JP2002220488A - ポリイミド表面の処理方法 - Google Patents
ポリイミド表面の処理方法Info
- Publication number
- JP2002220488A JP2002220488A JP2002001178A JP2002001178A JP2002220488A JP 2002220488 A JP2002220488 A JP 2002220488A JP 2002001178 A JP2002001178 A JP 2002001178A JP 2002001178 A JP2002001178 A JP 2002001178A JP 2002220488 A JP2002220488 A JP 2002220488A
- Authority
- JP
- Japan
- Prior art keywords
- polyimide
- treating
- solution
- kapton
- polyimide surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 79
- 239000004952 Polyamide Substances 0.000 title 1
- 229920002647 polyamide Polymers 0.000 title 1
- 229920001721 polyimide Polymers 0.000 claims abstract description 150
- 239000004642 Polyimide Substances 0.000 claims abstract description 133
- 238000001035 drying Methods 0.000 claims abstract description 27
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 claims abstract description 16
- 150000001412 amines Chemical class 0.000 claims description 17
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 7
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 24
- 230000001070 adhesive effect Effects 0.000 abstract description 24
- 125000003277 amino group Chemical group 0.000 abstract 1
- 238000010422 painting Methods 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 42
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 34
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 30
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 25
- 230000032798 delamination Effects 0.000 description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 20
- 230000004888 barrier function Effects 0.000 description 15
- 239000000463 material Substances 0.000 description 14
- 238000012360 testing method Methods 0.000 description 14
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 10
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 9
- DPBLXKKOBLCELK-UHFFFAOYSA-N pentan-1-amine Chemical compound CCCCCN DPBLXKKOBLCELK-UHFFFAOYSA-N 0.000 description 9
- 230000006872 improvement Effects 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005507 spraying Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- YNWDKZIIWCEDEE-UHFFFAOYSA-N pantoprazole sodium Chemical compound [Na+].COC1=CC=NC(CS(=O)C=2[N-]C3=CC=C(OC(F)F)C=C3N=2)=C1OC YNWDKZIIWCEDEE-UHFFFAOYSA-N 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- NHWGPUVJQFTOQX-UHFFFAOYSA-N ethyl-[2-[2-[ethyl(dimethyl)azaniumyl]ethyl-methylamino]ethyl]-dimethylazanium Chemical compound CC[N+](C)(C)CCN(C)CC[N+](C)(C)CC NHWGPUVJQFTOQX-UHFFFAOYSA-N 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- GPCKFIWBUTWTDH-UHFFFAOYSA-N pentane-3,3-diamine Chemical compound CCC(N)(N)CC GPCKFIWBUTWTDH-UHFFFAOYSA-N 0.000 description 3
- 229920005575 poly(amic acid) Polymers 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- -1 siloxane amines Chemical class 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 1
- 238000007385 chemical modification Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 231100000206 health hazard Toxicity 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000005462 imide group Chemical group 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- SAVARAGQNLNIOF-UHFFFAOYSA-N pentane-1,1,5-triamine Chemical compound NCCCCC(N)N SAVARAGQNLNIOF-UHFFFAOYSA-N 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000002407 reforming Methods 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/757,056 US6461681B2 (en) | 2001-01-08 | 2001-01-08 | Method of treating a surface of a polyimide |
| US09/757056 | 2001-01-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002220488A true JP2002220488A (ja) | 2002-08-09 |
| JP2002220488A5 JP2002220488A5 (enExample) | 2005-03-10 |
Family
ID=25046177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002001178A Pending JP2002220488A (ja) | 2001-01-08 | 2002-01-08 | ポリイミド表面の処理方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6461681B2 (enExample) |
| EP (1) | EP1221458B1 (enExample) |
| JP (1) | JP2002220488A (enExample) |
| DE (1) | DE60203327T2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050276911A1 (en) * | 2004-06-15 | 2005-12-15 | Qiong Chen | Printing of organometallic compounds to form conductive traces |
| US20070040501A1 (en) | 2005-08-18 | 2007-02-22 | Aitken Bruce G | Method for inhibiting oxygen and moisture degradation of a device and the resulting device |
| US7722929B2 (en) | 2005-08-18 | 2010-05-25 | Corning Incorporated | Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device |
| US7829147B2 (en) | 2005-08-18 | 2010-11-09 | Corning Incorporated | Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device |
| US20080206589A1 (en) * | 2007-02-28 | 2008-08-28 | Bruce Gardiner Aitken | Low tempertature sintering using Sn2+ containing inorganic materials to hermetically seal a device |
| US20080048178A1 (en) * | 2006-08-24 | 2008-02-28 | Bruce Gardiner Aitken | Tin phosphate barrier film, method, and apparatus |
| US20120148896A1 (en) * | 2010-12-09 | 2012-06-14 | E.I. Du Pont De Nemours And Company | Multi-layer article of polyimide nanoweb with amidized surface |
| CN115368616A (zh) * | 2022-09-08 | 2022-11-22 | 上海神力科技有限公司 | 一种聚酰亚胺膜表面改性方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4113550A (en) * | 1974-08-23 | 1978-09-12 | Hitachi, Ltd. | Method for fabricating semiconductor device and etchant for polymer resin |
| US4218283A (en) * | 1974-08-23 | 1980-08-19 | Hitachi, Ltd. | Method for fabricating semiconductor device and etchant for polymer resin |
| JPS5636527A (en) * | 1980-06-30 | 1981-04-09 | Hitachi Ltd | Etching solution for polyimide type resin film |
| KR0126792B1 (ko) | 1994-04-11 | 1998-04-01 | 김광호 | 폴리이미드(Polyimide) 표면 처리방법 |
| US6218022B1 (en) * | 1996-09-20 | 2001-04-17 | Toray Engineering Co., Ltd. | Resin etching solution and process for etching polyimide resins |
| JPH1149880A (ja) | 1997-08-06 | 1999-02-23 | P I Gijutsu Kenkyusho:Kk | 表面処理法及びその接着剤 |
-
2001
- 2001-01-08 US US09/757,056 patent/US6461681B2/en not_active Expired - Fee Related
-
2002
- 2002-01-08 EP EP02250094A patent/EP1221458B1/en not_active Expired - Lifetime
- 2002-01-08 JP JP2002001178A patent/JP2002220488A/ja active Pending
- 2002-01-08 DE DE60203327T patent/DE60203327T2/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE60203327T2 (de) | 2006-03-23 |
| EP1221458B1 (en) | 2005-03-23 |
| DE60203327D1 (de) | 2005-04-28 |
| EP1221458A1 (en) | 2002-07-10 |
| US6461681B2 (en) | 2002-10-08 |
| US20020127341A1 (en) | 2002-09-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
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| A977 | Report on retrieval |
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| A131 | Notification of reasons for refusal |
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| A02 | Decision of refusal |
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