JP2002158156A - 電子ビーム露光装置、電子ビーム露光方法、及び半導体素子製造方法 - Google Patents
電子ビーム露光装置、電子ビーム露光方法、及び半導体素子製造方法Info
- Publication number
- JP2002158156A JP2002158156A JP2000351055A JP2000351055A JP2002158156A JP 2002158156 A JP2002158156 A JP 2002158156A JP 2000351055 A JP2000351055 A JP 2000351055A JP 2000351055 A JP2000351055 A JP 2000351055A JP 2002158156 A JP2002158156 A JP 2002158156A
- Authority
- JP
- Japan
- Prior art keywords
- electron beam
- correction value
- electron
- electron beams
- current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000010894 electron beam technology Methods 0.000 title claims abstract description 227
- 239000004065 semiconductor Substances 0.000 title claims description 13
- 238000000034 method Methods 0.000 title claims description 9
- 238000007493 shaping process Methods 0.000 claims description 51
- 238000000465 moulding Methods 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 230000001678 irradiating effect Effects 0.000 abstract description 5
- 238000001514 detection method Methods 0.000 description 5
- 238000003860 storage Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
- H01J37/3045—Object or beam position registration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
- H01J37/3177—Multi-beam, e.g. fly's eye, comb probe
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Electron Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Electron Sources, Ion Sources (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000351055A JP2002158156A (ja) | 2000-11-17 | 2000-11-17 | 電子ビーム露光装置、電子ビーム露光方法、及び半導体素子製造方法 |
PCT/JP2001/009812 WO2002041372A1 (fr) | 2000-11-17 | 2001-11-09 | Systeme d'exposition a un faisceau electronique, procede d'exposition a un faisceau electronique et procede de production d'elements semi-conducteurs |
TW090128180A TWI230838B (en) | 2000-11-17 | 2001-11-14 | Electron beam exposure device and method and manufacturing method of semiconductor elements |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000351055A JP2002158156A (ja) | 2000-11-17 | 2000-11-17 | 電子ビーム露光装置、電子ビーム露光方法、及び半導体素子製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2002158156A true JP2002158156A (ja) | 2002-05-31 |
Family
ID=18824174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000351055A Withdrawn JP2002158156A (ja) | 2000-11-17 | 2000-11-17 | 電子ビーム露光装置、電子ビーム露光方法、及び半導体素子製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2002158156A (fr) |
TW (1) | TWI230838B (fr) |
WO (1) | WO2002041372A1 (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017159693A1 (fr) * | 2016-03-14 | 2017-09-21 | 株式会社ニコン | Dispositif d'exposition, procédé d'exposition, procédé de lithographie et procédé de fabrication de dispositif |
WO2018167936A1 (fr) * | 2017-03-17 | 2018-09-20 | 株式会社ニコン | Dispositif d'exposition, procédé lithographique, et procédé de fabrication de dispositif |
WO2018167922A1 (fr) * | 2017-03-16 | 2018-09-20 | 株式会社ニコン | Appareil optique à faisceau de particules chargées, appareil d'exposition, procédé d'exposition, appareil de commande, procédé de commande, appareil de génération d'informations, et procédé de fabrication de dispositif |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101414126B (zh) | 2002-10-30 | 2012-02-15 | 迈普尔平版印刷Ip有限公司 | 电子束曝光系统 |
JP4520426B2 (ja) | 2005-07-04 | 2010-08-04 | 株式会社ニューフレアテクノロジー | 電子ビームのビームドリフト補正方法及び電子ビームの描画方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5384463A (en) * | 1991-06-10 | 1995-01-24 | Fujisu Limited | Pattern inspection apparatus and electron beam apparatus |
DE69223088T2 (de) * | 1991-06-10 | 1998-03-05 | Fujitsu Ltd | Apparat zur Musterüberprüfung und Elektronenstrahlgerät |
JP3298347B2 (ja) * | 1995-01-11 | 2002-07-02 | 株式会社日立製作所 | 電子線描画装置 |
US6107636A (en) * | 1997-02-07 | 2000-08-22 | Canon Kabushiki Kaisha | Electron beam exposure apparatus and its control method |
JP3976835B2 (ja) * | 1997-05-08 | 2007-09-19 | キヤノン株式会社 | 電子ビーム露光方法及び電子ビーム露光装置 |
JPH11233418A (ja) * | 1998-02-18 | 1999-08-27 | Jeol Ltd | 電子ビーム描画装置 |
-
2000
- 2000-11-17 JP JP2000351055A patent/JP2002158156A/ja not_active Withdrawn
-
2001
- 2001-11-09 WO PCT/JP2001/009812 patent/WO2002041372A1/fr active Search and Examination
- 2001-11-14 TW TW090128180A patent/TWI230838B/zh not_active IP Right Cessation
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017159693A1 (fr) * | 2016-03-14 | 2017-09-21 | 株式会社ニコン | Dispositif d'exposition, procédé d'exposition, procédé de lithographie et procédé de fabrication de dispositif |
JPWO2017159693A1 (ja) * | 2016-03-14 | 2019-01-10 | 株式会社ニコン | 露光装置及び露光方法、リソグラフィ方法、並びにデバイス製造方法 |
WO2018167922A1 (fr) * | 2017-03-16 | 2018-09-20 | 株式会社ニコン | Appareil optique à faisceau de particules chargées, appareil d'exposition, procédé d'exposition, appareil de commande, procédé de commande, appareil de génération d'informations, et procédé de fabrication de dispositif |
US10984982B2 (en) | 2017-03-16 | 2021-04-20 | Nikon Corporation | Charged particle beam optical apparatus, exposure apparatus, exposure method, control apparatus, control method, information generation apparatus, information generation method and device manufacturing method |
US11387074B2 (en) | 2017-03-16 | 2022-07-12 | Nikon Corporation | Charged particle beam optical apparatus, exposure apparatus, exposure method, control apparatus, control method, information generation apparatus, information generation method and device manufacturing method |
WO2018167936A1 (fr) * | 2017-03-17 | 2018-09-20 | 株式会社ニコン | Dispositif d'exposition, procédé lithographique, et procédé de fabrication de dispositif |
Also Published As
Publication number | Publication date |
---|---|
TWI230838B (en) | 2005-04-11 |
WO2002041372A1 (fr) | 2002-05-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4327497B2 (ja) | 電子ビーム露光装置、電子ビーム露光方法、半導体素子製造方法、マスク、及びマスク製造方法 | |
JPH10214779A (ja) | 電子ビーム露光方法及び該方法を用いたデバイス製造方法 | |
WO2002058118A1 (fr) | Dispositif d'exposition a des faisceaux d'electrons et dispositif de deviation de faisceaux d'electrons | |
JP4368411B2 (ja) | 電子ビーム露光装置 | |
JP4612838B2 (ja) | 荷電粒子線露光装置およびその露光方法 | |
JP3971174B2 (ja) | 露光方法、電子ビーム露光装置、及び電子部品製造方法 | |
JP4301724B2 (ja) | 電子ビーム露光装置及び電子レンズ | |
JP2002158156A (ja) | 電子ビーム露光装置、電子ビーム露光方法、及び半導体素子製造方法 | |
JP2023160972A (ja) | 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法 | |
JP4401557B2 (ja) | 電子ビーム露光装置、電子ビーム補正方法、電子ビーム露光方法、及び半導体素子製造方法 | |
US6881968B2 (en) | Electron beam exposure apparatus, electron beam exposure method, semiconductor device manufacturing method, and electron beam shape measuring method | |
JP4112791B2 (ja) | 電子ビーム補正方法及び電子ビーム露光装置 | |
JP4616517B2 (ja) | 電子ビーム露光方法、電子ビーム露光装置、及び半導体素子製造方法 | |
JP4511707B2 (ja) | 電子ビーム露光装置、露光方法、及び半導体素子製造方法 | |
JP4401556B2 (ja) | 電子ビーム補正方法及び電子ビーム露光装置 | |
WO2002061813A1 (fr) | Dispositif a faisceau d'electrons, element de formation de faisceaux d'electrons et procede de fabrication dudit element | |
JP4558238B2 (ja) | 電子ビーム露光装置、電子ビーム露光方法、及び半導体素子製造方法 | |
JP4554749B2 (ja) | 電子ビーム露光装置及び半導体素子製造方法 | |
JP2004071990A (ja) | 荷電粒子ビーム露光装置、荷電粒子ビームのシャープネス測定方法、及び半導体素子製造方法 | |
WO2002063663A1 (fr) | Appareil d"exposition a faisceau d"electrons et procede d"exposition | |
WO2002063662A1 (fr) | Procede de fabrication d'une fente, fente, et systeme d'exposition de faisceau a electrons | |
JP2001319859A (ja) | 電子ビーム露光装置、電子ビーム露光方法、素子製造方法、及びマスク | |
WO2002052623A1 (fr) | Systeme d'exposition d'un faisceau d'electrons et element d'etalonnage de la positon d'irradiation du faisceau d'electrons |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20080205 |