JPH0135011B2 - - Google Patents

Info

Publication number
JPH0135011B2
JPH0135011B2 JP56192959A JP19295981A JPH0135011B2 JP H0135011 B2 JPH0135011 B2 JP H0135011B2 JP 56192959 A JP56192959 A JP 56192959A JP 19295981 A JP19295981 A JP 19295981A JP H0135011 B2 JPH0135011 B2 JP H0135011B2
Authority
JP
Japan
Prior art keywords
etching
polyimide
tma
polyimide resin
carbon atoms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56192959A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5896632A (ja
Inventor
Shigenori Yamaoka
Katamatsu Isozaki
Gotaro Nishi
Yukihiro Okabe
Mitsuo Waki
Masuo Mizuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP56192959A priority Critical patent/JPS5896632A/ja
Priority to US06/445,408 priority patent/US4431478A/en
Priority to GB08234286A priority patent/GB2115750B/en
Publication of JPS5896632A publication Critical patent/JPS5896632A/ja
Priority to MY474/86A priority patent/MY8600474A/xx
Publication of JPH0135011B2 publication Critical patent/JPH0135011B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/286—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials
    • H10P50/287—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials by chemical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Weting (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP56192959A 1981-12-02 1981-12-02 ポリイミド系樹脂のエツチング方法 Granted JPS5896632A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP56192959A JPS5896632A (ja) 1981-12-02 1981-12-02 ポリイミド系樹脂のエツチング方法
US06/445,408 US4431478A (en) 1981-12-02 1982-11-30 Etching agent for polyimide type resins and process for etching polyimide type resins with the same
GB08234286A GB2115750B (en) 1981-12-02 1982-12-01 Agent and process for etching polyimide type resins
MY474/86A MY8600474A (en) 1981-12-02 1986-12-30 Etching agent for polyimide type resins and process for etching polimide type resins with the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56192959A JPS5896632A (ja) 1981-12-02 1981-12-02 ポリイミド系樹脂のエツチング方法

Publications (2)

Publication Number Publication Date
JPS5896632A JPS5896632A (ja) 1983-06-08
JPH0135011B2 true JPH0135011B2 (https=) 1989-07-21

Family

ID=16299873

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56192959A Granted JPS5896632A (ja) 1981-12-02 1981-12-02 ポリイミド系樹脂のエツチング方法

Country Status (4)

Country Link
US (1) US4431478A (https=)
JP (1) JPS5896632A (https=)
GB (1) GB2115750B (https=)
MY (1) MY8600474A (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4624740A (en) * 1985-01-22 1986-11-25 International Business Machines Corporation Tailoring of via-hole sidewall slope
US4883744A (en) * 1988-05-17 1989-11-28 International Business Machines Corporation Forming a polymide pattern on a substrate
US4846929A (en) * 1988-07-13 1989-07-11 Ibm Corporation Wet etching of thermally or chemically cured polyimide
US4857143A (en) * 1988-12-16 1989-08-15 International Business Machines Corp. Wet etching of cured polyimide
US5242713A (en) * 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
US5653893A (en) * 1995-06-23 1997-08-05 Berg; N. Edward Method of forming through-holes in printed wiring board substrates
US20050227049A1 (en) * 2004-03-22 2005-10-13 Boyack James R Process for fabrication of printed circuit boards
TW201026513A (en) * 2009-01-08 2010-07-16 Univ Nat Cheng Kung Imprinting process of polyimide
TWI678596B (zh) * 2018-09-13 2019-12-01 新應材股份有限公司 正型光阻組成物及圖案化聚醯亞胺層之形成方法
US11257679B2 (en) 2018-11-26 2022-02-22 Stmicroelectronics Pte Ltd Method for removing a sacrificial layer on semiconductor wafers

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3361589A (en) * 1964-10-05 1968-01-02 Du Pont Process for treating polyimide surface with basic compounds, and polyimide surface having thin layer of polyamide acid
US3871930A (en) * 1973-12-19 1975-03-18 Texas Instruments Inc Method of etching films made of polyimide based polymers
US4369090A (en) * 1980-11-06 1983-01-18 Texas Instruments Incorporated Process for etching sloped vias in polyimide insulators

Also Published As

Publication number Publication date
MY8600474A (en) 1986-12-31
JPS5896632A (ja) 1983-06-08
US4431478A (en) 1984-02-14
GB2115750A (en) 1983-09-14
GB2115750B (en) 1985-07-24

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