JP2002144224A5 - - Google Patents

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Publication number
JP2002144224A5
JP2002144224A5 JP2000345540A JP2000345540A JP2002144224A5 JP 2002144224 A5 JP2002144224 A5 JP 2002144224A5 JP 2000345540 A JP2000345540 A JP 2000345540A JP 2000345540 A JP2000345540 A JP 2000345540A JP 2002144224 A5 JP2002144224 A5 JP 2002144224A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000345540A
Other languages
Japanese (ja)
Other versions
JP2002144224A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000345540A priority Critical patent/JP2002144224A/ja
Priority claimed from JP2000345540A external-priority patent/JP2002144224A/ja
Publication of JP2002144224A publication Critical patent/JP2002144224A/ja
Publication of JP2002144224A5 publication Critical patent/JP2002144224A5/ja
Pending legal-status Critical Current

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JP2000345540A 2000-11-13 2000-11-13 遊離砥粒により研磨加工するための研磨装置及びその停止方法 Pending JP2002144224A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000345540A JP2002144224A (ja) 2000-11-13 2000-11-13 遊離砥粒により研磨加工するための研磨装置及びその停止方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000345540A JP2002144224A (ja) 2000-11-13 2000-11-13 遊離砥粒により研磨加工するための研磨装置及びその停止方法

Publications (2)

Publication Number Publication Date
JP2002144224A JP2002144224A (ja) 2002-05-21
JP2002144224A5 true JP2002144224A5 (enExample) 2007-12-27

Family

ID=18819558

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000345540A Pending JP2002144224A (ja) 2000-11-13 2000-11-13 遊離砥粒により研磨加工するための研磨装置及びその停止方法

Country Status (1)

Country Link
JP (1) JP2002144224A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5570065B2 (ja) * 2010-09-17 2014-08-13 グローバルウェーハズ・ジャパン株式会社 半導体ウエハの研磨方法及び半導体ウエハ研磨装置
JP2012069897A (ja) * 2010-08-27 2012-04-05 Covalent Materials Corp 半導体ウエハの研磨方法及び半導体ウエハ研磨装置

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