to provide a desired effective light source. FIG. 9 shows a flowchart of the lamp position adjusting method according to the present embodiment, and the present embodiment will be described below. When the lamp 1 is replaced, first, the axial telecentricity is measured in step S1 as in the first embodiment, and the measured value of the axial telecentricity is set within the standard value in step S2. It is determined by the computer 17 whether or not there is. If the value of the on-axis telecentricity is not within the standard value, the lamp position is adjusted by driving the lamp stage 20 in two directions perpendicular to the optical axis to a position where a good on-axis telecentricity is obtained in step S4. . If the value of the on-axis telecentricity is within the standard value, step S8
To measure the effective light source distribution. The effective light source distribution can be measured by measuring the angular distribution on the image plane, similarly to the measurement of the on-axis telecentricity. The on-axis telecentricity is obtained from the center of gravity of the light amount distribution. For example, if the effective σ is a desired value, it is obtained by calculating the moment of the light amount distribution. In the present embodiment, it is determined whether or not the measured angular distribution on the image plane matches a desired distribution (step S9), and a predetermined operation is performed by the computer 17, and the operation result becomes a desired value. Thus, the lamp position is controlled (step S10) by driving the lamp stage 20 in the optical axis direction.

For example, in order to set the effective σ to a desired value, a moment is calculated from the angular distribution, and the lamp stage is driven in the optical axis direction so that the moment becomes the desired value. When it is confirmed that the calculation result has a desired value and a desired distribution has been obtained, the lamp position adjustment ends.

By adjusting the position of the light source as in this embodiment, exposure can be performed with a good on-axis telecentricity even when the light source is exchanged, a good mix-and-match can be performed, and a desired effective Since exposure can be performed with a light source distribution, stable image performance can be obtained. The effective light source distribution may be measured by measuring the light intensity distribution on the pupil plane of the projection optical system. When the projection lens has an off-axis region as an imaging region, such as a catadio optical system or an Offner optical system, the illumination light for illuminating the center of the illumination region is used instead of the on-axis telecentricity. The position of the light source may be adjusted by measuring the angle between the light axis passing through the center of gravity of the light quantity and the optical axis.

FIG. 6 is a view showing a measurement method different from the method of measuring the angle distribution on the image plane described with reference to FIG. The difference from the measurement method shown in FIG. 2 is that the stage 13 is not defocused, but a pinhole is formed at a position defocused from the object plane of the projection optical system 11, and the image plane 12 of the projection optical system 11 is defocused. This is to measure the angle distribution by measuring the light intensity distribution. Since the conjugate plane of the pinhole at the position defocused from the object plane of the projection optical system 11 deviates from the image plane (substrate position) of the projection optical system 11, the pinhole forms an image at the defocused position from above the substrate, If the position distribution of the light intensity on the substrate is measured, the angle distribution of the position of the pinhole can be measured. The position distribution may be measured by moving the sensor 14 on the measurement surface, or may be measured collectively by a flat sensor. As a method of forming a pinhole at a position defocused from the object plane of the projection optical system, the pinhole reticle may be formed by placing the reticle on a reticle stage and driving the reticle stage in the optical axis direction. The pattern surface may be defocused from the object surface of the projection optical system by turning over the pinhole reticle without defocusing. Further, a configuration may be adopted in which a tool aperture having the same effect can be inserted into the defocused position.

The configuration of the illumination optical system is not essential to the present invention. In an exposure apparatus that performs exposure using light from a light source, the position of the light source is adjusted on-axis telecentricity or illumination. It is within the technical scope of the present invention if it is performed while observing the angle formed by the light axis passing through the center of gravity of the light and the optical axis of the illumination light illuminating the center of the area.

Further, in the exposure apparatus or the light source position adjusting method according to the present invention, an example in which the position of the light source is automatically adjusted is used in the description of the above-described embodiment.
The lamp stage 20 may be driven manually, or an operator may adjust the position of the lamp 1 based on the measurement result instead of the automatic adjustment by the computer 17.

(Embodiment of Semiconductor Production System)
A semiconductor device (a semiconductor chip such as an IC or an LSI) using the exposure apparatus or the light source position adjusting method thereof according to the present invention.
An example of a production system for a liquid crystal panel, a CCD, a thin-film magnetic head, a micromachine, and the like will be described. In this system, maintenance services such as troubleshooting and periodic maintenance of a manufacturing apparatus installed in a semiconductor manufacturing factory or provision of software are performed using a computer network outside the manufacturing factory.

FIG. 10 shows the entire system cut out from a certain angle. In the figure, reference numeral 101 denotes a business establishment of a vendor (apparatus supply maker) that provides a semiconductor device manufacturing apparatus. Examples of manufacturing equipment include semiconductor manufacturing equipment for various processes used in a semiconductor manufacturing plant, such as pre-processing equipment (lithography equipment such as exposure equipment, resist processing equipment, etching equipment, heat treatment equipment, film formation equipment, flattening equipment, etc.). Equipment and post-process equipment (assembly equipment, inspection equipment, etc.). A host management system 1 that provides a maintenance database for manufacturing equipment in the business office 101
08, a plurality of operation terminal computers 110, and a local area network (LAN) 109 connecting these to construct an intranet or the like. The host management system 108 has a gateway for connecting the LAN 109 to the Internet 105, which is an external network of the office, and a security function for restricting external access.

On the other hand, reference numerals 102 to 104 denote manufacturing factories of semiconductor manufacturers as users of the manufacturing apparatus. The manufacturing factories 102 to 104 may be factories belonging to different manufacturers or factories belonging to the same manufacturer (for example, a factory for a pre-process, a factory for a post-process, etc.). In each of the factories 102 to 104, a plurality of manufacturing apparatuses 106, a local area network (LAN) 111 connecting them to construct an intranet or the like, and a host as a monitoring apparatus for monitoring the operation status of each manufacturing apparatus 106 are provided. A management system 107 is provided. Each factory 1
Host management system 107 provided in the storage system 02 to 104
Has a gateway for connecting the LAN 111 in each factory to the Internet 105 which is an external network of the factory. As a result, access to the host management system 108 on the vendor 101 side from the LAN 111 of each factory via the Internet 105 is possible, and access is allowed only to limited users by the security function of the host management system 108. In particular,
Via the Internet 105, status information indicating the operation status of each manufacturing apparatus 106 (for example, the symptom of the manufacturing apparatus in which a trouble has occurred) is notified from the factory side to the vendor side, and response information corresponding to the notification (for example, (Information indicating how to cope with a trouble, software and data for coping), and maintenance information such as the latest software and help information can be received from the vendor. For data communication between each of the factories 102 to 104 and the vendor 101 and data communication with the LAN 111 in each of the factories, a communication protocol (T
CP / IP) is used. Instead of using the Internet as an external network outside the factory, it is also possible to use a dedicated line network (such as ISDN) that cannot be accessed by a third party and has high security. Further, the host management system is not limited to the one provided by the vendor, and a user may construct a database and place it on an external network, and permit access from a plurality of factories of the user to the database.

FIG. 11 is a conceptual diagram showing the entire system according to the present embodiment cut out from a different angle from FIG. In the above example, a plurality of user factories each having a manufacturing device and a management system of a vendor of the manufacturing device are connected via an external network, and the production management of each factory and at least one device are connected via the external network. The data of the manufacturing apparatus was communicated. On the other hand, in this example, a factory equipped with manufacturing equipment of a plurality of vendors is connected to a management system of each of the plurality of manufacturing equipments via an external network outside the factory, and maintenance information of each manufacturing equipment is stored. It is for data communication. In the figure, reference numeral 201 denotes a manufacturing plant of a manufacturing apparatus user (semiconductor device manufacturer), and a manufacturing line for performing various processes, for example, an exposure apparatus 202, a resist processing apparatus 203;
A film forming apparatus 204 is introduced. Although only one manufacturing factory 201 is illustrated in FIG. 11, a plurality of factories are actually networked similarly. Each device in the factory is connected by a LAN 206 to form an intranet, and the host management system 205 manages the operation of the production line.

On the other hand, each business establishment of a vendor (apparatus maker) such as an exposure apparatus maker 210, a resist processing apparatus maker 220, and a film forming apparatus maker 230 has a host management system 21 for remote maintenance of the supplied equipment.
1, 211, and 231 which include a maintenance database and an external network gateway as described above. A host management system 205 for managing each device in the user's manufacturing plant, and a vendor management system 2 for each device
11, 221, and 231 are connected by the Internet or a dedicated line network which is the external network 200. In this system, if a trouble occurs in any of a series of manufacturing equipment on the manufacturing line,
Although the operation of the production line is paused, quick response is possible by receiving remote maintenance via the Internet 200 from the vendor of the troubled device, and the suspension of the production line can be minimized. .

Each of the manufacturing apparatuses installed in the semiconductor manufacturing factory has a display, a network interface, and a computer that executes network access software and apparatus operation software stored in a storage device. The storage device is a built-in memory, a hard disk, a network file server, or the like. The network access software includes a dedicated or general-purpose web browser, and provides, for example, a user interface having a screen as shown in FIG. 12 on a display. The operator who manages the manufacturing equipment at each factory refers to the screen and refers to the manufacturing equipment model 401, the serial number 402, the trouble subject 4
03, date of occurrence 404, degree of urgency 405, symptom 406, coping method 407, progress 408, and other information are input to input items on the screen. The input information is transmitted to the maintenance database via the Internet, and the resulting appropriate maintenance information is returned from the maintenance database and presented on the display. Further, the user interface provided by the web browser further includes a hyperlink function 410 as shown in the figure.
412, the operator can access more detailed information of each item, extract the latest version of software used for manufacturing equipment from the software library provided by the vendor, and operate the operation guide (help Information). Here, the maintenance information provided by the maintenance database includes the information on the present invention described above, and the software library also provides the latest software for realizing the present invention.

Next, a semiconductor device manufacturing process using the above-described production system will be described. FIG. 13 shows a flow of the entire semiconductor device manufacturing process.
In step 1 (circuit design), the circuit of the semiconductor device is designed. Step 2 is a process for making a mask on the basis of the circuit pattern design. Step 3
In (wafer manufacture), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and assembly such as an assembly process (dicing and bonding) and a packaging process (chip encapsulation). Process. In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7). The pre-process and the post-process are performed in separate dedicated factories, and maintenance is performed for each of these factories by the above-described remote maintenance system. Further, information for production management and apparatus maintenance is also communicated between the pre-process factory and the post-process factory via the Internet or a dedicated line network.

FIG. 14 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. Step 1
In 5 (resist processing), a photosensitive agent is applied to the wafer. Step 16 (exposure) uses the above-described exposure apparatus to print and expose the circuit pattern of the mask onto the wafer. Step 17 (development) develops the exposed wafer. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. Since the manufacturing equipment used in each process is maintained by the remote maintenance system described above, troubles can be prevented beforehand, and if troubles occur, quick recovery is possible. Can be improved in productivity.

[0041]

By adjusting the position of the light source according to the present invention, the on-axis telecentricity is good and a good mix-and-match can be obtained even if the light source is replaced.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing an exposure apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating a method of measuring the on-axis telecentricity in the embodiment of the present invention.

FIG. 3 is a ray diagram in a case where non-telecene light is incident when a substrate has a step.

FIG. 4 is a plan view showing a reticle pattern and a transfer pattern in the state of FIG. 3;

FIG. 5 is a ray diagram in a case where telecentric light is incident when a substrate has a step.

FIG. 6 is a diagram illustrating a method of measuring the on-axis telecentricity different from FIG. 2 in the embodiment of the present invention.

FIG. 7 shows a flowchart according to the first embodiment of the present invention.

FIG. 8 shows a flowchart in the second embodiment of the present invention.

FIG. 9 shows a flowchart in the third embodiment of the present invention.

FIG. 10 is a conceptual view of a semiconductor device production system using an exposure apparatus or a light source position adjusting method according to the present invention as viewed from a certain angle.

FIG. 11 is a conceptual diagram of a semiconductor device production system using the exposure apparatus or the light source position adjusting method according to the present invention as viewed from another angle.

FIG. 12 is a specific example of a user interface.

FIG. 13 is a diagram illustrating a flow of a device manufacturing process.

FIG. 14 is a diagram illustrating a wafer process.

[Explanation of symbols]

1: lamp (light source), 3: shutter, 6: fly-eye lens, 8: masking blade, 10: reticle, 1
1: Projection optical system, 12: Image plane, 13: Stage, 14:
Sensor (constituting first measuring means), 16: (constituting second measuring means), 17: computer, 20: lamp stage, CL: light amount of illumination light passing through center of gravity, 1
01: Vendor's office, 102, 103, 104: Manufacturing factory, 105: Internet, 106: Manufacturing equipment, 1
07: factory host management system, 108: vendor host management system, 109: vendor local area network (LAN), 110: operation terminal computer, 111: factory local area network (L)
AN), 200: external network, 201: manufacturing apparatus user's manufacturing factory, 202: exposure apparatus, 203: resist processing apparatus, 204: film formation processing apparatus, 205: factory host management system, 206: factory local area network (LAN), 210: exposure apparatus maker, 21
1: a host management system for an office of an exposure apparatus maker;
20: resist processing equipment maker, 221: host management system of a business of the resist processing equipment maker, 230: film forming equipment maker, 231: host management system of the business establishment of the film forming equipment maker, 401: model of manufacturing equipment, 402 : Serial number, 403: trouble subject, 404: date of occurrence, 405: urgency, 406: symptom, 407: remedy, 408: progress, 410, 411, 412: hyperlink function.

Claims (17)

[Claims] 1. An exposure apparatus for illuminating an original on which a pattern is drawn using light generated from a light source and projecting the pattern onto a substrate coated with a photosensitive agent by a projection optical system. Means for measuring an angle between a light ray passing through the center of gravity of the illumination light on the optical axis or the center of the illumination area on the image plane and the optical axis, and a light source for moving the light source in three orthogonal directions orthogonal to each other Comprising a position adjusting means, based on a measurement result of the means for measuring the angle,
An exposure apparatus, wherein the light source is moved in at least two axial directions by the light source position adjusting means. 2. An exposure apparatus for illuminating an original on which a pattern is drawn by using light generated from a light source and projecting the pattern onto a substrate coated with a photosensitive agent by a projection optical system. A first measuring means for measuring an angle between a light ray passing through the center of gravity of the illumination light on the optical axis or the center of the illumination area on the image plane and the optical axis; and a second measuring means for measuring the illuminance on the substrate. And a light source position adjusting means for moving the light source in three axial directions orthogonal to each other, the light source position adjusting means moving the light source to the optical axis based on the measurement result of the first measuring means. An exposure apparatus for moving the light source in the optical axis direction based on the measurement result of the second measurement means. 3. An exposure apparatus for illuminating an original on which a pattern is drawn by using light generated from a light source and projecting the pattern on a substrate coated with a photosensitive agent by a projection optical system. First measuring means for measuring an angle between a light ray passing through the center of gravity of the illumination light and the optical axis on the optical axis or the center of the illumination area on the image plane of the projection optical system; A second measuring unit for measuring an effective light source distribution; and a light source position adjusting unit for moving the light source in three orthogonal directions, wherein the light source position adjusting unit is configured to perform a measurement based on a measurement result of the first measuring unit. An exposure apparatus for moving the light source in two axial directions orthogonal to the optical axis, and moving the light source in the optical axis direction based on the measurement result of the second measuring means. 4. A method for adjusting the position of a light source in an exposure apparatus, which illuminates an original on which a pattern is drawn by using light generated from a light source and projects the pattern on a substrate coated with a photosensitive agent by a projection optical system. Measuring the angle between a light ray passing through the center of gravity of the amount of illumination light on the optical axis or the center of the illumination area on the image plane of the projection optical system and the optical axis, and based on the measurement result of the angle, A light source position adjusting method for an exposure apparatus, wherein the light source position is adjusted by moving the light source in at least two axial directions. 5. A light source position adjusting method for an exposure apparatus, which illuminates an original on which a pattern is drawn by using light generated from a light source and projects the pattern onto a substrate coated with a photosensitive agent by a projection optical system. Measuring the angle between the optical axis and the light passing through the center of gravity of the amount of illumination light on the optical axis or the center of the illumination area on the image plane of the projection optical system, and measuring the illuminance on the substrate, The light source is moved in two axis directions orthogonal to the optical axis based on the measurement result of the angle, and the light source is moved in the optical axis direction based on the measurement result of the illuminance on the substrate to adjust the light source position. A method for adjusting the position of a light source in an exposure apparatus. 6. A light source position adjusting method for an exposure apparatus, which illuminates an original on which a pattern is drawn by using light generated from a light source and projects the pattern on a substrate coated with a photosensitive agent by a projection optical system. Measuring the angle between the optical axis and the light passing through the center of gravity of the amount of illumination light on the optical axis or the center of the illumination area on the image plane of the projection optical system, and on the pupil plane of the projection optical system. The effective light source distribution is measured, and the light source is moved in two axial directions orthogonal to the optical axis based on the measurement result of the angle, and the light source is moved in the optical axis direction based on the measurement result of the effective light source distribution. A light source position adjustment method for an exposure apparatus, comprising: 7. The light source position adjustment of the exposure apparatus according to claim 4, wherein the position of the light source is adjusted to a position where a light beam passing through the light quantity gravity center becomes parallel to the optical axis. Method. 8. The method according to claim 5, wherein the position of the light source is adjusted to a position where the measured value of the illuminance on the image plane is maximized. 9. The method according to claim 6, wherein the position of the light source is adjusted to a position where the effective light source distribution becomes a desired distribution. 10. A method for manufacturing a semiconductor device, comprising manufacturing a device using the light source position adjusting method for an exposure apparatus according to claim 4. Description: 11. A step of installing a manufacturing apparatus group for various processes including the exposure apparatus according to claim 1 in a semiconductor manufacturing factory, and a semiconductor device by a plurality of processes using the manufacturing apparatus group. Manufacturing a semiconductor device. 12. A step of connecting the manufacturing equipment group via a local area network, and data communication between at least one of the manufacturing equipment group between the local area network and an external network outside the semiconductor manufacturing plant. 12. The method according to claim 11, further comprising the step of: 13. A semiconductor manufacturing factory different from the semiconductor manufacturing factory by accessing a database provided by a vendor or a user of the exposure apparatus via the external network to obtain maintenance information of the manufacturing apparatus by data communication. 13. The production management is performed by performing data communication between the device and the external network.
3. The method for manufacturing a semiconductor device according to item 1. 14. A manufacturing apparatus group for various processes including the exposure apparatus according to claim 1, a local area network connecting the manufacturing apparatus group, and an external device outside the factory from the local area network. A semiconductor manufacturing plant, comprising: a gateway enabling access to a network; and capable of performing data communication of information on at least one of the manufacturing apparatus groups. 15. The semiconductor device according to claim 1, which is installed in a semiconductor manufacturing plant.
4. The maintenance method for an exposure apparatus according to any one of claims 1 to 3, wherein
A step of providing a maintenance database connected to an external network of a semiconductor manufacturing plant by a vendor or a user of the exposure apparatus, and a step of permitting access to the maintenance database from the inside of the semiconductor manufacturing plant via the external network. Transmitting the maintenance information stored in the maintenance database to the semiconductor manufacturing factory via the external network. 16. The exposure apparatus according to claim 1, further comprising a display, a network interface, and a computer that executes network software, and stores maintenance information of the exposure apparatus via a computer network. An exposure apparatus characterized in that data communication can be performed by using the same. 17. The network software,
Provided on the display is a user interface for accessing a maintenance database provided by a vendor or a user of the exposure apparatus connected to an external network of a factory where the exposure apparatus is installed, and from the database via the external network. The exposure apparatus according to claim 16, wherein information can be obtained.