JP2002144224A - 遊離砥粒により研磨加工するための研磨装置及びその停止方法 - Google Patents
遊離砥粒により研磨加工するための研磨装置及びその停止方法Info
- Publication number
- JP2002144224A JP2002144224A JP2000345540A JP2000345540A JP2002144224A JP 2002144224 A JP2002144224 A JP 2002144224A JP 2000345540 A JP2000345540 A JP 2000345540A JP 2000345540 A JP2000345540 A JP 2000345540A JP 2002144224 A JP2002144224 A JP 2002144224A
- Authority
- JP
- Japan
- Prior art keywords
- surface plate
- carrier
- drive mechanism
- platen
- polishing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 60
- 239000006061 abrasive grain Substances 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title claims description 17
- 230000003247 decreasing effect Effects 0.000 claims abstract description 6
- 238000001514 detection method Methods 0.000 claims description 12
- 238000004904 shortening Methods 0.000 abstract description 2
- 238000006073 displacement reaction Methods 0.000 description 14
- 239000002002 slurry Substances 0.000 description 9
- 230000007423 decrease Effects 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 238000007517 polishing process Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 101150000715 DA18 gene Proteins 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000345540A JP2002144224A (ja) | 2000-11-13 | 2000-11-13 | 遊離砥粒により研磨加工するための研磨装置及びその停止方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000345540A JP2002144224A (ja) | 2000-11-13 | 2000-11-13 | 遊離砥粒により研磨加工するための研磨装置及びその停止方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002144224A true JP2002144224A (ja) | 2002-05-21 |
| JP2002144224A5 JP2002144224A5 (enExample) | 2007-12-27 |
Family
ID=18819558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000345540A Pending JP2002144224A (ja) | 2000-11-13 | 2000-11-13 | 遊離砥粒により研磨加工するための研磨装置及びその停止方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002144224A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012064835A (ja) * | 2010-09-17 | 2012-03-29 | Covalent Materials Corp | 半導体ウエハの研磨方法及び半導体ウエハ研磨装置 |
| JP2012069897A (ja) * | 2010-08-27 | 2012-04-05 | Covalent Materials Corp | 半導体ウエハの研磨方法及び半導体ウエハ研磨装置 |
-
2000
- 2000-11-13 JP JP2000345540A patent/JP2002144224A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012069897A (ja) * | 2010-08-27 | 2012-04-05 | Covalent Materials Corp | 半導体ウエハの研磨方法及び半導体ウエハ研磨装置 |
| JP2012064835A (ja) * | 2010-09-17 | 2012-03-29 | Covalent Materials Corp | 半導体ウエハの研磨方法及び半導体ウエハ研磨装置 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071112 |
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