JP2002141337A5 - - Google Patents

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Publication number
JP2002141337A5
JP2002141337A5 JP2000335694A JP2000335694A JP2002141337A5 JP 2002141337 A5 JP2002141337 A5 JP 2002141337A5 JP 2000335694 A JP2000335694 A JP 2000335694A JP 2000335694 A JP2000335694 A JP 2000335694A JP 2002141337 A5 JP2002141337 A5 JP 2002141337A5
Authority
JP
Japan
Prior art keywords
substrate
clamp ring
vacuum chamber
heat insulating
insulating member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000335694A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002141337A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000335694A priority Critical patent/JP2002141337A/ja
Priority claimed from JP2000335694A external-priority patent/JP2002141337A/ja
Publication of JP2002141337A publication Critical patent/JP2002141337A/ja
Publication of JP2002141337A5 publication Critical patent/JP2002141337A5/ja
Pending legal-status Critical Current

Links

JP2000335694A 2000-11-02 2000-11-02 プラズマ処理装置及びプラズマ処理方法 Pending JP2002141337A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000335694A JP2002141337A (ja) 2000-11-02 2000-11-02 プラズマ処理装置及びプラズマ処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000335694A JP2002141337A (ja) 2000-11-02 2000-11-02 プラズマ処理装置及びプラズマ処理方法

Publications (2)

Publication Number Publication Date
JP2002141337A JP2002141337A (ja) 2002-05-17
JP2002141337A5 true JP2002141337A5 (enExample) 2005-11-04

Family

ID=18811392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000335694A Pending JP2002141337A (ja) 2000-11-02 2000-11-02 プラズマ処理装置及びプラズマ処理方法

Country Status (1)

Country Link
JP (1) JP2002141337A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010098010A (ja) * 2008-10-14 2010-04-30 Ulvac Japan Ltd エッチング装置及びエッチング方法
JP2010098012A (ja) * 2008-10-14 2010-04-30 Ulvac Japan Ltd エッチング装置及びエッチング方法
JP5272648B2 (ja) * 2008-10-27 2013-08-28 大日本印刷株式会社 半導体素子の製造方法、及び半導体基板の加工方法
CN104878363B (zh) 2014-02-28 2017-07-21 北京北方微电子基地设备工艺研究中心有限责任公司 机械卡盘及等离子体加工设备
GB201518756D0 (en) * 2015-10-22 2015-12-09 Spts Technologies Ltd Apparatus for plasma dicing
JP6524566B2 (ja) * 2018-02-07 2019-06-05 パナソニックＩｐマネジメント株式会社 プラズマ処理装置およびプラズマ処理方法

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