MY8600474A - Etching agent for polyimide type resins and process for etching polimide type resins with the same - Google Patents

Etching agent for polyimide type resins and process for etching polimide type resins with the same

Info

Publication number
MY8600474A
MY8600474A MY474/86A MY8600474A MY8600474A MY 8600474 A MY8600474 A MY 8600474A MY 474/86 A MY474/86 A MY 474/86A MY 8600474 A MY8600474 A MY 8600474A MY 8600474 A MY8600474 A MY 8600474A
Authority
MY
Malaysia
Prior art keywords
type resins
etching
polimide
same
polyimide
Prior art date
Application number
MY474/86A
Other languages
English (en)
Inventor
Shigenori Yamaoka
Kenmatsu Isozaki
Kyotaro Nishi
Yukihiro Okabe
Mitsutaka Waki
Masuo Mizuno
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of MY8600474A publication Critical patent/MY8600474A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/286—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials
    • H10P50/287—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials by chemical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Weting (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
MY474/86A 1981-12-02 1986-12-30 Etching agent for polyimide type resins and process for etching polimide type resins with the same MY8600474A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56192959A JPS5896632A (ja) 1981-12-02 1981-12-02 ポリイミド系樹脂のエツチング方法

Publications (1)

Publication Number Publication Date
MY8600474A true MY8600474A (en) 1986-12-31

Family

ID=16299873

Family Applications (1)

Application Number Title Priority Date Filing Date
MY474/86A MY8600474A (en) 1981-12-02 1986-12-30 Etching agent for polyimide type resins and process for etching polimide type resins with the same

Country Status (4)

Country Link
US (1) US4431478A (https=)
JP (1) JPS5896632A (https=)
GB (1) GB2115750B (https=)
MY (1) MY8600474A (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4624740A (en) * 1985-01-22 1986-11-25 International Business Machines Corporation Tailoring of via-hole sidewall slope
US4883744A (en) * 1988-05-17 1989-11-28 International Business Machines Corporation Forming a polymide pattern on a substrate
US4846929A (en) * 1988-07-13 1989-07-11 Ibm Corporation Wet etching of thermally or chemically cured polyimide
US4857143A (en) * 1988-12-16 1989-08-15 International Business Machines Corp. Wet etching of cured polyimide
US5242713A (en) * 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
US5653893A (en) * 1995-06-23 1997-08-05 Berg; N. Edward Method of forming through-holes in printed wiring board substrates
US20050227049A1 (en) * 2004-03-22 2005-10-13 Boyack James R Process for fabrication of printed circuit boards
TW201026513A (en) * 2009-01-08 2010-07-16 Univ Nat Cheng Kung Imprinting process of polyimide
TWI678596B (zh) * 2018-09-13 2019-12-01 新應材股份有限公司 正型光阻組成物及圖案化聚醯亞胺層之形成方法
US11257679B2 (en) 2018-11-26 2022-02-22 Stmicroelectronics Pte Ltd Method for removing a sacrificial layer on semiconductor wafers

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3361589A (en) * 1964-10-05 1968-01-02 Du Pont Process for treating polyimide surface with basic compounds, and polyimide surface having thin layer of polyamide acid
US3871930A (en) * 1973-12-19 1975-03-18 Texas Instruments Inc Method of etching films made of polyimide based polymers
US4369090A (en) * 1980-11-06 1983-01-18 Texas Instruments Incorporated Process for etching sloped vias in polyimide insulators

Also Published As

Publication number Publication date
JPS5896632A (ja) 1983-06-08
JPH0135011B2 (https=) 1989-07-21
US4431478A (en) 1984-02-14
GB2115750A (en) 1983-09-14
GB2115750B (en) 1985-07-24

Similar Documents

Publication Publication Date Title
GB2107076B (en) Highly reliable electrooptical device and process for manufacturing the same
SG4488G (en) Method for manufacturing boiled noodles and apparatus for the same
EP0227959A3 (en) Polyimide film and process for producing the same
DE3276990D1 (en) Josephson-junction logic circuit
MY8600474A (en) Etching agent for polyimide type resins and process for etching polimide type resins with the same
JPS57201678A (en) Typing device
AU87913S (en) Computer
DE3270651D1 (en) Josephson-junction logic device
GB2104290B (en) Semiconductor device and method for manufacturing the same
GB2098751B (en) Cold pressure-welding apparatus
DE3370002D1 (en) Phenolic resin foam and process for producing the same
JPS5332838A (en) Restricted fluid and process for producinf the same
JPS57207430A (en) Logic circuit
GB2097262B (en) Cricket balls hockey balls and the like
DE3278321D1 (en) Semiconductor devices provided with heat-dissipating means
DE3273549D1 (en) Restructurable integrated circuit
GB8409427D0 (en) Transporting apparatus
GB2112301B (en) Reflector and method for manufacturing the same
GB8414235D0 (en) Comparing distances between balls
GB2130772B (en) Electronic typewriter and word processor
DE3266132D1 (en) Typing device
GB2108761B (en) Integrated circuits
GB2102331B (en) Anisotropic resins
EP0070255A3 (en) Ski-rack with anti-theft device
DE3275458D1 (en) Bottom margin indicator apparatus for typewriters and the like