JP2002220488A - ポリイミド表面の処理方法 - Google Patents

ポリイミド表面の処理方法

Info

Publication number
JP2002220488A
JP2002220488A JP2002001178A JP2002001178A JP2002220488A JP 2002220488 A JP2002220488 A JP 2002220488A JP 2002001178 A JP2002001178 A JP 2002001178A JP 2002001178 A JP2002001178 A JP 2002001178A JP 2002220488 A JP2002220488 A JP 2002220488A
Authority
JP
Japan
Prior art keywords
polyimide
treating
solution
polyimide surface
kapton
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002001178A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002220488A5 (https=
Inventor
Guangjin Li
カンジン・リー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of JP2002220488A publication Critical patent/JP2002220488A/ja
Publication of JP2002220488A5 publication Critical patent/JP2002220488A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Laminated Bodies (AREA)
JP2002001178A 2001-01-08 2002-01-08 ポリイミド表面の処理方法 Pending JP2002220488A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/757056 2001-01-08
US09/757,056 US6461681B2 (en) 2001-01-08 2001-01-08 Method of treating a surface of a polyimide

Publications (2)

Publication Number Publication Date
JP2002220488A true JP2002220488A (ja) 2002-08-09
JP2002220488A5 JP2002220488A5 (https=) 2005-03-10

Family

ID=25046177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002001178A Pending JP2002220488A (ja) 2001-01-08 2002-01-08 ポリイミド表面の処理方法

Country Status (4)

Country Link
US (1) US6461681B2 (https=)
EP (1) EP1221458B1 (https=)
JP (1) JP2002220488A (https=)
DE (1) DE60203327T2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050276911A1 (en) * 2004-06-15 2005-12-15 Qiong Chen Printing of organometallic compounds to form conductive traces
US7722929B2 (en) 2005-08-18 2010-05-25 Corning Incorporated Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device
US7829147B2 (en) 2005-08-18 2010-11-09 Corning Incorporated Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device
US20070040501A1 (en) * 2005-08-18 2007-02-22 Aitken Bruce G Method for inhibiting oxygen and moisture degradation of a device and the resulting device
US20080206589A1 (en) * 2007-02-28 2008-08-28 Bruce Gardiner Aitken Low tempertature sintering using Sn2+ containing inorganic materials to hermetically seal a device
US20080048178A1 (en) * 2006-08-24 2008-02-28 Bruce Gardiner Aitken Tin phosphate barrier film, method, and apparatus
US20120148896A1 (en) * 2010-12-09 2012-06-14 E.I. Du Pont De Nemours And Company Multi-layer article of polyimide nanoweb with amidized surface
CN115368616A (zh) * 2022-09-08 2022-11-22 上海神力科技有限公司 一种聚酰亚胺膜表面改性方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4218283A (en) * 1974-08-23 1980-08-19 Hitachi, Ltd. Method for fabricating semiconductor device and etchant for polymer resin
US4113550A (en) * 1974-08-23 1978-09-12 Hitachi, Ltd. Method for fabricating semiconductor device and etchant for polymer resin
JPS5636527A (en) * 1980-06-30 1981-04-09 Hitachi Ltd Etching solution for polyimide type resin film
KR0126792B1 (ko) 1994-04-11 1998-04-01 김광호 폴리이미드(Polyimide) 표면 처리방법
US6218022B1 (en) * 1996-09-20 2001-04-17 Toray Engineering Co., Ltd. Resin etching solution and process for etching polyimide resins
JPH1149880A (ja) 1997-08-06 1999-02-23 P I Gijutsu Kenkyusho:Kk 表面処理法及びその接着剤

Also Published As

Publication number Publication date
US20020127341A1 (en) 2002-09-12
DE60203327T2 (de) 2006-03-23
EP1221458B1 (en) 2005-03-23
DE60203327D1 (de) 2005-04-28
EP1221458A1 (en) 2002-07-10
US6461681B2 (en) 2002-10-08

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