JP2002214308A - Microcomputer and electronic equipment for mounting it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a microcomputer capable of providing an interface exclusive terminal for inputting an inspection signal in a position easy to handle of a package without being limited by the shape of a package or the position of a lead terminal, and efficiently inspecting whether the function based on a set specification is exhibited or not with an inspection device of the same structure, and electronic equipment for mounting it. SOLUTION: The interface exclusive terminal 3 for inputting the inspection signal 26 is provided on the other surface 29 different from one surface 27 of the package 21.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microcomputer having a circuit block which performs a function based on a control signal when a control signal is input from a lead terminal provided on one surface of a package, and a microcomputer having the same. It relates to an electronic device to be mounted.

[0002]

2. Description of the Related Art In recent years, electronic devices having various functions have been developed, and in order to realize such functions, a chipset and a microcomputer for realizing their specifications are mounted on the electronic devices. It is done by making them work. The microcomputer controls the chipset so as to have different specifications for each type of electronic device, so that the electronic device can operate in accordance with the specifications. In some cases, the microcomputer has a so-called evaluation chip (hereinafter, referred to as an “evaluator”) that constitutes an in-circuit emulator for implementing in-circuit emulation. “In-circuit emulation” refers to an inspection function that allows the evaluator to perform a predetermined operation in a simulated manner, thereby confirming whether the circuit of the microcomputer to be inspected is operating as intended. The operation state of such a microcomputer includes a normal mode that operates based on the set specifications and an evaluator mode for checking the operation state of the microcomputer and the like.

[0003] The evaluator mode is a mode for examining the operating state of a microcomputer when it is considered that a microcomputer that should operate based on the set specifications is not operating properly based on the specifications. Since the terminals used in both modes are different, the conventional microcomputer is provided with an interface dedicated terminal used in the evaluator mode in addition to the lead terminals used in the normal mode.

Conventionally, this dedicated interface terminal is:
On one surface, such as the side surface of a microcomputer package, a lead terminal is provided in a mixed manner. The arrangement of both terminals is determined at the time of design. When the microcomputer is to be operated in the evaluator mode and the operation state is to be inspected, the above-mentioned interface-dedicated terminal is selected from both terminals and a predetermined inspection signal is inputted to the interface-dedicated terminal. Was.

[0005]

However, different types of microcomputers have different package shapes and lead terminal positions depending on their specifications.
The position of the interface dedicated terminal in the package is also different. Therefore, since different types of microcomputers cannot be inspected by the same configuration of the inspection apparatus, it is desired that the microcomputer be configured so that the inspection can be easily and efficiently performed.

Accordingly, the present invention solves the above-mentioned problems, and an interface-dedicated terminal for inputting an inspection signal can be provided at a position of a package that is easy to handle without being restricted by the shape of the package or the position of a lead terminal. It is an object of the present invention to provide a microcomputer capable of efficiently inspecting whether or not a function based on a set specification is exhibited by the inspection device, and an electronic device equipped with the microcomputer.

[0007]

According to the first aspect of the present invention, a control signal is input from a lead terminal provided on one surface of a package, and a function based on the control signal is provided. A microcomputer provided with a circuit block that performs a function based on the control signal, in order to test an operation state as to whether the circuit block performs a function based on the control signal. An evaluator for inspecting an operation state of the circuit block, and an interface dedicated terminal provided on another surface of the package different from the one surface for inputting the inspection signal. This is achieved by a microcomputer. According to the configuration of claim 1, the interface-dedicated terminal can be provided regardless of the shape of the package and the position of the lead terminal in any position of the package.
It will be provided independently on the other surface. For this reason, the interface-dedicated terminal can be provided at a position of the package that is easy to handle without being limited by the shape of the package or the position of the lead terminal. Therefore, the microcomputer can easily input the inspection signal from the interface-dedicated terminal even if a malfunction has occurred in the operation state and the microcomputer needs to be inspected. Then, based on the test signal, the microcomputer efficiently tests whether or not the function based on the set specifications is exhibited. Further, the microcomputer only needs to provide the lead terminals on one surface of the package, and there is no need to provide the interface-dedicated terminals, so that more lead terminals can be provided. Therefore, the microcomputer can exhibit many functions by the circuit blocks by inputting the control signals from more lead terminals.

According to a second aspect of the present invention, in the configuration of the first aspect, the one surface is a side surface of the package, and the other surface is one of a top surface and a bottom surface of the package. I do. According to the configuration of claim 2,
In addition to the function of claim 1, the interface dedicated terminal is provided independently on the upper surface or the bottom surface regardless of the shape of the package and the position of the lead terminal in any position of the package. For this reason, the interface-dedicated terminal can be provided at an easy-to-handle position of the package without being limited by the shape of the package or the position of the lead terminal.

According to a third aspect of the present invention, in the configuration of the first aspect, the interface-dedicated terminal is covered with a covering member having an insulating property that can be removed on the other surface. According to the configuration of the third aspect, in addition to the operation of the first aspect, when the circuit block of the microcomputer is in a normal operation, the interface-dedicated terminal is not exposed on one surface. Will not be damaged. Also,
When the operation state of the circuit block is inspected, the operation state may be inspected by removing the covering member and inputting an inspection signal from the interface dedicated terminal.

[0010] The above object is attained by the invention of claim 4;
When a control signal is input from a lead terminal provided on one surface of a package, the electronic device includes a microcomputer including a circuit block that performs a function based on the control signal. An evaluator that inspects an operation state of the circuit block by an inspection signal input from outside of the package to inspect an operation state of whether the circuit block is performing a function based on the control signal, The present invention is achieved by an electronic device provided on another surface different from the one surface of the package and having an interface dedicated terminal for inputting the inspection signal. According to the configuration of the fourth aspect, the interface-dedicated terminal is provided independently on the other surface regardless of the shape of the package and the position of the lead terminal at any position of the package. For this reason, the interface-dedicated terminal can be provided at a position of the package that is easy to handle without being limited by the shape of the package or the position of the lead terminal. Therefore, the microcomputer can easily input the inspection signal from the interface-dedicated terminal even if a malfunction has occurred in the operation state and the microcomputer needs to be inspected.
Then, based on the test signal, the microcomputer efficiently tests whether or not the function based on the set specifications is exhibited. Further, the microcomputer only needs to provide the lead terminals on one surface of the package, and there is no need to provide the interface-dedicated terminals, so that more lead terminals can be provided. Therefore, the microcomputer can exhibit many functions by the circuit blocks by inputting the control signals from more lead terminals.

According to a fifth aspect of the present invention, in the configuration of the fourth aspect, the one surface is a side surface of the package, and the other surface is one of a top surface and a bottom surface of the package. I do. According to the configuration of claim 5,
In addition to the function of claim 4, the interface dedicated terminal is provided independently on the upper surface or the bottom surface regardless of the shape of the package and the position of the lead terminal at any position of the package. For this reason, the interface-dedicated terminal can be provided at an easy-to-handle position of the package without being limited by the shape of the package or the position of the lead terminal.

[0012]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Note that the embodiments described below are preferred specific examples of the present invention,
Although various technically preferable limits are given, the scope of the present invention is not limited to these modes unless otherwise specified in the following description.

First Embodiment FIG. 1 shows an example in which a development tool 15 is connected to an electronic device 19 on which a microcomputer 1 to which a microcomputer according to a first embodiment of the present invention is applied is mounted. FIG. This electronic device 19
Can be applied to all electronic devices on which a microcomputer can be mounted, such as a television receiver, a video tape recorder, and an audio device. The electronic device 19 has a normal mode in which the set function is exhibited in the operation state, and an evaluator mode in which the development tool 15 is connected to check the operation state of the microcomputer 1.

The electronic device 19 has the microcomputer 1 and the chip set 17. The microcomputer 1 has a function of outputting a control signal 23 to the chipset 17 via the lead terminal 5 based on the set specifications. The chipset 17 performs a predetermined operation based on a control signal 23 from the microcomputer 1 and can perform various operations depending on the control signal 23 from the microcomputer 1.

The microcomputer 1 includes an evaluator 7 and a CPU (Central) as a circuit block.
Processing Unit) 9, ROM (Rea)
dOnly Memory) 11, a peripheral block 13 as a circuit block, an interface dedicated terminal 3, and a lead terminal 5. This evaluator 7
Is connected to the interface dedicated terminal 3 and the CPU 9, and the CPU 9 is connected to the ROM 11 and the peripheral block 13. Further, the lead terminal 5 is connected to the peripheral block 13.

The interface dedicated terminal 3 and the lead terminal 5 have different purposes of use. Specifically, the lead terminal 5 is not used in the evaluator mode, but is a terminal for the microcomputer 1 to output the control signal 23 to control the chipset 17 in the normal mode. On the other hand, unlike the lead terminal 5, the interface dedicated terminal 3 is not used in the normal mode, but when the evaluator mode is set, the development tool 15 is not used.
This is a terminal to which the inspection signal 25 from is input.

The evaluator 7 receives an inspection signal 25 from the development tool 15 via the interface dedicated terminal 3 and determines whether or not the CPU 9 is performing a function based on the set specifications based on the inspection signal 25. The operating condition is checked.

The CPU 9 performs the above-described operation in the evaluator mode, and performs the ROM operation in the normal mode.
It is programmed so as to exhibit a function based on the set value (specification) set to “11”. ROM 11
Is a rewritable non-volatile storage medium for storing a set value programmed so that the CPU 9 operates based on the set specifications. Therefore, the microcomputer 1 can variously change the specifications by rewriting the set values in the ROM 11.

The peripheral block 13 is a peripheral circuit for assisting the operation of the CPU 9. The peripheral block 13 controls the chipset 1 under the control of the CPU 9.
Control signal 23 for operating chip 7
Output to

FIG. 2 is a perspective view showing an example of the appearance when the microcomputer 1 of FIG. 1 is viewed from the bottom surface 27 side. The microcomputer 1 is, for example, a QFP (Quad Flat Package) which is one of surface-mounted ICs (Integrated Circuits).
Is formed. Package 2
1 is a DIP (Dual Inline)
Package), BGA (Ball Grid A)
ray) or PGA (Pin Grid Arra)
Needless to say, it may be configured in the form of y) or the like. The package 21 is provided so that the lead terminals 5 used in the normal mode are arranged on the side surface 31.

A feature of the microcomputer 1 is that the interface dedicated terminal 3 is provided on another surface different from the one surface on which the lead terminals 5 are provided. Specifically, for example, if this one surface is the side surface 31, the other surface is preferably either the upper surface 29 or the bottom surface 27 of the package 21. That is, this microcomputer 1
The interface dedicated terminal 3 is provided on either the upper surface 29 or the bottom surface 27 different from the side surface 31 of the package 21.

With this configuration, the interface dedicated terminal 3 is provided independently at a position different from the side surface 31 of the package 21 on which the lead terminal 5 is provided, for example, at the upper surface 29 or the bottom surface 27. Become. Therefore, the interface-dedicated terminal 3 is formed by the package 21 having any shape and the lead terminal 5 is formed by the package 21.
Is provided independently on the top surface 29 or the bottom surface 27. That is, the interface dedicated terminal 3 can be provided at a position of the package 21 that is easy to handle without being restricted by the shape of the package 21 or the lead terminal 5. Therefore, the development tool 15 can be easily connected to the interface dedicated terminal 3. In the following description, it is assumed that the interface dedicated terminal 3 is provided on the bottom surface 27 of the package 21 as an example.

Therefore, when the microcomputer 1 attempts to inspect its operation state, an inspection signal is easily input from the interface dedicated terminal 3. Then, based on the inspection signal 25, the microcomputer 1 efficiently inspects the operation state as to whether or not the function based on the specification is exhibited.

Further, the microcomputer 1 does not need to provide the interface-dedicated terminals 3 on the side surface 31 of the package 21, so that more lead terminals 5 can be provided. Therefore, the microcomputer 1
Can perform many functions by inputting control signals from many lead terminals 5.

FIG. 3 is an AA 'sectional view showing an example of a sectional configuration of the microcomputer 1 of FIG. The microcomputer 1 has, for example, a lead terminal 5 provided on a side surface 31 of a package 21. Specifically, the lead terminal 5
Is, for example, a lead frame that is long in one direction, and extends inside the package 21 such that the base end side of the lead terminal 5 is substantially parallel to the bottom surface 27 near the center in the thickness direction T of the package 21. The side is exposed outside the package 21. Further, the front end side of the lead terminal 5 is bent in two steps respectively at two positions outside the package 21, the distal end portion is configured to form a same plane as the bottom surface 27. Then, at the base end of the lead terminal 5 inside the package 21,
The evaluator 7, the CPU 9, the ROM 11, and the chip 33 having the peripheral block 13 are connected.

The chip 33 is, for example, a CSP (Chi
p Size Package) and package 2
For example, it is provided so as to be parallel to the bottom surface 27 inside 1. A plurality of bumps 35 are provided on the surface of the chip 33, and the chip 33 and the lead terminals 5 are connected by the bumps 35. On the other hand, the interface dedicated terminal 3 is
Are connected to the bumps 35 by wires 39 extending from the bumps 35 to the bumps 35.

Microcomputer 1 and electronic equipment 19
Has the above configuration. Next, an example of the inspection operation will be described with reference to FIGS. Electronic device 1 of FIG.
9 is sold to a predetermined user, for example, and is used by that user. However, this electronic device 19
If it is suspected that the user is performing an operation different from the desired specification, the user is usually taken to a service center, for example. The service center is provided with a development tool 15 (inspection device) for inspecting the operation state of the microcomputer 1 mounted on the electronic device 19. The development tool 15 is a device that is used, for example, when inspecting an operation state as to whether or not the microcomputer 1 is operating based on specifications set when the electronic device 19 is developed.

First, the interface dedicated terminal 3 in the electronic device 19 is located at a position different from the side surface 31 of the package 21 on which the lead terminals 5 are provided, for example, the upper surface 29.
Alternatively, it is provided independently on the bottom surface 27. Therefore, the interface dedicated terminal 3 is
Is any shape, and the lead terminal 5 is
1 at any position, for example, the upper surface 29
Alternatively, it is provided independently on the bottom surface 27. Therefore, the interface dedicated terminal 3 is connected to the package 2
It can be provided at the position of the package 21 which is easy to handle without being limited by the shape of the lead 1 and the position of the lead terminal 5. Therefore, the microcomputer 1 can easily connect the development tool 15 to the interface dedicated terminal 3.

Therefore, the microcomputer 1 can easily input the inspection signal from the interface-dedicated terminal 3 provided at a convenient position regardless of the shape of the package 21 or the shape or position of the lead terminal 5 as described above. The operation state is inspected.

The operation state of the microcomputer 1 mounted on the electronic device 19 is inspected based on the inspection signal 25. That is, when the microcomputer 1 is set to the evaluator mode, the evaluator 7 checks the operation of the CPU 9 based on the check signal 25. When the evaluator 7 operates, the microcomputer 1 efficiently checks an operation state as to whether or not a function based on the set specifications is exhibited. If the microcomputer 1 does not operate based on the set specifications, for example,
Debugging can be performed by appropriately changing the set values stored in M11. Then, the development tool 15 is removed from the electronic device 19 whose inspection has been completed, and the electronic device 19 is returned to the predetermined user.

According to the first embodiment of the present invention, the interface dedicated terminal 3 is provided independently at a position different from the side surface 31 of the package 21 on which the lead terminal 5 is provided, for example, on the upper surface 29 or the bottom surface 27. Will be. Therefore, regardless of the shape of the package 21 and the position of the lead terminal 5 at any position of the package 21, the interface dedicated terminal 3 is provided independently on the top surface 29 or the bottom surface 27, for example. For this reason, the interface dedicated terminal 3 can be provided at a position of the package 21 that is easy to handle and is not limited to the shape of the package 21 or the position of the lead terminal 5. Then, the microcomputer 1 can easily receive the inspection signal 25 from the interface dedicated terminal 3 provided at such a position. Therefore, the microcomputer 1 is provided with the interface dedicated terminal 3 at the position of the package 21 which is not limited to the shape of the package 21 or the position of the lead terminal 5. The inspection device) efficiently inspects whether the function based on the set specifications is exhibited.

Second Embodiment FIG. 4 is a sectional view showing an example of a sectional configuration of a microcomputer 1 to which a microcomputer according to a second embodiment of the present invention is applied. Since the microcomputer 1a according to the second embodiment has substantially the same configuration as the microcomputer 1 according to the first embodiment in FIGS. 1 to 3, the same components are denoted by the same reference numerals as those in FIGS. The description is omitted, and the description will focus on the differences. In the microcomputer 1a according to the second embodiment, in addition to the configuration of the microcomputer 1 according to the first embodiment, the interface dedicated terminal 3 is provided on the surface of the package 21 of the microcomputer 1 where the interface dedicated terminal 3 is provided. A covering member 37 is provided to cover.

The covering member 37 is an insulator that can be removed by polishing, for example, and covers the interface dedicated terminal 3 when the microcomputer 1 is in the normal mode. Here, in the microcomputer 1, the interface dedicated terminal 3 is exposed by removing the covering member 37 by a predetermined removing means (not shown). Next, the development tool 15 is connected to the interface-dedicated terminal 3, and the evaluator mode is set.

Then, similarly to the first embodiment, the development tool 15 outputs the inspection signal 25 to the interface dedicated terminal 3 so that the microcomputer 1 determines whether the function based on the set specifications is exhibited. The operating condition is checked. When returning from the evaluator mode to the normal mode, the microcomputer 1 may again cover the interface dedicated terminal 3 with the covering member 37.

According to the second embodiment of the present invention, substantially the same effects as those of the first embodiment can be obtained. In addition, when the microcomputer 1 is in the normal mode, it is not used. Since the interface-dedicated terminal 3 is covered with the covering member 37, damage to the interface-dedicated terminal 3 can be prevented.

Modification FIG. 5 shows a microcomputer 1b to which a microcomputer as a modification of the above embodiment of the present invention is applied.
FIG. 3 is a cross-sectional view showing a cross-sectional configuration example of FIG. The microcomputer 1b has substantially the same configuration as the microcomputer 1 in the above-described embodiment in FIGS. 1 to 4, and thus the same configuration is denoted by the reference numerals in FIGS. It will be explained mainly.

In this microcomputer 1b, FIG.
Are different in the configuration of the lead terminal 5 in the microcomputer 1 as the first embodiment shown in FIG. Specifically, in the microcomputer 1b, the lead terminal 5a provided on the bottom surface 27 provided with the interface dedicated terminal 3 is connected by a wiring 37 extending from the bump 35 provided on the chip 33 to the bottom surface 27. It has become. The lead terminal 5a is provided on the outer peripheral side on the bottom surface 27, and
Are provided separately on the inner peripheral side on the bottom surface 27. Therefore, the lead terminal 5a and the interface-dedicated terminal 3 can be provided on the bottom surface 27 at a position where they are not mixed. It is needless to say that the same effect as in the second embodiment can be obtained by providing the microcomputer 1b with the covering member 37 as in the second embodiment.

According to a modification of the above embodiment of the present invention,
Since the lead terminal 5a and the interface dedicated terminal 3 are provided separately so as to be distinguishable on one surface such as the bottom surface 27, substantially the same effects as in the above embodiment can be exerted. Side 31
Since no lead wire is provided, the size of the package 21 in the longitudinal direction can be reduced.

The present invention is not limited to the above embodiment. For example, instead of being removed by polishing in the evaluator mode,
For example, it goes without saying that the interface dedicated terminal 3, the lead terminal 5, and the package 21 may be removed by being dissolved by a predetermined solvent that does not dissolve the package. Each configuration of the above embodiment can be partially omitted or arbitrarily combined so as to be different from the above.

[0040]

As described above, according to the present invention,
Dedicated interface terminals for inputting inspection signals can be provided at easy-to-handle locations that are not restricted by the shape of the package or the positions of the lead terminals. It is possible to provide a microcomputer capable of efficiently inspecting whether or not it is exerted, and an electronic device equipped with the microcomputer.

[Brief description of the drawings]

FIG. 1 is an exemplary block diagram showing an example of a state in which a development tool is connected to an electronic device equipped with a microcomputer according to a first embodiment of the present invention;

FIG. 2 is an exemplary perspective view showing an example of an appearance when the microcomputer of FIG. 1 is viewed from the bottom side;

FIG. 3 is an AA ′ cross-sectional view showing a cross-sectional configuration example of the microcomputer of FIG. 2;

FIG. 4 is an exemplary sectional view showing a sectional configuration example of a microcomputer according to a second embodiment of the invention;

FIG. 5 is a cross-sectional view illustrating a cross-sectional configuration example of a microcomputer as a modification of the embodiment of the present invention.

[Explanation of symbols]

1, 1a, 1b ... microcomputer, 3 ...
Interface dedicated terminal, 5 ... lead terminal, 7.
..Evaluator, 9 ... CPU (circuit block), 11 ... ROM, 13 ... peripheral block (circuit block), 19 ... electronic equipment, 21 ...
-Package, 23 ... control signal, 25 ... inspection signal, 27 ... bottom surface (other surface), 29 ... top surface (other surface), 31 ... side surface (one surface), 37 ... Coating member

Claims (5)

[Claims] 1. A microcomputer including a circuit block that performs a function based on a control signal when a control signal is input from a lead terminal provided on one surface of a package, wherein the circuit block is An evaluator that inspects an operation state of the circuit block by an inspection signal input from outside of the package to inspect an operation state of whether or not a function based on a control signal is exhibited; and A microcomputer which is provided on another surface different from the surface and has an interface dedicated terminal for inputting the inspection signal. 2. The microcomputer according to claim 1, wherein the one surface is a side surface of the package, and the other surface is one of a top surface and a bottom surface of the package. 3. The microcomputer according to claim 1, wherein the interface-dedicated terminal is covered with a covering member having an insulating property that can be removed on the other surface. 4. An electronic apparatus equipped with a microcomputer including a circuit block that performs a function based on a control signal when a control signal is input from a lead terminal provided on one surface of a package. The microcomputer may determine an operation state of the circuit block by an inspection signal input from outside of the package in order to inspect an operation state of whether the circuit block is performing a function based on the control signal. An electronic device comprising: an evaluator to be inspected; and an interface dedicated terminal provided on another surface of the package different from the one surface, for inputting the inspection signal. 5. The package according to claim 4, wherein the one surface is a side surface of the package, and the other surface is mounted with a microcomputer which is one of an upper surface and a lower surface of the package. Electronic device as described.