JP2002220488A5 - - Google Patents

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Publication number
JP2002220488A5
JP2002220488A5 JP2002001178A JP2002001178A JP2002220488A5 JP 2002220488 A5 JP2002220488 A5 JP 2002220488A5 JP 2002001178 A JP2002001178 A JP 2002001178A JP 2002001178 A JP2002001178 A JP 2002001178A JP 2002220488 A5 JP2002220488 A5 JP 2002220488A5
Authority
JP
Japan
Prior art keywords
treating
polyimide surface
surface according
solution
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002001178A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002220488A (ja
Filing date
Publication date
Priority claimed from US09/757,056 external-priority patent/US6461681B2/en
Application filed filed Critical
Publication of JP2002220488A publication Critical patent/JP2002220488A/ja
Publication of JP2002220488A5 publication Critical patent/JP2002220488A5/ja
Pending legal-status Critical Current

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JP2002001178A 2001-01-08 2002-01-08 ポリイミド表面の処理方法 Pending JP2002220488A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/757056 2001-01-08
US09/757,056 US6461681B2 (en) 2001-01-08 2001-01-08 Method of treating a surface of a polyimide

Publications (2)

Publication Number Publication Date
JP2002220488A JP2002220488A (ja) 2002-08-09
JP2002220488A5 true JP2002220488A5 (https=) 2005-03-10

Family

ID=25046177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002001178A Pending JP2002220488A (ja) 2001-01-08 2002-01-08 ポリイミド表面の処理方法

Country Status (4)

Country Link
US (1) US6461681B2 (https=)
EP (1) EP1221458B1 (https=)
JP (1) JP2002220488A (https=)
DE (1) DE60203327T2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050276911A1 (en) * 2004-06-15 2005-12-15 Qiong Chen Printing of organometallic compounds to form conductive traces
US7722929B2 (en) 2005-08-18 2010-05-25 Corning Incorporated Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device
US7829147B2 (en) 2005-08-18 2010-11-09 Corning Incorporated Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device
US20070040501A1 (en) * 2005-08-18 2007-02-22 Aitken Bruce G Method for inhibiting oxygen and moisture degradation of a device and the resulting device
US20080206589A1 (en) * 2007-02-28 2008-08-28 Bruce Gardiner Aitken Low tempertature sintering using Sn2+ containing inorganic materials to hermetically seal a device
US20080048178A1 (en) * 2006-08-24 2008-02-28 Bruce Gardiner Aitken Tin phosphate barrier film, method, and apparatus
US20120148896A1 (en) * 2010-12-09 2012-06-14 E.I. Du Pont De Nemours And Company Multi-layer article of polyimide nanoweb with amidized surface
CN115368616A (zh) * 2022-09-08 2022-11-22 上海神力科技有限公司 一种聚酰亚胺膜表面改性方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4218283A (en) * 1974-08-23 1980-08-19 Hitachi, Ltd. Method for fabricating semiconductor device and etchant for polymer resin
US4113550A (en) * 1974-08-23 1978-09-12 Hitachi, Ltd. Method for fabricating semiconductor device and etchant for polymer resin
JPS5636527A (en) * 1980-06-30 1981-04-09 Hitachi Ltd Etching solution for polyimide type resin film
KR0126792B1 (ko) 1994-04-11 1998-04-01 김광호 폴리이미드(Polyimide) 표면 처리방법
US6218022B1 (en) * 1996-09-20 2001-04-17 Toray Engineering Co., Ltd. Resin etching solution and process for etching polyimide resins
JPH1149880A (ja) 1997-08-06 1999-02-23 P I Gijutsu Kenkyusho:Kk 表面処理法及びその接着剤

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