JP2002033035A - 保護素子 - Google Patents
保護素子Info
- Publication number
- JP2002033035A JP2002033035A JP2000217315A JP2000217315A JP2002033035A JP 2002033035 A JP2002033035 A JP 2002033035A JP 2000217315 A JP2000217315 A JP 2000217315A JP 2000217315 A JP2000217315 A JP 2000217315A JP 2002033035 A JP2002033035 A JP 2002033035A
- Authority
- JP
- Japan
- Prior art keywords
- protection element
- plastic film
- melting point
- melt resin
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002985 plastic film Substances 0.000 claims abstract description 83
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 79
- 239000000956 alloy Substances 0.000 claims abstract description 79
- 229920006255 plastic film Polymers 0.000 claims abstract description 78
- 238000002844 melting Methods 0.000 claims abstract description 73
- 230000008018 melting Effects 0.000 claims abstract description 69
- 229920005989 resin Polymers 0.000 claims abstract description 64
- 239000011347 resin Substances 0.000 claims abstract description 64
- 239000012943 hotmelt Substances 0.000 claims abstract description 63
- 230000004907 flux Effects 0.000 claims abstract description 29
- 238000010438 heat treatment Methods 0.000 claims abstract description 19
- 239000004020 conductor Substances 0.000 claims description 34
- 238000007789 sealing Methods 0.000 claims description 34
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 22
- 230000001681 protective effect Effects 0.000 claims description 16
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 239000010931 gold Substances 0.000 claims description 14
- 229910052737 gold Inorganic materials 0.000 claims description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 13
- -1 polyethylene terephthalate Polymers 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 10
- 239000004952 Polyamide Substances 0.000 claims description 10
- 229920002647 polyamide Polymers 0.000 claims description 10
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 10
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 10
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 9
- 239000004593 Epoxy Substances 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 9
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 6
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 6
- 239000004697 Polyetherimide Substances 0.000 claims description 6
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 6
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 6
- 229920002530 polyetherether ketone Polymers 0.000 claims description 6
- 229920001601 polyetherimide Polymers 0.000 claims description 6
- 229920001955 polyphenylene ether Polymers 0.000 claims description 6
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 6
- 229920002635 polyurethane Polymers 0.000 claims description 6
- 239000004814 polyurethane Substances 0.000 claims description 6
- 239000002033 PVDF binder Substances 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 5
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 5
- 239000004699 Ultra-high molecular weight polyethylene Substances 0.000 claims description 5
- 229920001893 acrylonitrile styrene Polymers 0.000 claims description 5
- 229920002457 flexible plastic Polymers 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 229920002492 poly(sulfone) Polymers 0.000 claims description 5
- 229920001230 polyarylate Polymers 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 5
- 229920006324 polyoxymethylene Polymers 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 5
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 5
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 claims description 5
- 238000004544 sputter deposition Methods 0.000 claims description 5
- 229920000785 ultra high molecular weight polyethylene Polymers 0.000 claims description 5
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 4
- 239000005033 polyvinylidene chloride Substances 0.000 claims description 4
- 229920006305 unsaturated polyester Polymers 0.000 claims description 4
- 238000007740 vapor deposition Methods 0.000 claims description 4
- 229920000877 Melamine resin Polymers 0.000 claims description 3
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 claims description 3
- 229930182556 Polyacetal Natural products 0.000 claims description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 3
- 239000004202 carbamide Substances 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 3
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 3
- 125000005641 methacryl group Chemical group 0.000 claims description 3
- 229920002312 polyamide-imide Polymers 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 3
- 239000005060 rubber Substances 0.000 claims description 3
- 239000010408 film Substances 0.000 description 40
- 229920003023 plastic Polymers 0.000 description 23
- 239000004033 plastic Substances 0.000 description 23
- 239000000463 material Substances 0.000 description 20
- 229910000743 fusible alloy Inorganic materials 0.000 description 19
- 238000004519 manufacturing process Methods 0.000 description 19
- 238000003466 welding Methods 0.000 description 17
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 229910001416 lithium ion Inorganic materials 0.000 description 11
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 10
- 238000005476 soldering Methods 0.000 description 9
- 238000001514 detection method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000000155 melt Substances 0.000 description 6
- 230000004927 fusion Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 150000002343 gold Chemical class 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000217315A JP2002033035A (ja) | 2000-07-18 | 2000-07-18 | 保護素子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000217315A JP2002033035A (ja) | 2000-07-18 | 2000-07-18 | 保護素子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002033035A true JP2002033035A (ja) | 2002-01-31 |
| JP2002033035A5 JP2002033035A5 (enExample) | 2007-07-05 |
Family
ID=18712443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000217315A Withdrawn JP2002033035A (ja) | 2000-07-18 | 2000-07-18 | 保護素子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002033035A (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7106165B2 (en) | 2003-07-01 | 2006-09-12 | Matsushita Electric Industrial Co., Ltd. | Fuse, battery pack using the fuse, and method of manufacturing the fuse |
| JP2011034755A (ja) * | 2009-07-31 | 2011-02-17 | Nec Schott Components Corp | 保護素子 |
| KR101157092B1 (ko) | 2006-12-01 | 2012-06-22 | 충-모우 유 | 온도 퓨즈 보호 장치 |
| CN114762070A (zh) * | 2020-04-13 | 2022-07-15 | 肖特（日本）株式会社 | 保护元件 |
| JP2022546621A (ja) * | 2019-09-09 | 2022-11-04 | ドングアン リテルヒューズ エレクロトニクス、カンパニー リミテッド | 過熱保護デバイスおよびバリスタ |
| JP7485005B1 (ja) | 2022-12-19 | 2024-05-16 | 株式会社レゾナック | 接合体の製造方法、接合体、及び電気電子部品 |
-
2000
- 2000-07-18 JP JP2000217315A patent/JP2002033035A/ja not_active Withdrawn
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7106165B2 (en) | 2003-07-01 | 2006-09-12 | Matsushita Electric Industrial Co., Ltd. | Fuse, battery pack using the fuse, and method of manufacturing the fuse |
| KR101157092B1 (ko) | 2006-12-01 | 2012-06-22 | 충-모우 유 | 온도 퓨즈 보호 장치 |
| JP2011034755A (ja) * | 2009-07-31 | 2011-02-17 | Nec Schott Components Corp | 保護素子 |
| CN101989519A (zh) * | 2009-07-31 | 2011-03-23 | 恩益禧肖特电子零件有限公司 | 保护元件 |
| TWI485739B (zh) * | 2009-07-31 | 2015-05-21 | Nec Schott Components Corp | Protection elements and non-retroactive protection devices |
| JP2022546621A (ja) * | 2019-09-09 | 2022-11-04 | ドングアン リテルヒューズ エレクロトニクス、カンパニー リミテッド | 過熱保護デバイスおよびバリスタ |
| CN114762070A (zh) * | 2020-04-13 | 2022-07-15 | 肖特（日本）株式会社 | 保护元件 |
| JP7485005B1 (ja) | 2022-12-19 | 2024-05-16 | 株式会社レゾナック | 接合体の製造方法、接合体、及び電気電子部品 |
| JP2024087480A (ja) * | 2022-12-19 | 2024-07-01 | 株式会社レゾナック | 接合体の製造方法、接合体、及び電気電子部品 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070523 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070523 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20080702 |