JP2002105634A - スパッタリング装置 - Google Patents

スパッタリング装置

Info

Publication number
JP2002105634A
JP2002105634A JP2000301534A JP2000301534A JP2002105634A JP 2002105634 A JP2002105634 A JP 2002105634A JP 2000301534 A JP2000301534 A JP 2000301534A JP 2000301534 A JP2000301534 A JP 2000301534A JP 2002105634 A JP2002105634 A JP 2002105634A
Authority
JP
Japan
Prior art keywords
target
backing plate
groove
sputtering
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000301534A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002105634A5 (OSRAM
Inventor
Hachiya Takeuchi
竹内八弥
Hideki Mori
秀樹 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2000301534A priority Critical patent/JP2002105634A/ja
Publication of JP2002105634A publication Critical patent/JP2002105634A/ja
Publication of JP2002105634A5 publication Critical patent/JP2002105634A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
JP2000301534A 2000-09-29 2000-09-29 スパッタリング装置 Pending JP2002105634A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000301534A JP2002105634A (ja) 2000-09-29 2000-09-29 スパッタリング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000301534A JP2002105634A (ja) 2000-09-29 2000-09-29 スパッタリング装置

Publications (2)

Publication Number Publication Date
JP2002105634A true JP2002105634A (ja) 2002-04-10
JP2002105634A5 JP2002105634A5 (OSRAM) 2007-11-01

Family

ID=18783059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000301534A Pending JP2002105634A (ja) 2000-09-29 2000-09-29 スパッタリング装置

Country Status (1)

Country Link
JP (1) JP2002105634A (OSRAM)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005007924A1 (en) * 2003-07-07 2005-01-27 Honeywell International Inc. Sputtering target constructions
JP2006526073A (ja) * 2003-05-23 2006-11-16 アプライド　フィルムス　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング　ウント　コンパニー　コマンディートゲゼルシャフト マグネトロンスパッタカソード電極
US7850829B2 (en) 2005-01-12 2010-12-14 Tosoh Smd, Inc. Sputter targets with expansion grooves for reduced separation
JP2011219824A (ja) * 2010-04-09 2011-11-04 Sumitomo Heavy Ind Ltd 成膜装置およびターゲット装置
CN102965627A (zh) * 2011-09-01 2013-03-13 住友重机械工业株式会社 成膜装置及靶装置
JP2019007037A (ja) * 2017-06-21 2019-01-17 スタンレー電気株式会社 スパッタリングターゲット、および、車両用灯具の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0243362A (ja) * 1988-08-03 1990-02-13 Hitachi Metals Ltd スパッターターゲットとバッキングプレートの接合体
JPH0853757A (ja) * 1994-08-10 1996-02-27 Fujitsu Ltd スパッタ用ターゲットの製造方法、スパッタ方法、及び、スパッタ装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0243362A (ja) * 1988-08-03 1990-02-13 Hitachi Metals Ltd スパッターターゲットとバッキングプレートの接合体
JPH0853757A (ja) * 1994-08-10 1996-02-27 Fujitsu Ltd スパッタ用ターゲットの製造方法、スパッタ方法、及び、スパッタ装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006526073A (ja) * 2003-05-23 2006-11-16 アプライド　フィルムス　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング　ウント　コンパニー　コマンディートゲゼルシャフト マグネトロンスパッタカソード電極
US8715471B2 (en) 2003-05-23 2014-05-06 Applied Materials Gmbh & Co Kg Magnetron sputter cathode
WO2005007924A1 (en) * 2003-07-07 2005-01-27 Honeywell International Inc. Sputtering target constructions
US7850829B2 (en) 2005-01-12 2010-12-14 Tosoh Smd, Inc. Sputter targets with expansion grooves for reduced separation
JP2011219824A (ja) * 2010-04-09 2011-11-04 Sumitomo Heavy Ind Ltd 成膜装置およびターゲット装置
CN102965627A (zh) * 2011-09-01 2013-03-13 住友重机械工业株式会社 成膜装置及靶装置
JP2019007037A (ja) * 2017-06-21 2019-01-17 スタンレー電気株式会社 スパッタリングターゲット、および、車両用灯具の製造方法

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