JP2002176001A - 熱処理装置 - Google Patents
熱処理装置Info
- Publication number
- JP2002176001A JP2002176001A JP2000370783A JP2000370783A JP2002176001A JP 2002176001 A JP2002176001 A JP 2002176001A JP 2000370783 A JP2000370783 A JP 2000370783A JP 2000370783 A JP2000370783 A JP 2000370783A JP 2002176001 A JP2002176001 A JP 2002176001A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- heat treatment
- processing chamber
- light source
- refrigerant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Control Of Resistance Heating (AREA)
- Thin Film Transistor (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000370783A JP2002176001A (ja) | 2000-12-05 | 2000-12-05 | 熱処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000370783A JP2002176001A (ja) | 2000-12-05 | 2000-12-05 | 熱処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002176001A true JP2002176001A (ja) | 2002-06-21 |
| JP2002176001A5 JP2002176001A5 (enExample) | 2008-01-24 |
Family
ID=18840609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000370783A Withdrawn JP2002176001A (ja) | 2000-12-05 | 2000-12-05 | 熱処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002176001A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007073953A (ja) * | 2005-09-06 | 2007-03-22 | Tera Semicon Corp | 多結晶シリコン薄膜製造方法及びその製造装置 |
| US7575985B2 (en) | 2000-12-05 | 2009-08-18 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating semiconductor device |
| CN115347125A (zh) * | 2022-10-18 | 2022-11-15 | 中国华能集团清洁能源技术研究院有限公司 | 一种钙钛矿材料快速原位退火的方法及退火装置 |
| JP2024111673A (ja) * | 2023-02-06 | 2024-08-19 | メトロ電気工業株式会社 | 加熱装置 |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5938584A (ja) * | 1982-08-30 | 1984-03-02 | ウシオ電機株式会社 | 照射加熱炉の運転方法 |
| JPS6229131A (ja) * | 1985-07-31 | 1987-02-07 | Hitachi Ltd | 薄膜形成方法 |
| JPS63200526A (ja) | 1987-02-17 | 1988-08-18 | Shinetsu Sekiei Kk | 減圧熱処理装置に用いられる反応管 |
| JPH05198507A (ja) * | 1991-09-21 | 1993-08-06 | Semiconductor Energy Lab Co Ltd | 半導体作製方法 |
| JPH06268242A (ja) | 1993-03-17 | 1994-09-22 | Matsushita Electric Ind Co Ltd | シリコン基板の製造方法および結晶質シリコン太陽電池 |
| JPH0729839A (ja) * | 1993-07-15 | 1995-01-31 | Sony Corp | 熱処理装置及びこれを用いた熱処理方法 |
| JPH07169974A (ja) | 1993-09-20 | 1995-07-04 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| JPH0851076A (ja) | 1994-05-30 | 1996-02-20 | Sanyo Electric Co Ltd | 半導体装置,半導体装置の製造方法,薄膜トランジスタ ,薄膜トランジスタの製造方法,表示装置 |
| JPH08264472A (ja) * | 1995-03-24 | 1996-10-11 | Hitachi Ltd | 半導体装置の製造方法及び半導体製造装置 |
| JPH08330602A (ja) | 1995-03-27 | 1996-12-13 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| JPH0951100A (ja) * | 1995-08-04 | 1997-02-18 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
| JPH1070077A (ja) * | 1996-07-24 | 1998-03-10 | Internatl Business Mach Corp <Ibm> | パルス状の急速な熱アニーリングによる多結晶シリコンの成長方法 |
| JPH1197706A (ja) | 1997-09-23 | 1999-04-09 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| WO2000031777A1 (en) * | 1998-11-20 | 2000-06-02 | Steag Rtp Systems, Inc. | Fast heating and cooling apparatus for semiconductor wafers |
| JP2000260710A (ja) | 1999-03-11 | 2000-09-22 | Seiko Epson Corp | 半導体装置の製造方法及びアニール装置 |
-
2000
- 2000-12-05 JP JP2000370783A patent/JP2002176001A/ja not_active Withdrawn
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5938584A (ja) * | 1982-08-30 | 1984-03-02 | ウシオ電機株式会社 | 照射加熱炉の運転方法 |
| JPS6229131A (ja) * | 1985-07-31 | 1987-02-07 | Hitachi Ltd | 薄膜形成方法 |
| JPS63200526A (ja) | 1987-02-17 | 1988-08-18 | Shinetsu Sekiei Kk | 減圧熱処理装置に用いられる反応管 |
| JPH05198507A (ja) * | 1991-09-21 | 1993-08-06 | Semiconductor Energy Lab Co Ltd | 半導体作製方法 |
| JPH06268242A (ja) | 1993-03-17 | 1994-09-22 | Matsushita Electric Ind Co Ltd | シリコン基板の製造方法および結晶質シリコン太陽電池 |
| JPH0729839A (ja) * | 1993-07-15 | 1995-01-31 | Sony Corp | 熱処理装置及びこれを用いた熱処理方法 |
| JPH07169974A (ja) | 1993-09-20 | 1995-07-04 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| JPH0851076A (ja) | 1994-05-30 | 1996-02-20 | Sanyo Electric Co Ltd | 半導体装置,半導体装置の製造方法,薄膜トランジスタ ,薄膜トランジスタの製造方法,表示装置 |
| JPH08264472A (ja) * | 1995-03-24 | 1996-10-11 | Hitachi Ltd | 半導体装置の製造方法及び半導体製造装置 |
| JPH08330602A (ja) | 1995-03-27 | 1996-12-13 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| JPH0951100A (ja) * | 1995-08-04 | 1997-02-18 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
| JPH1070077A (ja) * | 1996-07-24 | 1998-03-10 | Internatl Business Mach Corp <Ibm> | パルス状の急速な熱アニーリングによる多結晶シリコンの成長方法 |
| JPH1197706A (ja) | 1997-09-23 | 1999-04-09 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| WO2000031777A1 (en) * | 1998-11-20 | 2000-06-02 | Steag Rtp Systems, Inc. | Fast heating and cooling apparatus for semiconductor wafers |
| JP2000260710A (ja) | 1999-03-11 | 2000-09-22 | Seiko Epson Corp | 半導体装置の製造方法及びアニール装置 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7575985B2 (en) | 2000-12-05 | 2009-08-18 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating semiconductor device |
| JP2007073953A (ja) * | 2005-09-06 | 2007-03-22 | Tera Semicon Corp | 多結晶シリコン薄膜製造方法及びその製造装置 |
| CN115347125A (zh) * | 2022-10-18 | 2022-11-15 | 中国华能集团清洁能源技术研究院有限公司 | 一种钙钛矿材料快速原位退火的方法及退火装置 |
| JP2024111673A (ja) * | 2023-02-06 | 2024-08-19 | メトロ電気工業株式会社 | 加熱装置 |
| JP7661376B2 (ja) | 2023-02-06 | 2025-04-14 | メトロ電気工業株式会社 | 加熱装置 |
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